SG11201604641PA - Method and apparatus for design of a metrology target - Google Patents

Method and apparatus for design of a metrology target

Info

Publication number
SG11201604641PA
SG11201604641PA SG11201604641PA SG11201604641PA SG11201604641PA SG 11201604641P A SG11201604641P A SG 11201604641PA SG 11201604641P A SG11201604641P A SG 11201604641PA SG 11201604641P A SG11201604641P A SG 11201604641PA SG 11201604641P A SG11201604641P A SG 11201604641PA
Authority
SG
Singapore
Prior art keywords
design
metrology target
metrology
target
Prior art date
Application number
SG11201604641PA
Other languages
English (en)
Inventor
Guangqing Chen
Wei Liu
Der Schaar Maurits Van
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of SG11201604641PA publication Critical patent/SG11201604641PA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/303—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces using photoelectric detection means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70641—Focus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70681—Metrology strategies
    • G03F7/70683—Mark designs
SG11201604641PA 2013-12-30 2014-12-04 Method and apparatus for design of a metrology target SG11201604641PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361921939P 2013-12-30 2013-12-30
PCT/EP2014/076544 WO2015101460A1 (en) 2013-12-30 2014-12-04 Method and apparatus for design of a metrology target

Publications (1)

Publication Number Publication Date
SG11201604641PA true SG11201604641PA (en) 2016-07-28

Family

ID=52003804

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201604641PA SG11201604641PA (en) 2013-12-30 2014-12-04 Method and apparatus for design of a metrology target

Country Status (7)

Country Link
US (2) US11221560B2 (ja)
JP (1) JP6567523B2 (ja)
KR (2) KR102246286B1 (ja)
CN (1) CN105874387B (ja)
SG (1) SG11201604641PA (ja)
TW (1) TWI561938B (ja)
WO (1) WO2015101460A1 (ja)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102265868B1 (ko) * 2013-12-11 2021-06-16 케이엘에이 코포레이션 요건에 대한 타겟 및 프로세스 감도 분석
JP6567523B2 (ja) * 2013-12-30 2019-08-28 エーエスエムエル ネザーランズ ビー．ブイ． メトロロジーターゲットの設計のための方法及び装置
US9224098B2 (en) * 2014-01-10 2015-12-29 Optibrium Ltd. Sensitivity analysis tool for multi-parameter selection
JP6491677B2 (ja) 2014-06-10 2019-03-27 エーエスエムエル ネザーランズ ビー．ブイ． 計算的ウェーハ検査
KR102021450B1 (ko) 2014-09-22 2019-11-04 에이에스엠엘 네델란즈 비.브이. 공정 윈도우 식별자
WO2016078861A1 (en) 2014-11-17 2016-05-26 Asml Netherlands B.V. Process based metrology target design
CN107111245B (zh) * 2014-12-19 2019-10-18 Asml荷兰有限公司 测量非对称性的方法、检查设备、光刻系统及器件制造方法
US9490154B2 (en) * 2015-01-15 2016-11-08 Applied Materials, Inc. Method of aligning substrate-scale mask with substrate
US9824176B2 (en) * 2015-07-24 2017-11-21 Nanometrics Incorporated Optical critical dimension target design
NL2017300A (en) 2015-08-27 2017-03-01 Asml Netherlands Bv Method and apparatus for measuring a parameter of a lithographic process, substrate and patterning devices for use in the method
WO2017102336A1 (en) * 2015-12-18 2017-06-22 Asml Netherlands B.V. Improvements in gauge pattern selection
US10908512B2 (en) 2015-12-24 2021-02-02 Asml Netherlands B.V. Methods of controlling a patterning process, device manufacturing method, control system for a lithographic apparatus and lithographic apparatus
US20170256465A1 (en) 2016-03-01 2017-09-07 Asml Netherlands B.V. Method and apparatus to determine a patterning process parameter
IL297496A (en) 2016-07-15 2022-12-01 Asml Netherlands Bv A method and device for designing a target field for metrology
EP3293574A1 (en) 2016-09-09 2018-03-14 ASML Netherlands B.V. Metrology method, apparatus and computer program
JP6855565B2 (ja) 2016-09-27 2021-04-07 エーエスエムエル ネザーランズ ビー．ブイ． メトロロジレシピ選択
CN114137803A (zh) * 2016-12-02 2022-03-04 Asml荷兰有限公司 改变蚀刻参数的方法
EP3333633A1 (en) * 2016-12-09 2018-06-13 ASML Netherlands B.V. Methods and apparatus for predicting performance of a measurement method, measurement method and apparatus
JP2020518845A (ja) * 2017-05-04 2020-06-25 エーエスエムエル ホールディング エヌ．ブイ． 光学メトロロジの性能を測定するための方法、基板、及び装置
US10409939B1 (en) * 2017-08-30 2019-09-10 Cadence Design Systems, Inc. Statistical sensitivity analyzer
EP3457212A1 (en) * 2017-09-18 2019-03-20 ASML Netherlands B.V. Method of controlling a patterning process, device manufacturing method
CN111670411B (zh) * 2018-01-24 2023-11-14 Asml荷兰有限公司 基于计算量测的采样方案
US11333982B2 (en) * 2019-01-28 2022-05-17 Kla Corporation Scaling metric for quantifying metrology sensitivity to process variation
NL2024768A (en) * 2019-02-26 2020-08-31 Asml Netherlands Bv Inspection apparatus, lithographic apparatus, measurement method
WO2021073854A1 (en) * 2019-10-14 2021-04-22 Asml Holding N.V. Metrology mark structure and method of determining metrology mark structure
US11487929B2 (en) * 2020-04-28 2022-11-01 Kla Corporation Target design process for overlay targets intended for multi-signal measurements
MX2022014805A (es) * 2020-05-26 2023-01-18 Saint Gobain Metodo para estimar una funcion de calidad de un sustrato transparente de mono o multiples capas.
CN113656995B (zh) * 2021-07-06 2024-03-26 兰州空间技术物理研究所 一种基于电子轨迹积分法的电离规灵敏度数值计算方法
CN117897661A (zh) * 2021-08-18 2024-04-16 Asml荷兰有限公司 量测目标优化

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4576231A (en) * 1984-09-13 1986-03-18 Texaco Inc. Method and apparatus for combating encroachment by in situ treated formations
AU3325500A (en) * 1999-03-24 2000-10-09 Nikon Corporation Position determining device, position determining method and exposure device, exposure method and alignment determining device, and alignment determining method
DE50115382D1 (de) * 2000-08-09 2010-04-22 Artificial Sensing Instr Asi A Wellenleitergitterstruktur und optische messanordnung
DE10143723B4 (de) 2001-08-31 2006-09-28 Infineon Technologies Ag Verfahren zur Optimierung eines Layouts für eine Maske zur Verwendung bei der Halbleiterherstellung
WO2003075328A1 (fr) 2002-03-01 2003-09-12 Nikon Corporation Procede de reglage d'un systeme optique de projection, procede de prediction, procede d'evaluation, procede de reglage, procede d'exposition, dispositif d'exposition, programme et procede de fabrication dudit dispositif
US6721691B2 (en) 2002-03-26 2004-04-13 Timbre Technologies, Inc. Metrology hardware specification using a hardware simulator
JP4302965B2 (ja) * 2002-11-01 2009-07-29 株式会社日立ハイテクノロジーズ 半導体デバイスの製造方法及びその製造システム
US6943882B2 (en) * 2002-12-19 2005-09-13 Nikon Precision, Inc. Method to diagnose imperfections in illuminator of a lithographic tool
US6869739B1 (en) * 2003-01-28 2005-03-22 International Business Machines Corporation Integrated lithographic print and detection model for optical CD
EP1496397A1 (en) * 2003-07-11 2005-01-12 ASML Netherlands B.V. Method and system for feedforward overlay correction of pattern induced distortion and displacement, and lithographic projection apparatus using such a method and system
US7791727B2 (en) 2004-08-16 2010-09-07 Asml Netherlands B.V. Method and apparatus for angular-resolved spectroscopic lithography characterization
DE102005009071B4 (de) 2005-02-28 2008-06-26 Advanced Micro Devices, Inc., Sunnyvale Verfahren zur Prozesssteuerung
US7376169B2 (en) * 2005-03-07 2008-05-20 Joseph Reid Henrichs Optical phase conjugation laser diode
US7704605B2 (en) 2006-03-28 2010-04-27 Eastman Chemical Company Thermoplastic articles comprising cyclobutanediol having a decorative material embedded therein
CN102662309B (zh) 2005-09-09 2014-10-01 Asml荷兰有限公司 采用独立掩模误差模型的掩模验证系统和方法
US7925486B2 (en) 2006-03-14 2011-04-12 Kla-Tencor Technologies Corp. Computer-implemented methods, carrier media, and systems for creating a metrology target structure design for a reticle layout
US8045786B2 (en) 2006-10-24 2011-10-25 Kla-Tencor Technologies Corp. Waferless recipe optimization
US7873504B1 (en) * 2007-05-07 2011-01-18 Kla-Tencor Technologies Corp. Computer-implemented methods, carrier media, and systems for creating a metrology target structure design for a reticle layout
NL1036750A1 (nl) 2008-04-14 2009-10-15 Brion Tech Inc A Method Of Performing Mask-Writer Tuning and Optimization.
US8126669B2 (en) * 2008-06-09 2012-02-28 Carl Zeiss Smt Gmbh Optimization and matching of optical systems by use of orientation Zernike polynomials
NL2003654A (en) * 2008-11-06 2010-05-10 Brion Tech Inc Methods and system for lithography calibration.
NL2003702A (en) 2008-11-10 2010-05-11 Brion Tech Inc Pattern selection for lithographic model calibration.
TWI417942B (zh) 2009-12-17 2013-12-01 Ind Tech Res Inst 二維陣列疊對圖樣組之設計方法、疊對誤差量測方法及其量測系統
NL2007765A (en) * 2010-11-12 2012-05-15 Asml Netherlands Bv Metrology method and inspection apparatus, lithographic system and device manufacturing method.
NL2008957A (en) * 2011-07-08 2013-01-09 Asml Netherlands Bv Methods and systems for pattern design with tailored response to wavefront aberration.
NL2009294A (en) * 2011-08-30 2013-03-04 Asml Netherlands Bv Method and apparatus for determining an overlay error.
US8468471B2 (en) 2011-09-23 2013-06-18 Kla-Tencor Corp. Process aware metrology
US10354929B2 (en) 2012-05-08 2019-07-16 Kla-Tencor Corporation Measurement recipe optimization based on spectral sensitivity and process variation
NL2010717A (en) 2012-05-21 2013-11-25 Asml Netherlands Bv Determining a structural parameter and correcting an asymmetry property.
KR102020021B1 (ko) 2013-03-04 2019-09-10 케이엘에이 코포레이션 계측 타겟의 식별, 디자인 및 검증
US9490182B2 (en) * 2013-12-23 2016-11-08 Kla-Tencor Corporation Measurement of multiple patterning parameters
JP6567523B2 (ja) * 2013-12-30 2019-08-28 エーエスエムエル ネザーランズ ビー．ブイ． メトロロジーターゲットの設計のための方法及び装置
WO2015101458A1 (en) * 2013-12-30 2015-07-09 Asml Netherlands B.V. Method and apparatus for design of a metrology target
US10073357B2 (en) * 2014-02-21 2018-09-11 Asml Netherlands B.V. Measuring a process parameter for a manufacturing process involving lithography
WO2016123552A1 (en) * 2015-01-30 2016-08-04 Kla-Tencor Corporation Device metrology targets and methods
US11170072B2 (en) * 2015-04-10 2021-11-09 ASML Netherands B.V. Method and apparatus for inspection and metrology
IL297496A (en) * 2016-07-15 2022-12-01 Asml Netherlands Bv A method and device for designing a target field for metrology
WO2019035854A1 (en) * 2017-08-16 2019-02-21 Kla-Tencor Corporation MACHINE LEARNING IN RELATION TO METROLOGY MEASUREMENTS

Also Published As

Publication number Publication date
WO2015101460A1 (en) 2015-07-09
CN105874387A (zh) 2016-08-17
US20220113638A1 (en) 2022-04-14
CN105874387B (zh) 2018-10-16
KR102246286B1 (ko) 2021-04-30
TW201531810A (zh) 2015-08-16
KR20160103131A (ko) 2016-08-31
US20150185625A1 (en) 2015-07-02
KR20190057429A (ko) 2019-05-28
JP2017502332A (ja) 2017-01-19
US11221560B2 (en) 2022-01-11
JP6567523B2 (ja) 2019-08-28
TWI561938B (en) 2016-12-11

Similar Documents

Publication Publication Date Title
TWI561938B (en) Method and apparatus for design of a metrology target
SG11201604739RA (en) Method and apparatus for design of a metrology target
HK1215475A1 (zh) 用於三維製造的方法和設備
IL263765A (en) A method and device for designing a target field for metrology
PL3038799T3 (pl) Sposób i system do oceny co najmniej jednej właściwości manipulatora
GB201316102D0 (en) A method and apparatus
GB201311097D0 (en) A method and apparatus for dilution of aerosols
EP2971926A4 (en) METHOD AND APPARATUS FOR INTERIOR PIPE COATING
PT3005298T (pt) Método de reconstrução de um objeto a partir de visualizações de projeção
GB201317195D0 (en) Method of manufacturing a pattern and apparatus therefor
GB2518948B (en) Method and apparatus for tracking an object
EP2967287A4 (en) ENDOSCOPE APPARATUS AND METHODS OF USE THEREOF
GB2537430B (en) Method and apparatus for operating a camera
GB201412190D0 (en) Method of optimization for an application
PL2789061T3 (pl) Urządzenie laserowe i sposób obróbki laserowej materiału docelowego
EP2986385A4 (en) METHOD FOR PRODUCING A DROP GENERATION DEVICE
IL240012A0 (en) Device and methods for defining plasma
GB2515121B (en) A method and apparatus for a strike on a target
GB201305695D0 (en) A method of forming an article
GB2531929B (en) Method and apparatus for coating a screen
GB201312916D0 (en) Apparatus and method for moving an object
SG2013062120A (en) A system and method for inspection
GB2517616B (en) A method and a device for surface determination by means of microwaves
GB201305599D0 (en) Method and apparatus for measuring a part
PL2879356T3 (pl) Sposób i urządzenie do wizualizacji zakresów protokołu dynamicznej konfiguracji hosta