SG11201608733YA - Method and device for evening out a substrate stack - Google Patents

Method and device for evening out a substrate stack

Info

Publication number
SG11201608733YA
SG11201608733YA SG11201608733YA SG11201608733YA SG11201608733YA SG 11201608733Y A SG11201608733Y A SG 11201608733YA SG 11201608733Y A SG11201608733Y A SG 11201608733YA SG 11201608733Y A SG11201608733Y A SG 11201608733YA SG 11201608733Y A SG11201608733Y A SG 11201608733YA
Authority
SG
Singapore
Prior art keywords
substrate stack
evening out
evening
stack
substrate
Prior art date
Application number
SG11201608733YA
Other languages
English (en)
Inventor
Jürgen Burggraf
Friedrich Paul Lindner
Original Assignee
Ev Group E Thallner Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ev Group E Thallner Gmbh filed Critical Ev Group E Thallner Gmbh
Publication of SG11201608733YA publication Critical patent/SG11201608733YA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Laminated Bodies (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
SG11201608733YA 2014-04-30 2015-03-31 Method and device for evening out a substrate stack SG11201608733YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014106100.4A DE102014106100A1 (de) 2014-04-30 2014-04-30 Verfahren und Vorrichtung zum Vergleichmäßigen eines Substratstapels
PCT/EP2015/057054 WO2015165679A1 (de) 2014-04-30 2015-03-31 Verfahren und vorrichtung zum vergleichmässigen eines substratstapels

Publications (1)

Publication Number Publication Date
SG11201608733YA true SG11201608733YA (en) 2016-11-29

Family

ID=52774255

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201608733YA SG11201608733YA (en) 2014-04-30 2015-03-31 Method and device for evening out a substrate stack

Country Status (9)

Country Link
US (1) US9984942B2 (ko)
EP (1) EP3138122B1 (ko)
JP (1) JP2017516300A (ko)
KR (1) KR102443474B1 (ko)
CN (1) CN106463343B (ko)
DE (1) DE102014106100A1 (ko)
SG (1) SG11201608733YA (ko)
TW (1) TWI680549B (ko)
WO (1) WO2015165679A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI770110B (zh) * 2017-03-30 2022-07-11 日商日本碍子股份有限公司 暫時固定基板及電子元件的暫時固定方法
KR102361472B1 (ko) * 2019-09-20 2022-02-10 세메스 주식회사 본딩 헤드 및 본딩 방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0817166B2 (ja) * 1991-04-27 1996-02-21 信越半導体株式会社 超薄膜ｓｏｉ基板の製造方法及び製造装置
JPH07241764A (ja) * 1994-03-04 1995-09-19 Fujitsu Ltd 研磨装置と研磨方法
DE10052293A1 (de) 2000-10-20 2002-04-25 B L E Lab Equipment Gmbh Verfahren zum Aufbringen eines Substrats
US20040060514A1 (en) * 2002-01-25 2004-04-01 Applied Materials, Inc. A Delaware Corporation Gas distribution showerhead
US7397596B2 (en) * 2004-07-28 2008-07-08 Ler Technologies, Inc. Surface and subsurface detection sensor
WO2008125543A2 (en) * 2007-04-17 2008-10-23 Interuniversitair Microelektronica Centrum (Imec) Method for reducing the thickness of substrates
DE102009015878A1 (de) * 2009-04-01 2010-10-07 Peter Wolters Gmbh Verfahren zum materialabtragenden Bearbeiten von flachen Werkstücken
JP2010263124A (ja) * 2009-05-08 2010-11-18 Sumitomo Electric Ind Ltd Ｉｉｉ−ｖ族半導体光デバイスの製造方法
US8852391B2 (en) * 2010-06-21 2014-10-07 Brewer Science Inc. Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate
US9299594B2 (en) * 2010-07-27 2016-03-29 Taiwan Semiconductor Manufacturing Company, Ltd. Substrate bonding system and method of modifying the same
CN103221813B (zh) * 2010-11-12 2017-05-17 Ev 集团 E·索尔纳有限责任公司 用于测量晶片堆叠的层厚度和晶格缺陷的测量装置和方法
WO2012083978A1 (de) * 2010-12-20 2012-06-28 Ev Group E. Thallner Gmbh Aufnahmeeinrichtung zur halterung von wafern
JP5477976B2 (ja) * 2011-09-05 2014-04-23 レーザーテック株式会社 厚さ測定装置
EP2752871B1 (en) * 2013-01-08 2015-09-16 ams AG Method of application of a carrier to a device wafer

Also Published As

Publication number Publication date
EP3138122B1 (de) 2021-09-29
DE102014106100A1 (de) 2015-11-05
TWI680549B (zh) 2019-12-21
WO2015165679A1 (de) 2015-11-05
CN106463343A (zh) 2017-02-22
EP3138122A1 (de) 2017-03-08
US20170110377A1 (en) 2017-04-20
KR20170002385A (ko) 2017-01-06
JP2017516300A (ja) 2017-06-15
CN106463343B (zh) 2020-03-03
KR102443474B1 (ko) 2022-09-14
US9984942B2 (en) 2018-05-29
TW201603210A (zh) 2016-01-16

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