SG11201606358XA - Boron-containing dopant compositions, systems and methods of use thereof for improving ion beam current and performance during boron ion implantation - Google Patents
Boron-containing dopant compositions, systems and methods of use thereof for improving ion beam current and performance during boron ion implantationInfo
- Publication number
- SG11201606358XA SG11201606358XA SG11201606358XA SG11201606358XA SG11201606358XA SG 11201606358X A SG11201606358X A SG 11201606358XA SG 11201606358X A SG11201606358X A SG 11201606358XA SG 11201606358X A SG11201606358X A SG 11201606358XA SG 11201606358X A SG11201606358X A SG 11201606358XA
- Authority
- SG
- Singapore
- Prior art keywords
- boron
- systems
- methods
- beam current
- performance during
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B3/00—Hydrogen; Gaseous mixtures containing hydrogen; Separation of hydrogen from mixtures containing it; Purification of hydrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J27/00—Ion beam tubes
- H01J27/02—Ion sources; Ion guns
- H01J27/20—Ion sources; Ion guns using particle beam bombardment, e.g. ionisers
- H01J27/22—Metal ion sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/08—Ion sources; Ion guns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32807—Construction (includes replacing parts of the apparatus)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/006—Details of gas supplies, e.g. in an ion source, to a beam line, to a specimen or to a workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/04—Means for controlling the discharge
- H01J2237/047—Changing particle velocity
- H01J2237/0473—Changing particle velocity accelerating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
- H01J2237/08—Ion sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
- H01J2237/08—Ion sources
- H01J2237/0815—Methods of ionisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/31701—Ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/336—Changing physical properties of treated surfaces
- H01J2237/3365—Plasma source implantation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/32—Hydrogen storage
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Organic Chemistry (AREA)
- Combustion & Propulsion (AREA)
- Inorganic Chemistry (AREA)
- Electron Sources, Ion Sources (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201461947064P | 2014-03-03 | 2014-03-03 | |
US14/635,413 US9570271B2 (en) | 2014-03-03 | 2015-03-02 | Boron-containing dopant compositions, systems and methods of use thereof for improving ion beam current and performance during boron ion implantation |
PCT/US2015/018396 WO2015134430A1 (fr) | 2014-03-02 | 2015-03-03 | Compositions de dopage contenant du bore, systèmes et procédés d'utilisation de celles-ci pour améliorer le courant et les performances du faisceau d'ions pendant une implantation d'ions de bore |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201606358XA true SG11201606358XA (en) | 2016-09-29 |
Family
ID=52633734
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201606358XA SG11201606358XA (en) | 2014-03-03 | 2015-03-03 | Boron-containing dopant compositions, systems and methods of use thereof for improving ion beam current and performance during boron ion implantation |
SG10201600291PA SG10201600291PA (en) | 2014-03-03 | 2016-01-14 | Boron-containing dopant compositions, systems and methods of use thereof for improving ion beam current and performance during boron ion implantation |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201600291PA SG10201600291PA (en) | 2014-03-03 | 2016-01-14 | Boron-containing dopant compositions, systems and methods of use thereof for improving ion beam current and performance during boron ion implantation |
Country Status (8)
Country | Link |
---|---|
US (3) | US9570271B2 (fr) |
EP (1) | EP3114699B1 (fr) |
JP (2) | JP6594888B2 (fr) |
KR (2) | KR102465137B1 (fr) |
CN (3) | CN109119316B (fr) |
SG (2) | SG11201606358XA (fr) |
TW (1) | TWI748939B (fr) |
WO (1) | WO2015134430A1 (fr) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
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US9570271B2 (en) * | 2014-03-03 | 2017-02-14 | Praxair Technology, Inc. | Boron-containing dopant compositions, systems and methods of use thereof for improving ion beam current and performance during boron ion implantation |
US9677171B2 (en) * | 2014-06-06 | 2017-06-13 | Varian Semiconductor Equipment Associates, Inc. | Method of improving ion beam quality in a non-mass-analyzed ion implantation system |
KR20170004381A (ko) * | 2015-07-02 | 2017-01-11 | 삼성전자주식회사 | 불순물 영역을 포함하는 반도체 장치의 제조 방법 |
EP3188214A1 (fr) * | 2015-12-29 | 2017-07-05 | Praxair Technology, Inc. | Compositions de dopant contenant du bore, systèmes et leurs procédés d'utilisation pour améliorer le faisceau ionique et la performance lors d'implantation d'ions de bore |
US10221201B2 (en) | 2015-12-31 | 2019-03-05 | Praxair Technology, Inc. | Tin-containing dopant compositions, systems and methods for use in ION implantation systems |
SG10201910772PA (en) * | 2016-03-28 | 2020-01-30 | Entegris Inc | Hydrogenated isotopically enriched boron trifluoride dopant source gas composition |
JP6730457B2 (ja) * | 2016-05-13 | 2020-07-29 | インテグリス・インコーポレーテッド | 窒素イオン注入においてイオン源性能を改善するためのフッ素化組成物 |
CN107293469B (zh) * | 2017-06-26 | 2019-03-01 | 武汉华星光电半导体显示技术有限公司 | 电离室、离子植入设备及离子植入方法 |
US10269542B2 (en) * | 2017-06-26 | 2019-04-23 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Ionization chamber, ion-implantation apparatus and ion-implantation method |
US10597773B2 (en) * | 2017-08-22 | 2020-03-24 | Praxair Technology, Inc. | Antimony-containing materials for ion implantation |
CN107680904A (zh) * | 2017-09-04 | 2018-02-09 | 天津大学 | 硼‑11同位素在集成电路的半导体掺杂中的应用及方法 |
CN109300778B (zh) * | 2018-09-30 | 2021-10-15 | 上海华力集成电路制造有限公司 | 离子注入方法 |
KR102642616B1 (ko) | 2018-12-15 | 2024-03-05 | 엔테그리스, 아이엔씨. | 불소 이온 주입 방법 및 시스템 |
US11120966B2 (en) * | 2019-09-03 | 2021-09-14 | Applied Materials, Inc. | System and method for improved beam current from an ion source |
US11232925B2 (en) | 2019-09-03 | 2022-01-25 | Applied Materials, Inc. | System and method for improved beam current from an ion source |
CN114600222A (zh) | 2019-09-20 | 2022-06-07 | 恩特格里斯公司 | 用于离子植入的等离子体浸渍方法 |
CN117038423A (zh) * | 2023-10-09 | 2023-11-10 | 上海凡森璞瑞新材料股份有限公司 | 包含四氟化锗混合气的离子注入系统、方法及掺杂物质 |
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US9570271B2 (en) * | 2014-03-03 | 2017-02-14 | Praxair Technology, Inc. | Boron-containing dopant compositions, systems and methods of use thereof for improving ion beam current and performance during boron ion implantation |
-
2015
- 2015-03-02 US US14/635,413 patent/US9570271B2/en active Active
- 2015-03-03 CN CN201810954282.7A patent/CN109119316B/zh active Active
- 2015-03-03 KR KR1020167023981A patent/KR102465137B1/ko active IP Right Grant
- 2015-03-03 WO PCT/US2015/018396 patent/WO2015134430A1/fr active Application Filing
- 2015-03-03 JP JP2016555326A patent/JP6594888B2/ja active Active
- 2015-03-03 EP EP15709078.8A patent/EP3114699B1/fr active Active
- 2015-03-03 CN CN201580010132.5A patent/CN106062918B/zh active Active
- 2015-03-03 SG SG11201606358XA patent/SG11201606358XA/en unknown
- 2015-12-29 US US14/982,544 patent/US9548181B2/en active Active
-
2016
- 2016-01-14 SG SG10201600291PA patent/SG10201600291PA/en unknown
- 2016-02-16 TW TW105104473A patent/TWI748939B/zh active
- 2016-03-02 CN CN201610116525.0A patent/CN106935465A/zh active Pending
- 2016-03-04 JP JP2016041940A patent/JP2017120755A/ja active Pending
- 2016-03-15 KR KR1020160030797A patent/KR20170078490A/ko not_active Application Discontinuation
- 2016-10-14 US US15/293,367 patent/US10090133B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR20160144966A (ko) | 2016-12-19 |
KR20170078490A (ko) | 2017-07-07 |
WO2015134430A1 (fr) | 2015-09-11 |
US9570271B2 (en) | 2017-02-14 |
US20170032941A1 (en) | 2017-02-02 |
EP3114699B1 (fr) | 2020-11-04 |
SG10201600291PA (en) | 2017-07-28 |
KR102465137B1 (ko) | 2022-11-10 |
CN109119316B (zh) | 2022-02-08 |
EP3114699A1 (fr) | 2017-01-11 |
CN106062918A (zh) | 2016-10-26 |
US10090133B2 (en) | 2018-10-02 |
WO2015134430A8 (fr) | 2016-10-13 |
JP6594888B2 (ja) | 2019-10-23 |
TWI748939B (zh) | 2021-12-11 |
CN106935465A (zh) | 2017-07-07 |
US9548181B2 (en) | 2017-01-17 |
TW201733901A (zh) | 2017-10-01 |
US20160133427A1 (en) | 2016-05-12 |
CN109119316A (zh) | 2019-01-01 |
JP2017515258A (ja) | 2017-06-08 |
US20150248992A1 (en) | 2015-09-03 |
CN106062918B (zh) | 2018-09-21 |
JP2017120755A (ja) | 2017-07-06 |
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