BR112015015380A2 - dispositivos eletrônicos inclináveis e estiráveis e métodos - Google Patents

dispositivos eletrônicos inclináveis e estiráveis e métodos

Info

Publication number
BR112015015380A2
BR112015015380A2 BR112015015380A BR112015015380A BR112015015380A2 BR 112015015380 A2 BR112015015380 A2 BR 112015015380A2 BR 112015015380 A BR112015015380 A BR 112015015380A BR 112015015380 A BR112015015380 A BR 112015015380A BR 112015015380 A2 BR112015015380 A2 BR 112015015380A2
Authority
BR
Brazil
Prior art keywords
methods
electronic devices
tilt
elastomeric material
trace
Prior art date
Application number
BR112015015380A
Other languages
English (en)
Inventor
Levander Alejandro
Aleksov Aleksandar
Staines David
Seneviratne Dilan
Soto Gonzalez Javier
Kobrinsky Mauro
Islam Rafiqul
Pietambaram Srinivas
Andryushchenko Tatyana
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of BR112015015380A2 publication Critical patent/BR112015015380A2/pt

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    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
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    • B23B5/16—Turning-machines or devices specially adapted for particular work; Accessories specially adapted therefor for bevelling, chamfering, or deburring the ends of bars or tubes
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    • B32B27/00—Layered products comprising a layer of synthetic resin
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    • B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
    • H01L2924/15747—Copper [Cu] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/1579—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H01L2924/15791—The principal constituent being an elastomer, e.g. silicones, isoprene, neoprene
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Geometry (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Micromachines (AREA)
  • Structure Of Printed Boards (AREA)
  • Switches With Compound Operations (AREA)

Abstract

resumo patente de invenção: "dispositivos eletrônicos inclináveis e estiráveis e métodos". geralmente discutido neste documento são sistemas e métodos que podem incluir um dispositivo estirável e inclinável. de acordo com um exemplo, um método pode incluir (1) depositar um primeiro material de elastômero em um painel, (2) laminar o material de rastreio no material de elastômero, (3) processar o material de rastreio para padronizar o material de rastreio em um ou mais traços e um ou mais blocos de ligação, (4) fixar uma matriz em um ou mais blocos de ligação, ou (5) depositar um segundo material de elastômero sobre e ao redor de um ou mais traços, os blocos de ligação e a matriz para encapsular um ou mais traços e um ou mais blocos de ligação no primeiro e no segundo material de elastômero.
BR112015015380A 2014-07-11 2014-07-11 dispositivos eletrônicos inclináveis e estiráveis e métodos BR112015015380A2 (pt)

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PCT/US2014/046395 WO2016007175A1 (en) 2014-07-11 2014-07-11 Bendable and stretchable electronic devices and methods

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Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105431292B (zh) 2014-07-11 2018-06-08 英特尔公司 可弯曲并且可拉伸的电子器件和方法
TWI592956B (zh) * 2015-06-25 2017-07-21 Wafer Mems Co Ltd Core inductor production methods
US20170344055A1 (en) * 2016-05-25 2017-11-30 Intel Corporation Structural brace for electronic circuit with stretchable substrate
WO2018097518A1 (ko) * 2016-11-24 2018-05-31 주식회사 아모그린텍 평판 케이블 제조 방법
CN108538799B (zh) 2017-03-02 2024-02-27 弗莱克斯有限公司 互连部件和互连组件
KR102030235B1 (ko) * 2017-06-15 2019-10-10 고려대학교 세종산학협력단 신축성 기판 구조체 및 그 제조방법, 신축성 디스플레이 및 그 제조방법 그리고 신축성 디스플레이 사용방법
WO2019070541A1 (en) 2017-10-03 2019-04-11 Juno Therapeutics, Inc. HPV-SPECIFIC BINDING MOLECULES
MX2020010460A (es) * 2018-04-05 2021-01-29 Juno Therapeutics Inc Receptores de células t, y células diseñadas que expresan los mismos.
US10985484B1 (en) 2018-10-01 2021-04-20 Flex Ltd. Electronic conductive interconnection for bridging across irregular areas in a textile product
FR3087936B1 (fr) * 2018-10-24 2022-07-15 Aledia Dispositif electronique
CN109686769B (zh) * 2018-12-25 2020-09-08 深圳市华星光电技术有限公司 可拉伸显示装置的制作方法及可拉伸显示装置
CN112020239B (zh) * 2019-05-29 2021-07-27 北京梦之墨科技有限公司 一种电子电路及电子电路制作方法
TWI798901B (zh) 2021-10-29 2023-04-11 財團法人工業技術研究院 電路裝置及其製造方法以及電路系統
TWI815553B (zh) * 2022-07-14 2023-09-11 友達光電股份有限公司 線路結構

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100437437B1 (ko) 1994-03-18 2004-06-25 히다치 가세고교 가부시끼가이샤 반도체 패키지의 제조법 및 반도체 패키지
KR20050023442A (ko) * 2002-07-26 2005-03-09 콸콤 인코포레이티드 와이어 본딩영역 어레이 패키지에서 소형의 최소 다이를수용하기 위한 방법
TWI241000B (en) * 2003-01-21 2005-10-01 Siliconware Precision Industries Co Ltd Semiconductor package and fabricating method thereof
US7057116B2 (en) 2003-06-02 2006-06-06 Intel Corporation Selective reference plane bridge(s) on folded package
WO2005067044A1 (en) * 2004-01-12 2005-07-21 Infineon Technologies Ag A method for connecting a die assembly to a substrate in an integrated circuit and a semiconductor device comprising a die assembly
JP4527991B2 (ja) 2004-01-28 2010-08-18 株式会社日立製作所 マルチチップモジュールの製造方法
JP2005311321A (ja) 2004-03-22 2005-11-04 Sharp Corp 半導体装置およびその製造方法、並びに、該半導体装置を備えた液晶モジュールおよび半導体モジュール
KR101429098B1 (ko) * 2004-06-04 2014-09-22 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 인쇄가능한 반도체소자들의 제조 및 조립방법과 장치
US8217381B2 (en) * 2004-06-04 2012-07-10 The Board Of Trustees Of The University Of Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
GB0505826D0 (en) * 2005-03-22 2005-04-27 Uni Microelektronica Ct Vsw Methods for embedding of conducting material and devices resulting from said methods
US20070123963A1 (en) * 2005-11-29 2007-05-31 Peter Krulevitch Method for producing flexible, stretchable, and implantable high-density microelectrode arrays
US7914842B1 (en) 2006-02-10 2011-03-29 Second Sight Medical Products, Inc Method of manufacturing a flexible circuit electrode array
MY172115A (en) * 2006-09-06 2019-11-14 Univ Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
US20080188020A1 (en) * 2007-02-05 2008-08-07 Kuo Wei-Min Method of LED packaging on transparent flexible film
KR100887475B1 (ko) 2007-02-26 2009-03-10 주식회사 네패스 반도체 패키지 및 그 제조방법
TW200921873A (en) 2007-11-09 2009-05-16 Powertech Technology Inc Chip-to-substrate interconnection device with wire-bonding
US8097926B2 (en) * 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
JP5646492B2 (ja) 2008-10-07 2014-12-24 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 伸縮可能な集積回路およびセンサアレイを有する装置
WO2010086033A1 (en) 2009-01-30 2010-08-05 Interuniversitair Microelektronica Centrum Vzw Stretchable electronic device
WO2010086416A1 (en) 2009-01-30 2010-08-05 Imec Stretchable electronic device
DE102009031568A1 (de) 2009-06-29 2010-12-30 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Erzeugung eines elektronischen Systems, Verfahren zur Erzeugung einer Freiformfläche mit einem solchen System, sowie elektronisches System und Freiformflächen mit einem solchen System
TWI442530B (zh) 2009-10-14 2014-06-21 Advanced Semiconductor Eng 封裝載板、封裝結構以及封裝載板製程
US8569894B2 (en) * 2010-01-13 2013-10-29 Advanced Semiconductor Engineering, Inc. Semiconductor package with single sided substrate design and manufacturing methods thereof
US8525340B2 (en) 2010-06-11 2013-09-03 Premitec, Inc. Flexible electronic devices and related methods
TWI508252B (zh) 2011-11-18 2015-11-11 Iridium Medical Technology Co Ltd 非平面晶片組件
TWI517274B (zh) 2012-03-21 2016-01-11 矽品精密工業股份有限公司 晶圓級半導體封裝件之製法及其晶圓級封裝基板之製法
US8895864B2 (en) * 2012-03-30 2014-11-25 Nokia Corporation Deformable apparatus and method
CN105431292B (zh) 2014-07-11 2018-06-08 英特尔公司 可弯曲并且可拉伸的电子器件和方法

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SG11201610371TA (en) 2017-01-27
WO2016007175A1 (en) 2016-01-14
US20160284630A1 (en) 2016-09-29
TW201606880A (zh) 2016-02-16
KR101691485B1 (ko) 2017-01-02
CN105431292B (zh) 2018-06-08
EP3172048A4 (en) 2018-04-18
JP2016527730A (ja) 2016-09-08
TWI614815B (zh) 2018-02-11
CN105431292A (zh) 2016-03-23
KR20160021071A (ko) 2016-02-24
JP6195399B2 (ja) 2017-09-13
EP3172048A1 (en) 2017-05-31
US10204855B2 (en) 2019-02-12

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B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
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