SG11201608219WA - Polishing pads and systems and methods of making and using the same - Google Patents

Polishing pads and systems and methods of making and using the same

Info

Publication number
SG11201608219WA
SG11201608219WA SG11201608219WA SG11201608219WA SG11201608219WA SG 11201608219W A SG11201608219W A SG 11201608219WA SG 11201608219W A SG11201608219W A SG 11201608219WA SG 11201608219W A SG11201608219W A SG 11201608219WA SG 11201608219W A SG11201608219W A SG 11201608219WA
Authority
SG
Singapore
Prior art keywords
systems
making
methods
same
polishing pads
Prior art date
Application number
SG11201608219WA
Other languages
English (en)
Inventor
Duy K Lehuu
Kenneth A P Meyer
Moses M David
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of SG11201608219WA publication Critical patent/SG11201608219WA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B24B7/241—Methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG11201608219WA 2014-04-03 2015-03-31 Polishing pads and systems and methods of making and using the same SG11201608219WA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461974848P 2014-04-03 2014-04-03
US201462052729P 2014-09-19 2014-09-19
PCT/US2015/023572 WO2015153597A1 (en) 2014-04-03 2015-03-31 Polishing pads and systems and methods of making and using the same

Publications (1)

Publication Number Publication Date
SG11201608219WA true SG11201608219WA (en) 2016-10-28

Family

ID=52823890

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201608134YA SG11201608134YA (en) 2014-04-03 2015-03-31 Polishing pads and systems and methods of making and using the same
SG11201608219WA SG11201608219WA (en) 2014-04-03 2015-03-31 Polishing pads and systems and methods of making and using the same

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG11201608134YA SG11201608134YA (en) 2014-04-03 2015-03-31 Polishing pads and systems and methods of making and using the same

Country Status (8)

Country Link
US (2) US10071461B2 (ko)
EP (2) EP3126092B1 (ko)
JP (2) JP6640106B2 (ko)
KR (2) KR102347711B1 (ko)
CN (2) CN106163740B (ko)
SG (2) SG11201608134YA (ko)
TW (2) TWI652142B (ko)
WO (2) WO2015153601A1 (ko)

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US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
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TW201542318A (zh) 2015-11-16
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US20170173758A1 (en) 2017-06-22
KR102347711B1 (ko) 2022-01-06
JP6640106B2 (ja) 2020-02-05
TW201542316A (zh) 2015-11-16
JP2017510470A (ja) 2017-04-13
CN106163740A (zh) 2016-11-23
JP2017513722A (ja) 2017-06-01
KR20160142346A (ko) 2016-12-12
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EP3126092A1 (en) 2017-02-08
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TWI652142B (zh) 2019-03-01
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