SG11201600343TA - Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules - Google Patents

Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules

Info

Publication number
SG11201600343TA
SG11201600343TA SG11201600343TA SG11201600343TA SG11201600343TA SG 11201600343T A SG11201600343T A SG 11201600343TA SG 11201600343T A SG11201600343T A SG 11201600343TA SG 11201600343T A SG11201600343T A SG 11201600343TA SG 11201600343T A SG11201600343T A SG 11201600343TA
Authority
SG
Singapore
Prior art keywords
modules
shielding
fabrication methods
optoelectronic
stray light
Prior art date
Application number
SG11201600343TA
Other languages
English (en)
Inventor
Hartmut Rudmann
Simon Gubser
Susanne Westenhofer
Stephan Heimgartner
Jens Geiger
Sonja Hanselmann
Christoph Friese
Xu Yi
Thng Chong Kim
John A Vidallon
Ji Wang
Qi Chuan Yu
Kam Wah Leong
Original Assignee
Heptagon Micro Optics Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heptagon Micro Optics Pte Ltd filed Critical Heptagon Micro Optics Pte Ltd
Publication of SG11201600343TA publication Critical patent/SG11201600343TA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00278—Lenticular sheets
    • B29D11/00307—Producing lens wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14687—Wafer level processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Ophthalmology & Optometry (AREA)
  • Led Device Packages (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Lens Barrels (AREA)
  • Light Receiving Elements (AREA)
  • Photovoltaic Devices (AREA)
  • Micromachines (AREA)
SG11201600343TA 2013-07-30 2014-07-25 Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules SG11201600343TA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361859828P 2013-07-30 2013-07-30
US201361915193P 2013-12-12 2013-12-12
PCT/SG2014/000351 WO2015016775A1 (en) 2013-07-30 2014-07-25 Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules

Publications (1)

Publication Number Publication Date
SG11201600343TA true SG11201600343TA (en) 2016-02-26

Family

ID=52426849

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201706696VA SG10201706696VA (en) 2013-07-30 2014-07-25 Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules
SG11201600343TA SG11201600343TA (en) 2013-07-30 2014-07-25 Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG10201706696VA SG10201706696VA (en) 2013-07-30 2014-07-25 Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules

Country Status (7)

Country Link
US (3) US9543354B2 (ko)
EP (2) EP3028303B1 (ko)
KR (1) KR102280613B1 (ko)
CN (1) CN105474392B (ko)
SG (2) SG10201706696VA (ko)
TW (2) TWI678828B (ko)
WO (1) WO2015016775A1 (ko)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3172767B1 (en) * 2014-07-25 2022-01-05 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules including an image sensor having regions optically separated from one another
US20160307881A1 (en) * 2015-04-20 2016-10-20 Advanced Semiconductor Engineering, Inc. Optical sensor module and method for manufacturing the same
US10177527B2 (en) 2015-05-28 2019-01-08 Vixar Inc. VCSELS and VCSEL arrays designed for improved performance as illumination sources and sensors
US20170047362A1 (en) * 2015-08-13 2017-02-16 Heptagon Micro Optics Pte. Ltd. Optoelectronic module with customizable spacers
DE102015113438B4 (de) * 2015-08-14 2021-07-01 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Trägersubstrat für ein optoelektronisches Halbleiterbauteil
US20180302990A1 (en) * 2015-10-07 2018-10-18 Heptagon Micro Optics Pte. Ltd. Molded Circuit Substrates
CN105353567B (zh) * 2015-12-02 2019-01-15 深圳市华星光电技术有限公司 采用无黑色矩阵技术的va型液晶显示面板及其制作方法
US10109753B2 (en) * 2016-02-19 2018-10-23 X-Celeprint Limited Compound micro-transfer-printed optical filter device
CN109328318B (zh) * 2016-04-15 2021-11-02 赫普塔冈微光有限公司 具有对准间隔件的光电子模块和用于组装所述光电子模块的方法
US20180017741A1 (en) * 2016-07-15 2018-01-18 Advanced Semiconductor Engineering, Inc. Semiconductor package device and method of manufacturing the same
CN109690351B (zh) 2016-09-23 2022-12-09 深圳帧观德芯科技有限公司 半导体x射线检测器的封装
US20180315894A1 (en) * 2017-04-26 2018-11-01 Advanced Semiconductor Engineering, Inc. Semiconductor device package and a method of manufacturing the same
CN110945668B (zh) * 2017-07-25 2023-09-22 ams传感器新加坡私人有限公司 用于在光电子模块上制造均匀的材料的层的晶片级方法
WO2019093965A1 (en) * 2017-11-07 2019-05-16 Ams Sensors Singapore Pte. Ltd. Optoelectronic modules having locking assemblies and methods for manufacturing the same
EP3718183B1 (en) 2017-11-29 2023-02-15 Vixar, Inc. Power monitoring approach for vcsels and vcsel arrays
US11692813B2 (en) * 2017-12-27 2023-07-04 Ams Sensors Singapore Pte. Ltd. Optoelectronic modules and methods for operating the same
WO2019183275A1 (en) 2018-03-20 2019-09-26 Vixar, Inc. Eye safe optical modules
FR3081366B1 (fr) * 2018-05-28 2021-11-05 Beam Dispositif et procede de detection de la position d'un faisceau laser
CN112969572A (zh) * 2018-11-02 2021-06-15 ams传感器新加坡私人有限公司 制造光学元件模块的方法
DE102018129346A1 (de) * 2018-11-21 2020-05-28 Osram Opto Semiconductors Gmbh Halbleiterlaser und herstellungsverfahren für einen halbleiterlaser
US20220109282A1 (en) * 2019-01-17 2022-04-07 Osram Opto Semiconductors Gmbh Method for obtaining electronic devices and electronic devices
US20220238587A1 (en) * 2019-08-27 2022-07-28 Mitsubishi Electric Corporation Optical sensor module and manufacturing method thereof
US11244996B2 (en) 2020-04-27 2022-02-08 Facebook Technologies, Llc Micro OLEDs having narrow bezel
DE102023200393A1 (de) 2023-01-19 2024-07-25 Robert Bosch Gesellschaft mit beschränkter Haftung Photodetektoreinrichtung und Verfahren zum Herstellen einer Photodetektoreinrichtung
US20240332327A1 (en) 2023-04-03 2024-10-03 Semiconductor Components Industries, Llc Image sensor packages and related methods
TWI846530B (zh) * 2023-06-30 2024-06-21 晉弘科技股份有限公司 影像感測模組製作方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007142058A (ja) 2005-11-17 2007-06-07 Matsushita Electric Ind Co Ltd 半導体撮像素子およびその製造方法並びに半導体撮像装置とその製造方法
US20080070340A1 (en) * 2006-09-14 2008-03-20 Nicholas Francis Borrelli Image sensor using thin-film SOI
US20080191333A1 (en) * 2007-02-08 2008-08-14 Advanced Chip Engineering Technology Inc. Image sensor package with die receiving opening and method of the same
US9153614B2 (en) * 2007-08-15 2015-10-06 Micron Technology, Inc. Method and apparatus for lens alignment for optically sensitive devices and systems implementing same
US7829966B2 (en) 2007-11-23 2010-11-09 Visera Technologies Company Limited Electronic assembly for image sensor device
TW200937642A (en) 2007-12-19 2009-09-01 Heptagon Oy Wafer stack, integrated optical device and method for fabricating the same
TWI505703B (zh) * 2007-12-19 2015-10-21 Heptagon Micro Optics Pte Ltd 光學模組，晶圓等級的封裝及其製造方法
US7741652B2 (en) * 2008-03-07 2010-06-22 Visera Technologies Company Limited Alignment device and application thereof
JP2011128355A (ja) * 2009-12-17 2011-06-30 Sony Corp 撮像レンズ及び撮像レンズを用いたカメラモジュール並びに撮像レンズの製造方法及びカメラモジュールの製造方法
TWI466278B (zh) * 2010-04-06 2014-12-21 Kingpak Tech Inc 晶圓級影像感測器構裝結構及其製造方法
JP6162114B2 (ja) 2011-07-19 2017-07-12 ヘプタゴン・マイクロ・オプティクス・プライベート・リミテッドＨｅｐｔａｇｏｎ Ｍｉｃｒｏ Ｏｐｔｉｃｓ Ｐｔｅ． Ｌｔｄ． 光電子モジュール、光電子モジュールの製造方法、ならびに光電子モジュールを備える機器およびデバイス
JP6247633B2 (ja) * 2011-08-10 2017-12-13 ヘプタゴン・マイクロ・オプティクス・プライベート・リミテッドＨｅｐｔａｇｏｎ Ｍｉｃｒｏ Ｏｐｔｉｃｓ Ｐｔｅ． Ｌｔｄ． 光電子モジュールおよびその製造方法
TW201310102A (zh) * 2011-08-17 2013-03-01 Pixart Imaging Inc 鏡頭模組及其製造方法
US9595553B2 (en) * 2012-11-02 2017-03-14 Heptagon Micro Optics Pte. Ltd. Optical modules including focal length adjustment and fabrication of the optical modules
SG11201504456YA (en) * 2012-12-27 2015-07-30 Heptagon Micro Optics Pte Ltd Fabrication of optical elements and modules incorporating the same
US9094593B2 (en) 2013-07-30 2015-07-28 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules

Also Published As

Publication number Publication date
KR20160039645A (ko) 2016-04-11
EP3028303A1 (en) 2016-06-08
EP3454371B1 (en) 2021-03-31
CN105474392A (zh) 2016-04-06
TWI678828B (zh) 2019-12-01
US9859327B2 (en) 2018-01-02
US20170084663A1 (en) 2017-03-23
EP3454371A1 (en) 2019-03-13
CN105474392B (zh) 2021-06-25
US20180102394A1 (en) 2018-04-12
TWI638470B (zh) 2018-10-11
TW201519479A (zh) 2015-05-16
EP3028303B1 (en) 2018-08-22
US10199426B2 (en) 2019-02-05
KR102280613B1 (ko) 2021-07-22
EP3028303A4 (en) 2017-03-08
US20150034975A1 (en) 2015-02-05
SG10201706696VA (en) 2017-09-28
WO2015016775A1 (en) 2015-02-05
US9543354B2 (en) 2017-01-10
TW201841409A (zh) 2018-11-16

Similar Documents

Publication Publication Date Title
SG11201600346YA (en) Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules
SG10201706696VA (en) Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules
SG10201705797UA (en) Compact opto-electronic modules and fabrication methods for such modules
IL242902B (en) Optical modulator from standard production processing
HK1218550A1 (zh) 常見輕鏈小鼠
EP3072155A4 (en) Compact optoelectronic modules
HK1202094A1 (en) System for performing laser filamentation within transparent materials
GB2510916B (en) Optical source
EP2946410A4 (en) TECHNIQUES FOR FORMING OPTOELECTRONIC DEVICES
EP3001185A4 (en) OPTICAL GRANULATOR
EP2951937A4 (en) ARMORED CONNECTOR ASSEMBLIES FOR EHF STRIP
GB201308918D0 (en) An optical inspection system
GB2547150B (en) Circuitry for biasing light shielding structures
GB2529770B (en) Implementation concepts and related methods for optical computing devices
EP3087598A4 (en) Optoelectronic packaging assemblies
SG10201706775RA (en) Optoelectronic component
EP2987007A4 (en) NETWORK OF FILTERS HAVING REDUCED DIFFUSED LIGHT
HK1218165A1 (zh) 光幕部件
EP2971937A4 (en) Self-locating light source module
EP2843853A4 (en) OPTICAL MODULE AND PREPARATION METHOD THEREOF
PT3028352T (pt) Fonte ótica
TWI563329B (en) Light source module
GB201315669D0 (en) An optical module and method
TWI563323B (en) Back light module
GB2513091B (en) Radiation shield