JP5475053B2 - Method for manufacturing conductive substrate and conductive substrate - Google Patents

Description

  The present invention relates to a method for manufacturing a conductive substrate, and more particularly to a method for manufacturing a conductive substrate formed to have a fine structure on the surface thereof and the conductive substrate.

  Conductive substrates are often used for optoelectronic devices such as monitors, touch panels, sensors, electronic paper, and optical elements.

  As a typical conductive substrate, for example, a substrate used for a touch panel using a resistance film method or a capacitance method can be cited. Such a conductive substrate includes a substrate and a thin transparent conductive layer formed on the surface of the substrate using a metal or metal oxide, and the surface of the touch panel is pressed by, for example, a stylus or a finger. Then, the other transparent conductive layer above the conductive substrate is locally deformed and comes into contact with the transparent conductive layer of the conductive substrate. In this way, the two transparent conductive layers are partially brought into contact with each other to energize and input signals.

  However, when the two transparent conductive layers come into contact with each other, a sticking phenomenon between the two occurs. Due to this sticking phenomenon, the lower transparent conductive layer formed on the surface of the substrate is pulled each time the pressure on the touch panel surface is released and the upper transparent conductive layer returns to its original position. Therefore, if the input is repeated, the transparent conductive layer is damaged or peeled off due to repeated pulling, leading to an increase in the resistance value of the transparent conductive layer, and thus normal input from the touch panel The problem that it becomes impossible. Therefore, there is a demand for improvement in the adhesive strength between the substrate and the transparent conductive layer formed on the substrate and the structural strength of the conductive substrate.

  In view of the above problems, a transparent conductive substrate comprising a substrate using a transparent polymer, a transparent conductive layer formed on the transparent polymer substrate, and a coating layer formed so as to cover the transparent conductive layer is disclosed. (Patent Document 1). According to this, the coating layer is made of metal oxide, metal nitride, metal nitride oxide, carbon, nitrogen carbide, silicon carbide, etc., and the transparent conductive layer is damaged by the formation of the coating layer. Is prevented. However, since this coating layer is generally formed on the conductive layer formed using the sputtering method again using the sputtering method, the formation process is complicated.

  Moreover, the transparent conductive film provided with a transparent plastic film, a transparent conductive thin film, and the resin layer which is pinched | interposed between these and contains an ionic group is disclosed (patent document 2). According to this, since the resin layer has adhesiveness, the transparent plastic film and the transparent conductive thin film can be firmly bonded, and the transparent conductive thin film is stuck as described above. It can be prevented from being damaged by the phenomenon. However, such a transparent conductive film has a problem that the adhesiveness of the resin layer is reversed, and dust easily adheres in the manufacturing process.

  In addition to the above, there is also used a technique for preventing damage or peeling of the transparent conductive layer due to a sticking phenomenon by reducing the contact area between the conductive layers using a fine structure whose surface is patterned. In order to form a fine structure, a hot embossing method, a photolithography etching method, or the like is generally used, but these methods have inherent problems caused in the process. For example, in the hot embossing method, it is difficult to equalize the embossing force, it is difficult to control the precision and roughness of the microstructure, and the microstructure formed by this method has a saw-shaped corner, There is a tendency to become a right-angle type or a staircase type, and there is also a problem that peeling of the conductive layer is further accelerated by stress concentration due to such an angular shape. A photolithography etching method using an etching solution is also disclosed (Patent Document 3), but not only is the etching solution expensive, but there is also a risk of environmental pollution. In addition, the fine structure formed by this method has the same problem as the hot embossing method in which the shape of the corners becomes angular.

US Patent Application Publication No. 2003/0087119 US Pat. No. 6,629,833 US Pat. No. 6,036,579

  Therefore, there is still a need for the development of a conductive substrate that does not use an etchant and has a fine structure with a non-sharp corner shape and an enhanced adhesion between the conductive layer and the substrate. ing.

  The present invention has been proposed in order to solve the above-described problems, and is a conductive material that can easily produce a conductive substrate in which the transparent conductive layer is prevented from peeling off from the substrate by repeated application of pressure from the outside. An object of the present invention is to provide a substrate manufacturing method and a conductive substrate thereof.

  In order to achieve the above object, the present invention provides a photocurable composition comprising at least one photocurable prepolymer having a plurality of reactive functional groups and having a functional group equivalent of 70 to 700 g / mol. A photocurable layer forming step of forming a curable layer on the substrate, an arrangement step of arranging a pattern mask on the photocurable layer so as to shield a part of the photocurable layer, and the pattern mask. A first exposure step of exposing the photocurable layer using a first light source to cure the first region in the photocurable layer; a removing step of removing the pattern mask; Exposing the photocurable layer from which the pattern mask has been removed using a light source to cure the second region that is not cured in the photocurable layer, the first region and the second region, The surface heights of the A conductive substrate comprising: a second exposure step in which a fine structure is formed on the substrate by imparting surface roughness; and a conductive layer forming step in which a conductive layer is formed on the fine structure. A manufacturing method and a conductive substrate formed by the method are provided.

  According to the above configuration, since the process includes the step of forming the conductive layer on the photocurable layer having a fine structure on the surface, the conductive layer may be damaged or peeled off from the substrate by external pressure application. It is possible to provide a method for manufacturing a conductive substrate and the conductive substrate that are prevented from being damaged.

FIG. 1 is a schematic side view showing a series of steps of a method for manufacturing a conductive substrate according to a preferred embodiment of the present invention. FIG. 2 is a schematic side view showing a series of steps of a method for manufacturing a conductive substrate according to a preferred embodiment of the present invention. FIG. 3 is a schematic side view showing a series of steps of a method for manufacturing a conductive substrate according to a preferred embodiment of the present invention. FIG. 4 is a schematic side view showing a series of steps of a method for manufacturing a conductive substrate according to a preferred embodiment of the present invention. FIG. 5 is a schematic side view showing a series of steps of a method for manufacturing a conductive substrate according to a preferred embodiment of the present invention. FIG. 6 is a schematic side view showing a series of steps of a method for manufacturing a conductive substrate according to a preferred embodiment of the present invention.

As shown in FIGS. 1-6, the manufacturing method of the electroconductive board | substrate which concerns on preferable embodiment of this invention includes the following 6 processes.
(1) A photocurable composition containing at least one photocurable prepolymer having a plurality of reactive functional groups and having a functional group equivalent of 70 to 700 g / mol, a photocurable composition containing a photoinitiator, and a solvent. The paste is applied to the substrate 21 to form a paste layer. The reactive functional group can be allowed to undergo a crosslinking reaction by a free group. Next, for example, the paste layer is dried by heating to remove the solvent contained in the base layer, and a photocurable layer forming step in which an uncured photocurable layer 22a is formed on the substrate 21 (see FIG. 1);
(2) An arrangement step of arranging the pattern mask 31 on the photocurable layer 22a so as to shield a part of the photocurable layer 22a;
(3) The photocurable layer 22a is exposed using the first light source L1 through the pattern mask 31, and the first region 221 in the photocurable layer 22a includes the photocurable layer 22a. A first exposure step (ie cross-linking) for curing the photocurable prepolymer (see FIGS. 2 and 3);
(4) A removal step of removing the pattern mask 31;
(5) The photocurable layer 22a from which the pattern mask 31 has been removed is exposed using the second light source L2, and the second region 222 that has not been cured in step (3) is cured in the photocurable layer. And the second exposure step (FIG. 2) in which a fine structure is formed on the substrate 21 by imparting surface roughness (Rz) by different surface heights of the first region 221 and the second region 222. 4); and (6) a conductive layer forming step of forming a transparent conductive layer 23 on the surface of the microstructure by sputtering or vapor deposition (see FIG. 6).

  In the above process, the pattern mask 31 is one or a plurality of light transmission regions 311 that can transmit light from the first light source L1, and one for blocking, absorbing, or reflecting light from the first light source L1. Alternatively, a structure provided with a plurality of light opaque regions 312 may be used. In addition, the width (d1) of the light transmission region 311 and the width (d2) of the light non-transmission region 312 are 50 μm to 250 μm, respectively. Therefore, the width of each first region 221 is also 50 μm to 250 μm.

  The photocurable composition contains at least one photocurable prepolymer having a plurality of reactive functional groups. Here, the reactive functional group may be any group that undergoes a photopolymerization reaction when irradiated with light, and may be, for example, an alkenyl group or an epoxy group. Examples of the photocurable prepolymer having an alkenyl group include an acrylic-based compound, an ether-based compound including a vinyl group, and a styrene-based compound. And thiolene-based compounds.

  The photocurable composition may also be a monomer or an oligomer, or a combination thereof, and the molecular weight is not limited in the present invention, but the functional group equivalent thereof is less than 70. If not, it ’s good.

  Here, the functional group equivalent of the photocurable composition is defined by dividing the molecular weight of the photocurable composition by the number of functional groups.

  The photocurable prepolymer may have a functional group equivalent in the range of 70 to 700 g / mol as described above, more preferably in the range of 80 to 600 g / mol, and still more preferably 85 to 400 g. It may be in the range of / mol.

  Below, the principle by which the uneven | corrugated fine structure is formed in the surface of the photocurable layer 22 when this photocurable prepolymer hardens | cures is demonstrated.

  By applying a paste containing a photocurable composition containing at least one photocurable prepolymer, a photoinitiator, and a solvent to the substrate 21, an uncured photocurable layer 22a is obtained. It is formed. Next, when the first region 221 in the photocurable layer 22a is irradiated with ultraviolet rays through the pattern mask 31, free radicals are generated from the photoinitiator by the irradiation of the ultraviolet rays. This free radical causes a crosslinking reaction of the photocurable layer 22a in the first region 221, and as the crosslinking reaction proceeds, the average molecular weight and viscosity of the molecules in the first region 221 gradually increase, and the first region The reaction is stopped when 221 exceeds a predetermined viscosity.

  During the progress of the crosslinking reaction as described above, the concentration of the unreacted photocurable composition in the first region 221 in the photocurable layer 22a is lowered, so the second region 222 in the photocurable layer 22a. The concentration of the unreacted photocurable composition becomes relatively high. Since the substance has the property of diffusing from a high concentration to a low concentration, the unreacted photocurable composition in the second region 222 diffuses to the exposed first region 221. Therefore, as shown in FIG. 3, after the first exposure step, the photocurable layer 22 b partially cured already protrudes in the first region 221 and is recessed in the second region 222. Thus, a fine structure appears on the surface of the photocurable layer 22b.

  Further, the smaller the molecular weight of the photocurable composition, the faster the unreacted photocurable composition in the first region 221 diffuses into the already cured second region 222, and the first region 221 and the second region Since the average value (that is, Rz value) of the difference in surface height between the regions 222 is increased, that is, the surface roughness of the formed microstructure is increased.

  In addition, since the photocuring reaction becomes more rapid as the number of functional groups in the photocurable composition increases, the unreacted photocurable composition in the first region 221 diffuses faster in the already cured second region 222. The photocuring reaction is continued. As a result, the average value (ie, Rz value) of the difference in surface height between the first region 221 and the second region 222 is increased, that is, the surface roughness of the formed microstructure is increased.

  It should be noted that in the first exposure step, the photocurable composition may be completely cured or only partially cured, that is, the first of the photocurable layer 22b. As long as the photocurable composition in the region 221 does not have fluidity, the degree of curing in the process is not limited.

  The solvent used for the photocurable layer 22a, that is, the paste in the photocurable layer forming step is not particularly limited as long as it can sufficiently dissolve the photocurable composition and the photoinitiator. For example, alcohol, ketone , Esters, halogen solvents, hydrocarbons and the like are used. More specifically, acetone, acetonitrile, chloroform, chlorophenol, cyclohexane, cyclohexanone, cyclopentanone, dichloromethane, diethyl acetate, dimethyl carbonate, ethanol, ethyl acetate, N, N-dimethylacetamide, 1,2-propanediol, Examples include 2-hexanone, methanol, methyl acetate, butyl acetate, toluene, tetrahydrofuran, and combinations thereof.

  Similarly, the photoinitiator used in the photocurable layer 22a, that is, the paste may be any one that promotes the photocurability of the photocurable composition. For example, vinyl phenone derivatives, benzophenone A derivative, Michler's ketone, benzyne, benzyl derivative, benzoin derivative, benzoin methyl ether derivative, α-acyloxy ester, thioxanthone derivative, and anthraquinone derivative can be used. The amount of the photoinitiator used in the paste is not particularly limited, but is preferably 0.01% by mass or more based on the total mass of the paste.

  Moreover, the said paste is good in solid content being 10-80 mass%. This is because when the solid content is less than 10% by mass, it does not become uneven even when irradiated with ultraviolet rays, and when the solid content exceeds 80% by mass, it becomes difficult to apply the paste to the substrate, and after curing. It is because it becomes easy to produce a crack. Therefore, the solid content in the paste is preferably 15 to 60% by mass, more preferably 20 to 40% by mass.

  The transparent conductive layer 23 is made of a metal or a metal compound, and the metal is selected from the group consisting of gold, silver, platinum, lead, copper, aluminum, nickel, chromium, titanium, iron, cobalt, and tin. At least one kind is used, and the metal compound may be at least one selected from the group consisting of indium oxide, tin oxide, titanium oxide, aluminum oxide, zinc oxide, gallium oxide, and indium tin oxide. Indium tin.

  The substrate 21 is preferably made of a transparent insulating material, more preferably a polymer. Examples of the polymer include polyester resins, polyether resins, polycarbonate resins, polyamide resins, polyimide resins, polyolefin resins, acrylic resins, polyvinyl chloride resins, polystyrene resins, and polyvinyl alcohol resins. When using at least one selected from the group consisting of a polyarylate resin, a polyphenylene sulfide resin, a polyvinylidene chloride resin, a methacrylate ester resin, an acetyl cellulose resin, a diacetyl cellulose resin, and a triacetyl cellulose resin More preferably, polyethylene terephthalate is preferably used.

  Although the thickness of the board | substrate 21 is not specifically limited, Preferably it is 2-300 micrometers, More preferably, it is good in it being 10-130 micrometers. If the thickness is less than 2 μm, the substrate 21 may have insufficient mechanical strength, and it becomes difficult to continuously form the transparent conductive layer. Moreover, since it will become difficult to curve when thickness exceeds 300 micrometers, difficulty will arise at the time of bending a transparent conductive layer.

The first light source L1 can be selected from ultraviolet rays, visible rays, electron beams, or X-rays, but ultraviolet rays are more preferable. The exposure amount of the first light source L1 is not particularly limited, but the fine structure can be formed better as the exposure amount is larger. However, the higher the exposure, the higher the energy consumption and cost. On the other hand, when there is little exposure amount, time required for hardening of a photocurable composition will become long. Taking cost and working time into consideration, the exposure amount of the first light source L1 is preferably 70 mJ / cm ² or more, and more preferably 70 mJ / cm ^{2 to} 4000 mJ / cm ² . This is because, if the exposure amount is less than 70 mJ / cm ^2, hardly microstructure is formed, it exceeds 4000 mJ / cm ² in the opposite, and there is a possibility that the substrate 21 is deformed. Therefore, if further Ultimately, may exposure amount of the first light source L1 may If it is ^{100mJ / cm 2 ~3500mJ / cm 2} , more preferably at ^{400mJ / cm 2 ~1500mJ / cm 2} .

  The second light source L2 can be preferably selected from ultraviolet rays, visible rays, electron beams or X-rays, but ultraviolet rays are particularly preferred. The exposure amount of the second light source L2 is not particularly limited as long as it can completely cure the photocurable layer 22a (particularly the second region 222). Further, the first light source L1 and the second light source L2 may be the same or different.

  FIG. 6 is a side view showing an outline of a conductive substrate obtained by the method of one embodiment according to the present invention. The conductive substrate is formed on the substrate 21 and the photocured material that is entirely cured. The photocurable layer 22, the photocurable layer surface 220 which is the surface of the photocurable layer 22 and is finely structured so as to exhibit an uneven shape, and the transparent conductive layer 23 formed on the photocurable layer surface 220. It is configured. Since the transparent conductive layer 23 is provided on the photocurable layer 22 having a microstructured surface, the shape of the transparent conductive layer surface 230 which is the surface is substantially the shape of the photocurable layer surface 220. Is the same. Further, the Rz value and Sm value indicating the surface roughness of the transparent conductive layer surface 230 are adjusted by changing the functional group equivalent of the photocurable composition and the exposure amount of the first light source so as to be a desired value. In the present invention, the Rz value is preferably 0.5 μm to 3.5 μm, and the Sm value is preferably 0.05 mm to 0.35 mm. Here, the Rz value is defined by the ten-point average value of the difference in surface height H between the adjacent first region 221 and the second region 222, and the Sm value is a fine structure. The average value of the interval of one cycle of the concave portion and the convex portion (see FIG. 6). In the present embodiment, a probing type surface roughness meter (micro shape measuring machine, manufactured by Kosaka Laboratory Ltd., model number: ET4000A) Was determined using.

Further, the thickness of the transparent conductive layer 23 is preferably 10 nm to 300 nm, and more preferably 10 nm to 200 nm. This is because if the thickness is less than 10 nm, it becomes difficult to form a continuous layer having a good conductivity with a surface resistance value of 10 ³ Ω / □ or less, and conversely, if it is too thick, the transparency is lowered. Because.

  The conductive substrate obtained by the method of the present invention has a fine structure in which the surface is uneven. When this is used as, for example, an electrode plate in a touch panel, the surface of the conductive substrate is different from that of a conductive substrate with a flat surface. Since the contact area of the electrode plate with the conductive layer is small, a sticking phenomenon between the conductive layers hardly occurs, and thus peeling and breakage due to the pulling of the conductive layer can be prevented.

  In addition, since the conductive substrate obtained by the method of the present invention has a corrugated fine structure on its surface, it is compared with a conductive substrate having an angular fine structure (for example, a saw type, a right angle type or a step type). Since concentration of pressure applied from the outside hardly occurs, an increase in electric resistance value due to breakage of the conductive layer can be prevented.

  From the above effects, the conductive substrate obtained by the method of the present invention can be applied to various devices such as a touch panel and a monitor, but is particularly suitable for use as an electrode plate in a touch panel.

  In the following, specific examples will be shown to explain the implementation method and effects of the present invention in more detail. In addition, the following Examples are shown in order to provide the further concreteness to description, and do not show the intention which limits this invention.

<Example 1>
(Manufacture of conductive substrates)
Photocurable prepolymer having a reactive functional group (manufactured by Sartomer, USA, model number: SR444, functional group equivalent 99.3 g / mol) 0.2 g, toluene 0.8 g and photoinitiator (manufactured by Ciba, USA) Name: I-184) 0.02 g was mixed to obtain a paste (1.02 g) having a solid content of 20% by mass.

  The paste is dropped on a polyester substrate (trade name: A4300, 5 cm × 5 cm × 100 μm, manufactured by Toyobo, Japan), and the paste is uniformly applied on the substrate under the conditions of a rotation speed of 1000 rpm and 40 seconds by a spin coating method. did. The substrate with the paste applied is then left in an oven maintained at a temperature of 80 ° C. for 3 minutes to remove the solvent (ie toluene) and transferred to another oven maintained at a temperature of 100 ° C. Heat treatment for 2 minutes was performed. Thereafter, the substrate was cooled to room temperature to form an uncured photocurable layer on the substrate.

A pattern mask having both a space width and a line width of 50 μm is placed on the substrate on which the photocurable layer is formed, and then a first UV light source (first The light curable layer was exposed at an exposure amount of 520 mJ / cm ² . Therefore, the photocurable layer is formed in a concavo-convex shape so as to be hardened and protruded in the exposed first region and to be recessed without being cured in the second unexposed region. After removing the pattern mask, the photocurable layer was exposed using a second UV light source (second light source) of 450 mJ / cm ² in a nitrogen atmosphere. Thereby, it hardened | cured so that the surface height of a 1st area | region and a 2nd area | region might differ, and the fine structure was obtained.

The substrate having the fine structure of the photocurable layer formed on the surface in this manner is put into a magnetron sputtering apparatus, and Sn / (In + Sn) = 10 mass%, that is, the tin in the tin with respect to the total mass of indium and tin. The target is indium tin oxide having a mass of 10% by mass, and the degree of vacuum in the apparatus is set to 3 × 10 ⁻⁶ torr. Then, O ₂ /Ar=0.02, that is, the ratio of oxygen to argon is 0.02. Argon and oxygen are introduced into the apparatus so that the gas pressure is 5 × 10 ⁻⁴ torr, the input power is 4 kW, the substrate temperature is room temperature, and the cured photocurable layer has a thickness of 30 nm indium oxide. A tin conductive layer was formed.

  As described above, the surface roughness of the conductive substrate formed by the method of Example 1 was measured with a probing surface roughness meter (micro shape measuring machine, manufactured by Kosaka Laboratory Ltd., model number: ET4000A). The value was 0.21 μm, the Rz value was 0.73 μm, and the Sm value was 0.099 mm.

(Sliding writing test of conductive substrate)
A sliding inspection machine (Taiwan Newsun TECHNOLOGY, model number SDT-009) is formed by bonding conductive substrates with conductive glass with spacers on the surface and indium tin oxide conductive layers facing each other. The surface of the conductive substrate on which the transparent conductive layer was not formed was reciprocated between 2 cm and 100,000 times while being pressed with a 250 g press with a formaldehyde resin stylus pen with an R0.8 tip.

(Measurement of surface resistance of conductive substrate)
Conductive substrate before and after the above-mentioned sliding writing test using a surface resistance measuring machine (Mitsubishi Yuka Co., Ltd., Lotest AMCP-T400) using a four-probe method according to JIS-K7194 The surface electrical resistance of was measured. The resistance value before the sliding writing test was set to Ro, the resistance value after the test was set to R, and the ratio of R to Ro was calculated. Here, the closer the R / Ro value is to 1, the better the structural stability of the conductive substrate, that is, the more difficult it is to peel off the conductive layer. The R / Ro value of the conductive substrate obtained in this example is shown in Table 1 below.

<Example 2 to Example 4>
In Examples 2 to 4, the manufacturing method and the evaluation method of the conductive substrate are almost the same as those in Example 1. The difference from Example 1 is that the first UV light source for exposing the photocurable layer is used. This is that the exposure amount of (first light source) is different.

  Table 1 below shows the first light source exposure amount, the pattern mask space width and line width, the surface roughness parameters, and the R / Ro values for each of Examples 1 to 2, and the first light source. By changing the exposure amount, it is compared how the surface roughness of the conductive substrate changes and how the result affects the structural stability of the conductive substrate.

  As can be seen from Table 1, when the Rz value is less than 0.73 μm or exceeds 2.82 μm, the R / Ro value is relatively high, that is, the structural stability of the conductive substrate is lowered. Therefore, it is derived that a particularly preferable value of Rz is 0.73 to 2.82 μm. Incidentally, as a conductive substrate used for a touch panel, it is generally required that R / Ro ≦ 1.3, but this required value varies depending on the application range.

<Example 5 to Example 7, Comparative Example 1>
In Examples 5 to 7, the manufacturing method and the evaluation method of the conductive substrate are substantially the same as those in Example 1. The difference from Example 1 is that the first UV light source for exposing the photocurable layer is used. In addition to the exposure amount of (first light source), the space width and line width of the pattern mask are different.

  Table 2 below shows the first light source exposure amount, the pattern mask space width and line width, the surface roughness parameters, and the R / Ro values of Examples 5 to 7, and the first light source. By changing the exposure amount and the space width and line width of the pattern mask, how the surface roughness of the conductive substrate changes and how the result affects the structural stability of the conductive substrate will be compared.

  Table 2 also shows the results of Example 2 and Comparative Example 1 for comparison. In Comparative Example 1, the substrate used in each Example was not provided with a photocurable layer, that is, without forming a fine structure, and using a magnetron sputtering apparatus as it was, under the same conditions as in Example 1 above, An indium tin oxide conductive layer having a thickness of 30 nm is formed on a substrate.

  As can be seen from the results of Examples 1 to 7 and Comparative Example 1 in Table 1 and Table 2, the surface of the conductive substrate (Examples 1 to 7) having the photo-curable layer having the microstructured surface is the microstructure. It can be seen that the resistance value ratio (R / Ro) is close to 1 compared to the conductive substrate (Comparative Example 1) that does not have the photocurable layer formed. In other words, the conductive substrate obtained by the method according to the present invention has the micro-structured photo-curable layer 22 between the substrate 21 and the conductive layer 23, thereby bonding the substrate 21 and the conductive layer 23. Since the strength is enhanced and the surface of the conductive layer 23 formed in the photocurable layer 22 is also finely structured, the conductive layer 23 is damaged due to repeated application of pressure from the outside, and the conductive layer. 23 shows that peeling from the substrate 21 is prevented.

  As mentioned above, although preferable embodiment of this invention was described, this invention is not limited to this, It cannot be overemphasized that it can change variously in the range which does not deviate from the summary.

  According to the method for manufacturing a conductive substrate according to the present invention, it is possible to provide a conductive substrate in which the conductive layer is prevented from being damaged or peeled off from the substrate due to repeated application of pressure from the outside. Therefore, for example, it can be used for manufacturing an electrode plate for a touch panel.

21 Substrate 22, 22a, 22b Photocurable layer 220 Photocurable layer surface 221 First region 222 Second region 23 Conductive layer 230 Conductive layer surface 31 Pattern mask 311 Light transmitting region 312 Light non-transmitting region L1 First Light source L2 Second light source

Claims (8)

A method of manufacturing a conductive substrate for an electrode plate in a touch panel,
A photocurable layer having a plurality of reactive functional groups and a photocurable layer containing a photocurable composition containing at least one photocurable prepolymer having a functional group equivalent of 70 to 700 g / mol on a substrate. Forming process;
An arranging step of arranging a pattern mask on the photocurable layer so as to shield a part of the photocurable layer;
A first exposure step of exposing the photocurable layer using a first light source through the pattern mask to cure the first region in the photocurable layer;
A removing step of removing the pattern mask;
The second light source is used to expose the photocurable layer from which the pattern mask has been removed, to cure a second region that is not cured in the photocurable layer, and thereby the first region and the second region are cured. A second exposure step in which a fine structure is formed on the substrate by imparting surface roughness due to different surface heights from the region;
A conductive layer forming step of forming a conductive layer on the microstructure;
It equipped with a door,
In the first exposure step, the exposure amount as the first light source performs the exposure by using the ultraviolet ^{70mJ / cm 2 ~4000mJ / cm 2} ,
The width of each first region is 50 μm to 250 μm,
The surface roughness of the microstructure is 0.73 μm to 2.82 μm in Rz value and 0.05 mm to 0.35 mm in Sm value.
The manufacturing method of the electroconductive board | substrate characterized by the above-mentioned.   The method for producing a conductive substrate according to claim 1, wherein an alkenyl group or an epoxy group is used as the reactive functional group. 3. The method for manufacturing a conductive substrate according to claim 1, wherein in the first exposure step, the first light source is selected from ultraviolet rays, visible rays, electron beams, or X-rays. . In the second exposure step, as the second light source, ultraviolet rays, visible light, and wherein the selectively used from the electron beam or X-ray method for producing a conductive substrate according to claim 1 or 2 . The substrate is made of a polymer, and the polymer is a polyester resin, a polyether resin, a polycarbonate resin, a polyamide resin, a polyimide resin, a polyolefin resin, an acrylic resin, a polyvinyl chloride resin, Group consisting of polystyrene resin, polyvinyl alcohol resin, polyarylate resin, polyphenylene sulfide resin, polyvinylidene chloride resin, methacrylate ester resin, acetyl cellulose resin, diacetyl cellulose resin , triacetyl cellulose resin The method for producing a conductive substrate according to any one of claims 1 to 4 , wherein at least one selected from the group consisting of more than one is used. The conductive layer is made of a metal or a metal compound,
The metal uses at least one selected from the group consisting of gold, silver, platinum, lead, copper, aluminum, nickel, chromium, titanium, iron, cobalt, tin,
The metal compound, indium oxide, tin oxide, titanium oxide, aluminum oxide, zinc oxide, gallium oxide, characterized by using at least one selected from the group consisting of indium tin oxide, claim 1-5 The method for producing a conductive substrate according to one item. The conductive layer is characterized by being formed on the surface of the fine structure by the sputtering method, method for producing a conductive substrate according to any one of claims 1-6. A conductive substrate manufactured by the method for producing a conductive substrate according to any one of claim 1 to 7 the surface roughness of the conductive layer, at 0.73μm~2.82μm in Rz value A conductive substrate having a Sm value of 0.05 mm to 0.35 mm.

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