CN103137244B - For conductive base and the manufacture method thereof of contact panel - Google Patents
For conductive base and the manufacture method thereof of contact panel Download PDFInfo
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- CN103137244B CN103137244B CN201110384133.XA CN201110384133A CN103137244B CN 103137244 B CN103137244 B CN 103137244B CN 201110384133 A CN201110384133 A CN 201110384133A CN 103137244 B CN103137244 B CN 103137244B
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Abstract
A kind of conductive base and manufacture the method for this conductive base, comprise: on substrate material, form uncured photocurable material layer, it is made up of photocurable constituent, and this photocurable constituent comprises at least one and has multiple reactive functional group and the photocurable prepolymer with functional group's equivalent of 70-700 gram/mol; Patterned shielding is provided; Make the first light source by this patterned shielding, the photocurable material layer that the photocurable material layer forming section so as to making this uncured is regions curing; Remove this patterned shielding; Irradiate with secondary light source, to solidify the photocurable material layer of this subregion solidification further, form the structurized photocurable material layer with micro-structure surface whereby; And conductive layer is formed on the micro-structure surface of this structurized photocurable material layer.
Description
Technical field
The present invention relates to a kind of conductive base and manufacture the method for this conductive base, particularly relate to conductive base and manufacture method thereof that a kind of formation has micro-structure surface.
Background technology
Conductive base can be applied to electrooptical device, as display, contact panel, transducer, Electronic Paper and optical element etc.
Typical conductive base, such as resistance-type or capacitance type touch control substrate, have substrate material usually, and the metal be formed on the surface of substrate material or metal oxide transparent conducting layer.Due to touch base plate carry out pressing line with pointer time, the conductive layer being positioned at upper strata can by external force and produce regional area deformation, and then make two to be spaced the Contact of conductive layer and conducting.But be stained with glutinous phenomenon owing to can produce during two conductive layers make contact, when the external force pressed disappears, be positioned at the conductive layer on upper strata by reinstatement, now can make the strength that conductive layer is pullled.So easily cause the stripping of breaking of conductive layer under repeating to press line (such as pressing line with pointer), the resistance value of conductive layer is raised and the unstable situation generation of sending a telegraph property.Therefore how to improve the bond strength of conductive layer and substrate material and the structural strength of conductive layer itself, and prevent conductive layer under external force, producing crack and stripping is an important topic.
United States Patent (USP) discloses 2003/0087119 in early days and discloses a kind of transparent conductive substrate, and it has substrate material, is formed in the transparency conducting layer on this substrate material, and covers the cover layer on this transparency conducting layer.This tectal material can be metal oxide, metal nitride, metal oxynitride, carbon, nitrogen carbide, carborundum etc.Utilize this cover layer and can prevent transparency conducting layer under external force, producing crack or stripping.But because this cover layer will be formed with sputtering way, therefore make the technique manufacturing this transparent conductive substrate comparatively complicated.
United States Patent (USP) 6,629,833 disclose a kind of transparent conductive substrate, and it has plastic base ground, be formed on this plastic base ground containing ionic group resin bed, and be formed in this containing the transparency conducting layer on ionic group resin.Utilize this to contain the tackness of ionic group resin, this transparency conducting layer can be bonding on this plastic base ground securely to prevent transparency conducting layer from producing crack or stripping under external force.But because tackness should be had containing ionic group resin, made easily to be stained with in the process manufacturing transparent conductive substrate the particulate that glutinous dust etc. is external.
Divided by outside upper method, the generally another kind of mode preventing conductive layer from producing crack and stripping under external force, be used in conductive layer surface to form concave-convex micro-structure so as to reducing the contact area between two conductive layers, effectively can reduce conductive layer to be whereby stained with because of contact and glutinous caused to pull strength, and then extend the useful life of conductive layer.
The method of general making micro-structural has physics stamped method or chemical method for etching etc., but the birth defect that these methods all have its technique to cause.Such as, physics stamped method because of force of impression not easily even, so easily affect precision and the size of micro-structural, and the micro-structural impressed out has folding angled construction (as sawtooth, right angle or trapezium structure) mostly, the existence of this knuckle can make the easier stress of conductive layer concentrate and accelerate damaged or not easily form continuous conductive layer; And the chemical method for etching mentioned in United States Patent (USP) 6,036,579, etching solution wherein used is expensive, and can cause environmental pollution, and the micro-structural etched also has knuckle mostly, so also there be the problem identical with physics stamped method.
Based on aforesaid shortcoming, industrial quarters is needed badly and develops one without the need to chemical etching liquor, not easily produce the micro-structural with acute angle, and the technology that simultaneously tackness between conductive layer and substrate material can be made more to promote, to overcome the problem of aforementioned all prior aries.
Summary of the invention
Therefore, the object of the present invention is to provide one can prevent transparency conducting layer from producing under external force to break or peel off from substrate material, manufacturing simple conductive base preparation method without the need to chemical etching liquor.
According to a kind of disclosed method manufacturing conductive base, comprise: on substrate material, form uncured photocurable material layer, this uncured photocurable material layer is made up of photocurable constituent, this photocurable constituent comprises the photocurable prepolymer that at least one has multiple reactive functional group, and this photocurable prepolymer has functional group's equivalent of 70-700 gram/mol (g/mol); There is provided patterned shielding, to cover this uncured photocurable material layer surface partly, the photocurable material layer making this uncured forms at least one shielded area and at least one non-obstructing district; Make the first light source by this patterned shielding, the photocurable prepolymer in the non-obstructing district in the photocurable material layer making this uncured produces curing reaction, so as to the photocurable material layer that the photocurable material layer forming section making this uncured is regions curing, it have at least one convex curing area and the uncured district of at least one concavity; Remove this patterned shielding; Irradiate with secondary light source, to solidify the photocurable material layer of this subregion solidification further, the uncured district of concavity of the photocurable material layer that this subregion is solidified produces curing reaction, forms the structurized photocurable material layer with concave-convex micro-structure surface whereby; And conductive layer is formed on the micro-structure surface of this structurized photocurable material layer.
Preferably, this photocurable prepolymer with multiple reactive functional group is the group selecting the combination of free multi-functional acrylic's resin prepolymer, multi-functional amidocarbonic acid acrylic resin prepolymer and aforementioned prepolymer to form.
Preferably, this patterned shielding has the transmission region and alternatively non-transparent region that are alternately arranged, and described transmission region has the spacing of 50 μm-250 μm.
Preferably, this first light source and this secondary light source are ultraviolet light, visible ray, electron beam or X-ray.
Preferably, this first light source is ultraviolet light, and its exposure dose is for being not less than 70mJ/cm
2and not higher than 4000mJ/cm
2.
Preferably, the material of this substrate material is polymer, and this polymer is selected from the group be made up of polyester based resin, polyethers system resin, polycarbonate-based resin, polyamide series resin, polyimides system resin, polyolefin-based resins, acrylic ester resin, polyvinyl chloride resin, polystyrene resin, polyvinyl alcohol resin, polyarylate system resin, polyphenylene sulfide system resin, sub-vinylite, methacrylate ester resin, cellulose acetate, cellulose diacetate and the Triafol T of poly-dichloro and their combination.
Preferably, the material of this conductive layer is metal or metallic compound, this metal is selected from the group be made up of gold, silver, platinum, lead, copper, aluminium, nickel, chromium, titanium, iron, cobalt and tin and their alloy, and this metallic compound is selected from the group be made up of indium oxide, tin oxide, titanium oxide, aluminium oxide, zinc oxide, gallium oxide and tin indium oxide and their combination.
Preferably, this conductive layer is deposited on the micro-structure surface of this structurized photocurable material layer with sputtering way.
The present invention also discloses the obtained conductive base of a kind of method according to above-mentioned manufacture conductive base, and wherein, this conductive layer has a upper surface, and this upper surface has Rz and is 0.5 μm-3.5 μm and Sm is the surface roughness of 0.05mm-0.35mm.
Beneficial effect of the present invention is: the micro-structure surface utilizing this structurized photocurable material layer, conductive layer surface is made to form concave-convex micro-structure, the bond strength of conductive layer and substrate material and the structural strength of conductive layer itself can be increased whereby, thus strengthen preventing from transparency conducting layer from producing under external force breaking or peel off from substrate material.
Accompanying drawing explanation
Fig. 1 to Fig. 6, illustrates a kind of step manufacturing the preferred embodiment of the method for transparent conductive substrate of the present invention.Wherein:
Fig. 1 is schematic side view, illustrates that present pre-ferred embodiments forms uncured photocurable material layer on base material;
Fig. 2 is schematic side view, illustrates that present pre-ferred embodiments uses light shield to cover this uncured photocurable material layer with patterning;
Fig. 3 is schematic side view, and the photocurable material layer of the subregion solidification formed after present pre-ferred embodiments exposes this uncured photocurable material layer patternedly is described;
Fig. 4 is schematic side view, and the present pre-ferred embodiments simultaneously curing area of the photocurable material layer that exposed portion is regions curing and uncured district is described;
Fig. 5 is schematic side view, illustrate present pre-ferred embodiments after Fig. 4 step obtain having the structurized photocurable material layer of concave-convex micro-structure surface; And
Fig. 6 is schematic side view, sputter layer of transparent conductive layer on the structurized photocurable material layer that present pre-ferred embodiments is formed at Fig. 5 is described and obtains conductive base.
Embodiment
Below in conjunction with drawings and Examples, the present invention is described in detail.
Before the present invention is described in detail, it should be noted that in the following description content, similar element represents with identical numbering.
Consult Fig. 1 to Fig. 6, a kind of preferred embodiment manufacturing the method for conductive base of the present invention comprises following steps:
A photocurable slurry is coated on transparent substrates material 21 to form photocurable pulp layer by (), this photocurable slurry has photocurable constituent and solvent, this photocurable constituent comprises the photocurable prepolymer that light trigger and at least one have multiple reactive functional group, and this photocurable prepolymer has functional group's equivalent of 70-700 gram/mol (g/mol), this photocurable prepolymer can be monomer or oligomerization compound;
(b) this photocurable pulp layer dry, to remove the solvent in this photocurable slurry, make on this substrate material 21, form the uncured photocurable material layer 22a (as Fig. 1) with photocurable prepolymer, described reactive functional group can produce cross-linking reaction by free radical causes;
C () provides patterned shielding 31, form at least one shielded area 222 and at least one non-obstructing district 221 to cover this uncured photocurable material layer 22a (as Fig. 2), the photocurable material layer 22a making this uncured partly;
D () makes the first light source (L
1) by this patterned shielding 31, the photocurable prepolymer in the non-obstructing district 221 in the photocurable material layer 22a making this uncured produces curing reaction.Above-mentioned curing reaction utilizes light trigger cracking to produce free radical, and the light curable functional group prepolymer therefore causing the non-obstructing district 221 of this uncured photocurable material layer 22a produces polymerization reaction and solidifies gradually, and the photocurable constituent in the shielded area 222 of the photocurable material layer 22a therefore causing this uncured flows towards this non-obstructing district 221, and then the photocurable material layer 22a making this uncured forms the photocurable material layer 22b (as Fig. 3) having convex curing area 223 and solidify with the subregion in the uncured district 224 of concavity;
E () removes this patterned shielding 31 (as Fig. 4);
F () uses secondary light source (L
2), irradiate the photocurable material layer 22b (as Fig. 4) of this subregion solidification, the uncured district 224 of this concavity of the photo-curing material 22b that this subregion is solidified is solidified to form concavity curing area 225, and therefore on this substrate material 21, forms the structurized photocurable material layer 22 (as Fig. 5) with concave-convex micro-structure surface 220; And
G () forms transparency conducting layer 23 (as Fig. 6) with sputter or evaporation mode on this structurized photocurable material layer 22.
This patterned shielding 31 has the transmission region 311 and alternatively non-transparent region 312 that are alternately arranged, and every two adjacent transmission regions 311 have the spacing (d) of 50 μm-250 μm.The light-permeable region 311 of this patterned shielding 31 for for make this first light source through, and this alternatively non-transparent region 312 be for stopping, absorption or reflection source.
Can be used for the material as photocurable prepolymer of the present invention, comprise but be not limited in the synthesized functionality amidocarbonic acid acrylic resin prepolymers such as the hydroxyl alkane ester of functional acrylic resin's prepolymer of acrylic acid or the acrylate with polyalcohol, polyalcohol and acrylic or methacrylic and combination thereof.Preferably, this prepolymer material is acrylate.
Preferably, this prepolymer has functional group's equivalent of 70-700 gram/mol.Functional group's equivalent of prepolymer is defined as follows:
Functional group's equivalent=(functional group's number of the molecular weight/prepolymer of prepolymer) of prepolymer
More preferably, functional group's equivalent of this prepolymer is 80-600 gram/mol, and the best is 85-400 gram/mol.The formation of the photocurable material layer 22 of the photocuring reaction theory and structure of this prepolymer will further describe as follows.There is the material that can carry out the functional group of photocuring reaction, be called photo-curing material.Photo-curing material is mixed with light trigger, uncured photocurable material layer is formed with coating method, again this layer is carried out to the irradiation of ultraviolet light, light trigger can be cracked into free radical (freeradical) by ultraviolet light, and the functional group that free radical causes photo-curing material produces reaction, along with the carrying out of reaction, the molecular weight of photocurable material layer and viscosity can continue to rise, until the viscosity of photocurable material layer is excessive, stops photocuring reaction, and form dry and comfortable surface.Curing area in photocurable material layer, owing to producing photocuring reaction, more still unreacted photo-curing materials are needed to carry out photocuring reaction, therefore still unreacted photo-curing material, can be flowed from uncured district toward curing area, to provide still unreacted photo-curing material, make the photocuring reaction in curing area can continue to carry out.Still unreacted photo-curing material, from uncured district toward the flow phenomenon of curing area, makes the curing area of photocurable material layer become thicker, and presents the mountain peak shape of protuberance; Simultaneously also make the uncured district of photocurable material layer become thinner, and present the mountain valley shape of depression, make the difference that curing area and uncured interval have occurred on thickness, the surface micro-structure that formation mountain peak and mountain valley alternately occur.When the molecular weight of photo-curing material is less, the flow rate of still unreacted photo-curing material in photocurable material layer is faster, still unreacted photo-curing material comparatively fast can flow to curing area by uncured district, make the Rz value between uncured district and curing area higher, also representing the surface micro-structure formed can be more obvious.When functional group's number of photo-curing material is larger, photo-curing material is when carrying out photocuring reaction, its extent of reaction can be more fierce, make still unreacted photo-curing material comparatively fast can flow to curing area by uncured district, to maintain the carrying out of photocuring reaction, this makes the Rz value between uncured district and curing area higher, and also representing the surface micro-structure formed can be more obvious.
Here it is noted that, the state of cure of the photo-curing material in step (c) with (e) can be solidify completely or solidify partially, as long as photo-curing material can be made no longer to have mobility, be not particularly limited in the present invention.
The solvent that can be applicable in the present invention is not particularly limited, as long as the solvent that photocurable materials can be made fully to dissolve all can use, alcohols, ketone, ester class, halogenated solvent, hydro carbons etc. can be selected from, such as: acetone, acetonitrile, chloroform, chlorophenol, cyclohexane, cyclohexanone, cyclopentanone, carrene, diethyl acetate, dimethyl carbonate, ethanol, ethyl acetate, N, the group that N-dimethylacetylamide, 1,2-PD, methyl-n-butyl ketone, methyl alcohol, methyl acetate, butyl acetate, toluene and oxolane and their combination are formed.
There is no particular restriction for the light trigger that can be applicable in the present invention, as long as light-curable resin can be made to carry out photocuring reaction all can use, the group that vinyl benzene ketone, benzophenone derivates, michler's ketone, benzyne, benzyl derivative, benzoin derivatives, benzoin methylether class, alpha-acyloxy ester, thioxanthene ketone and Anthraquinones and their combination are formed can be selected from.The use amount of this initator is also also unrestricted, and better use amount is for being not less than 0.01wt% (when consisting of 100wt% with photocurable slurry).
Preferably, this photocurable slurry has the solid content of 10-80wt%, if solid content is lower than 10wt%, irradiating ultraviolet light not easily forms concave-convex micro-structure, if solid content is greater than 80wt%, is not easily coated with, and the easy embrittlement of irradiating ultraviolet light posterior photocuring material layer.More preferably, the solid content of this photocurable slurry is 15-60wt%, and the best is 20-40wt%.
Preferably, the material of this conductive layer 23 is metal or metallic compound, this metal is selected from the group be made up of gold, silver, platinum, lead, copper, aluminium, nickel, chromium, titanium, iron, cobalt and tin and their alloy, this metallic compound is selected from the group be made up of indium oxide, tin oxide, titanium oxide, aluminium oxide, zinc oxide, gallium oxide and tin indium oxide (indiumtinoxide, ITO) and their combination.More preferably, this metallic compound is tin indium oxide.
This substrate material 21 can be transparent insulation material.Preferably, the material of this substrate material 21 is polymer, this polymer is selected from by polyester based resin, polyethers system resin, polycarbonate-based resin, polyamide series resin, polyimides system resin, polyolefin-based resins, acrylic ester resin, polyvinyl chloride resin, polystyrene resin, polyvinyl alcohol resin, polyarylate system resin, polyphenylene sulfide system resin, the sub-vinylite of poly-dichloro, methacrylate ester resin, cellulose acetate (celluloseacetate), cellulose diacetate (diacetylcellulose) and Triafol T (triacetylcellulose), and the group that their combination is formed.More preferably, the material of this transparent substrates material is polyethylene terephthalate.
Limited especially although the thickness of this substrate material 21 there is no, be preferably the scope at 2-300 μm, be more preferred from the scope at 10-130 μm.When thickness does not reach 2 μm, the mechanical strength as substrate material can be not enough, the operation forming transparency conducting layer continuously can be become and be difficult to carry out.Again, if when thickness is more than 300 μm, then windabilityly easily to have problems, the coiling process of transparency conducting layer can be difficult to carry out.
The transparent conductive substrate that said method of the present invention is made, can be used in the formation of the various device such as contact panel and display.Especially goodly contact panel battery lead plate is used as.
Preferably, the first light source used in the step of this uncured photocurable material layer 22a of illumination can be ultraviolet light, visible ray, electron beam or X-ray, be more preferred from and use ultraviolet light to realize, and its UV-irradiation dosage is not less than 70mJ/cm
2, be preferably 70-4000mJ/cm
2, exposure dose is lower than 70mJ/cm
2then not easily form micro-structural, exposure dose is higher than 4000mJ/cm
2substrate material 21 is then easily made to be out of shape.More preferably, exposure dose is 100-3500mJ/cm
2, the best is 400-1500mJ/cm
2.In addition, aforesaid secondary light source also can be ultraviolet light, visible ray, electron beam or X-ray, is more preferred from and uses ultraviolet light to realize.In the present invention, the exposure dose of secondary light source, there is no and limit especially, as long as uncured photocurable material layer 22a can be made to solidify, all can be applied in the present invention.In addition, the first light source and secondary light source can be identical or different.
Consult Fig. 6, be the preferred embodiment of the transparent conductive substrate obtained by the inventive method, comprise: substrate material 21; Structurized photocurable material layer 22, is formed on this substrate material 21, and has concave-convex micro-structure surface 220; And conductive layer 23 is formed on the concave-convex micro-structure surface 220 of this structurized photocurable material layer 22.This conductive layer 23 has the upper surface 230 identical in fact with this concave-convex micro-structureization surface 220 shapes, and this upper surface 230 has Rz and is 0.5 μm-3.5 μm and Sm is the surface roughness of 0.05mm-0.35mm.Rz value is defined as 10 mean values (ten-pointmeanroughness) of the thickness disparity value between the thicker district of thickness (convex region) and thinner thickness district (recessed district), and Sm is the average headway (meanspacing) in adjacent land or recessed district.Rz and Sm can utilize probe-type surface analyzer (Japanese KOSAKA system, model ET-4000A) to test.
Preferably, this conductive layer 23 has the thickness of 10nm-300nm, is more preferred from 10-200nm.If when thickness is thinner than 10nm, being then difficult to become surface resistivity is 10
3the pantostrat with satisfactory electrical conductivity of Ω/below, if blocked up, easily causes the reduction etc. of the transparency.
Conductive base obtained by the present invention has concave-convex micro-structureization surface, if this conductive base is applied to the fields such as contact panel, compare the conductive base that surface is smooth, because the contact area of itself and another electrode is less, can reduce be stained with glutinous problem and because of pointer press line this conductive layer is caused pull, and this conductive layer is broken, peel off with substrate material even further.In addition, concaveconvex structure obtained by the present invention is wavy micro-structural, compared to the conductive base with folding angled construction (as sawtooth, right angle or trapezium structure), can reduce and make stress concentrate on this knuckle because external force presses, and this conductive layer is broken, cause the problem that surface resistivity rises.
Execution mode and effect of each object of the present invention will be described with embodiment below.It is noted that, this embodiment is only and illustrates use, and should not be interpreted as restriction of the invention process.
< embodiment 1>
Prepared by conductive base
By the photocurable prepolymer (Sartomer of 0.2g tool reactive functional group, model SR444, acrylic ester, functional group's equivalent is 99.3g/mol), add toluene 0.8g (Toluene) and light trigger 0.02g (U.S. Ciba, I-184), to be mixed with the photocurable slurry (1.02g) that solid content is 20wt%.
By made photocurable slurry 1.02g, drip (Japanese Toyobo, model A4300 on Polyester substrate material, 5cm × 5cm × 100 μm), with method of spin coating (SpinCoating, 1000rpm, 40 seconds), slurry is evenly flattened, be placed in the baking oven of constant temperature 80 DEG C, toast 3 minutes except desolventizing, then move in the baking oven of constant temperature 100 DEG C, toast 2 minutes to heat-treat, finally after cooling, form the uncured photocurable material layer above substrate material.
By live width 50 μm, the patterned shielding (light shield) that line-spacing is 50 μm is placed in the top of the substrate material scribbling uncured photocurable material layer.
Use ultraviolet exposure machine (U.S. Fusion), in a nitrogen environment, scribble the substrate material of uncured photocurable material layer with UV-irradiation, exposure dose is 520mJ/cm
2, with the photocurable material layer that forming section is regions curing.
Removed by light shield, in a nitrogen environment, then scribble the substrate material of the photocurable material layer that subregion is solidified with ultraviolet light direct irradiation, exposure dose is 450mJ/cm
2.The photocurable material layer of this subregion solidification forms the structurized photocurable material layer with concave-convex micro-structure surface after irradiating.
Be positioned in magnetic control sputtering plating cavity by the substrate material with structurized photocurable material layer, with the ITO of Sn/ (In+Sn)=10wt% for target, chamber vacuum degree is extracted into 3 × 10
-6after torr, pass into sputter gas Ar and O
2in cavity, O
2/ Ar=0.02, operating pressure is 5 × 10
-4torr, power is 4kW, to form the ITO conductive layer that thickness is 30nm on structurized photocurable material layer.
The surface roughness test of conductive base: the Ra value recording the conductive base of embodiment 1 with probe-type surface analyzer (Japanese KOSAKA system, model ET-4000A) is 0.21 μm, and Rz value is 0.73 μm, and Sm value is 0.099mm.Line mean roughness (centerlineaverageroughness) centered by Ra, Rz is 10 mean roughness (ten-pointmeanroughness), and Sm is average headway (meanspacing).
The resistance to stroke test of conductive base: conductive base and the electro-conductive glass that surface has sept are fitted, fit in the mode that their ITO layer is opposite to one another, abrasion resistant tester is used (to rise science and technology again, model SDT-009), at the another side (non-conductive face) of conductive base, rule back and forth 100,000 times (calculating back and forth once) with R0.8 formaldehyde resin pen, marking lengths 2cm, loading 250g.
The surface resistivity of conductive base measures: use Mitsubishi's oiling (stock) LotestAMCP-T400 resistance processed measurer, be that benchmark measures with 4 terminal methods according to JIS-K7194, the surface resistivity of the conductive base before measuring the test of resistance to stroke and after test, before resistance to stroke test, resistance is Ro, after resistance to stroke test, resistance is R, and calculate R/Ro resistance variations ratio, resistance variations ratio is healed, and to represent the structure of conductive base more stable for convergence 1, and transparency conducting layer is more not easy because external force produces crack or stripping.The surface resistivity change ratio result of conductive base is as shown in table 1.
< embodiment 2-4>
Except UV-irradiation scribbles the first time of the substrate material of uncured photocurable material layer except exposure dose difference, other conditions prepared by the conductive base of embodiment 2-4 are identical with embodiment 1.It is as shown in table 1 that the surface roughness of the exposure dose of embodiment 2-4, the live width of light shield and line-spacing, conductive base and surface resistivity change ratio result.
Table 1
Can find out when Rz is lower than 0.73 μm or higher than 2.82 μm from the result of surface resistivity change ratio (R/Ro) of embodiment 1-4, surface resistivity change ratio has cumulative trend, and the preferred range of display Rz is 0.73-2.82 μm.The requirement of conductive base in the application of contact panel is generally R/Ro≤1.3.But surface resistivity change ratio can have different requirements according to different application.
< embodiment 5-7>
Except UV-irradiation scribble the substrate material of uncured photocurable material layer first time exposure dose and the live width of light shield different from line-spacing except, other conditions prepared by the conductive base of embodiment 5-7 are identical with embodiment 1.It is as shown in table 2 that the surface roughness of the exposure dose of embodiment 5-7, the live width of light shield and line-spacing, conductive base and surface resistivity change ratio result.
Can find out when Sm is lower than 0.1mm or higher than 0.22mm from the result of surface resistivity change ratio (R/Ro) of embodiment 2 and 5-7, surface resistivity change ratio has cumulative trend, and the preferred range of display Sm is 0.1-0.22mm.
Table 2
< comparative example 1>
The preparation of the conductive base of comparative example 1 is directly positioned in magnetic control sputtering plating cavity by transparent substrates material, and with the ITO of Sn/ (In+Sn)=10wt% for target, chamber vacuum degree is extracted into 3 × 10
-6after torr, pass into sputter gas Ar and O
2in cavity, O
2/ Ar=0.02, operating pressure is 5 × 10
-4torr, power is 4kW, and base substrate temperature is room temperature, to form the ITO conductive layer that thickness is 30nm on substrate material.It is as shown in table 2 that the surface roughness of the conductive base of comparative example 1 and surface resistivity change ratio result.
The conductive base (embodiment 1-7) with structurized photocurable material layer 22 can be found out than the surface resistivity change ratio not having the conductive base of structurized photocurable material layer 22 (comparative example 1) to have comparatively to level off to 1 from the experimental result of table 1 and table 2, this result also further illustrates the present invention and utilizes structurized photocurable material layer 22 and can strengthen the bond strength of transparency conducting layer and substrate material and the structural strength of conductive layer itself, thus strengthens preventing transparency conducting layer under external force, producing crack or peeling off from substrate material.
But the above, be only preferred embodiment of the present invention, when not limiting scope of the invention process with this, namely all simple equivalences done according to claims of the present invention and description change and modify, and all still belong to the scope that the present invention is contained.
Claims (7)
1., for a manufacture method for the conductive base of contact panel, it is characterized in that comprising:
Substrate material forms uncured photocurable material layer, this uncured photocurable material layer is made up of photocurable constituent, this photocurable constituent comprises at least one and has multiple photocurable prepolymer carrying out photocuring reaction functional group, and this photocurable prepolymer has functional group's equivalent of 70-700 gram/mol;
There is provided patterned shielding, to cover this uncured photocurable material layer surface partly, the photocurable material layer making this uncured forms at least one shielded area and at least one non-obstructing district;
Make the first light source by this patterned shielding, this photocurable prepolymer in this non-obstructing district in the photocurable material layer making this uncured produces curing reaction, so as to the photocurable material layer that the photocurable material layer forming section making this uncured is regions curing, it have at least one convex curing area and the uncured district of at least one concavity;
Remove this patterned shielding;
Irradiate with secondary light source, the photocurable material layer of this subregion of further solidification solidification, the uncured district of concavity of the photocurable material layer that this subregion is solidified produces curing reaction, forms the structurized photocurable material layer with concave-convex micro-structure surface whereby; And
The micro-structure surface of this structurized photocurable material layer forms conductive layer;
This patterned shielding has the transmission region and alternatively non-transparent region that are alternately arranged, and described transmission region has the spacing of 50 μm-250 μm, and this first light source is ultraviolet light, and its exposure dose is for being not less than 70mJ/cm
2and not higher than 4000mJ/cm
2.
2. manufacture method according to claim 1, is characterized in that: this has multiple photocurable prepolymer carrying out photocuring reaction functional group is be selected from the group be made up of the combination of multi-functional acrylic's resin prepolymer, multi-functional amidocarbonic acid acrylic resin prepolymer and aforementioned prepolymer.
3. manufacture method according to claim 1, is characterized in that: this secondary light source is ultraviolet light, visible ray, electron beam or X-ray.
4. manufacture method according to claim 1, it is characterized in that: the material of this substrate material is polymer, this polymer is selected from by polyester based resin, polyethers system resin, polycarbonate-based resin, polyamide series resin, polyimides system resin, polyolefin-based resins, acrylic ester resin, polyvinyl chloride resin, polystyrene resin, polyvinyl alcohol resin, polyarylate system resin, polyphenylene sulfide system resin, the sub-vinylite of poly-dichloro, methacrylate ester resin, cellulose acetate, cellulose diacetate and Triafol T, and the group that their combination is formed.
5. manufacture method according to claim 1, it is characterized in that: the material of this conductive layer is metal or metallic compound, this metal is selected from the group be made up of gold, silver, platinum, lead, copper, aluminium, nickel, chromium, titanium, iron, cobalt and tin and their alloy, and this metallic compound is selected from the group be made up of indium oxide, tin oxide, titanium oxide, aluminium oxide, zinc oxide, gallium oxide and tin indium oxide and their combination.
6. manufacture method according to claim 1, is characterized in that: this conductive layer is deposited on the micro-structure surface of this structurized photocurable material layer with sputtering way.
7. the conductive base for contact panel, it is characterized in that: this conductive base is that manufacture method according to claim 1 obtains, wherein, this conductive layer has a upper surface, this upper surface has Rz and is 0.5 μm-3.5 μm and Sm is the surface roughness of 0.05mm-0.35mm, wherein, Rz value is defined as 10 mean values of the thickness disparity value in convex region and recessed interval, and Sm is the average headway in adjacent land or recessed district.
Priority Applications (1)
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| CN201110384133.XA CN103137244B (en) | 2011-11-28 | 2011-11-28 | For conductive base and the manufacture method thereof of contact panel |
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| CN201110384133.XA CN103137244B (en) | 2011-11-28 | 2011-11-28 | For conductive base and the manufacture method thereof of contact panel |
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| CN103137244B true CN103137244B (en) | 2015-12-09 |
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| CN1784449A (en) * | 2003-05-07 | 2006-06-07 | 三井化学株式会社 | Cationically photopolymerizable resin composition and optical disk surface protection material |
| CN101263564A (en) * | 2005-09-12 | 2008-09-10 | 日东电工株式会社 | Transparent conductive film, electrode plate for touch panel, and the touch panel |
| CN201518237U (en) * | 2009-09-04 | 2010-06-30 | 远东新世纪股份有限公司 | Conducting laminated body |
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| JP4635756B2 (en) * | 2005-07-14 | 2011-02-23 | Ｊｓｒ株式会社 | Method for forming optical member |
| JP2011086785A (en) * | 2009-10-16 | 2011-04-28 | Bridgestone Corp | Method of manufacturing light permeable electromagnetic shield material, and light permeable electromagnetic shield material |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1784449A (en) * | 2003-05-07 | 2006-06-07 | 三井化学株式会社 | Cationically photopolymerizable resin composition and optical disk surface protection material |
| CN101263564A (en) * | 2005-09-12 | 2008-09-10 | 日东电工株式会社 | Transparent conductive film, electrode plate for touch panel, and the touch panel |
| CN201518237U (en) * | 2009-09-04 | 2010-06-30 | 远东新世纪股份有限公司 | Conducting laminated body |
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