SG10201402670UA - An apparatus and method for wafer stacking - Google Patents

An apparatus and method for wafer stacking

Info

Publication number
SG10201402670UA
SG10201402670UA SG10201402670UA SG10201402670UA SG10201402670UA SG 10201402670U A SG10201402670U A SG 10201402670UA SG 10201402670U A SG10201402670U A SG 10201402670UA SG 10201402670U A SG10201402670U A SG 10201402670UA SG 10201402670U A SG10201402670U A SG 10201402670UA
Authority
SG
Singapore
Prior art keywords
wafer stacking
stacking
wafer
Prior art date
Application number
SG10201402670UA
Inventor
Eng Hwa Chua
Original Assignee
Systems Automation S Pte Ltd Fa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Systems Automation S Pte Ltd Fa filed Critical Systems Automation S Pte Ltd Fa
Priority to SG10201402670UA priority Critical patent/SG10201402670UA/en
Priority to PCT/SG2015/050126 priority patent/WO2015183197A1/en
Publication of SG10201402670UA publication Critical patent/SG10201402670UA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
    • H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
SG10201402670UA 2014-05-27 2014-05-27 An apparatus and method for wafer stacking SG10201402670UA (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SG10201402670UA SG10201402670UA (en) 2014-05-27 2014-05-27 An apparatus and method for wafer stacking
PCT/SG2015/050126 WO2015183197A1 (en) 2014-05-27 2015-05-27 An apparatus and method for wafer stacking

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG10201402670UA SG10201402670UA (en) 2014-05-27 2014-05-27 An apparatus and method for wafer stacking

Publications (1)

Publication Number Publication Date
SG10201402670UA true SG10201402670UA (en) 2015-12-30

Family

ID=54699388

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201402670UA SG10201402670UA (en) 2014-05-27 2014-05-27 An apparatus and method for wafer stacking

Country Status (2)

Country Link
SG (1) SG10201402670UA (en)
WO (1) WO2015183197A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109051686B (en) * 2018-09-29 2020-08-04 苏州精濑光电有限公司 Workpiece operation method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0269924A (en) * 1988-09-05 1990-03-08 Sumitomo Electric Ind Ltd Adhering method for board
JP2006332563A (en) * 2005-05-30 2006-12-07 Nikon Corp Wafer conveyor, wafer lamination conveyor and method for manufacturing laminated semiconductor device
JP5445160B2 (en) * 2010-01-18 2014-03-19 株式会社ニコン Wafer processing apparatus, wafer processing method, and device manufacturing method
JP5707950B2 (en) * 2011-01-13 2015-04-30 株式会社ニコン Substrate overlay apparatus and substrate overlay method

Also Published As

Publication number Publication date
WO2015183197A1 (en) 2015-12-03

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