SG11201604465VA - Integrated wire bonder and 3d measurement system with defect rejection - Google Patents

Integrated wire bonder and 3d measurement system with defect rejection

Info

Publication number
SG11201604465VA
SG11201604465VA SG11201604465VA SG11201604465VA SG11201604465VA SG 11201604465V A SG11201604465V A SG 11201604465VA SG 11201604465V A SG11201604465V A SG 11201604465VA SG 11201604465V A SG11201604465V A SG 11201604465VA SG 11201604465V A SG11201604465V A SG 11201604465VA
Authority
SG
Singapore
Prior art keywords
measurement system
wire bonder
integrated wire
defect rejection
rejection
Prior art date
Application number
SG11201604465VA
Other languages
English (en)
Inventor
Daren W Keller
Original Assignee
Fairchild Semiconductor
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fairchild Semiconductor filed Critical Fairchild Semiconductor
Publication of SG11201604465VA publication Critical patent/SG11201604465VA/en

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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/143—Digital devices
    • H01L2924/1432—Central processing unit [CPU]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/143—Digital devices
    • H01L2924/1433—Application-specific integrated circuit [ASIC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
SG11201604465VA 2013-12-11 2014-10-24 Integrated wire bonder and 3d measurement system with defect rejection SG11201604465VA (en)

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US11923208B2 (en) * 2017-05-19 2024-03-05 Illinois Tool Works Inc. Methods and apparatuses for chemical delivery for brush conditioning
US10658328B2 (en) * 2017-11-09 2020-05-19 Asm Technology Singapore Pte Ltd Detection of foreign particles during wire bonding
CN111079564B (zh) * 2019-11-27 2021-06-01 奥特斯科技(重庆)有限公司 处理部件承载件的方法及光学检查设备和计算机可读介质
CN111054638A (zh) * 2019-11-27 2020-04-24 奥特斯科技(重庆)有限公司 制造部件承载件的方法及在制造期间操控面板的设备
US20220230314A1 (en) * 2021-01-15 2022-07-21 Kulicke And Soffa Industries, Inc. Intelligent pattern recognition systems for wire bonding and other electronic component packaging equipment, and related methods
CN112992692B (zh) * 2021-05-19 2021-07-20 佛山市联动科技股份有限公司 一种全自动切割引线的方法及系统

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JPS60187033A (ja) * 1984-03-07 1985-09-24 Toshiba Corp 半導体装置の自動ワイヤボンデイング方法
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US5581632A (en) * 1994-05-02 1996-12-03 Cognex Corporation Method and apparatus for ball bond inspection system
JP2973989B2 (ja) * 1997-11-19 1999-11-08 日本電気株式会社 外観検査機能付きワイヤボンディング装置
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JP2001060605A (ja) * 1999-08-24 2001-03-06 Murata Mfg Co Ltd 実装基板上での電子部品の接合部の検査方法および装置
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US20050275089A1 (en) * 2004-06-09 2005-12-15 Joshi Rajeev D Package and method for packaging an integrated circuit die
WO2010090605A1 (en) 2009-02-06 2010-08-12 Agency For Science, Technology And Research Methods for examining a bonding structure of a substrate and bonding structure inspection devices
JP4991893B2 (ja) * 2010-03-16 2012-08-01 常陽機械株式会社 微小径ワイヤボンディングの良否判定方法及び判定装置

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US20150162299A1 (en) 2015-06-11
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