JP2013205991A - Capacitive touch panel substrate formed on transparent base material and display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a capacitive touch panel substrate that can be easily released from another organic constituent such as an adhesive sheet and an ultraviolet curable resin when manufacturing the capacitive touch panel substrate and thereby can be manufactured inexpensively without decreasing a yield.SOLUTION: A capacitive touch panel substrate formed on a transparent base material, includes: first transparent electrodes 1; second transparent electrodes 2; first connection parts 3 connecting the first transparent electrodes 1; second connection parts 4 connecting the second transparent electrodes 2; an insulator layer 5 formed in spaces where the first connection parts 3 and the second connection parts 4 intersect; extraction wiring 20 connected to the first transparent electrodes 1 and the second transparent electrodes 2; and a protective layer 6. The contact angle between the protective layer 6 and water is 65° or more and 85° or less. The content of fluorine elements on the surface of the protective layer 6 is 0.1 or more and 30.0 or less when the amount of carbon elements on the surface of the protective layer 6 is 100.

Description

  The present invention relates to a capacitive touch panel substrate and a display device formed on a transparent substrate.

The touch panel is a component of an input device that allows the operator to touch a transparent surface on the display screen with a finger or a pen to detect a touched position and input data. In recent years, it has become widely used because it enables intuitive input. In particular, the touch panel is often combined with a display panel such as a liquid crystal to input and output information in an integrated manner.
The touch panel detection method includes a resistance film type, a capacitance type, an ultrasonic type, an optical type, and the like. Until now, the resistance film type, which was relatively excellent in terms of manufacturing cost, has been the mainstream. However, a resistive touch panel having a structure in which an air layer is provided between two transparent conductive films has low optical characteristics (for example, transmittance), and it cannot be said that durability and operating temperature characteristics are sufficient. Improvements have been sought.

On the other hand, capacitive touch panels that do not have moving parts have high optical characteristics (for example, transmittance), and are superior in resistance and operating temperature characteristics in terms of durability and operating temperature characteristics. Development is progressing toward the application (see, for example, Patent Documents 1 and 2).
The capacitive touch panel can be roughly classified into a surface type and a projected type, and a surface type is used for a large product of 10 type (25.4 cm size) or more. In many cases, a projection type is used for a small product of type 6 or less. A surface type with a simple electrode plate structure is likely to be large, but it is difficult to detect two or more contact points simultaneously. On the other hand, a projection type with a complicated electrode plate structure is disadvantageous for an increase in size, but two or more contact points can be detected simultaneously.

  In general, a projected capacitive touch panel substrate includes a first transparent electrode arranged in the x direction, a second transparent electrode arranged in the y direction, and a first transparent electrode on a transparent substrate. The first connection part that joins the first connection part, the second connection part that joins the second transparent electrodes, and the first connection part and the second connection part intersect with each other. And an insulating layer for electrically insulating the second connection portion. In addition, on the transparent base material, extraction wiring connecting these transparent electrodes and control circuit is formed, and extraction wiring connecting to the control circuit to protect the transparent electrodes, connection parts and extraction wiring from corrosion and contact scratches. In many cases, a protective layer is formed and used so as to cover almost the entire surface other than the connection portion (see, for example, Patent Document 3).

  There are two types of projected capacitive touch panels: a film type using a resin film such as polyethylene terephthalate (PET) as a transparent substrate, and a glass type using non-alkali glass or soda glass. However, the glass type is often used for small products such as portable terminals because the transparency is inferior and the resistance of the transparent electrode on the film is high, so the electrode part cannot be made small. ing.

  The projected capacitive touch panel described above is generally located on the outermost surface when viewed from the operation surface side, and includes a tempered glass called a cover glass for preventing cracks and scratches, and a touch panel provided with a transparent electrode It consists of a substrate and a display device such as a liquid crystal display device or an organic EL display. The projected capacitive touch panel has a problem that the transparent electrode on the touch panel substrate is visually recognized when viewed from the operation surface side of the touch panel and / or moire generated between the touch panel substrate and the display device. In order to avoid the problem of being visually recognized and the problem that the performance of the touch panel is degraded due to noise generated from a display device such as a liquid crystal display device or an organic EL display, between the cover glass and the touch panel substrate and / or the touch panel substrate. In many cases, a gap layer of about 0.1 to 1.0 μm is formed between the display devices.

In recent years, a thinner projection capacitive touch panel has been demanded, and the gap layer is removed while avoiding the above-described problems of visually recognizing the transparent electrode and moire and the problem of deterioration of the touch panel performance due to noise. Thus, a thinning method is disclosed (for example, see Patent Documents 4 and 5).
However, in this method, even if the gap layer is removed and a thin touch panel substrate can be manufactured, in the bonding process using other organic components such as an adhesive sheet and an ultraviolet curable resin, foaming and dust are attached. In other words, since the touch panel substrate having a poor quality cannot be efficiently regenerated and / or reused, there is a problem in that the yield is deteriorated and the productivity is lowered. That is, the protective layer on the surface of the touch panel substrate in which the quality is poor has poor peelability from the organic component (hereinafter referred to as “releasability”) and cannot be removed cleanly. There has been a problem of lowering.

  Other characteristics required for the projected capacitive touch panel include minimization of the margin at the glass edge and increased strength of the glass edge. As an effective and productive method for realizing this, a plurality of the touch panel substrates are bonded together with an ultraviolet curable resin having ultraviolet curable and hot water peelability to form a laminated body, and the glass edge of the laminated body A method is known in which a plurality of touch panel substrates are processed together by cutting and polishing the glass or strengthening glass (see, for example, Patent Documents 6 and 7).

  The UV curable resin is applied to the touch panel substrate after the UV curable resin is applied, bonded to a desired base material, and irradiated with UV light to cure the exposed portion of the coating film by photocrosslinking. The touch panel substrate is divided into original pieces by immersing in warm water after performing desired treatments collectively. By using this ultraviolet curable resin, the touch panel substrate can be processed together, and therefore, it can be manufactured at a lower cost compared to the case of individual processing. However, when this method is used, in the touch panel substrate disclosed heretofore, the UV curable resin remains on the surface of the touch panel substrate because the peelability of the protective layer on the surface of the touch panel substrate and the UV curable resin is poor in warm water. Could not solve the problem.

JP 63-174120 A JP 2006-23904 A JP 2007-279819 A JP 2011-213796 A JP 2011-192271 A JP 2010-285324 A JP 2010-192616 A

The purpose of the present invention is that when manufacturing a capacitive touch panel, even if there is a process of adhering the touch panel substrate surface and other organic components such as an adhesive sheet and an ultraviolet curable resin, the release property is good. In addition, it provides a capacitive touch panel substrate that can be manufactured at low cost without causing problems such as a decrease in yield because the touch panel substrate cannot be reused cleanly and the organic component remains on the surface of the touch panel substrate. It is to be.
Another object of the present invention is to provide a cover glass-integrated capacitive touch panel substrate that can be manufactured at a lower cost by using a cover glass as a transparent substrate.
Moreover, it is providing the display apparatus which has the said electrostatic capacitance type touch panel board | substrate.

The present invention has been made in view of such a situation, and when producing a capacitive touch panel substrate, since the release property from other organic components such as an adhesive sheet and an ultraviolet curable resin is good, the yield is high. Provided is a capacitive touch panel substrate that can be manufactured at low cost without lowering.
According to one aspect of the first invention of the present invention, (A) a first transparent electrode, (B) a second transparent electrode, and (C) (A) a first linking the first transparent electrode. And (D) the second connection portion connecting the second transparent electrodes, (E) the intersection of the (C) first connection portion and the (D) second connection portion. An insulating layer formed during the process, (F) (A) the first transparent electrode and (B) the lead-out wiring connected to the second transparent electrode, and (G) a protective layer. In the capacitive touch panel substrate formed on the transparent base material, the contact angle between the protective layer (G) and water is in the range of 65 degrees to 85 degrees, and the (G) Content of the fluorine element on the surface of the protective layer is in the range of 0.1 to 30.0, where the amount of carbon element on the surface of the protective layer (G) is 100. A capacitive touch panel substrate formed on a transparent substrate to be.

One aspect of the second invention according to claim 2 is formed on a transparent substrate, wherein the protective layer (G) contains a fluorine-based additive having an unsaturated ethylenic double bond. It is a capacitive touch panel substrate.
One aspect of the third invention according to claim 3 is a capacitive touch panel substrate formed on a transparent substrate, wherein the transparent substrate is the same as a cover glass.
One aspect of the fourth invention according to claim 4 is a display device including the capacitive touch panel substrate formed on the transparent base material described above.

According to the present invention, when manufacturing a capacitive touch panel substrate, because it has good releasability from other organic components such as pressure-sensitive adhesive sheets and ultraviolet curable resins, it is inexpensive without reducing yield. A touch panel substrate that can be manufactured can be provided.
In addition, when manufacturing a thin capacitive touch panel substrate, it can be manufactured at low cost without reducing the yield because of its good releasability from other organic components such as adhesive sheets and UV-curable resins. A touch panel substrate can be provided.

In addition, when manufacturing a capacitive touch panel substrate with a blank space at the edge of the glass, the yield is improved because it is easy to release from other organic components such as adhesive sheets and UV-curable resins. It is possible to provide a touch panel substrate that can be manufactured at low cost without being reduced.
Further, by using a cover glass for the transparent base material, it is possible to provide a cover glass integrated touch panel substrate that can be manufactured at a lower cost by reducing the number of components.
In addition, it is possible to provide a display device having the capacitive touch panel substrate.

After the first transparent electrode, the second transparent electrode, and the first connection portion connecting the first transparent electrode were formed, the second connection portion and the extraction wiring were simultaneously formed through the insulating layer, The plane schematic diagram which shows an example of the electrostatic capacitance type touch panel board | substrate of this invention. After the second connecting portion and the extraction wiring are formed at the same time, the first connecting portion connecting the first transparent electrode through the first transparent electrode, the second transparent electrode, and the insulating layer is formed, The plane schematic diagram which shows an example of the electrostatic capacitance type touch panel board | substrate of this invention. a) Projection schematic diagram showing an example of the capacitive touch panel substrate of the present invention. b) Projection schematic diagram showing an example of the cover glass integrated capacitive touch panel substrate of the present invention. a) A cross-sectional schematic diagram showing an example of a capacitive touch panel having a conventional gap layer. b) The cross-sectional schematic diagram which shows an example of the cover glass integrated electrostatic capacitance type touch panel of this invention which removed the gap layer.

The projected capacitive touch panel substrate of the present invention will be described in detail based on the embodiment. The touch panel substrate of the present invention is not limited to the following configuration unless it exceeds the gist.
The touch panel substrate of this embodiment is a first substrate that connects (A) a first transparent electrode, (B) a second transparent electrode, and (C) (A) a first transparent electrode on a transparent base material. A connection portion, (D) (B) a second connection portion connecting the second transparent electrodes, (E) (C) formed between the first connection portion and (D) the second connection portion. An insulating layer, (F) (A) a first transparent electrode, and (B) a lead-out wiring connected to the second transparent electrode, and (G) a protective layer, (G) a protective layer The touch panel substrate has a contact angle between water and water in the range of 65 degrees to 85 degrees.

Here, the contact angle is a contact angle at room temperature with respect to pure water, which is determined by a sessile drop method defined in 6 of JIS R3257.
When the contact angle is less than 65 degrees, the adhesion with organic components such as pressure-sensitive adhesive sheets and ultraviolet curable resins is improved, so that the organic components are not peeled off and the yield in the reuse process and the like is reduced. When the contact angle is larger than 85 degrees, the adhesion with the organic component is deteriorated, the desired tackiness and adhesiveness cannot be obtained, and problems such as breakage due to falling off or peeling off of the substrate occur.

Further, the touch panel substrate of the present embodiment is quantified by analyzing and quantifying the content of fluorine element on the surface of the touch panel substrate by X-ray photoelectron spectroscopy, and assuming the amount of carbon element on the surface of the touch panel substrate as 100. Is contained in a ratio of 0.1 to 30.0.
The measurement of the fluorine element content on the surface of the touch panel substrate is performed using X-ray photoelectron spectroscopy (also referred to as ESCA (Electron Spectroscopy for Chemical Analysis)). Photoelectron X-ray spectroscopy is capable of quantifying elements of several tens of atoms with a depth of several nanometers from the outermost surface of the touch panel substrate. It has been found that there is a relationship with releasability from organic components such as.

When the present inventors include the fluorine element on the surface of the touch panel substrate after post-baking measured by X-ray photoelectron spectroscopy at a ratio of 0.1 to 30.0 in the touch panel substrate surface Furthermore, the present inventors have found that a surface having good releasability from organic components such as pressure-sensitive adhesive sheets and ultraviolet curable resins can be obtained.
The ratio of the amount of fluorine element to the amount of carbon element is preferably in the range of 0.1 to 20.0, more preferably in the range of 1 to 10.0. When the fluorine element is smaller than 0.1, the adhesion with organic components such as the pressure-sensitive adhesive sheet and the ultraviolet curable resin is improved. Desirable tackiness and adhesiveness with an organic component such as a curable resin cannot be obtained, resulting in problems such as breakage due to dropping off or peeling off of the substrate.

<UV curable organic coating composition>
The ultraviolet curable organic coating composition suitable for use in the protective layer of the touch panel substrate of the present embodiment is not particularly limited as long as it satisfies the above-described functions, but (i) a photopolymerizable monomer, (ii) An ultraviolet curable organic coating composition containing a transparent resin, (iii) a photopolymerization initiator, (iv) an additive, and (v) a solvent, wherein the contact angle between the protective layer (G) and water is 65 In order to be in the range of not less than 85 degrees and not more than 85 degrees, and / or in the ratio of the fluorine element on the surface of the touch panel substrate after the post-baking is in the range of 0.1 to 30.0, It is preferable that at least one selected from the group of i) a photopolymerizable monomer, (ii) a transparent resin, and (iv) an additive contains a fluorine element. In particular, since the function required for the protective layer (G) is a contact angle with water on the surface of the protective layer and the fluorine element content on the surface, the surface modification of the protective layer is possible, and From the viewpoint of easily adjusting the addition amount, it is preferable to use (iv) an additive containing fluorine as an additive.

  Specific examples of the fluorine-containing compound include vinylidene fluoride, vinyl fluoride, ethylene trifluoride and the like, and fluororesins such as copolymers thereof. The additive containing elemental fluorine contains a perfluoroalkyl structure in which all or part of the hydrogen atoms in the hydrocarbon group are replaced with fluorine atoms. As the additive containing elemental fluorine, commercially available products may be used. For example, trade names: Megafac F-114, F-172D, F-178K, F-178RM, F-410, F-443, F-444, F-445, F-470, F-471, F-472SF, F-474, F-475, F-477, F-479, F-482, F-483, F-489, F- 493, F-494, R-30, R-61, R-90, MOF-350SF (manufactured by DIC), tangent 100C, 150CH, 208G, 212MH, 215M, 222F, 245F, 250, 251, 300, 310 , 400SW, 501, 710FS, 710FM, 710FL, AK, FTX-206D, FTX-207S, FTX-208G, FTX-209F, F X-211S, FTX-212D, FTX-213F, FTX-218G, FTX-218G, FTX-220D, FTX-220S, FTX-230D, FTX-230G, FTX-230S, FTX-233F, FTX-240D, FTX- 240G, FTX-245M, FTX-290M, FTX-710LL, FTX-730FM, FTX-730FL, FTX-730LS, FTX-730LM, FTX-730LL, FTX-750FM, FTX-750LL (manufactured by Neos FC), Novec FC 4430, FC-4432 (manufactured by Sumitomo 3M), F-top EF-351, EF-352, EF-801, EF-802 (manufactured by Gemco), and the like.

  Among them, those having a nonionic structure are preferable from the viewpoint of the stability of the ultraviolet curable organic coating composition. For example, Megafac F-172D, F-178K, F-178RM, F-443, F-444, F-445, F-470, F-471, F-472SF, F-474, F-475, F-477, F-479, F-482, F-483, F-489R-30, R-61, R-90, MOF-350SF (manufactured by DIC), footage 208G, 212MH, 215M, 222F, 245F, 250, 251, 710FS, 710FM, 710FL, FTX-206D, FTX-207S, FTX-208G, FTX-209F , FTX-211S, FTX-212D, FTX-213F, FTX-218, FTX-218G, FT -220D, FTX-220S, FTX-230D, FTX-230G, FTX-230S, FTX-233F, FTX-240D, FTX-240G, FTX-245M, FTX-290M, FTX-710LL, FTX-730FM, FTX-730FL , FTX-730LS, FTX-730LM, FTX-730LL, FTX-750FM, FTX-750LL (manufactured by Neos), Novec FC-4430, FC-4432 (manufactured by Sumitomo 3M), F-top EF-351, EF-352 EF-801, EF-802 (Gemco) and the like.

Furthermore, the (iv) additive preferably contains a fluorine-based additive having at least one unsaturated ethylenic double bond.
As a fluorine-type additive which has an unsaturated ethylenic double bond, you may use a commercially available thing, for example, brand name: Mega-Fac RS-75, Mega-Fac RS-76-E, Mega-Fac RS-76- NS, Megafuck RS-72-K, Defenza FH-700 (manufactured by DIC), KY-1203 (manufactured by Shin-Etsu Chemical), OPTOOL AR-110, OPTOOL DAC-HP (manufactured by Daikin) and the like.

  The content of the fluorine-based additive is preferably in the range of 0.1 to 5.0% by weight, more preferably 0.1 to 3% by weight with respect to the solid content of the ultraviolet curable organic coating composition. It is in the range of 0% by weight. If the content of the fluorine-containing additive having an unsaturated ethylenic double bond is less than 0.1% by weight, the adhesiveness with an organic component such as an adhesive sheet or an ultraviolet curable resin is improved, so that it is beautiful. If it is not peeled off and the content is more than 5.0% by weight, the desired adhesiveness and adhesiveness with an organic component such as a pressure sensitive adhesive sheet or an ultraviolet curable resin cannot be obtained, and the substrate is damaged due to dropping or peeling. It will cause problems such as.

The (i) photopolymerizable monomer is not particularly limited as long as it can be crosslinked by light. The photopolymerizable monomer used in a general ultraviolet curable organic coating composition can be used. Can be used. An ultraviolet curable organic coating composition suitable for use in the present embodiment contains (i) a photopolymerizable monomer and (iii) a photopolymerization initiator described later in the composition after light irradiation. The film | membrane etc. which consist of a composition can be favorably hardened | cured because (i) photopolymerizable monomers or (i) a photopolymerizable monomer and (ii) transparent resin mentioned later superpose | polymerize. Moreover, by performing light irradiation through a mask, the physical properties and the solubility in a developer differ between a portion irradiated with light (exposed portion) and a portion not irradiated with light (unexposed portion). Thus, a pattern can be obtained satisfactorily.
In this embodiment, “light” is a concept including not only visible light but also infrared rays, ultraviolet rays, and various types of radiation (X-rays, γ-rays, electron beams, etc.), and (i) photopolymerization of the present invention. The polymerizable monomer is preferably one that is favorably polymerized by various light rays described below.

  (I) Specific examples of the photopolymerizable monomer include 1,9-nonanediol diacrylate, EO (ethylene oxide) modified bisphenol A diacrylate, PO (propylene oxide) modified bisphenol A diacrylate, and EO modified bisphenol F diacrylate. , ECH (epichlorohydrin) modified phthalic diacrylate, PO modified glycerol triacrylate, EO modified trimethylolpropane triacrylate, PO modified trimethylolpropane triacrylate, trimethylolpropane tri (meth) acrylate, ethylene oxide adduct of trimethylolpropane Tri (meth) acrylate, trimethylolpropane propylene oxide adduct tri (meth) acrylate, trimethylolethane tri (meth) Acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, tetra (meth) acrylate of pentaerythritol ethylene oxide adduct, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, Penta (meth) acrylate of ethylene oxide adduct of dipentaerythritol, penta (meth) acrylate of caprolactone adduct of dipentaerythritol, tripentaerythritol poly (meth) acrylate, glycerol tri (meth) acrylate, ethylene oxide addition of glycerol Tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 2-hydroxy-3-acryl Iroxypropyl methacrylate, polyethylene glycol # 200 diacrylate, polyethylene glycol # 400 diacrylate, polyethylene glycol # 600 diacrylate, polyethylene glycol # 1000 diacrylate, tricyclodecane dimethanol diacrylate, 1,10-decanediol diacrylate, 1,6-hexanediol diacrylate, 1,9-nonanediol diacrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, polypropylene glycol # 400 diacrylate, polypropylene glycol (# 700) diacrylate, polytetramethylene glycol # 650 diacrylate, 9,9-bis [4- (2-acryloyloxyethoxy) phenyl Nyl] fluorene, 5-ethyl-2- (2-hydroxy-1,1-dimethylethyl) -5- (hydroxymethyl) -1,3-dioxane diacrylate, neopentyl glycol acrylic acid adduct of hydroxypivalate, bisphenol -F4 mole ethylene oxide adduct diacrylate, ethylene oxide modified phosphoric acid acrylate, propoxylated ethoxylated bisphenol A diacrylate, ethoxylated bisphenol A diacrylate, propoxylated bisphenol A diacrylate, bisphenol A EO adduct acrylate, etc. .

  Among these, “R-604” (manufactured by Nippon Kayaku Co., Ltd.) as 5-ethyl-2- (2-hydroxy-1,1-dimethylethyl) -5- (hydroxymethyl) -1,3-dioxane diacrylate, “FM-400” (manufactured by Nippon Kayaku Co., Ltd.) as the neopentyl glycol acrylic acid adduct of hydroxypivalate, “R-712” (manufactured by Nippon Kayaku Co., Ltd.) as the diacrylate of bisphenol F4 mole ethylene oxide adduct, ethylene “PM-21” (manufactured by Nippon Kayaku Co., Ltd.) is preferably used as the oxide-modified phosphate acrylate, and “V # 700” (manufactured by Osaka Organic Chemical Industry Co., Ltd.) is used as the bisphenol A EO adduct acrylate.

  (I) Only 1 type may be used for a photopolymerizable monomer and it may use 2 or more types together. The content ratio of (i) the photopolymerizable monomer in the photosensitive resin composition of the present embodiment is not particularly limited, but (ii) the photopolymerizable monomer is (i) based on 100 parts by mass of the transparent resin. It is preferably within the range of 30 to 150 parts by mass, more preferably within the range of 30 to 100 parts by mass, and even more preferably within the range of 40 to 80 parts by mass. By setting it as 30 mass parts or more, the developability and sensitivity at the time of pattern processing can be improved especially, and by setting it as 150 mass parts or less, adhesiveness with the inorganic material surface can be made especially favorable.

The above (ii) transparent resin has good adhesion to the surface of an inorganic material layer such as a transparent substrate or transparent electrode, and increases the mechanical strength when a protective layer is formed on the surface of the underlying inorganic material layer. Because it is heat and chemical resistant and resistant under high temperature and high humidity conditions, these films are exposed to heat and chemicals in the touch panel manufacturing process, or the manufactured touch panel is placed under high temperature and high humidity. Even if it is a case, it is preferable that the compound which has an alkoxysilane is included at the point which can function favorably.
The compound (ii) having an alkoxysilane that constitutes the transparent resin has an adhesive property because the Si atom in the alkoxysilane interacts with an atom on the surface of the inorganic material (substrate surface) composed of a metal or an inorganic substance. Is thought to improve. Moreover, the hardness of the film | membrane obtained by hardening the photosensitive resin composition becomes high by containing Si atom.

  (Ii) In the transparent resin, the compound having alkoxysilane includes γ-methacryloyloxypropyltrimethoxysilane, γ-acryloyloxypropyltrimethoxysilane, γ-methacryloyloxypropyltriethoxysilane, and γ-acryloyloxypropyltriethoxysilane. Γ-methacryloyloxypropylmethyldimethoxysilane, γ-acryloyloxypropylmethyldimethoxysilane, γ-methacryloyloxypropylmethyldiethoxysilane, γ-acryloyloxypropylmethyldiethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, etc. Can be mentioned. Among these, γ-methacryloyloxypropyltrimethoxysilane, γ-acryloyloxypropyltrimethoxysilane, γ-acryloyloxypropylmethyldimethoxysilane, γ-methacryloyloxypropyltriethoxysilane, γ-acryloyloxypropyltriethoxysilane, γ -Methacryloyloxypropylmethyldimethoxysilane, γ-methacryloyloxypropylmethyldiethoxysilane, and γ-acryloyloxypropylmethyldiethoxysilane are preferable, and γ-methacryloyloxypropyltrimethoxysilane and γ-acryloyloxypropyltrimethoxysilane are more preferable. . Only 1 type may be used for the compound which has alkoxysilane, and it may use 2 or more types together.

  Examples of the (iii) photopolymerization initiator include acetophenone, 2,2′-diethoxyacetophenone, p-dimethylacetophenone, p-dimethylaminopropiophenone, dichloroacetophenone, trichloroacetophenone, p-tert-butylacetophenone, and the like. Benzophenones such as benzophenone, 2-chlorobenzophenone, p, p'-bisdimethylaminobenzophenone; benzoin ethers such as benzyl, benzoin, benzoin methyl ether, benzoin isopropyl ether, benzoin isobutyl ether; thioxanthone, 2- Sulfur compounds such as chlorothioxanthone, 2,4-diethylthioxanthone, 2-methylthioxanthone, 2-isopropylthioxanthone; 2-hydroxy-2-methyl-1-phenyl-propan-1-one, 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1-propane-1- ON, 2-Hydroxy-1- {4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl] phenyl} -2-methyl-propan-1-one, 1-hydroxy-cyclohexyl-phenyl-ketone 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,2- ( Alkylphenones such as dimethylamino) -2-[(4-methylphenyl) methyl] -1- [4- (4-morpholinyl) phenyl] -1-butanone; 1,2-octane Dione, 1- [4- (phenylthio)-, 2- (O-benzoyloxime)], ethanone, 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl]-, 1- (0-acetyloxime), 1- “4- (phenylthio) phenyl] -octane-1-one-2-oneoxime-O-benzoate (product name“ OXE01 ”(manufactured by BASF Japan)), etc. Oxime esters; anthraquinones such as 2-ethylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3-diphenylanthraquinone; 2,4-trichloromethyl- (4′-methoxyphenyl) -6-triazine, 2,4-trichloromethyl- (4′-methoxynaphthyl) -6-triazine, 2,4-trichloromethyl- Piperonyl) -6-triazine, 2,4-trichloromethyl - (triazines such as 4'-methoxy styryl) -6-triazine; and the like.

  (Iii) Only 1 type may be used for a photoinitiator and it may use 2 or more types together. Although the content rate of (iii) photoinitiator in the photosensitive resin composition of this embodiment is not specifically limited, (iii) With respect to 100 mass parts of transparent resins, (iii) Photoinitiator is It is preferably within the range of 5 to 20 parts by mass, more preferably within the range of 5 to 15 parts by mass, and even more preferably within the range of 5 to 10 parts by mass. By setting it as 5 mass parts or more, the sensitivity at the time of pattern processing can be improved especially, and transparency can be made especially favorable by setting it as 20 mass parts or less.

  Examples of the solvent (v) include methanol, ethanol, ethyl cellosolve, ethyl cellosolve acetate, methyl cellosolve, methyl cellosolve acetate, diglyme, cyclohexanone, ethylbenzene, xylene, isoamyl acetate, n-amyl acetate, propylene glycol monomethyl ether, propylene glycol monomethyl ether Ether acetate, propylene glycol monoethyl ether, propylene glycol monoethyl ether acetate, diethylene glycol, diethylene glycol monomethyl ether, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether, ethylene glycol Monobutyl ether acetate, triethylene glycol, triethylin glycol monomethyl ether, triethylin glycol monomethyl ether acetate, triethylene glycol monoethyl ether, triethylene glycol monoethyl ether acetate, liquid polyethylene glycol, dipropylene glycol monomethyl ether, dipropylene glycol monomethyl Examples include ether acetate, dipropylene glycol monoethyl ether, dipropylene glycol monoethyl ether acetate, lactic acid ester, methyl methoxypropionate, and ethyl ethoxypropionate.

  (V) Only 1 type may be used for a solvent and it may use 2 or more types together. (V) Although the content rate of a solvent is not specifically limited, It is preferable to use so that the solid content rate in all the photosensitive resin compositions may exist in the range of 20-30 mass%. By setting the solid content ratio within the above range, the viscosity of the photosensitive resin composition can be made moderate, and the coating property when forming a film by coating on an inorganic material (substrate) is particularly high. improves.

  As the ultraviolet curable organic coating composition used for the protective layer, the contact angle between the protective layer and water is in the range of 65 ° to 85 °, and / or the surface of the touch panel substrate after the post-baking. In order to contain elemental fluorine in a ratio in which elemental fluorine is in the range of 0.1 to 30.0, a fluorine-based additive having an unsaturated ethylenic double bond is added to a commercially available ultraviolet curable organic coating composition. You may add and use an agent. Films composed of these compositions have pattern processability, and when these compositions are used, a cured film having high hardness and transparency can be obtained.

Examples of commercially available ultraviolet curable organic coating compositions include, for example, trade names: XF110180, XF110181A, XF110181B, XF110182 (Rohm and Haas), NS-E2200 (Toray), NN801, NN901 (JSR) .
Further, in the present embodiment, it is preferable that the transparent base material is the same as the cover glass in that the number of parts can be reduced and manufacturing can be performed at low cost.

<Projection type capacitive touch panel substrate>
FIG. 1 and FIG. 2 are plan views of a touch panel substrate showing an example of the present invention through the protective layer 6. Here, FIG. 1 and FIG. 2 are examples in which the positional relationship of the first connection portion 3, the second connection portion 4, and the insulating layer 5 is different.
As shown in FIG. 1, the projected capacitive touch panel substrate of the present embodiment includes a first transparent electrode 1, a second transparent electrode 2, a first connection portion 3, and a second connection on a transparent substrate 10. Connecting portion 4, insulating layer 5, and lead-out wiring 20. The insulating layer 5 is disposed in order to prevent and insulate the second connecting portion 4 orthogonal to the first connecting portion 3. In addition, the projected capacitive touch panel substrate of the present embodiment further has a protective layer 6.

  FIG. 1 shows a structure in which the first connecting portion 3 is formed in the lowermost layer, the insulating layer 5 is provided thereon, and the second connecting portion 4 is formed on the insulating layer 5. As described above, the second connection portion 4 may be formed in the lowermost layer, and the insulating layer 5 may be provided thereon, and the first connection portion 3 may be formed on the insulating layer 5. The connecting portion 3 and the second connecting portion 4 may be in either the x direction or the y direction with respect to the transparent substrate 10.

 Although it does not specifically limit as the transparent base material 10, For example, glass plates, such as a soda lime glass, a low alkali borosilicate glass, an alkali free alumino borosilicate glass, or a polyethylene terephthalate (PET), a triacetyl cellulose ( A plastic plate or plastic film made of TAC), polymethyl methacrylate (PMMA), polycarbonate (PC), or the like is used.

  FIG. 3 a) is a schematic projection view showing an example of the structure of a projected capacitive touch panel formed on the transparent base material 10 and comprising the touch panel substrate of the present embodiment and the cover glass 30. FIG. 3 b) is a diagram showing the structure of a cover glass integrated projection capacitive touch panel substrate using a cover glass for the transparent base material 10, and an aluminosilicate glass (for example, a trade name) Special glass plates such as “Gollira (manufactured by Corning)”, “IOX-FS (manufactured by Corning)”, “Dragonrail (manufactured by Asahi Glass)”) and chemically strengthened soda lime glass can be used. When a cover glass is used for the transparent substrate 10, the number of parts of one transparent substrate can be reduced in order to provide both a frame layer (bezel) (not shown) and the touch panel sensor 40 on one glass. The touch panel can be manufactured at a low cost.

  The first transparent electrode 1 and the second transparent electrode 2 are not particularly limited as long as the first transparent electrode 1 and the second transparent electrode 2 can be disposed on the surface of the transparent substrate 10, such as ITO and zinc oxide (ZnO). An organic conductive material such as an inorganic conductive material, polyethylenedioxythiophene / polystyrene sulfonic acid (PEDOT / PSS), polyaniline, polypyrrole, or the like can be used. These materials may be used alone or in combination of two or more. Among these, it is preferable to use ITO in terms of transparency and resistance value.

In the case of the structure shown in FIG. 1, that is, the first connection portion 3 is a connection portion for connecting the adjacent first transparent electrodes 1 arranged in the x direction with respect to the transparent substrate 10. Are formed simultaneously with the first transparent electrode 1 using the same transparent conductive material as the material of the first transparent electrode 1. In other words, when the first transparent electrode 1 is formed, the first connecting portion 3 is also formed at the same time, which means that a continuous transparent electrode pattern is formed without interruption in the x direction.
Furthermore, although the 2nd transparent electrode 2 arranged in the y direction with respect to the transparent base material 10 is also formed simultaneously with the 1st transparent electrode 1 and the 1st connection part 3, the 2nd transparent electrode 2 Is not formed at the same time as the second connection portion 4, the state is not yet connected in the y direction at this point.

  The second connection portion 4 is formed separately from the first transparent electrode 1 by using the same transparent conductive material as the material of the first transparent electrode 1, but the material of the extraction wiring 20 through the insulating layer 5. It may be formed simultaneously with the extraction wiring 20 using the same conductive material. Moreover, in the example shown in FIG. 1 and FIG. 2, the connection part of the x direction with respect to the transparent base material 10 is the first connection part 3, and the connection part of the y direction is the second connection part 4. As described above, the x direction and the y direction may be reversed. That is, a structure in which the connection portion in the x direction is used as the second connection portion 3 and formed simultaneously with the extraction wiring 20 using the same conductive material as the material of the extraction wiring 20 may be used.

  Various metal materials can be used for the second connection portion 4 and the lead-out wiring 20, and metals such as Mo (molybdenum), Al (aluminum), Ag (silver), Cu (copper), and Pd (palladium) are used. A method of preferably using a three-layer structure of Mo / Al / Mo and forming a film by sputtering at a thickness of about 350 mm / 2000 mm / 350 mm, followed by a photolithography process using a positive resist, followed by etching and resist stripping ( (Hereinafter referred to as “MAM”) is widely used.

The insulating layer 5 can be formed using a known material conventionally used for an insulating layer or a protective film. Examples thereof include inorganic films such as SiO ₂ and SiN _x and organic materials such as transparent resins. Since inorganic films are formed of SiO ₂ or SiN _x by a CVD method, a sputtering method, or the like, there is a problem that the manufacturing cost becomes high, such as an increase in energy consumption and the number of processes. Organic materials are preferably used. As the organic material, an ultraviolet curable coating composition containing a polymerizable group-containing oligomer, monomer, photopolymerization initiator, and other additives can be used.

  As described above, the protective layer 6 has a contact angle between the protective layer 6 and water in the range of 65 degrees to 85 degrees, and the content of the fluorine element on the surface of the protective layer 6 is analyzed by X-ray photoelectron spectroscopy. If the amount of carbon element on the surface of the protective layer 6 is 100, and the fluorine element contains fluorine element in a ratio within the range of 0.1 to 30.0, unsaturated ethylenic It can be formed using a known ultraviolet curable organic coating composition containing an oligomer having a double bond, a monomer, a photopolymerization initiator, and other additives.

<Projected capacitive touch panel>
FIG. 4a) is a schematic cross-sectional view showing an example of a capacitive touch panel having a conventional gap layer, and FIG. 4b) shows the implementation of the present invention with the gap layer as shown in FIG. 4a) removed. It is a cross-sectional schematic diagram which shows an example of the cover glass integrated capacitive touch panel which concerns on a form.

The capacitive touch panel of FIG. 4 a) includes a liquid crystal display device 70 composed of a liquid crystal 74 carried by a TFT substrate 73 and a color filter 72, a touch panel sensor 40, a cover glass 30, and an anti-scattering film 50. . The touch panel sensor 40 and the cover glass 30 is bonded by a high transparency adhesive layer not shown (O ptical C lear A dhesive Film , hereinafter referred to as "OCA"). Polarizing plates 71 are bonded to both surfaces of the liquid crystal display device 70, and transparent electrodes and metal wirings are formed on one surface of the touch panel sensor 40. Further, a design (bezel) 51 is formed on the cover glass 30 or the scattering prevention film 50. Between the touch sensor 40 and the liquid crystal display device 70, when viewed from the operation surface side of the touch panel, there is a problem that the transparent electrode on the touch panel substrate is visually recognized and / or moire generated between the touch panel substrate and the display device. In order to avoid the problem that the performance of the touch panel is degraded due to noise generated from a display device such as a liquid crystal display device or an organic EL display, and / or between the cover glass and the touch panel substrate, and / or A gap layer 60 having a spacing of about 0.1 to 1.0 μm is formed between the touch panel substrate and the display device. In addition, a design (bezel) 51 may be formed on the touch sensor 40 side of the cover glass 30, and the anti-scattering film 50 may be omitted.

  FIG. 4B) is an example of a capacitive touch panel in which the gap layer 60 is removed and the liquid crystal display device 70 and the scattering prevention film 50 are bonded together by OCA (not shown). An optical adjustment layer 31, a touch panel electrode, and a design (bezel) 51 are formed on the device side. Further, the scattering prevention film 50 and the cover glass 30 on which the optical adjustment layer 31, the touch panel electrode, and the design (bezel) 51 are formed are bonded together by OCA (not shown). Further, the anti-scattering film 50 may be omitted and used due to a device such as an OCA (not shown) having the function of the anti-scattering film 50.

  In the projected capacitive touch panel described above, in order to rework defective bonding products caused by air bubbles and foreign matters mixed in the bonding process using OCA, and reuse defective products in the final touch panel product. Therefore, OCA re-peelability is required. Any known OCA can be used as long as it has removability, and is not particularly limited, but commercially available products include LUCIACS CR9707 (manufactured by Nitto Denko Corporation), 8171CL, 8172CL, 8146-1, 8146. -2, 8146-3, 8146-4 (manufactured by Sumitomo 3M Co., Ltd.), SANCUARY OP, SANCUARY DH, SANCUARY DK (manufactured by Sanei Kaken Co., Ltd.), NE-takMHM-SR (manufactured by Niei Engineering Co., Ltd.), and the like.

<Method of manufacturing capacitive touch panel substrate>
As the 1st transparent electrode 1, the 2nd transparent electrode 2, the 1st connection part 3, and the 2nd connection part 4, although ITO generally used in general is suitable, it is not limited. Depending on the specific specifications of the capacitive touch panel function, the characteristics of ITO and the characteristics as a transparent electrode pattern are selected. For example, as an ITO film, a film having a film thickness of 30 nm and a sheet resistance value of about 100Ω / □ is formed by a thin film forming unit of a sputtering apparatus. Next, a resist pattern is formed by a photolithographic method including a series of steps of resist coating, exposure, and development using an etching-resistant photosensitive resin. Thereafter, a pattern is formed through ITO etching and a resist peeling process. For example, as the first connection portion 3, a large number of patterns having a width of 50 μm to 100 μm and a length of 200 μm to 500 μm are formed.

As the second connection portion 4 and the extraction wiring 20, the above-mentioned Mo / Al / Mo three-layer laminated film is formed by thin film forming means such as a sputtering apparatus, and a resist pattern is formed by the photolithography method. Thereafter, a pattern is formed through a metal etching and resist stripping process. The thickness of each layer can be 350 mm / 2000 mm / 350 mm in order from the lower layer, for example, in the three-layer structure laminated film of this example. For pattern etching of these layers, an etching solution containing phosphoric acid, nitric acid, and acetic acid is used. Can be used for wet etching.
The second connecting portion 4 and the lead-out wiring 20 may be formed by patterning an Al-based or Ag-based metal thin film other than those described above by a photolithography / etching process, or by printing using a conductive ink, etc. Depending on the pattern accuracy, conductivity, size, etc. of the electrode plate, it can be selected as appropriate.

Specifically, the conductive material of the second connection portion 4 and the lead-out wiring 20 is photosensitive such as a conductive paste in which conductive powders such as silver, copper, and carbon are dispersed in an organic binder to impart photosensitivity. A metal material can be preferably used. When the conductive material of the second connection portion 4 and the extraction wiring 20 is a photosensitive metal material, the reflectance of the second connection portion 4 and the extraction wiring 20 can be easily controlled to 10% or less. It is preferably used because the problem can be easily avoided and the manufacturing cost can be suppressed. Because it is easier to absorb, scatter, and diffract light than metal films such as Mo, Al, Ag, Cu, and Pd obtained by sputtering by appropriately selecting the particle size of conductive powder such as silver, copper, and carbon. It is easy to control the reflectance to 10% or less. Furthermore, other known techniques for reducing the reflectance may be applied. Further, the same material can suppress the reflected lightness L ^* to 15 or less by the same principle.

  A photosensitive metal material such as a conductive paste whose reflectance is controlled to 10% or less is formed by a printing method such as screen printing, and is finely patterned by a photolithographic method. When a connection part is formed simultaneously, the problem that the connection part formed under normal use conditions can be visually recognized can be solved. The photolithographic method is a method in which a photosensitive conductive paste is applied onto a substrate, and then the exposed portion of the coating film is cured by photocrosslinking by irradiating ultraviolet light through a photomask corresponding to a desired extraction wiring. This is a method for forming a lead-out wiring pattern by baking after removing the unexposed portion of the coating film. By using this photolithography method, it is possible to obtain a conductive pattern that is cheaper than the vapor deposition method and has a higher definition than the printing method formed by screen printing or gravure offset printing.

  When the second connecting portion 4 and the extraction wiring 20 are patterned on the transparent base material 10 at an early stage, the pattern is detected and recognized optically because it has sufficient light shielding properties against transmitted light. Easy. Therefore, the metal electrode pattern itself can be used as an index of alignment with respect to a layer on which a subsequent pattern is formed. In addition to the electrode pattern, an alignment mark can be provided independently in the same layer as the second connection portion 4 and the extraction wiring 20. Independently providing a mark for alignment can generally achieve higher accuracy in the alignment process in which a position correction amount is determined from pattern recognition and a movement for position correction is output.

The insulating layer 5 is formed so as to cover a range including the effective area of the first connection portion 3 or the second connection portion 4. As a manufacturing method of the insulating layer 5, an insulating function can be obtained by forming a SiO ₂ film with a thickness of 100 nm or more. However, as an easier manufacturing method, an organic insulating film can also be formed by a photolithography method. For example, an ultraviolet curable organic insulating film coating composition having a refractive index of 1.53 and a volume resistivity of 2 × 10 ¹⁵ Ω · cm is applied to a spray coat, spin coat, slit die coat, roll coat, bar coat, etc. By the method, it is applied so that the dry film thickness is in the range of 0.2 to 10 μm, more preferably in the range of 0.5 to 5 μm. If necessary, the dried film is exposed through a mask having a predetermined pattern provided in contact with or not in contact with the film. The kind of the light beam at the time of exposure is not particularly limited, and examples thereof include visible light, ultraviolet rays, far infrared rays, electron beams, X-rays, etc. Among them, ultraviolet rays are preferable. The illuminance of the light beam is not particularly limited, but is preferably within a range of 5 to 150 mW / cm ^{2 at} 365 nm, and particularly preferably within a range of 15 to 35 mW / cm ² .

  Then, if necessary, the film is immersed in an aqueous alkaline developer such as sodium carbonate or sodium hydroxide, or sprayed with a developer or the like to remove uncured portions and form a desired pattern. Furthermore, in order to accelerate | stimulate superposition | polymerization of an ultraviolet curable organic type insulation film coating composition and to harden | cure, it heats (post-bake) as needed. A pattern is formed through these steps, and a patterned insulating layer 5 having a transmittance exceeding 97% can be obtained.

The protective film 6 includes an effective area of the first transparent electrode 1, the second transparent electrode 2, the first connection portion 3, the second connection portion 4, the insulating layer 5, and the extraction wiring 20. To cover. The method for forming the protective film 6 is not particularly limited. For example, the dry film thickness is in the range of 0.5 to 20 μm by a coating method such as spray coating, spin coating, slit die coating, roll coating, or bar coating. Of these, the ultraviolet curable organic coating composition is applied so as to be within a range of 1.0 to 10 μm. If necessary, the dried film is exposed through a mask having a predetermined pattern provided in contact with or not in contact with the film. The kind of the light beam at the time of exposure is not particularly limited, and examples thereof include visible light, ultraviolet rays, far infrared rays, electron beams, X-rays, etc. Among them, ultraviolet rays are preferable. The illuminance of the light beam is not particularly limited, but is preferably within a range of 5 to 150 mW / cm ^{2 at} 365 nm, and particularly preferably within a range of 15 to 35 mW / cm ² . Then, if necessary, it is immersed in an aqueous alkaline developer such as sodium carbonate or sodium hydroxide, or the developer is sprayed by spraying or the like to remove uncured portions and form a desired pattern. Furthermore, in order to accelerate | stimulate superposition | polymerization of the said ultraviolet curable organic type coating composition and to harden, it heats (post-baking) as needed, respectively. In addition, since the protective film 6 forms the outermost layer of the capacitive touch panel substrate, it is desirable that the protective film 6 be disposed as wide as possible to serve as a planarization layer.

Hereinafter, the present invention will be specifically described by way of examples. However, the present invention is not limited thereto without departing from the spirit of the present invention.
[Synthesis of UV-curable organic coating composition]
As a commercially available UV curable organic coating composition, NN901 (manufactured by JSR) is added with an additive (trade name: Megafax RS-75 (manufactured by DIC)), 1 weight with respect to the solid content weight of NN901. % And stirred for 30 minutes to obtain an ultraviolet curable organic coating composition 2.

Similarly, the ultraviolet curable organic coating composition 1 and the additives were changed to those shown in Table 1 to obtain ultraviolet curable organic coating compositions 3-14.
(Commercially available UV curable organic coating composition 7) NS-E2200 (manufactured by Toray Industries, Inc.)
(Commercially available UV curable organic coating composition 13) XF110182 (manufactured by Rohm and Haas)
(Additive)
A: Megafuck RS-75 (manufactured by DIC)
B: Defenza FH-700 (manufactured by DIC)
C: OPTOOL DAC-HP (Daikin)
D: Megafuck F-470 (manufactured by DIC)
E: X-22-164E (manufactured by Shin-Etsu Silicone)

Example 1
<Production of capacitive touch panel substrate>
On the aluminosilicate glass, Mo, Al, and Mo were formed by sputtering in the order of 350 mm / 2000 mm / 350 mm, respectively, and a positive resist (LC100-10cp manufactured by Rohm and Haas Electronic Materials) was spin-coated, Drying was performed at 100 ° C. for 5 minutes on a hot plate to dry the coating film. Thereafter, exposure was performed through a photomask having a desired opening at 100 mJ / cm ² using a high-pressure mercury lamp as a light source, and then 60% at 23 ° C. with a 2.3 wt% tetramethylammonium hydroxide aqueous solution. Shower development was performed for 2 seconds. After washing with water, wet etching is performed using an etching solution composed of phosphoric acid, nitric acid, acetic acid, and water in a ratio of 5: 5: 5: 1, and a resist stripping solution of 2% potassium hydroxide is used. After the resist was removed, heat treatment was performed at 230 ° C. for 30 minutes in a hot air circulation oven to produce the second connection portion 4 and the extraction wiring 20. The obtained second connection portion 4 was 8 μm wide × 200 μm long. The sheet resistance of the Mo / Al / Mo film was 0.2Ω / □.

Next, a negative resist (NN901 manufactured by JSR) was applied by spin coating, and dried at 100 ° C. for 5 minutes on a hot plate to dry the coating film. After that, exposure was performed through a photomask having a desired opening at 100 mJ / cm ² using a high-pressure mercury lamp as a light source, and then shower development was performed for 30 seconds with a 0.2 wt% aqueous sodium bicarbonate solution. did. After washing with water, heat treatment was performed at 230 ° C. for 30 minutes in a hot air circulation oven to form the insulating layer 5. The insulating layer 5 has a width of 60 μm × length of 120 μm so as to cover only the effective portion of the second connection portion 4.

Subsequently, an ITO film having a film thickness of 30 nm is formed by a sputtering apparatus, a positive resist (LC100-10cp manufactured by Rohm and Haas) is spin-coated, and dried at 100 ° C. for 5 minutes on a hot plate. The membrane was dried. Thereafter, exposure was performed through a photomask having a desired opening at 100 mJ / cm ² using a high-pressure mercury lamp as a light source, and then 60% at 23 ° C. with a 2.3 wt% tetramethylammonium hydroxide aqueous solution. Shower development was performed for 2 seconds. After washing with water, wet etching is performed using an etching solution composed of oxalic acid (ITO etching solution manufactured by Mizuho Chemical Co., Ltd.), and the resist is removed using a 2% potassium hydroxide resist stripping solution. A heat treatment was performed at 230 ° C. for 30 minutes to form the first transparent electrode 1, the second transparent electrode 2, and the first connection portion 3. The sheet resistance of the ITO film was 100Ω / □.

Further, a negative resist (NN901 manufactured by JSR) was applied by spin coating, dried on a hot plate at 100 ° C. for 5 minutes, and the coating film was dried. After that, exposure was performed through a photomask having a desired opening at 100 mJ / cm ² using a high-pressure mercury lamp as a light source, and then shower development was performed for 30 seconds with a 0.2 wt% aqueous sodium bicarbonate solution. did. After washing with water, heat treatment was performed at 230 ° C. for 30 minutes in a hot air circulation oven to form the protective layer 6, and the capacitive touch panel substrate 1 was obtained. The insulating layer 5 was formed so as to cover the entire region 2 mm inside from the glass edge of the touch panel substrate, excluding the connection part connected to the extraction wiring 20 and the control circuit, and the touch panel substrate 1 was obtained.

[Evaluation of pure water contact angle]
On the glass substrate, each of the ultraviolet curable organic coating compositions 1 to 14 was applied by a spin coating method, dried on a hot plate at 100 ° C. for 5 minutes, and the coating film was dried. Thereafter, exposure was performed at 100 mJ / cm ² using a high-pressure mercury lamp as a light source, and then shower development was performed with a 0.2 wt% sodium hydrogen carbonate aqueous solution for 30 seconds. After washing with water, heat treatment was performed at 230 ° C. for 30 minutes in a hot air circulation oven to form a coating film having a film thickness of 2.3 μm. The pure water contact angle at room temperature of the prepared evaluation substrate was measured with a contact angle measuring device CA-VE type manufactured by Kyowa Interface Science Co., Ltd. The measurement was carried out by the sessile drop method specified in 6 of JIS R3257, and the contact angle was obtained. The results are shown in Table 2.
[Measurement of amount of fluorine element on coating film surface]
The fluorine / carbon element ratio on the surface of the coating film was measured with an X-ray photoelectron spectroscopy analyzer ESCA (Electron Spectroscopic for Chemical Analysis) AXIS-HS (Shimadzu Corporation / Kratos).

[Adhesive sheet peelability evaluation]
On the glass substrate, each of the ultraviolet curable organic coating compositions 1 to 14 was applied by a spin coating method, dried on a hot plate at 100 ° C. for 5 minutes, and the coating film was dried. Thereafter, exposure was performed at 100 mJ / cm ² using a high-pressure mercury lamp as a light source, and then shower development was performed with a 0.2 wt% sodium hydrogen carbonate aqueous solution for 30 seconds. After washing with water, heat treatment was performed at 230 ° C. for 30 minutes in a hot air circulation oven to form a coating film having a film thickness of 2.3 μm. On the other hand, a polarizing plate (trade name “SEG1425DU”, manufactured by Nitto Denko Corporation) was bonded onto another glass substrate, and treated with an autoclave at 50 ° C. and 5 atm for 15 minutes. Furthermore, LUCIACS CR9707 (manufactured by Nitto Denko Corporation) is attached as an adhesive sheet to the coating film side of the glass substrate on which the coating films of the ultraviolet curable organic coating compositions 1 to 14 are formed, and the adhesive surface of the adhesive sheet The glass substrate on which the polarizing plate was bonded was bonded to the side, and the laminate was obtained by an autoclave treatment at 50 ° C. and 5 atm for 15 minutes. The obtained laminate was immersed in warm water at 80 ° C. for 48 hours, and the laminate was peeled off by hand. It was evaluated whether or not the adhesive remains on the coating film surface of the ultraviolet curable organic coating composition after the laminate was peeled by hand. The case where the glass substrate of the coating film of the UV curable organic coating composition cannot be peeled from the laminate is not possible (×), and the glass substrate of the coating film of the UV curable organic coating composition can be peeled from the laminate, but the paste is The case where it remains on the glass surface is acceptable (△), the case where the glass substrate of the coating film of the ultraviolet curable organic coating composition can be peeled from the laminate, and the case where the glue does not remain on the glass surface is good (◯). The case where the glass substrate of the coating film of the ultraviolet curable organic coating composition was naturally peeled off from the laminate during warm water immersion at 80 ° C. was evaluated as better (（). The results are shown in Table 2.

(Examples 2-9, Comparative Examples 1-5)
Touch panel substrates 2 to 14 were obtained in the same manner as in Example 1 except that the ultraviolet curable organic coating composition 1 was changed to 2 to 14, and the same evaluation was performed.
The ultraviolet curable organic coating composition and physical property evaluation results are shown in Table 1, and the peelability evaluation results are shown in Table 2.

  From Examples 1 to 9 in this embodiment, the contact angle of the coating film of the ultraviolet curable organic coating composition is in the range of 65 degrees to 85 degrees, and the fluorine element content on the coating film surface is The peelability of the pressure-sensitive adhesive sheet was good when the amount of carbon element on the coating film surface was 100 and within the range of 0.1 to 30.0. As mentioned above, the effect of this invention was demonstrated by the comparison with Comparative Examples 1-5.

DESCRIPTION OF SYMBOLS 1 ... 1st transparent electrode 2 ... 2nd transparent electrode 3 ... 1st connection part 4 ... 2nd connection part 5 ... Insulating layer 6 ... Protective layer 10 ... Transparent base material 20 ... Extraction wiring 30 ... Cover glass 31 ... Optical adjustment layer 40 ... Touch panel sensor 50 ... Spattering prevention film 51 ... Design (bezel)
60 ... Gap layer 70 ... Liquid crystal display device 71 ... Polarizing plate 72 ... Color filter 73 ... TFT substrate 74 ... Liquid crystal

Claims (4)

(A) 1st transparent electrode, (B) 2nd transparent electrode, (C) 1st connection part which ties said (A) 1st transparent electrode, (D) said (B) 2nd A second connecting portion connecting the transparent electrodes of (A), (E) the insulating layer formed between the (C) first connecting portion and the (D) second connecting portion, and (F) the above (A) The first transparent electrode and the (B) extraction wiring connected to the second transparent electrode, and (G) a protective layer, and the electrostatic formed on the transparent substrate. In capacitive touch panel substrates,
(G) The contact angle between the protective layer and water is in the range of 65 degrees to 85 degrees,
The content of the fluorine element on the surface of the protective layer (G) is in the range of 0.1 to 30.0 when the amount of carbon element on the surface of the protective layer (G) is 100. A capacitive touch panel substrate formed on a transparent substrate.   The capacitance type touch panel substrate formed on the transparent substrate according to claim 1, wherein the protective layer (G) contains a fluorine-based additive having an unsaturated ethylenic double bond.   The capacitive touch panel substrate formed on the transparent substrate according to claim 1, wherein the transparent substrate is the same as a cover glass.   A display device comprising the capacitive touch panel substrate formed on the transparent base material according to claim 1.

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