SG11201601090WA - Geometries and patterns for surface texturing to increase deposition retention - Google Patents
Geometries and patterns for surface texturing to increase deposition retentionInfo
- Publication number
- SG11201601090WA SG11201601090WA SG11201601090WA SG11201601090WA SG11201601090WA SG 11201601090W A SG11201601090W A SG 11201601090WA SG 11201601090W A SG11201601090W A SG 11201601090WA SG 11201601090W A SG11201601090W A SG 11201601090WA SG 11201601090W A SG11201601090W A SG 11201601090WA
- Authority
- SG
- Singapore
- Prior art keywords
- geometries
- patterns
- surface texturing
- increase deposition
- retention
- Prior art date
Links
- 230000008021 deposition Effects 0.000 title 1
- 230000014759 maintenance of location Effects 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C21/00—Accessories or implements for use in connection with applying liquids or other fluent materials to surfaces, not provided for in groups B05C1/00 - B05C19/00
- B05C21/005—Masking devices
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4404—Coatings or surface treatment on the inside of the reaction chamber or on parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24149—Honeycomb-like
- Y10T428/24165—Hexagonally shaped cavities
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Drying Of Semiconductors (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Micromachines (AREA)
- Treatment Of Fiber Materials (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/029,108 US9101954B2 (en) | 2013-09-17 | 2013-09-17 | Geometries and patterns for surface texturing to increase deposition retention |
PCT/US2014/052727 WO2015041812A1 (en) | 2013-09-17 | 2014-08-26 | Geometries and patterns for surface texturing to increase deposition retention |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201601090WA true SG11201601090WA (en) | 2016-04-28 |
Family
ID=52668200
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201601090WA SG11201601090WA (en) | 2013-09-17 | 2014-08-26 | Geometries and patterns for surface texturing to increase deposition retention |
SG10201808864SA SG10201808864SA (en) | 2013-09-17 | 2014-08-26 | Geometries and patterns for surface texturing to increase deposition retention |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201808864SA SG10201808864SA (en) | 2013-09-17 | 2014-08-26 | Geometries and patterns for surface texturing to increase deposition retention |
Country Status (8)
Country | Link |
---|---|
US (1) | US9101954B2 (zh) |
EP (1) | EP3047516B1 (zh) |
JP (1) | JP6496739B2 (zh) |
KR (3) | KR102407620B1 (zh) |
CN (2) | CN105531796B (zh) |
SG (2) | SG11201601090WA (zh) |
TW (1) | TWI632592B (zh) |
WO (1) | WO2015041812A1 (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2017015191A1 (en) * | 2015-07-23 | 2017-01-26 | Honeywell International Inc. | Improved sputtering coil product and method of making |
US11114289B2 (en) | 2016-04-27 | 2021-09-07 | Applied Materials, Inc. | Non-disappearing anode for use with dielectric deposition |
CN210156345U (zh) * | 2016-09-13 | 2020-03-17 | 应用材料公司 | 用于处理腔室的腔室部件、用于处理腔室的屏蔽的设计膜以及处理腔室 |
US10434604B2 (en) * | 2016-10-14 | 2019-10-08 | Applied Materials, Inc. | Texturizing a surface without bead blasting |
US10655212B2 (en) | 2016-12-15 | 2020-05-19 | Honeywell Internatonal Inc | Sputter trap having multimodal particle size distribution |
US20180211819A1 (en) * | 2017-01-20 | 2018-07-26 | Honeywell International Inc. | Particle trap for sputtering coil and method of making |
JP2020516770A (ja) | 2017-04-07 | 2020-06-11 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 基板端部上のプラズマ密度制御 |
US20190062908A1 (en) * | 2017-08-22 | 2019-02-28 | Suranjan Dabare | Semiconductor process kit with nano structures |
US11077410B2 (en) * | 2017-10-09 | 2021-08-03 | Applied Materials, Inc. | Gas injector with baffle |
US11183373B2 (en) * | 2017-10-11 | 2021-11-23 | Honeywell International Inc. | Multi-patterned sputter traps and methods of making |
US11926157B2 (en) | 2021-03-05 | 2024-03-12 | Funai Electric Co., Ltd. | Photoresist imaging and development for enhanced nozzle plate adhesion |
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-
2013
- 2013-09-17 US US14/029,108 patent/US9101954B2/en active Active
-
2014
- 2014-08-26 CN CN201480050497.6A patent/CN105531796B/zh active Active
- 2014-08-26 EP EP14845559.5A patent/EP3047516B1/en active Active
- 2014-08-26 CN CN201811076686.7A patent/CN109599327B/zh active Active
- 2014-08-26 SG SG11201601090WA patent/SG11201601090WA/en unknown
- 2014-08-26 KR KR1020217030141A patent/KR102407620B1/ko active IP Right Grant
- 2014-08-26 KR KR1020167009984A patent/KR102305853B1/ko active IP Right Grant
- 2014-08-26 JP JP2016544338A patent/JP6496739B2/ja active Active
- 2014-08-26 KR KR1020227018844A patent/KR102513445B1/ko active IP Right Grant
- 2014-08-26 WO PCT/US2014/052727 patent/WO2015041812A1/en active Application Filing
- 2014-08-26 SG SG10201808864SA patent/SG10201808864SA/en unknown
- 2014-08-29 TW TW103129985A patent/TWI632592B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR102513445B1 (ko) | 2023-03-22 |
US9101954B2 (en) | 2015-08-11 |
US20150079336A1 (en) | 2015-03-19 |
CN109599327A (zh) | 2019-04-09 |
EP3047516A4 (en) | 2017-03-15 |
KR20160055914A (ko) | 2016-05-18 |
KR102407620B1 (ko) | 2022-06-10 |
CN105531796A (zh) | 2016-04-27 |
EP3047516B1 (en) | 2019-10-02 |
CN109599327B (zh) | 2023-06-23 |
KR20220082933A (ko) | 2022-06-17 |
KR20210119557A (ko) | 2021-10-05 |
KR102305853B1 (ko) | 2021-09-27 |
TWI632592B (zh) | 2018-08-11 |
WO2015041812A1 (en) | 2015-03-26 |
JP6496739B2 (ja) | 2019-04-03 |
CN105531796B (zh) | 2018-10-12 |
EP3047516A1 (en) | 2016-07-27 |
SG10201808864SA (en) | 2018-11-29 |
JP2016532316A (ja) | 2016-10-13 |
TW201517119A (zh) | 2015-05-01 |
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