SG11201610371TA - Bendable and stretchable electronic devices and methods - Google Patents

Bendable and stretchable electronic devices and methods

Info

Publication number
SG11201610371TA
SG11201610371TA SG11201610371TA SG11201610371TA SG11201610371TA SG 11201610371T A SG11201610371T A SG 11201610371TA SG 11201610371T A SG11201610371T A SG 11201610371TA SG 11201610371T A SG11201610371T A SG 11201610371TA SG 11201610371T A SG11201610371T A SG 11201610371TA
Authority
SG
Singapore
Prior art keywords
bendable
methods
electronic devices
stretchable electronic
stretchable
Prior art date
Application number
SG11201610371TA
Other languages
English (en)
Inventor
Alejandro Levander
Tatyana Andryushchenko
David Staines
Mauro Kobrinsky
Aleksandar Aleksov
Dilan Seneviratne
Gonzalez Javier Soto
Srinivas Pietambaram
Rafiqul Islam
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of SG11201610371TA publication Critical patent/SG11201610371TA/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B5/00—Turning-machines or devices specially adapted for particular work; Accessories specially adapted therefor
    • B23B5/16—Turning-machines or devices specially adapted for particular work; Accessories specially adapted therefor for bevelling, chamfering, or deburring the ends of bars or tubes
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    • B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
    • H01L2924/15747—Copper [Cu] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/1579—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H01L2924/15791—The principal constituent being an elastomer, e.g. silicones, isoprene, neoprene
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Geometry (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Micromachines (AREA)
  • Switches With Compound Operations (AREA)
  • Structure Of Printed Boards (AREA)
SG11201610371TA 2014-07-11 2014-07-11 Bendable and stretchable electronic devices and methods SG11201610371TA (en)

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JP6195399B2 (ja) 2017-09-13
US20160284630A1 (en) 2016-09-29
US10204855B2 (en) 2019-02-12
BR112015015380A2 (pt) 2017-07-11
KR101691485B1 (ko) 2017-01-02
JP2016527730A (ja) 2016-09-08
EP3172048A1 (en) 2017-05-31
EP3172048A4 (en) 2018-04-18
TWI614815B (zh) 2018-02-11
CN105431292B (zh) 2018-06-08
KR20160021071A (ko) 2016-02-24
WO2016007175A1 (en) 2016-01-14
CN105431292A (zh) 2016-03-23

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