CN103137244A - Electric conduction base material and manufacturing method of electric conduction base material - Google Patents
Electric conduction base material and manufacturing method of electric conduction base material Download PDFInfo
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- CN103137244A CN103137244A CN201110384133XA CN201110384133A CN103137244A CN 103137244 A CN103137244 A CN 103137244A CN 201110384133X A CN201110384133X A CN 201110384133XA CN 201110384133 A CN201110384133 A CN 201110384133A CN 103137244 A CN103137244 A CN 103137244A
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Abstract
An electric conduction base material and a manufacturing method of the electric conduction base material comprise that a non-solidification photo-curing material layer is formed on a substrate material and formed by components capable of achieving photo-curing, and the components capable of achieving photo-curing comprise at least one kind of prepolymer capable of achieving photo-curing provided with a plurality of reactiveness functional groups and 70-700 g/mol of functional group equivalences; a patterning shield layer is provided; a first light source passes through the patterning shield layer, and the non-solidification photo-curing material layer is enabled to form a photo-curing material layer with a partial region solidified; the patterning shield layer is removed; a second light source irradiates to further solidify the photo-curing material layer with the partial region solidified, and therefore a structured photo-curing material layer with a microstructural surface is formed; and an electric conduction layer is formed on the microstructural surface of the structured photo-curing material layer.
Description
Technical field
The present invention relates to a kind of conductive base and make the method for this conductive base, particularly relate to conductive base and manufacture method thereof that a kind of formation has micro-structure surface.
Background technology
Conductive base can be applied to electrooptical device, as display, contact panel, transducer, Electronic Paper, and optical element etc.
Typical conductive base, for example resistance-type or capacitance type touch control substrate, have the substrate material usually, and be formed on lip-deep metal or the metal oxide transparent conducting layer of substrate material.When pressing line due to touch base plate with pointer, the conductive layer that is positioned at the upper strata can be subjected to external force and produce regional area deformation, and then makes contact and conducting between two each interval conductive layers.Be stained with glutinous phenomenon but can produce during due to two conductive layer contacts, when the external force that presses disappears, be positioned at the conductive layer on upper strata with reinstatement, the strength that can make conductive layer be pullled this moment.So easily cause breaking of conductive layer to be peeled off repeating to press under line (for example pressing line with pointer), the resistance value that makes conductive layer raises and the unstable situation of sending a telegraph property occurs.Therefore how to improve the bond strength of conductive layer and substrate material and the structural strength of conductive layer itself, and prevent that conductive layer from producing the crack and peeling off is an important topic under external force.
United States Patent (USP) discloses 2003/0087119 in early days and discloses a kind of electrically conducting transparent base material, and it has transparent polymer substrate material, is formed on the transparency conducting layer on this transparent polymer substrate material, and covers the cover layer on this transparency conducting layer.This tectal material can be metal oxide, metal nitride, metal oxynitride, carbon, carbonization nitrogen, carborundum etc.Utilize this cover layer and can prevent that transparency conducting layer from producing the crack or peeling off under external force.But because this cover layer will form with sputtering way, therefore make the technique of making this electrically conducting transparent base material comparatively complicated.
United States Patent (USP) 6,629,833 disclose a kind of electrically conducting transparent base material, and it has the plastic base ground, is formed on to contain the ionic group resin bed on this plastic base ground, and is formed on this and contains transparency conducting layer on the ionic group resin.Utilize this tackness that contains the ionic group resin, this transparency conducting layer can be bonding on this plastic base ground securely to prevent that transparency conducting layer from producing the crack or peeling off under external force.But because this contains the ionic group resin and has tackness, make external particulates such as easily being stained with glutinous dust in the process of making the electrically conducting transparent base material.
Outside upper method, the general another kind of mode that prevents that conductive layer from producing the crack and peeling off under external force, to be used in conductive layer surface to form concave-convex micro-structure so as to reducing the contact area between two conductive layers, can effectively reduce whereby conductive layer and be stained with glutinous pullling strength and then the useful life of prolongation conductive layer of causing because of contact.
General method of making micro-structural has physics stamped method or chemical method for etching etc., but the birth defect that these methods all have its technique to cause.For example, the physics stamped method is difficult for evenly because of force of impression, so easily affect precision and the size of micro-structural, and the micro-structural that impresses out has knuckle shape structure (as sawtooth, right angle or trapezium structure) mostly, and the existence of this knuckle can make the easier stress of conductive layer concentrate and accelerate damaged or be difficult for forming continuous conductive layer; And the chemical method for etching of mentioning in United States Patent (USP) 6,036,579, wherein etching solution used is expensive, and can cause environmental pollution, and the micro-structural that etches also has knuckle mostly, so the problem identical with the physics stamped method also arranged.
Based on aforesaid shortcoming, to need badly on industrial quarters and develop a kind of chemical etching liquor that need not, difficult generation has the micro-structural of acute angle, and the technology that simultaneously tackness between conductive layer and substrate material is more promoted, to overcome the problem of aforementioned all prior aries.
Summary of the invention
Therefore, the object of the present invention is to provide a kind ofly can prevent that transparency conducting layer from producing break or peel off from the substrate material under external force, need not chemical etching liquor and make simple conductive base preparation method.
According to a kind of disclosed method of making conductive base, comprise: form uncured photo-curing material layer on the substrate material, this uncured photo-curing material layer is made of the photocurable constituent, this photocurable constituent comprises at least a photocurable prepolymer with a plurality of reactive functional group, and this photocurable prepolymer has functional group's equivalent of 70-700 g/mol (g/mol); Patterned shielding is provided, surperficial to cover partly this uncured photo-curing material layer, make this uncured photo-curing material layer form at least one shielded area and at least one non-shielded area; Make the first light source by this patterned shielding, make the photocurable prepolymer of the non-shielded area in this uncured photo-curing material layer produce curing reaction, so as to the photo-curing material layer that this uncured photo-curing material layer forming section zone is solidified, have at least one convex curing area and at least one concavity uncured district on it; Remove this patterned shielding; Shine with secondary light source, photo-curing material layer with this subregion curing of further curing, make the concavity uncured district generation of the photo-curing material floor of this subregion curing solidify curing reaction, form whereby the structurized photo-curing material layer with concave-convex micro-structure surface; And form conductive layer on the micro-structure surface of this structurized photo-curing material layer.
Preferably, this photocurable prepolymer with a plurality of reactive functional group is to select free multi-functional acrylic resin prepolymer, multi-functional amido formic acid acrylic resin prepolymer, and the combination of the aforementioned prepolymer group that forms.
Preferably, this patterned shielding has transmission region and the non-transmission region of alternative arrangement, and described transmission region has the spacing of 50 μ m-250 μ m.
Preferably, this first light source and this secondary light source are ultraviolet light, visible light, electron beam or X-ray.
Preferably, this first light source is ultraviolet light, and its exposure dose is for being not less than 70mJ/cm
2And not higher than 4000mJ/cm
2
Preferably, the material of this substrate material is polymer, and it is that resin, polycarbonate-based resin, polyamide-based resin, polyimides are that resin, polyolefin-based resins, acrylic ester resin, polyvinyl chloride resin, polystyrene resin, polyvinyl alcohol resin, polyarylate are that resin, polyphenylene sulfide are resin, the inferior vinylite of poly-dichloro, methacrylate ester resin, cellulose acetate, cellulose diacetate and Triafol T, and their the combination group that consists of that this polymer selects free polyester based resin, polyethers.
Preferably, the material of this conductive layer is metal or metallic compound, this metal is to select free gold, silver, platinum, lead, copper, aluminium, nickel, chromium, titanium, iron, cobalt and tin, and their the alloy group that consists of, and this metallic compound is to select free indium oxide, tin oxide, titanium oxide, aluminium oxide, zinc oxide, gallium oxide and tin indium oxide, and their the combination group that consists of.
Preferably, this conductive layer is to be deposited on the micro-structure surface of this structurized photo-curing material layer with sputtering way.
The present invention also discloses a kind of conductive base that makes according to the method for above-mentioned manufacturing conductive base, and wherein, this conductive layer has a upper surface, and it is that 0.5 μ m-3.5 μ m and Sm are the surface roughness of 0.05mm-0.35mm that this upper surface has Rz.
Beneficial effect of the present invention is: the micro-structure surface that utilizes this structurized photo-curing material layer, make conductive layer surface form concave-convex micro-structure, can increase whereby the bond strength of conductive layer and substrate material and the structural strength of conductive layer itself, thereby strengthen preventing that transparency conducting layer from producing breaks or peel off from the substrate material under external force.
Description of drawings
Fig. 1 to Fig. 6 illustrates the step of the preferred embodiment of a kind of method of making conductive base of the present invention.Wherein:
Fig. 1 is schematic side view, illustrates that preferred embodiment of the present invention forms uncured photo-curing material layer on base material;
Fig. 2 is schematic side view, illustrates that preferred embodiment of the present invention uses light shield to cover this uncured photo-curing material layer with patterning ground;
Fig. 3 is schematic side view, and the preferred embodiment of the present invention photo-curing material layer that solidify formed subregion after this uncured photo-curing material layer that exposes is described patternedly;
Fig. 4 is schematic side view, and curing area and the uncured district of the photo-curing material floor of the preferred embodiment of the present invention regional curing of exposed portion simultaneously is described;
Fig. 5 is schematic side view, and preferred embodiment of the present invention resulting structurized photo-curing material layer with concave-convex micro-structure surface after Fig. 4 step is described; And
Fig. 6 is schematic side view, and preferred embodiment of the present invention sputter layer of transparent conductive layer and obtain conductive base on the formed structurized photo-curing material layer of Fig. 5 is described.
Embodiment
The present invention is described in detail below in conjunction with drawings and Examples.
Before the present invention is described in detail, be noted that in the following description content, similarly element is to represent with identical numbering.
Consult Fig. 1 to Fig. 6, a kind of preferred embodiment of making the method for conductive base of the present invention comprises following steps:
(a) the photocurable slurry is coated on transparent substrates material 21 to form the photocurable pulp layer, this photocurable slurry has photocurable constituent and solvent, this photocurable constituent comprises light trigger and at least a photocurable prepolymer with a plurality of reactive functional group, and this photocurable prepolymer has functional group's equivalent of 70-700 g/mol (g/mol), and this photocurable prepolymer can be monomer or oligomerization compound;
(b) dry this photocurable pulp layer, to remove the solvent in this photocurable slurry, make and form the uncured photo-curing material layer 22a (as Fig. 1) with photocurable prepolymer on this substrate material 21, described reactive functional group can be caused by free radical and produce cross-linking reaction;
(c) provide patterned shielding 31, to cover partly this uncured photo-curing material layer 22a (as Fig. 2), make this uncured photo-curing material layer 22a form at least one shielded area 222 and at least one non-shielded area 221;
(d) make the first light source (L
1) by this patterned shielding 31, make the photocurable prepolymer of the non-shielded area 221 in this uncured photo-curing material layer 22a produce curing reaction.Above-mentioned curing reaction is to utilize the light trigger cracking to produce free radical, and the light curable functional group prepolymer that therefore causes the non-shielded area 221 of this uncured photo-curing material layer 22a produces polymerization reaction and solidifies gradually, and therefore cause the photocurable constituent in the shielded area 222 of this uncured photo-curing material layer 22a to flow towards this non-shielded area 221, and then the photo-curing material floor 22b (as Fig. 3) that makes this uncured photo-curing material floor 22a form to have convex curing area 223 and the subregion in concavity uncured district 224 to solidify;
(e) remove this patterned shielding 31 (as Fig. 4);
(f) use secondary light source (L
2), shine the photo-curing material layer 22b (as Fig. 4) that solidify this subregion, make this concavity uncured district 224 of photo-curing material 22b that this subregion solidifies be solidified to form concavity curing area 225, and therefore form the structurized photo-curing material layer 22 (as Fig. 5) with concave-convex micro-structure surface 220 on this substrate material 21; And
(g) form transparency conducting layer 23 (as Fig. 6) with sputter or evaporation mode on this structurized photo-curing material layer 22.
This patterned shielding 31 has the transmission region 311 and non-transmission region 312 of alternative arrangement, and every two adjacent transmission regions 311 have the spacing (d) of 50 μ m-250 μ m.The light-permeable of this patterned shielding 31 zone 311 sees through this first light source for being used for, and should non-transmission region 312 for for stop, absorption or reflection source.
Can be used for the material as photocurable prepolymer of the present invention, comprise but be not limited in functionality amido formic acid acrylic resin prepolymer and the combination thereof that the hydroxyl alkane ester etc. of functionality acrylic resin prepolymer, polyalcohol and the acrylic or methacrylic of acrylic acid with polyalcohol or acrylate is synthesized.Preferably, this prepolymer material is acrylate.
Preferably, this prepolymer has functional group's equivalent of 70-700 g/mol.Functional group's equivalent of prepolymer is defined as follows:
Functional group's equivalent of prepolymer=(functional group's number of the molecular weight/prepolymer of prepolymer)
More preferably, functional group's equivalent of this prepolymer is 80-600 g/mol, and the best is 85-400 g/mol.The formation of the photo-curing material layer 22 of the photocuring reaction theory and structure of this prepolymer is further described following.Have the material that can carry out the functional group of photocuring reaction, be called photo-curing material.Photo-curing material is mixed with light trigger, form uncured photo-curing material layer with coating method, again this layer carried out the irradiation of ultraviolet light, ultraviolet light can be cracked into light trigger free radical (free radical), and the functional group that free radical causes photo-curing material produces reaction, along with the carrying out of reaction, the molecular weight of photo-curing material layer and viscosity can continue to rise, until the viscosity of photo-curing material layer is excessive, ends photocuring reaction, and form dry and comfortable surface.Curing area in the photo-curing material layer, owing to producing photocuring reaction, need more still unreacted photo-curing materials to carry out photocuring reaction, therefore unreacted photo-curing material still, can be flowed toward curing area by uncured district, so that still unreacted photo-curing material to be provided, make the photocuring reaction in curing area can continue to carry out.Still unreacted photo-curing material, by the flow phenomenon of uncured district toward curing area, make the curing area of photo-curing material layer become thicker, and present the mountain peak shape of protuberance; Simultaneously also make the uncured district of photo-curing material floor become thinner, and present the mountain valley shape of depression, make curing area and uncured interval the difference on thickness occur, form the surface micro-structure that mountain peak and mountain valley alternately occur.When the molecular weight of photo-curing material less, still the flow rate of unreacted photo-curing material in the photo-curing material layer is faster, still unreacted photo-curing material can comparatively fast flow to curing area by uncured district, make the Rz value between uncured district and curing area higher, represent that also formed surface micro-structure can be more obvious.When functional group's number of photo-curing material is healed large, photo-curing material is when carrying out photocuring reaction, its extent of reaction can be more fierce, making still, unreacted photo-curing material can comparatively fast flow to curing area by uncured district, to keep the carrying out of photocuring reaction, this makes the Rz value between uncured district and curing area higher, represents that also formed surface micro-structure can be more obvious.
Here it is noted that, can be to solidify fully or solidify partially in step (c) with the state of cure of photo-curing material (e), as long as can make photo-curing material no longer have mobility, is not particularly limited in the present invention.
The solvent that can be applicable in the present invention is not particularly limited, as long as the solvent that photocurable materials is fully dissolved all can be used, can be selected from alcohols, ketone, ester class, halogenated solvent, hydro carbons etc., for example: acetone, acetonitrile, chloroform, chlorophenol, cyclohexane, cyclohexanone, cyclopentanone, carrene, diethyl acetate, dimethyl carbonate, ethanol, ethyl acetate, N, N-dimethylacetylamide, 1,2-PD, methyl-n-butyl ketone, methyl alcohol, methyl acetate, butyl acetate, toluene and oxolane, and their the combination group that consists of.
There is no particular restriction to can be applicable to light trigger in the present invention, all can use as long as can make light-curable resin carry out photocuring reaction, can be selected from vinyl benzene ketone, benzophenone derivates, michler's ketone, benzyne, benzyl derivative, benzoin derivatives, benzoin methylether class, alpha-acyloxy ester, thioxanthene ketone and Anthraquinones, and their the combination group that consists of.The use amount of this initator also and unrestricted, better use amount is for being not less than 0.01wt% (take the photocurable slurry composition as 100wt% time).
Preferably, this photocurable slurry has the solid content of 10-80wt%, if solid content lower than 10wt%, irradiating ultraviolet light be difficult for to form concave-convex micro-structure, if solid content is difficult for being coated with greater than 80wt%, and the easy embrittlement of irradiating ultraviolet light posterior photocuring material layer.More preferably, the solid content of this photocurable slurry is 15-60wt%, and the best is 20-40wt%.
Preferably, the material of this conductive layer 23 is metal or metallic compound, this metal is to select free gold, silver, platinum, lead, copper, aluminium, nickel, chromium, titanium, iron, cobalt and tin, and their the alloy group that consists of, this metallic compound is to select free indium oxide, tin oxide, titanium oxide, aluminium oxide, zinc oxide, gallium oxide and tin indium oxide (indium tin oxide, ITO), and their the combination group that consists of.More preferably, this metallic compound is tin indium oxide.
This substrate material 21 can be transparent insulation material.preferably, the material of this substrate material 21 is polymer, this polymer is to select free polyester based resin, polyethers is resin, polycarbonate-based resin, polyamide-based resin, polyimides is resin, polyolefin-based resins, the acrylic ester resin, the polyvinyl chloride resin, polystyrene resin, polyvinyl alcohol resin, polyarylate is resin, polyphenylene sulfide is resin, the inferior vinylite of poly-dichloro, the methacrylate ester resin, cellulose acetate (cellulose acetate), cellulose diacetate (diacetyl cellulose) and Triafol T (triacetyl cellulose), and their the combination group that consists of.More preferably, the material of this transparent substrates material 21 is polyethylene terephthalate.
Although the thickness of this substrate material 21 there is no especially and is limited, be preferably the scope at 2-300 μ m, be more preferred from the scope at 10-130 μ m.When thickness does not reach 2 μ m, can be not enough as the mechanical strength of substrate material, make the operation meeting of continuous formation transparency conducting layer become and be difficult to carry out.Again, if when thickness surpassed 300 μ m, coiling property easily had problems, the coiling process of transparency conducting layer can be difficult to carry out.
The electrically conducting transparent base material that said method of the present invention is made can be used in the formation of the various devices such as contact panel and display.Especially better the use as the contact panel battery lead plate.
Preferably, the first light source that uses in the step of this uncured photo-curing material layer 22a of illumination can be ultraviolet light, visible light, electron beam or X-ray, be more preferred from ultraviolet light and realize, and its UV-irradiation dosage is not less than 70mJ/cm
2, be preferably 70-4000mJ/cm
2, exposure dose is lower than 70mJ/cm
2Be difficult for forming micro-structural, exposure dose is higher than 4000mJ/cm
2Easily make 21 distortion of substrate material.More preferably, exposure dose is 100-3500mJ/cm
2, the best is 400-1500mJ/cm
2In addition, aforesaid secondary light source also can be ultraviolet light, visible light, electron beam or X-ray, is more preferred from ultraviolet light and realizes.The exposure dose of secondary light source in the present invention there is no restriction especially, so long as uncured photo-curing material layer 22a solidified, all can be applied in the present invention.In addition, the first light source and secondary light source can be identical or different.
Consult Fig. 6, the preferred embodiment for electrically conducting transparent base material prepared according to the inventive method comprises: substrate material 21; Structurized photo-curing material layer 22 is formed on this substrate material 21, and has concave-convex micro-structure surface 220; And conductive layer 23 is formed on the concave-convex micro-structure surface 220 of this structurized photo-curing material layer 22.This conductive layer 23 has the upper surface 230 identical in fact with surperficial 220 shapes of this concave-convex micro-structureization, and it is that 0.5 μ m-3.5 μ m and Sm are the surface roughness of 0.05mm-0.35mm that this upper surface 230 has Rz.The Rz value is defined as 10 mean values (ten-point mean roughness) of the thickness disparity value between the thicker district of thickness (convex region) and thinner thickness district (recessed district), and Sm is the average headway (mean spacing) in adjacent land or recessed district.Rz and Sm can utilize probe-type surface analyzer (Japanese KO SAKA system, model ET-4000A) to test.
Preferably, this conductive layer 23 has the thickness of 10nm-300nm, is more preferred from 10-200nm.When if thickness is thinner than 10nm, being difficult to become surface resistivity is 10
3If the pantostrat with satisfactory electrical conductivity that Ω/ is following is the blocked up reduction that easily causes the transparency etc.
Prepared conductive base has concave-convex micro-structureization surface according to the present invention, if this conductive base is applied to the fields such as contact panel, compare the conductive base that has an even surface, because of the contact area of itself and another electrode less, can reduce and be stained with glutinous problem and rule to pullling that this conductive layer causes because pointer presses, and make this conductive layer break, even further peel off with the substrate material.In addition, the prepared concaveconvex structure of the present invention is wavy micro-structural, compared to the conductive base with knuckle shape structure (as sawtooth, right angle or trapezium structure), can reduce because external force presses makes stress concentrate on this knuckle, and this conductive layer is broken, the problem that causes surface resistivity to rise.
Below execution mode and the effect of each purpose of the present invention will be described with embodiment.It is noted that, this embodiment is only for illustrating use, and should not be interpreted as restriction of the invention process.
＜embodiment 1 〉
The conductive base preparation
Photocurable prepolymer (Sartomer with 0.2g tool reactive functional group, model SR444, acrylic ester, functional group's equivalent is 99.3g/mol), add toluene 0.8g (Toluene) and light trigger 0.02g (U.S. Ciba, I-184), to be mixed with solid content as the photocurable slurry (1.02g) of 20wt%.
With the photocurable slurry 1.02g that makes, dripping is (Japanese Toyobo, model A4300 on the substrate material in polyester, 5cm * 5cm * 100 μ m), with method of spin coating (Spin Coating, 1000rpm, 40 seconds), slurry is evenly flattened, be placed in the baking oven of 80 ℃ of constant temperature, toast desolventizing in 3 minutes, then move in the baking oven of 100 ℃ of constant temperature, toast 2 minutes to heat-treat, after at last cooling, form the uncured photo-curing material layer of substrate material top.
With live width 50 μ m, the patterned shielding (light shield) of line-spacing 50 μ m is placed in the top of the substrate material that scribbles uncured photo-curing material layer.
Use ultraviolet exposure machine (U.S. Fusion), under nitrogen environment, scribble the substrate material of uncured photo-curing material layer with UV-irradiation, exposure dose is 520mJ/cm
2, with the photo-curing material layer of forming section zone curing.
Light shield is removed, under nitrogen environment, more directly shone with ultraviolet light the substrate material that scribbles the photo-curing material layer that solidifies the subregion, exposure dose is 450mJ/cm
2The photo-curing material layer that solidify this subregion forms the structurized photo-curing material layer with concave-convex micro-structure surface through after shining.
The substrate material that will have structurized photo-curing material layer is positioned in the magnetic control sputtering plating cavity, and take the ITO of Sn/ (In+Sn)=10wt% as target, the chamber vacuum degree is extracted into 3 * 10
-6After torr, pass into sputter gas Ar and O
2In cavity, O
2/ Ar=0.02, operating pressure is 5 * 10
-4Torr, power are 4kW, to form thickness as the ITO conductive layer of 30nm on structurized photo-curing material layer.
The surface roughness test of conductive base: the Ra value that records the conductive base of embodiment 1 with probe-type surface analyzer (Japanese KO SAKA system, model ET-4000A) is 0.21 μ m, and the Rz value is 0.73 μ m, and the Sm value is 0.099mm.Line mean roughness centered by Ra (center line average roughness), Rz are 10 mean roughness (ten-point mean roughness), and Sm is average headway (mean spacing).
The anti-stroke test of conductive base: the electro-conductive glass that conductive base and surface is had sept is fitted, fit in the mode that their ITO layer is opposite to one another, use abrasion resistant tester (to rise again science and technology, model SDT-009), another side (non-conductive face) at conductive base, rule back and forth 100,000 times (calculating once back and forth) with R0.8 formaldehyde resin pen, marking lengths 2cm, loading 250g.
The surface resistivity of conductive base measures: use Mitsubishi's oiling (thigh) Lotest AMCP-T400 processed resistance measurer, be that benchmark is measured with 4 terminal methods according to JIS-K7194, measure before the test of anti-stroke with test after the surface resistivity of conductive base, before anti-stroke test, resistance is Ro, after anti-stroke test, resistance is R, and calculating R/Ro resistance variations ratio, the resistance variations ratio convergence 1 of healing represents that the structure of conductive base is more stable, and transparency conducting layer more is not easy produce the crack or peel off because of external force.It is as shown in table 1 that the surface resistivity of conductive base changes the ratio result.
＜embodiment 2-4 〉
Except UV-irradiation scribbled the difference of exposure dose for the first time of substrate material of uncured photo-curing material layer, other conditions of the conductive base of embodiment 2-4 preparation were identical with embodiment 1.It is as shown in table 1 that the surface roughness of the exposure dose of embodiment 2-4, the live width of light shield and line-spacing, conductive base and surface resistivity change the ratio result.
Table 1
When the result that changes ratio (R/Ro) from the surface resistivity of embodiment 1-4 can be found out as Rz lower than 0.73 μ m or higher than 2.82 μ m, surface resistivity changes ratio cumulative trend, and the preferred range of demonstration Rz is 0.73-2.82 μ m.The requirement of conductive base in the application of contact panel is generally R/Ro≤1.3.But surface resistivity changes ratio, different requirements can be arranged according to different application.
＜embodiment 5-7 〉
The live width that scribbles the exposure dose for the first time of substrate material of uncured photo-curing material layer and light shield except UV-irradiation is from line-spacing is different, and other conditions of the conductive base preparation of embodiment 5-7 are identical with embodiment 1.It is as shown in table 2 that the surface roughness of the exposure dose of embodiment 5-7, the live width of light shield and line-spacing, conductive base and surface resistivity change the ratio result.
When the result that changes ratio (R/Ro) from the surface resistivity of embodiment 2 and 5-7 can be found out as Sm lower than 0.1mm or higher than 0.22mm, surface resistivity changes ratio cumulative trend, and the preferred range of demonstration Sm is 0.1-0.22mm.
Table 2
＜comparative example 1 〉
The preparation of the conductive base of comparative example 1 is directly the transparent substrates material to be positioned in the magnetic control sputtering plating cavity, and take the ITO of Sn/ (In+Sn)=10wt% as target, the chamber vacuum degree is extracted into 3 * 10
-6After torr, pass into sputter gas Ar and O
2In cavity, O
2/ Ar=0.02, operating pressure is 5 * 10
-4Torr, power are 4kW, and substrate material temperature is room temperature, to form thickness as the ITO conductive layer of 30nm on the substrate material.It is as shown in table 2 that the surface roughness of the conductive base of comparative example 1 and surface resistivity change the ratio result.
Can find out from the experimental result of table 1 and table 2 that conductive base (embodiment 1-7) with structurized photo-curing material layer 22 has than the conductive base that there is no structurized photo-curing material layer 22 (comparative example 1) levels off to 1 surface resistivity and changes ratio, this result also further illustrates the present invention and utilizes structurized photo-curing material layer 22 and can strengthen the bond strength of transparency conducting layer and substrate material and the structural strength of conductive layer itself, thereby strengthens preventing that transparency conducting layer from producing the crack or peeling off from the substrate material under external force.
But the above is only preferred embodiment of the present invention, and when not limiting scope of the invention process with this, i.e. all simple equivalences of doing according to claims of the present invention and description change and modify, and all still belong to the scope that the present invention is contained.
Claims (10)
1. method of making conductive base is characterized in that comprising:
Form uncured photo-curing material layer on the substrate material, this uncured photo-curing material layer is made of the photocurable constituent, this photocurable constituent comprises at least a photocurable prepolymer with a plurality of reactive functional group, and this photocurable prepolymer has functional group's equivalent of 70-700 g/mol;
Patterned shielding is provided, surperficial to cover partly this uncured photo-curing material layer, make this uncured photo-curing material layer form at least one shielded area and at least one non-shielded area;
Make the first light source by this patterned shielding, make this photocurable prepolymer of this non-shielded area in this uncured photo-curing material layer produce curing reaction, so as to the photo-curing material layer that this uncured photo-curing material layer forming section zone is solidified, have at least one convex curing area and at least one concavity uncured district on it;
Remove this patterned shielding;
Shine with secondary light source, further solidify the photo-curing material layer that solidify this subregion, make the uncured district's generation of the concavity curing reaction of the photo-curing material floor of this subregion curing, form whereby the structurized photo-curing material layer with concave-convex micro-structure surface; And
Form conductive layer on the micro-structure surface of this structurized photo-curing material layer.
2. the method for manufacturing conductive base according to claim 1 is characterized in that: this photocurable prepolymer with a plurality of reactive functional group is freely multi-functional acrylic resin prepolymer, multi-functional amido formic acid acrylic resin prepolymer, and the combination of the aforementioned prepolymer group that forms of choosing.
3. the method for manufacturing conductive base according to claim 1, it is characterized in that: this patterned shielding has transmission region and the non-transmission region of alternative arrangement, and described transmission region has the spacing of 50 μ m-250 μ m.
4. the method for manufacturing conductive base according to claim 1, it is characterized in that: this first light source is ultraviolet light, visible light, electron beam or X-ray.
5. the method for manufacturing conductive base according to claim 1, it is characterized in that: this secondary light source is ultraviolet light, visible light, electron beam or X-ray.
6. the method for manufacturing conductive base according to claim 1, it is characterized in that: this first light source is ultraviolet light, and its exposure dose is for being not less than 70mJ/cm
2And not higher than 4000mJ/cm
2
7. the method for manufacturing conductive base according to claim 1, it is characterized in that: the material of this substrate material is polymer, this polymer selects free polyester based resin, polyethers is resin, polycarbonate-based resin, polyamide-based resin, polyimides is resin, polyolefin-based resins, the acrylic ester resin, the polyvinyl chloride resin, polystyrene resin, polyvinyl alcohol resin, polyarylate is resin, polyphenylene sulfide is resin, the inferior vinylite of poly-dichloro, the methacrylate ester resin, cellulose acetate, cellulose diacetate and Triafol T, and their the combination group that consists of.
8. the method for manufacturing conductive base according to claim 1, it is characterized in that: the material of this conductive layer is metal or metallic compound, this metal is to select free gold, silver, platinum, lead, copper, aluminium, nickel, chromium, titanium, iron, cobalt and tin, and their the alloy group that consists of, and this metallic compound is to select free indium oxide, tin oxide, titanium oxide, aluminium oxide, zinc oxide, gallium oxide and tin indium oxide, and their the combination group that consists of.
9. the method for manufacturing conductive base according to claim 1, it is characterized in that: this conductive layer is to be deposited on the micro-structure surface of this structurized photo-curing material layer with sputtering way.
10. conductive base, it is characterized in that: this conductive base is that the method for manufacturing conductive base according to claim 1 makes, wherein, this conductive layer has a upper surface, and it is that 0.5 μ m-3.5 μ m and Sm are the surface roughness of 0.05mm-0.35mm that this upper surface has Rz.
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| CN201110384133.XA CN103137244B (en) | 2011-11-28 | 2011-11-28 | For conductive base and the manufacture method thereof of contact panel |
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| CN201110384133.XA CN103137244B (en) | 2011-11-28 | 2011-11-28 | For conductive base and the manufacture method thereof of contact panel |
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| CN103137244A true CN103137244A (en) | 2013-06-05 |
| CN103137244B CN103137244B (en) | 2015-12-09 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106457858A (en) * | 2014-06-20 | 2017-02-22 | 3M创新有限公司 | Printing of multiple inks to achieve precision registration during subsequent processing |
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| CN1784449A (en) * | 2003-05-07 | 2006-06-07 | 三井化学株式会社 | Cationically photopolymerizable resin composition and optical disk surface protection material |
| JP2007025091A (en) * | 2005-07-14 | 2007-02-01 | Jsr Corp | Method for forming optical member |
| CN101263564A (en) * | 2005-09-12 | 2008-09-10 | 日东电工株式会社 | Transparent conductive film, electrode plate for touch panel, and the touch panel |
| CN201518237U (en) * | 2009-09-04 | 2010-06-30 | 远东新世纪股份有限公司 | Conducting laminated body |
| JP2011086785A (en) * | 2009-10-16 | 2011-04-28 | Bridgestone Corp | Method of manufacturing light permeable electromagnetic shield material, and light permeable electromagnetic shield material |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1784449A (en) * | 2003-05-07 | 2006-06-07 | 三井化学株式会社 | Cationically photopolymerizable resin composition and optical disk surface protection material |
| JP2007025091A (en) * | 2005-07-14 | 2007-02-01 | Jsr Corp | Method for forming optical member |
| CN101263564A (en) * | 2005-09-12 | 2008-09-10 | 日东电工株式会社 | Transparent conductive film, electrode plate for touch panel, and the touch panel |
| CN201518237U (en) * | 2009-09-04 | 2010-06-30 | 远东新世纪股份有限公司 | Conducting laminated body |
| JP2011086785A (en) * | 2009-10-16 | 2011-04-28 | Bridgestone Corp | Method of manufacturing light permeable electromagnetic shield material, and light permeable electromagnetic shield material |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106457858A (en) * | 2014-06-20 | 2017-02-22 | 3M创新有限公司 | Printing of multiple inks to achieve precision registration during subsequent processing |
| CN106457858B (en) * | 2014-06-20 | 2018-10-19 | 3M创新有限公司 | The printing of the multiple inks of accuracy registration is realized during subsequent processing |
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| CN103137244B (en) | 2015-12-09 |
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