TWI518739B - Method for making a conductive substrate - Google Patents

Description

Method of manufacturing a conductive substrate

This invention relates to a method of making a conductive substrate, and more particularly to a method of forming a conductive substrate having a microstructured surface.

The conductive substrate can be applied to photovoltaic devices such as displays, touch panels, sensors, electronic paper, and optical components.

A typical conductive substrate, such as a resistive or capacitive touch substrate, typically has a substrate and a metal or metal oxide transparent conductive layer formed on one surface of the substrate. When the touch substrate is touch-scored with the stylus, the conductive layer located in the upper layer is deformed by an external force to cause local area deformation, thereby causing the two conductive layers to contact and conduct. However, due to the adhesion of the two conductive layers, when the force is lost, the conductive layer in the upper layer will return to its original state, and the conductive layer will be subjected to a pulling force. Therefore, under repeated touch scribe lines (for example, with a stylus touch-pressure scribe line), the conductive layer is easily broken and peeled off, so that the resistance value of the conductive layer is increased and the callability instability occurs. Therefore, how to improve the bonding strength between the conductive layer and the substrate and the structural strength of the conductive layer itself and prevent the conductive layer from cracking and peeling under external force is an important issue.

US Patent Publication No. 2003/0087119 discloses a transparent conductive substrate having a transparent polymer substrate, a transparent conductive layer formed on the transparent polymer substrate, and a cover layer overlying the transparent conductive layer. . The material of the cover layer may be a metal oxide, a metal nitride, a metal oxynitride, carbon, nitrogen carbide, tantalum carbide or the like. By the cover layer, it is possible to prevent the transparent conductive layer from being cracked or peeled under an external force. However, since the cover layer is formed by sputtering, the process for manufacturing the transparent conductive substrate is complicated.

U.S. Patent 6,629,833 discloses a transparent conductive substrate having a plastic substrate, an ionic group-containing resin layer formed on the plastic substrate, and a transparent conductive layer formed on the ionic group-containing resin. By the adhesion of the ionic group-containing resin, the transparent conductive layer can be firmly adhered to the plastic substrate to prevent cracking or peeling of the transparent conductive layer under external force. However, since the ionic group-containing resin has adhesiveness, it is easy to adhere to foreign particles such as dust during the process of manufacturing the transparent conductive substrate.

In addition to the above methods, another conventional method for preventing cracks and peeling of the conductive layer under external force is to reduce the contact area between the two conductive layers by forming a concave-convex microstructure on the surface of the conductive layer, thereby effectively reducing the conductive layer The pulling force caused by contact and adhesion increases the service life of the conductive layer.

Generally, methods for fabricating microstructures include physical imprinting or chemical etching, etc., but these methods all have inherent defects caused by the process. For example, the physical imprint method is not easy to be uniform due to the imprinting force, so it is easy to affect the precision and size of the microstructure, and the imprinted microstructure mostly has a folded-angle structure (such as a sawtooth, a right angle or a trapezoidal structure), and the existence of the chamfer will The conductive layer is more susceptible to stress concentration and is accelerated to break or difficult to form a continuous conductive layer; and the chemical etching method mentioned in U.S. Patent No. 6,036,579, wherein the etching liquid used is expensive and causes environmental pollution, and the etched microstructure is also Most of them have a folding angle, so there are also the same problems as physical imprinting.

Based on the aforementioned shortcomings, there is an urgent need in the industry to develop a technique that does not require a chemical etching solution, is not easy to produce a microstructure having an acute angle, and at the same time, can improve the adhesion between the conductive layer and the substrate, thereby overcoming the above-mentioned various habits. Know the technical problems.

Accordingly, an object of the present invention is to provide a method for producing a conductive substrate which can prevent cracking of a transparent conductive layer under external force or peeling from a substrate without requiring a chemical etching solution and which is simple to manufacture.

Thus, a method of fabricating a transparent conductive substrate according to the present invention comprises: forming an uncured photocurable material layer on a substrate, the uncured photocurable material layer being a photocurable composition The photocurable composition comprises at least one photocurable prepolymer having a plurality of reactive functional groups, and the photocurable prepolymer has a functional group equivalent weight of 70 to 700 g/mol; providing a patterning Masking layer to partially shield the surface of the uncured photocurable material layer such that the uncured photocurable material layer forms at least one shielding region and at least one non-shadowing region; and a first light source passes through the patterned shielding layer, The photocurable prepolymer of the non-masking region in the uncured photocurable material layer is subjected to a curing reaction, whereby the uncured photocurable material layer forms a portion of the region-cured photocurable material layer having at least one thereon a convex solidified region and at least one concave uncured region; removing the patterned shielding layer; irradiating with a second light source to further cure the solidified light solidification of the partial region a material layer that causes a curing reaction to form a concave uncured region of the partially cured photocurable material layer, thereby forming a structured photocurable material layer having a textured surface; and the structured photocurable material A conductive layer is formed on the microstructured surface of the layer.

The effect of the invention is that the microstructure surface of the structured photocurable material layer is used to form a concave-convex microstructure on the surface of the conductive layer, thereby increasing the bonding strength between the conductive layer and the substrate and the structural strength of the conductive layer itself. Thereby, it is possible to enhance the prevention of cracking of the transparent conductive layer under external force or peeling from the substrate.

The foregoing and other objects, features, and advantages of the invention are set forth in the <RTIgt;

Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals.

Referring to FIGS. 1 through 6, a preferred embodiment of a method of fabricating a transparent conductive substrate of the present invention comprises:

(a) applying a photocurable paste to a transparent substrate 21 to form a photocurable paste having a photocurable composition and a solvent, which is photocurable The composition comprises a photoinitiator and at least one photocurable prepolymer having a plurality of reactive functional groups, and the photocurable prepolymer has a functional group of 70-700 g/mole (g/mol) Equivalent, the photocurable prepolymer may be a monomer or an oligopolymer;

(b) drying the photocurable paste layer to remove the solvent in the photocurable paste such that an uncured photocurable material layer 22a having a photocurable prepolymer is formed on the substrate 21 ( As shown in Figure 1), the reactive functional group can be initiated by a free radical to produce a crosslinking reaction;

(c) providing a patterned masking layer 31 to partially shield the uncured photocurable material layer 22a (as in FIG. 2) such that the uncured photocurable material layer 22a forms at least one masking region 222 and at least one non- Shading area 221;

and (d) a first light source (L ₁₎ through the patterned masking layer 31, such that the uncured photocurable material layer 22a in the non-masked regions 221 may generate a photocurable prepolymer curing reaction. The above curing reaction is a photocurable functional prepolymer which is generated by cleavage of a photoinitiator to generate a radical and thereby initiates the non-masking region 221 of the uncured photocurable material layer 22a, and thus causes a non-masking region. The concentration of the photocurable composition of 221 is decreased such that the photocurable composition in the masking region 222 of the uncured photocurable material layer 22a flows toward the non-masking region 221, thereby causing the uncured photocurable material layer 22a. Forming a partially cured photocurable material layer 22b having a convex solidified region 223 and a concave uncured region 224 (Fig. 3);

(e) removing the patterned shielding layer 31 (as shown in Figure 4);

(f) using a second light source (L ₂ ) to illuminate the partially cured photocurable material layer 22b (Fig. 4) to cure the concave uncured region 224 of the partially cured photocurable material 22b. Forming a concave solidified region 225, and thus forming a structured photocurable material layer 22 having a textured microstructured surface 220 on the substrate 21 (FIG. 5);

(g) Forming a transparent conductive layer 23 on the structured photocurable material layer 22 by sputtering or evaporation (Fig. 6).

The patterned shielding layer 31 has alternating light-transmissive regions 311 and non-transmissive regions 312, and each of the two adjacent light-transmitting regions 311 has a pitch (d) of 50 μm to 250 μm. The permeable region 311 of the patterned shielding layer 31 is for transmitting the first light source, and the non-transmissive region 312 is for blocking, absorbing or reflecting the light source.

Materials which can be used as the photocurable prepolymer of the present invention include, but are not limited to, functional acrylic resin prepolymers of acrylic acid or acrylate having a polyol, polyols, and hydroxyalkyl esters of acrylic acid or methacrylic acid. Synthetic functional urethane acrylic acid resin prepolymers, and combinations thereof. Preferably, the prepolymer material is an acrylate resin.

Preferably, the prepolymer has a functional group equivalent weight of from 70 to 700 grams per mole (g/mol). The functional group equivalents of the prepolymer are defined as follows:

More preferably, the prepolymer has a functional group equivalent weight of from 80 to 600 g/mole (g/mol), most preferably from 85 to 400 g/mole (g/mol). The photocuring reaction principle of the prepolymer and the formation of the structured photocurable material layer 22 will be further described below. A material having a functional group capable of undergoing a photocuring reaction is referred to as a photocurable material. The photocurable material is mixed with a photoinitiator to form a photocurable material layer by coating, and then the layer is irradiated with ultraviolet light, and the ultraviolet light will cleave the photoinitiator into free radicals, free radicals. The functional group of the photocurable material is initiated to react. As the reaction proceeds, the molecular weight and viscosity of the photocurable material layer continue to rise until the viscosity of the photocurable material layer is too large to stop the photocuring reaction and form a dry surface. The curing zone in the photocurable material layer requires more unreacted photocurable material to perform photocuring reaction due to the photocuring reaction, so that the unreacted photocurable material flows from the uncured zone to the curing zone. In order to provide a photocurable material that has not been reacted, the photocuring reaction in the curing zone can be continued. The unreacted photocurable material, the flow phenomenon from the uncured zone to the solidified zone, makes the solidified zone of the photocurable material layer thicker, and presents a ridged mountain shape; at the same time, the uncured zone of the photocurable material layer is also changed. It is thinner and presents a valley shape with a depression, so that a difference in thickness occurs between the solidified zone and the uncured zone, forming a surface microstructure alternately between the mountain and the valley. When the molecular weight of the photocurable material is smaller, the flow rate of the unreacted photocurable material in the photocurable material layer is faster, and the unreacted photocurable material can flow from the uncured region to the solidified region faster, so that the uncured region and the uncured region The higher Rz values between the solidification zones also represent a more pronounced surface microstructure. When the number of functional groups of the photocurable material is larger, the degree of reaction of the photocurable material in the photocuring reaction is more intense, so that the unreacted photocurable material flows from the uncured zone to the solidification zone faster to maintain The photocuring reaction proceeds, which results in a higher Rz value between the uncured zone and the cured zone, and also represents a more pronounced surface microstructure.

It should be noted here that the degree of curing of the photocurable material in steps (c) and (e) may be fully cured or partially cured as long as the photocurable material can no longer have fluidity, the present invention There are no special restrictions.

The solvent to be used in the present invention is not particularly limited as long as the solvent capable of sufficiently dissolving the photocurable material can be used, and may be selected from alcohols, ketones, esters, halogenated solvents, hydrocarbons, etc., for example, acetone. Acetonitrile, chloroform, chlorophenol, cyclohexane, cyclohexanone, cyclopentanone, dichloromethane, diethyl acetate, dimethyl carbonate, ethanol, ethyl acetate, N,N-dimethylacetamide, A group consisting of 1,2-propanediol, 2-hexanone, methanol, methyl acetate, butyl acetate, toluene, tetrahydrofuran, and the like.

The photoinitiator which can be used in the present invention is not particularly limited, and can be used mainly for photocuring of a photocurable resin, and can be selected from vinyl benzophenones, benzophenone derivatives, and Mich. a group consisting of ketones, benzynes, benzyl derivatives, benzoin derivatives, benzoin methyl ethers, α-methoxy esters, thioxanthones and anthraquinones, and combinations thereof . The amount of the initiator to be used is also not limited, and is preferably used in an amount of not less than 0.01% by weight (when the photocurable paste composition is 100% by weight).

Preferably, the photocurable paste has a solid content of 10 to 80% by weight. If the solid content is less than 10% by weight, the ultraviolet light is less likely to form a concave-convex microstructure, and if the solid content is more than 80% by weight, coating is difficult. The layer of photocurable material is easily brittle after exposure to ultraviolet light. More preferably, the photocurable paste has a solid content of 15 to 60% by weight, preferably 20 to 40% by weight.

Preferably, the material of the conductive layer 23 is a metal or a metal compound selected from the group consisting of gold, silver, platinum, lead, copper, aluminum, nickel, chromium, titanium, iron, cobalt and tin, and the like. A group consisting of a combination of alloys selected from the group consisting of indium oxide, tin oxide, titanium oxide, aluminum oxide, zinc oxide, gallium oxide, and indium tin oxide, and combinations thereof. More preferably, the metal compound is indium tin oxide.

The base material 21 may be a transparent insulating material. Preferably, the material of the base material 21 is a polymer selected from the group consisting of a polyester resin, a polyether resin, a polycarbonate resin, a polyamide resin, and a polyimide resin. , polyolefin resin, acrylate resin, polyvinyl chloride resin, polystyrene resin, polyvinyl alcohol resin, polyarylate resin, polyphenylene sulfide resin, polydivinylidene resin, A A group consisting of a acrylate resin, a cellulose acetate, a diacetyl cellulose, a triacetyl cellulose, and the like. More preferably, the material of the transparent substrate is polyethylene terephthalate.

Although the thickness of the base material 21 is not particularly limited, it is preferably in the range of 2 to 300 μm, more preferably in the range of 10 to 130 μm. When the thickness is less than 2 μm, the mechanical strength of the base material may be insufficient, so that the operation of continuously forming the transparent conductive layer may become difficult. Moreover, when the thickness exceeds 300 μm, the winding property is likely to cause a problem, and the winding process of the transparent conductive layer may be difficult.

The conductive substrate of the present invention can be used for the formation of various devices such as touch panels and displays. It is particularly preferable to use it as an electrode plate for a touch panel.

Preferably, the first light source used in the step of illuminating the uncured photocurable material layer 22a may be ultraviolet light, visible light, electron beam or X-ray, more preferably realized by using ultraviolet light, and ultraviolet light thereof. The irradiation dose is not less than 70 mJ/cm ² , preferably 70 to 4000 mJ/cm ² , and the irradiation dose is less than 70 mJ/cm ² , the microstructure is not easily formed, and the irradiation dose is higher than 4000 mJ/cm ² to facilitate the substrate. 21 deformation. More preferably, the irradiation dose is 100 to 3500 mJ/cm ² , and most preferably 400 to 1500 mJ/cm ² . In addition, the foregoing second light source may also be ultraviolet light, visible light, electron beam or X-ray, and more preferably realized by using ultraviolet light. The irradiation dose of the second light source in the present invention is not particularly limited as long as it can cure the uncured photocurable material layer 22a, and can be applied to the present invention. Furthermore, the first light source and the second light source may be the same or different.

Referring to FIG. 6, a preferred embodiment of a transparent conductive substrate prepared by the method of the present invention comprises: a substrate 21; a structured photocurable material layer 22 formed on the substrate 21, and A concave-convex microstructured surface 220 is formed; and a conductive layer 23 is formed on the textured microstructured surface 220 of the structured photocurable material layer 22. The conductive layer 23 has an upper surface 230 having substantially the same shape as the uneven microstructured surface 220, and the upper surface 230 has a surface roughness of Rz of 0.5 μm to 3.5 μm and Sm of 0.05 mm to 0.35 mm. The Rz value is defined as the ten-point mean roughness between the thicker thickness region (convex region) and the thinner thickness region (the concave region), and Sm is the adjacent convex region or concave region. Mean spacing. Rz and Sm can be tested using a probe type surface analyzer (manufactured by KOSAKA, Japan, model ET-4000A).

Preferably, the conductive layer 23 has a thickness of 10 nm to 300 nm, more preferably 10 to 200 nm. When the thickness is thinner than 10 nm, it is difficult to form a continuous layer having a good electrical conductivity of 10 ³ Ω/□ or less, and if it is too thick, the transparency is likely to be lowered.

The conductive substrate prepared according to the present invention has a concave-convex microstructured surface. If the conductive substrate is applied to a touch panel or the like, the conductive substrate is flat compared to the surface of the conductive substrate. Smaller, it can reduce the sticking problem and the pulling of the conductive layer by the stylus stroke, so that the conductive layer is broken and even further peeled off from the substrate. In addition, the concave-convex structure obtained by the invention is a wavy microstructure, and the conductive substrate having a folded-angle structure (such as a sawtooth, a right angle or a trapezoidal structure) can reduce stress caused by external force and concentrate on the The angle of the corner causes the conductive layer to rupture, causing a problem of an increase in surface resistance.

The embodiments and effects of each object of the present invention will be described below by way of examples. It should be noted that the examples are for illustrative purposes only and are not to be construed as limiting the invention.

<Example 1>

Conductive substrate preparation

0.2 g of a photocurable prepolymer having a reactive functional group (Sartomer, model SR444, acrylate system, functional group equivalent: 99.3 g/mol), adding toluene 0.8 g (Toluene) and photoinitiator 0.02 g ( Ciba, I-184, USA, to prepare a photocurable paste (1.02 g) having a solids content of 20% by weight.

1.02 g of the prepared photocurable slurry was dropped on a polyester base material (Toyobo, Japan, model A4300, 5 cm × 5 cm × 100 μm), and spin coating (1000 rpm, 40 seconds) The slurry was evenly flattened, placed in an oven at a constant temperature of 80 ° C, baked for 3 minutes to remove the solvent, then transferred to an oven at a constant temperature of 100 ° C, baked for 2 minutes for heat treatment, and finally returned to room temperature to form a substrate. A layer of uncured photocurable material.

A patterned masking layer (photomask) having a line width of 50 μm and a line spacing of 50 μm was placed over the substrate material coated with the uncured photocurable material layer.

Using a UV exposure machine (Fusion, USA), the substrate coated with the uncured photocurable material layer was irradiated with ultraviolet light under a nitrogen atmosphere at an irradiation dose of 520 (mJ/cm ² ) to form a partially cured photocuring layer. Material layer.

The photomask was removed, and the substrate coated with the partially cured photocurable material layer was directly irradiated with ultraviolet light under a nitrogen atmosphere at an irradiation dose of 450 (mJ/cm ² ). The partially cured photocurable material layer is irradiated to form a structured photocurable material layer having a textured surface.

The substrate material having the structured photocurable material layer is placed in the magnetron sputtering chamber, and the Sn/In+Sn=10 wt% ITO is used as the target, and the cavity vacuum is drawn to 3×10 ^-6 torr. , through the sputtering gas Ar and O ₂ in the cavity, O ₂ /Ar=0.02, working pressure 5×10 ^-4 torr, power 4KW, substrate temperature is room temperature, in structured photocuring An ITO conductive layer having a thickness of 30 nm was formed on the material layer.

Surface roughness test of the conductive substrate: The conductive substrate of Example 1 was measured by a probe type surface analyzer (manufactured by KOSAKA, Japan, model ET-4000A) to have an Ra value of 0.21 μm, an Rz value of 0.73 μm, and Sm. The value is 0.099 mm. Ra is a center line average roughness, Rz is a ten-point mean roughness, and Sm is a mean spacing.

Stroke resistance test of conductive substrate: the conductive substrate is bonded to the conductive glass with spacers on the surface, and the ITO layers are aligned with each other, and a wear-resistant tester is used (again, technology, model SDT) -009), on the other side of the conductive substrate (non-conductive surface), with a R0.8 formaldehyde resin pen back and forth lined 100,000 times (counting back and forth), the length of the scribe line is 2 cm, and the load is 250 g.

Surface resistance measurement of conductive substrate : Using a Mitsubishi oil-based (stock) Lotest AMCP-T400 resistance measuring device, measured by a 4-terminal method based on JIS-K7194, measuring the conductive substrate before and after the scratch resistance test Surface resistance, the resistance before the stroke test is Ro, the resistance after the stroke test is R, and the R/Ro resistance change ratio is calculated. The resistance change ratio is closer to 1 and the structure of the conductive substrate is more stable, and the transparent conductive layer is less easy. Cracks or peeling due to external forces. The results of the surface resistance change ratio of the conductive substrate are shown in Table 1.

<Examples 2 to 4>

The other conditions for the preparation of the conductive substrate of Example 2-4 were the same as those of Example 1 except that the first irradiation dose of the base material coated with the uncured photocurable material layer was different by ultraviolet light irradiation. The results of the irradiation dose of Example 2-4, the line width and the line pitch of the reticle, the surface roughness of the conductive substrate, and the surface resistance change ratio are shown in Table 1.

From the results of the surface resistance change ratio (R/Ro) of Examples 1-4, it can be seen that when Rz is lower than 0.73 μm or higher than 2.82 μm, the surface resistance change ratio has an increasing driving force, indicating that Rz is better. The range is from 0.73 to 2.82 μm. The requirements of the conductive substrate in the application of the touch panel are generally R/Ro≦1.3. However, the surface resistance change ratio can have different requirements depending on the application.

<Example 5-7>

Other conditions and examples of preparation of the conductive substrate of Examples 5-7 except that the first irradiation dose of the substrate coated with the uncured photocurable material layer and the line width and the line pitch of the reticle were different. 1 is the same. The results of the irradiation doses of Examples 5-7, the line width and the line pitch of the reticle, the surface roughness of the conductive substrate, and the surface resistance change ratio are shown in Table 2.

From the results of the surface resistance change ratio (R/Ro) of Examples 2 and 5-7, it can be seen that when Sm is less than 0.1 mm or higher than 0.22 mm, the surface resistance change ratio has an increasing driving force, indicating Sm. The preferred range is from 0.1 to 0.22 mm.

<Comparative Example 1>

The conductive substrate of Comparative Example 1 was prepared by directly placing the transparent substrate in a magnetron sputtering chamber, and using Sn/In+Sn=10 wt% of ITO as a target, and the cavity vacuum was pumped to 3×10 ^{− After 6} torr, the sputtering gas Ar and O _{2 are introduced} into the cavity, O ₂ /Ar=0.02, the working pressure is 5×10 ^-4 torr, the power is 4KW, and the substrate temperature is room temperature to be used in the substrate. An ITO conductive layer having a thickness of 30 nm was formed thereon. The results of the surface roughness and surface resistance change ratio of the conductive substrate of Comparative Example 1 are shown in Table 2.

From the experimental results of Tables 1 and 2, it can be seen that the conductive substrate having the structured photocurable material layer 22 (Examples 1-7) is more conductive than the conductive substrate without the structured photocurable material layer 22 (Comparative Example 1) ) having a surface resistance change ratio closer to 1, which further demonstrates that the present invention utilizes the structured photocurable material layer 22 to enhance the bonding strength of the transparent conductive layer to the substrate and the structural strength of the conductive layer itself, thereby Strengthening prevents the transparent conductive layer from cracking or peeling off from the substrate under external force.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

twenty one. . . Base material

twenty two. . . Structured layer of photocurable material

22a. . . Uncured photocurable material layer

22b. . . Partially cured photocurable material layer

220. . . Concave microstructured surface

221. . . Unmasked area

222. . . Shading area

223. . . Convex solidification zone

224. . . Concave uncured zone

225. . . Concave solidification zone

twenty three. . . Transparent conductive layer

230. . . Upper surface

31. . . Patterned masking layer

311. . . Light transmissive area

312. . . Non-transparent area

L ₁ . . . First light source

L ₂ . . . Second light source

d. . . spacing

1 is a side elevational view showing a step of forming an uncured photocurable material layer on a substrate according to a preferred embodiment of the present invention;

2 is a side elevational view showing a step of patterning the uncured photocurable material layer using a photomask according to a preferred embodiment of the present invention;

3 is a side elevational view showing a partially cured photocurable material layer formed by patterning a layer of the uncured photocurable material after a preferred embodiment of the present invention;

4 is a side elevational view showing the steps of simultaneously exposing a cured region and an uncured region of a partially cured photocurable material layer in accordance with a preferred embodiment of the present invention;

Figure 5 is a side elevational view showing a structured photocurable material layer having a textured surface having irregularities according to a step of Figure 4;

Figure 6 is a side elevational view showing a step of sputtering a transparent conductive layer on the structured photocurable material layer formed in Figure 5 to obtain a conductive substrate in accordance with a preferred embodiment of the present invention.

twenty one. . . Base material

twenty two. . . Structured layer of photocurable material

220. . . Concave microstructured surface

twenty three. . . Transparent conductive layer

230. . . Upper surface

Claims (7)

A method for manufacturing a conductive substrate for a touch panel to increase structural strength comprises: forming an uncured photocurable material layer on a substrate, the uncured photocurable material layer being photocurable Constructed of a composition comprising at least one photocurable prepolymer having a plurality of reactive functional groups, and the photocurable prepolymer having 70-700 g/mole (g/mol) a functional group equivalent; providing a patterned masking layer to partially shield the surface of the uncured photocurable material layer such that the uncured photocurable material layer forms at least one masking region and at least one non-masking region; Passing a patterned light shielding layer to cause a curing reaction of the photocurable prepolymer in the non-masking region of the uncured photocurable material layer, thereby forming the uncured photocurable material layer to form a partial region to be cured a layer of photocurable material having at least one convex solidified region and at least one concave uncured region thereon; removing the patterned shielding layer; irradiating with a second light source to further cure the portion a layer of the cured photocurable material layer to cause a curing reaction in the concave uncured region of the partially cured photocurable material layer, thereby forming a structured photocurable material layer having a textured surface; and Forming a conductive layer on the microstructure surface of the layer of photocurable material; wherein the patterned masking layer has alternating light-transmitting regions and non-light-transmitting regions, the light-transmitting regions having a pitch of 50 μm to 250 μm. The first light source is ultraviolet and whose irradiation dose is not less than 70mJ / cm ² and not more than 4000mJ / cm ^2. The method of claim 1, wherein the photocurable prepolymer having a plurality of reactive functional groups is selected from a polyfunctional acrylic resin prepolymer, a polyfunctional amino carboxylic acid acrylic acid. A group consisting of a resin prepolymer, and combinations thereof. The method of claim 1, wherein the second light source is ultraviolet light, visible light, electron beam or X-ray. The method according to claim 1, wherein the material of the base material is a polymer selected from the group consisting of a polyester resin, a polyether resin, a polycarbonate resin, and a polyamido compound. Resin, polyimide resin, polyolefin resin, acrylate resin, polyvinyl chloride resin, polystyrene resin, polyvinyl alcohol resin, polyarylate resin, polyphenylene sulfide resin, poly A group consisting of a combination of a dichloroethylene vinyl resin, a methacrylate resin, cellulose acetate, cellulose diacetate, cellulose triacetate, and the like. The method according to claim 1, wherein the material of the conductive layer is a metal or a metal compound selected from the group consisting of gold, silver, platinum, lead, copper, aluminum, nickel, chromium, titanium, a group of iron, cobalt, and tin, and combinations thereof, which are selected from the group consisting of indium oxide, tin oxide, titanium oxide, aluminum oxide, zinc oxide, gallium oxide, and indium tin oxide, and The group formed by the combination. The method of claim 1, wherein the conductive layer It is deposited on the microstructured surface of the structured photocurable material layer by sputtering. A conductive substrate for a touch panel, which is obtained according to the method described in claim 1, wherein the conductive layer has an upper surface having an Rz of 0.5 μm to 3.5 μm and Sm is a surface roughness of 0.05 mm to 0.35 mm.