KR101285009B1 - Method for making a conductive substrate, and conductive substrate made thereby - Google Patents

Abstract

Provided are a method for producing a conductive substrate, in which peeling of the transparent conductive layer from the substrate by application of pressure from the outside is prevented, and a conductive substrate thereof.
Forming a photocurable layer 22 containing at least one photocurable prepolymer having a plurality of reactive functional groups on the substrate 21, and disposing a pattern mask 31 so as to shield a part of the photocurable layer 22. The first exposure step of curing the first region 221 of the photocurable layer 22 by exposing the photocurable layer 22 using the first light source L1, and the pattern mask 31. The photocurable layer 22 is exposed using the process of removing and the 2nd light source L2, the unhardened 2nd area | region 222 of the photocurable layer 22 is hardened | cured, and 1st and 2nd A method of manufacturing a conductive substrate comprising a second exposure step of forming a microstructure on the substrate 21 with different surface elevations of the regions 221 and 222 and a step of forming the conductive layer 23 in the microstructure. to provide.

Description

A manufacturing method of a conductive substrate and its conductive substrate TECHNICAL FOR MAKING A CONDUCTIVE SUBSTRATE, AND CONDUCTIVE SUBSTRATE MADE THEREBY

The present invention relates to a method for producing a conductive substrate, and more particularly, to a method for producing a conductive substrate formed so as to have a fine structure on its surface, and a conductive substrate.

BACKGROUND OF THE INVENTION Conductive substrates are frequently used in optoelectronic devices such as monitors, touch panels, sensors, electronic paper, and optical elements.

As a typical electroconductive substrate, what is used for the touchscreen which used the resistive film system or the capacitive system is mentioned, for example. Such a conductive substrate is provided with a substrate and a thin film-shaped transparent conductive layer formed on the surface of the substrate using a metal or a metal oxide. When the surface of the touch panel is pressed by, for example, a stylus or a finger, the conductive substrate Another transparent conductive layer above the top of the strain deforms locally to contact the transparent conductive layer of the conductive substrate. In this manner, the two transparent conductive layers are energized by partial contact with each other to input a signal.

However, when two transparent conductive materials come into contact with each other, sticking phenomenon occurs between them. By this sticking phenomenon, the lower transparent conductive layer formed on the surface of the substrate is stretched whenever the pressure on the touch panel surface is released and the upper transparent conductive layer returns to the original position. Therefore, when the input is repeatedly performed, the transparent conductive layer is broken or peeled off by being repeatedly stretched, which leads to an increase in the resistance value of the transparent conductive layer, and furthermore, normal input from the touch panel cannot be performed. There is a problem. Therefore, improvement of the adhesive strength of a board | substrate and the transparent conductive layer formed in the said board | substrate, and the structural strength of a conductive substrate is calculated | required.

In view of the above problems, a transparent conductive substrate having a substrate using a transparent polymer, a transparent conductive layer formed on the transparent polymer substrate, and a coating layer formed to cover the transparent conductive layer is disclosed (Patent Document 1). According to this, the coating layer is comprised from metal oxide, metal nitride, metal nitride oxide, carbon, nitrogen carbide, silicon carbide, etc., and the coating layer is formed, and the damage of a transparent conductive layer is prevented. However, since this coating layer is generally formed again using the sputtering method on the conductive layer formed using the sputtering method, the formation process is cumbersome.

Moreover, the transparent conductive film provided with the transparent plastic film, the transparent conductive thin film, and the resin layer narrowed between these and containing an ionic group is disclosed (patent document 2). According to this, since the said resin layer has adhesiveness, the said transparent plastic film and the said transparent conductive thin film can be adhere | attached firmly, and the said transparent conductive thin film can be prevented from being damaged by the sticking phenomenon as mentioned above. have. However, in such a transparent conductive film, the adhesiveness of the said resin layer is inversely harmful, and there exists a problem that it is easy to adhere dust and dirt in the manufacturing process.

In addition to the above, a method of preventing damage or peeling of the transparent conductive layer due to sticking phenomenon is also used by reducing the contact area between the conductive layers using a microstructure in which the surface is patterned. In order to form the fine structure, thermal embossing, photolithography, etching, and the like are generally used, but these methods have inherent problems caused by the process. For example, in the thermal embossing method, it is difficult to equalize the embossing force, it is difficult to control the precision and roughness of the fine structure, and the fine structure formed by this method has a top shape and a right angle in the shape of each part. There is also a problem that the shape of the conductive layer becomes stepped or stepped and the peeling of the conductive layer is further accelerated by stress concentration due to the angular shape. Moreover, although the photolithography-etching method using the etching liquid is also disclosed (patent document 3), not only an etching liquid is expensive but it may cause environmental pollution. In addition, the fine structure formed by this method also has the same problem as that of the thermal embossing method in which the shape of each of the portions is uneven.

US Patent Application Publication No. 2003/0087119 U.S. Patent No. 6629833 U.S. Patent No. 6036579

Therefore, development of a conductive substrate having a fine structure in which the shape of each portion has an acute angle rather than an acute angle and enhanced the adhesion between the conductive layer and the substrate is still awaited without using an etching solution.

This invention is proposed in order to solve the said subject, The manufacturing method of the conductive substrate which can easily manufacture the conductive substrate which prevents peeling of a transparent conductive layer from a board | substrate by repeating application of pressure from the exterior, and its electroconductivity An object of the present invention is to provide a substrate.

In order to achieve the above object, the present invention provides a substrate for forming a photocurable layer comprising a photocurable composition having a plurality of reactive functional groups and containing at least one photocurable prepolymer having a functional group equivalent of 70 to 700 g / mol. A photocurable layer forming step, an arrangement step of placing a pattern mask on the photocurable layer so as to shield a part of the photocurable layer, and exposing the photocurable layer using a first light source through the pattern mask, The photocurable layer is exposed by exposing a first exposure step of curing the first region in the photocurable layer, a removal step of removing the pattern mask, and a photocurable layer from which the pattern mask is removed using a second light source. Hardens the second region that is not cured, and the surface altitudes of the first region and the second region are different from each other. It is provided by the method, The manufacturing method of the conductive substrate characterized by including the 2nd exposure process of forming a microstructure in a board | substrate, and the conductive layer formation process of forming a conductive layer in the said microstructure. Provided is a conductive substrate.

 According to the said structure, since it contains the process of forming a conductive layer in the photocurable layer which has a microstructure on the surface, it is prevented that a conductive layer is damaged or peeled from a board | substrate by application of pressure from the outside. A manufacturing method of a conductive substrate and the conductive substrate can be provided.

1-6 is a schematic side view which shows a series of process of the manufacturing method of the conductive substrate which concerns on preferable embodiment of this invention.

As shown in FIGS. 1-6, the manufacturing method of the conductive substrate which concerns on preferable embodiment of this invention includes the following 6 processes.

(1) A paste layer comprising a paste comprising a photocurable composition containing at least one of a photocurable prepolymer having a plurality of reactive functional groups and a functional group equivalent of 70 to 700 g / mol and a photoinitiator and a solvent, is applied to the substrate 21 To form. On the other hand, the reactive functional group may proceed the crosslinking reaction by the free group. Next, for example, a photocurable layer forming step of drying the paste layer by heating to remove the solvent contained in the paste layer to form the uncured photocurable layer 22a on the substrate 21 (see FIG. 1);

(2) an arrangement step of disposing a pattern mask 31 on the photocurable layer 22a so as to shield a part of the photocurable layer 22a;

(3) The photocurable layer 22a is exposed using the first light source L1 via the pattern mask 31 to expose the photocurable layer 22a in the first region 221 of the photocurable layer 22a. A first exposure process (i.e., crosslinking) to cure the photocurable prepolymer contained in C) (see FIGS. 2, 3);

(4) a removal step of removing the pattern mask 31;

(5) The second region 222 which is not cured in step (3) in the photocurable layer by exposing the photocurable layer 22a from which the pattern mask 31 has been removed using the second light source L2. ) And a second exposure step of forming a fine structure on the substrate 21 by applying the surface roughness Rz so that the surface altitudes of the first region 221 and the second region 222 are different from each other. 4; And

(6) A conductive layer forming step of forming a transparent conductive layer 23 on the surface of the microstructure by sputtering or vapor deposition (see FIG. 6).

In the above process, the pattern mask 31 blocks and absorbs one or a plurality of light transmitting regions 311 through which the light from the first light source L1 can pass, and light from the first light source L1. Alternatively, one provided with one or a plurality of light opaque regions 312 for reflecting may be used. In addition, the width d1 of the light transmitting region 311 and the width d2 of the light impermeable region 312 are 50 µm to 250 µm, respectively, and therefore, the width of each first region 221 is equal to 50. It is set to micrometers-250 micrometers.

The photocurable composition contains at least one photocurable prepolymer having a plurality of reactive functional groups. Here, as said reactive functional group, what is necessary is just to generate | occur | produce a photopolymerization reaction when light is irradiated, for example, an alkenyl group or an epoxy group may be sufficient. Examples of the photocurable prepolymer having an alkenyl group include, for example, an acrylic-based compound, an ether-based compound including a vinyl group, a styrene-based compound, and a styrene-based compound. (thiolene-based compound), and the like.

The photocurable composition may further be a monomer or an oligomer, or a combination thereof, and the molecular weight thereof is not limited in the present invention, and only the functional group equivalents thereof do not have to be less than 70.

In addition, the functional group equivalent of the photocurable composition here is defined by dividing the molecular weight of the said photocurable composition by the number of functional groups.

In addition, the photocurable prepolymer should just be functional group equivalent in the range of 70-700g / mol as mentioned above, More preferably, it exists in the range of 80-600g / mol, More preferably, it is 85-400g / mol It should be in range.

Hereinafter, the principle that the concavo-convex microstructure is formed on the surface of the photocurable layer 22 by curing the photocurable prepolymer will be described.

The uncured photocurable layer 22a is formed by apply | coating to the board | substrate 21 the paste containing the photocurable composition and solvent containing at least one of said photocurable prepolymers, and a photoinitiator. Next, when ultraviolet rays are irradiated to the first region 221 in the photocurable layer 22a via the pattern mask 31, free radicals are generated from the photoinitiator by the irradiation of the ultraviolet rays. As this free radical causes crosslinking reaction of the photocurable layer 22a in the 1st area | region 221, and as a crosslinking reaction advances, the average molecular weight and viscosity of the molecule | numerator in the 1st area | region 221 gradually become high, and 1st The reaction is stopped when the region 221 is at or above the predetermined viscosity.

During the progress of the crosslinking reaction as described above, the concentration of the unreacted photocurable composition in the first region 221 in the photocurable layer 22a is lowered, so that the second region 222 in the photocurable layer 22a The concentration of the unreacted photocurable composition becomes relatively high. Since the material has a property of being diffused from a high concentration to a low concentration, in the second region 222, the unreacted photocurable composition diffuses into the exposed first region 221. For this reason, as shown in FIG. 3, after the 1st exposure process, the photocurable layer 22b which was partially hardened comes out convexly in the 1st area | region 221, and concave in the 2nd area | region 222. As shown in FIG. The recesses and protrusions are formed so as to be recessed, whereby a fine structure is exhibited on the surface of the photocurable layer 22b.

In addition, the smaller the molecular weight of the photocurable composition, the faster the unreacted photocurable composition in the first region 221 diffuses from the already cured second region 222 and thus the first region 221 and the second region. Since the average value (i.e., Rz value) of the difference in surface altitude between 222 becomes large, the surface roughness of the formed microstructure eventually increases.

In addition, the greater the number of functional groups in the photocurable composition, the more rapid the photocuring reaction is, so that the unreacted photocurable composition in the first region 221 diffuses quickly from the already cured second region 222, thereby photocuring. The reaction continues. As a result, the average value (i.e., Rz value) of the difference in surface elevation between the first region 221 and the second region 222 increases, so that the surface roughness of the formed microstructure eventually increases.

It should be noted that, in the first exposure step, the photocurable composition may be completely cured or only partially cured, and eventually photocurable in the first region 221 of the photocurable layer 22b. If the composition can only be made non-flowable, the degree of curing in the process is not a problem.

As a solvent used for the photocurable layer 22a, ie, a paste in the said photocurable layer formation process, what is necessary is just what can fully melt | dissolve a photocurable composition and a photoinitiator, For example, alcohol, a ketone, ester, a halogen solvent, hydrocarbon, etc. Use selected from the group of. More specifically, acetone, acetonitrile, chloroform, chlorophenol, cyclohexane, cyclohexanone, cyclopentanone, dichloromethane, diethyl acetate, dimethyl carbonate, ethanol, ethyl acetate, N, N -Dimethylacetoamide, 1,2-propanediol, 2-hexanone, methanol, methyl acetate, butyl acetate, toluene and tetrahydrofuran and combinations thereof.

Similarly, the photocurable layer 22a, that is, the photoinitiator used in the paste may be any one that promotes photocurability of the photocurable composition. For example, vinyl phenone derivatives, benzophenone derivatives, Michler (Michler). ), Ketones, benzine, benzyl derivatives, benzoin derivatives, benzoin methyl ether derivatives, α-acyloxyesters, thioxanthone derivatives and anthraquinone derivatives. Although the quantity of the photoinitiator used for a paste is not specifically limited, It is preferable that it is 0.01 weight% or more with respect to the total weight of a paste.

The paste may have a solid content of 10 to 80 wt%. This is because if the solid content is less than 10 wt%, the uneven shape will not be formed even when irradiated with ultraviolet rays, and if the solid content exceeds 80 wt%, it will be difficult to apply the paste to the substrate and cracks will easily occur after curing. . Therefore, the solid content in the paste is preferably 15 to 60 wt%, more preferably 20 to 40 wt%.

The transparent conductive layer 23 is made of a metal or a metal compound, and the metal is selected from the group consisting of gold, silver, platinum, lead, copper, aluminum, nickel, chromium, titanium, iron, cobalt, and tin. At least 1 type may be used and the said metal compound may use at least 1 sort (s) chosen from the group which consists of indium oxide, tin oxide, titanium oxide, aluminum oxide, zinc oxide, gallium oxide, and indium tin oxide, Especially, Preferred is indium tin oxide.

The substrate 21 may be made of a transparent insulating material, and more preferably made of a polymer. Here, as the polymer, polyester resin, polyether resin, polycarbonate resin, polyamide resin, polyimide resin, polyolefin resin, acrylic resin, polyvinyl chloride resin, polystyrene resin, polyvinyl Group consisting of alcohol resin, polyallylate resin, polyphenylene sulfide resin, polyvinylidene chloride resin, methacrylic acid ester resin, acetyl cellulose resin, diacetyl cellulose resin, triacetyl cellulose resin It is good to use at least 1 sort (s) chosen from, More preferably, polyethylene terephthalate may be used.

Although the thickness of the board | substrate 21 is not specifically limited, Preferably it is 2-300 micrometers, More preferably, it is 10-130 micrometers. If the thickness does not satisfy 2 占 퐉, the substrate 21 may run out of mechanical strength, making it difficult to continuously form the transparent conductive layer. Moreover, when thickness exceeds 300 micrometers, since it becomes difficult to bend, difficulty arises, such as when bending a transparent conductive layer.

As the 1st light source L1, although it can select and use from an ultraviolet-ray, a visible light, an electron beam, or X-ray, an ultraviolet-ray is more preferable. Although the exposure amount of the 1st light source L1 is not specifically limited, The more exposure amount, the fine structure can be formed favorable. However, the greater the exposure amount, the higher the energy consumption and cost. On the other hand, when there is little exposure amount, the time required for hardening of a photocurable composition becomes long. Dundamyeon consideration of cost and working time, the exposure amount of the first light source (L1) is preferably not less than 70mJ / cm ^2, more preferably, it is 70mJ / cm ² to 4000mJ / cm ^2. This is unless the exposure amount is satisfied 70mJ / cm ^2, a fine structure is difficult to form, when it is more than 4000mJ / cm ² to the station, because the possibility that the modification to the substrate 21. Thus, by adding identification, the exposure amount of the first light source (L1) is good is 100mJ / cm ² to 3500mJ / cm ^2, more preferably, it is 400mJ / cm ² to 1500mJ / cm ^2.

The second light source L2 is also preferably selected from ultraviolet rays, visible rays, electron beams, or X-rays, but ultraviolet rays are more preferable. Although the exposure amount of the 2nd light source L2 is not specifically limited, What is necessary is just to be able to fully harden the photocurable layer 22a (especially 2nd area | region 222). In addition, the 1st light source L1 and the 2nd light source L2 may be the same, and may differ.

Fig. 6 is a side view showing the outline of the conductive substrate obtained by the method of one embodiment according to the present invention, wherein the conductive substrate is formed on the substrate 21 and the substrate 21 and is cured in its entirety. A layer 22, a photocurable layer surface 220 finely structured to have an uneven shape and a surface of the photocurable layer 22, and a transparent conductive layer 23 formed on the photocurable layer surface 220. It is. Since the transparent conductive layer 23 is provided on the photocurable layer 22 which has a microstructured surface, the shape of the transparent conductive layer surface 230 which is the surface is substantially the shape of the photocurable layer surface 220. Same as shape. In addition, Rz value and Sm value which show the surface roughness of the transparent conductive layer surface 230 can be adjusted by changing the functional group equivalent of a photocurable composition, and the exposure amount of a 1st light source so that it may become a desired value, and this invention In Rz value, it is preferable that they are 0.05 mm-0.35 mm in 0.5 micrometer-3.5 micrometers, and Sm value in Rz value. In addition, an Rz value is defined by the 10-point average value of the difference H of the surface height of the adjacent 1st area | region 221 and the 2nd area | region 222 here, and Sm value is a recessed part in a microstructure. It is the average value of the interval of one period of a convex part (refer FIG. 6), and it calculated | required in this embodiment using the surface roughness meter of a probing system (a fine shape measuring instrument, the product made by Kosaka Research Institute, model number: ET4000A).

In addition, the thickness of the transparent conductive layer 23 is preferably 10 nm to 300 nm, and more preferably 10 nm to 200 nm. This is because if the thickness does not satisfy 10 nm, a continuous layer having good conductivity with a surface resistance value of 10 ³ Ω / square or less becomes difficult to be formed, and if the thickness is too thick, transparency is lowered.

The conductive substrate obtained by the method of the present invention has a fine structure of which the surface is made of irregularities, and when used as an electrode plate in a touch panel, for example, compared with the conductive substrate having a flat surface, the conductivity of the other electrode plate is increased. Since the contact area with the layer is small, sticking phenomenon between the conductive layers is unlikely to occur, and thus peeling or breakage due to tension of the conductive layer can be prevented.

In addition, since the conductive substrate obtained by the method of the present invention has a wave-like microstructure on its surface, compared with the conductive substrate having an angular-shaped microstructure (for example, saw, rectangular or stepped), the external Since it is difficult to concentrate the pressure applied at, it is possible to prevent an increase in the electric resistance value due to breakage of the conductive layer.

From the above effects, the conductive substrate obtained by the method of the present invention is applicable to various devices such as a touch panel and a monitor, but is particularly suitable for use as an electrode plate in a touch panel.

Hereinafter, the embodiment and the method and effect of the present invention will be described in more detail. On the other hand, the following examples are provided to provide further specificity in the description, and do not represent the intention of limiting the present invention.

≪ Example 1 >

(Manufacture of Conductive Substrate)

0.2 g of a photocurable prepolymer having a reactive functional group (product of US Sartomer, type number SR444, functional group equivalent 99.3 g / mol), 0.8 g of toluene and 0.02 g of a photoinitiator (product of US Ciba, trade name: I-184) By mixing, a paste (1.02 g) having a solid content of 20 wt% was obtained.

The paste was added dropwise to a polyester substrate (Toyobo, Japan, trade name: A4300, 5 cm × 5 cm × 100 μm) and uniformly paste the paste on the substrate under the conditions of 1000 rpm and 40 seconds by spin coating. Applied. Next, the paste-coated substrate is left in an oven maintained at a temperature of 80 ° C. for 3 minutes to remove the solvent (ie, toluene), and then transferred to another oven maintained at a temperature of 100 ° C. for 2 minutes of heat treatment. Carried out. Then, the uncured photocurable layer was formed in the said board | substrate by cooling the said board | substrate to room temperature.

On the substrate on which the photocurable layer was formed, a pattern mask having a space width and a line width of 50 µm was disposed together, and then a first UV light source (first light source) by a UV exposure apparatus (manufactured by Fusion, USA) in a nitrogen atmosphere. The photocurable layer was exposed at the exposure amount of 520 mJ / cm ² . Therefore, the photocurable layer is formed in an uneven shape so as to cure and protrude in the exposed first region and not to cure in the unexposed second region. And after removing a pattern mask, the photocurable layer was further exposed using the 450 mJ / cm <^2> 2nd UV light source (2nd light source) in nitrogen atmosphere. This hardened | cured so that the surface height of a 1st area | region and a 2nd area | region might differ, and the microstructure was obtained.

In this way, a substrate having a microstructure formed by a photocurable layer on the surface thereof is placed in a magnetron sputtering device, and Sn / (In + Sn) = 10wt%, that is, the weight of tin in the indium and tin is 10wt% Target the indium tin oxide to be used, and set the vacuum degree in the apparatus to 3 × 10 ⁻⁶ torr, and then introduce argon and oxygen into the apparatus so that O ₂ / Ar = 0.02, that is, the ratio of oxygen to argon is 0.02, An indium tin oxide conductive layer having a thickness of 30 nm was formed on the cured photocurable layer with a gas pressure of 5 × 10 ⁻⁴ torr, an input power of ⁴ KW, and a temperature of the substrate at room temperature.

As described above, the surface roughness of the conductive substrate formed by the method of Example 1 was measured by a probing surface roughness meter (fine shape measuring instrument, manufactured by Kosaka Research Institute, Model No .: ET4000A), and the Ra value was 0.21 μm and the Rz value was 0.73 μm. , Sm value was 0.099 mm.

(Sliding written test of conductive substrate)

The conductive substrate was bonded to the conductive glass having spacers disposed on the surface thereof and the indium tin oxide conductive layer to face each other, so that the conductive substrate was transparent using a sliding tester (manufactured by Taiwan Newsunup Technology, type No. SDT009). The surface of the side on which the conductive layer was not formed was reciprocated 100,000 times between 2 cm while the tip was pressed under a pressure of 250 g with a formaldehyde resin stylus pen of R 0.8.

(Measurement of Surface Resistance of Conductive Substrates)

As a four-probe method based on JIS-K7194, using a surface resistance measuring instrument (made by Mitsubishi Emulsification Co., Ltd., Lotest AMCP-T400), a conductive substrate was prepared before and after the sliding writing test. Surface electrical resistance was measured. The ratio of R to Ro was computed by setting Ro as the resistance value before the sliding writing test, and R as the resistance after the test. Here, the closer the R / Ro value is to 1, the better the structural stability of the conductive substrate, that is, the less the conductive layer is peeled off. The R / Ro values of the conductive substrates obtained in this example are shown in Table 1 below.

<Examples 2 to 4>

In Examples 2-4, the manufacturing method and evaluation method of a conductive substrate are substantially the same as Example 1, The difference with Example 1 is that of the 1st UV light source (1st light source) which exposes a photocurable layer. The exposure amount is different.

In Table 1 below, the first light source exposure amount, the space width and line width of the pattern mask, the surface roughness angle parameter, and the R / Ro value of each of Examples 1 to 2 are shown, and the conductivity is changed by changing the exposure amount of the first light source. Compare how the surface roughness of the substrate changes and how the results affect the structural stability of the conductive substrate.

As can be seen from Table 1, when the Rz value does not satisfy 0.73 µm or exceeds 2.82 µm, the R / Ro value is relatively high, and eventually the structural stability of the conductive substrate is lowered. Thus, it is derived that the particularly preferable value of Rz is 0.73 to 2.82 mu m. For example, as the conductive substrate used for the touch panel, it is generally required that R / Ro ≦ 1.3, but this required value varies depending on the application range.

<Example 5 to Example 7, Comparative Example 1>

In Examples 5-7, the manufacturing method and evaluation method of a conductive substrate are substantially the same as Example 1, The difference with Example 1 is that of the 1st UV light source (1st light source) which exposes a photocurable layer. In addition to the exposure dose, the space width and line width of the pattern mask are different.

In Table 2 below, the first light source exposure amounts, the space widths and line widths of the pattern masks, the surface roughness angle parameters, and the R / Ro values, respectively, are shown in Tables 2 to 7, respectively. The surface roughness of the conductive substrate is changed by changing the space width and the line width, and how the results affect the structural stability of the conductive substrate is compared.

In addition, in Table 2, the result of the said Example 2 and the comparative example 1 was also shown as a comparison. In Comparative Example 1, the substrate used in each Example was not provided with a photocurable layer and eventually did not form a fine structure. As a result, the magnetron sputtering apparatus was used as it was, and under the same conditions as in Example 1, the substrate had a thickness of 30 nm. An indium tin oxide conductive layer was formed.

It can be seen from the results of Examples 1 to 7 and Comparative Example 1 in Table 1 and Table 2 that the conductive substrate (Examples 1 to 7) having a photocurable layer having a fine structure on the surface thereof has a fine structure on its surface. Compared with the electroconductive board | substrate (Comparative example 1) which does not have a photocurable layer, it turns out that resistance value ratio R / Ro is close to one. This is, after all, the conductive substrate obtained by the method according to the present invention, by having the photocurable layer 22 microstructured between the substrate 21 and the conductive layer 23, the substrate 21 and the conductive layer The bonding strength of (23) is strengthened, and the surface of the conductive layer 23 formed in the photocurable layer 22 is also finely structured, so that the conductive layer 23 by repeated application of pressure from the outside is formed. ) And the peeling from the board | substrate 21 of the conductive layer 23 are prevented.

As mentioned above, although preferred embodiment of this invention was described, it cannot be overemphasized that this invention is not limited to this and various changes are possible in the range which does not deviate from the summary.

According to the manufacturing method of the conductive substrate which concerns on this invention, since the conductive substrate which prevents a conductive layer from being damaged or peeled from a board | substrate by repeated application of pressure from the outside can be provided, for example, the electrode plate of a touch panel It can be used for the preparation of.

21: substrate
22, 22a, 22b: photocurable layer
220: photocurable layer surface
221: first region
222: second area
23: conductive layer
230: conductive layer surface
31: pattern mask
311: light transmitting region
312: light opaque region
L1: first light source
L2: second light source

Claims (10)

A photocurable layer forming step of forming a photocurable layer comprising a photocurable composition containing at least one photocurable prepolymer having a plurality of reactive functional groups and a functional group equivalent of 70 to 700 g / mol, and
An arrangement process of disposing a pattern mask on the photocurable layer so as to shield part of the photocurable layer;
A first exposure step of curing the first region in the photocurable layer by exposing the photocurable layer using a first light source through the pattern mask;
A removing step of removing the pattern mask;
The photocurable layer from which the pattern mask has been removed is exposed using a second light source to cure a second region that is not cured in the photocurable layer, and the surface elevations of the first region and the second region are different from each other. A second exposure step of forming a fine structure on the substrate by imparting surface roughness to it;
A conductive layer forming step of forming a conductive layer in the microstructure
A method for producing a conductive substrate, comprising: The method of claim 1,
An alkenyl group or an epoxy group is used as said reactive functional group, The manufacturing method of the conductive substrate characterized by the above-mentioned. The method of claim 1,
The width of each said 1st area | region is 50 micrometers-250 micrometers, The manufacturing method of the conductive substrate characterized by the above-mentioned. The method of claim 1,
In the first exposure step, the first light source is selected from ultraviolet rays, visible rays, electron beams or X-rays, and is used. The method of claim 1,
In the second exposure step, the second light source is selected from ultraviolet rays, visible light, electron beams or X-rays and used. The method of claim 1,
The said 1st exposure process WHEREIN: The manufacturing method of the conductive substrate characterized by using the ultraviolet-ray whose exposure amount is 70mJ / cm <^2> -4000mJ / cm <^2> as said 1st light source. The method of claim 1,
The substrate is made of a polymer, the polymer is a polyester resin, polyether resin, polycarbonate resin, polyamide resin, polyimide resin, polyolefin resin, acrylic resin, polyvinyl chloride resin, polystyrene Resin, polyvinyl alcohol resin, polyallylate resin, polyphenylene sulfide resin, polyvinylidene chloride resin, methacrylic acid ester resin, acetyl cellulose resin, diacetyl cellulose, triacetyl cellulose At least 1 sort (s) chosen from the group is used, The manufacturing method of the conductive substrate characterized by the above-mentioned. The method of claim 1,
The conductive layer is made of a metal or a metal compound,
The metal is at least one selected from the group consisting of gold, silver, platinum, lead, copper, aluminum, nickel, chromium, titanium, iron, cobalt, tin,
The metal compound uses at least one member selected from the group consisting of indium oxide, tin oxide, titanium oxide, aluminum oxide, zinc oxide, gallium oxide, and indium tin oxide. The method of claim 1,
The conductive layer is formed on the surface of the microstructure by the sputtering method. As a conductive substrate manufactured by the manufacturing method of the conductive substrate in any one of Claims 1-9,
The surface roughness of the said conductive layer is 0.5 micrometer-3.5 micrometers in Rz value, and 0.05 mm-0.35 mm in Sm value.

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