SG11201504456YA - Fabrication of optical elements and modules incorporating the same - Google Patents

Fabrication of optical elements and modules incorporating the same

Info

Publication number
SG11201504456YA
SG11201504456YA SG11201504456YA SG11201504456YA SG11201504456YA SG 11201504456Y A SG11201504456Y A SG 11201504456YA SG 11201504456Y A SG11201504456Y A SG 11201504456YA SG 11201504456Y A SG11201504456Y A SG 11201504456YA SG 11201504456Y A SG11201504456Y A SG 11201504456YA
Authority
SG
Singapore
Prior art keywords
fabrication
same
optical elements
modules incorporating
incorporating
Prior art date
Application number
SG11201504456YA
Inventor
Simon Gubser
Hakan Karpuz
Original Assignee
Heptagon Micro Optics Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heptagon Micro Optics Pte Ltd filed Critical Heptagon Micro Optics Pte Ltd
Publication of SG11201504456YA publication Critical patent/SG11201504456YA/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00278—Lenticular sheets
    • B29D11/00307—Producing lens wafers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G02B3/0031—Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/005—Diaphragms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/18—Diffraction gratings
    • G02B5/1847—Manufacturing methods
    • G02B5/1852—Manufacturing methods using mechanical means, e.g. ruling with diamond tool, moulding

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Ophthalmology & Optometry (AREA)
  • Health & Medical Sciences (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Lens Barrels (AREA)
  • General Engineering & Computer Science (AREA)
SG11201504456YA 2012-12-27 2013-12-10 Fabrication of optical elements and modules incorporating the same SG11201504456YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261746347P 2012-12-27 2012-12-27
PCT/SG2013/000525 WO2014104972A1 (en) 2012-12-27 2013-12-10 Fabrication of optical elements and modules incorporating the same

Publications (1)

Publication Number Publication Date
SG11201504456YA true SG11201504456YA (en) 2015-07-30

Family

ID=51016160

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201504456YA SG11201504456YA (en) 2012-12-27 2013-12-10 Fabrication of optical elements and modules incorporating the same

Country Status (8)

Country Link
US (2) US9478681B2 (en)
EP (1) EP2939053B1 (en)
JP (1) JP6253666B2 (en)
KR (1) KR102135492B1 (en)
CN (1) CN104937445B (en)
SG (1) SG11201504456YA (en)
TW (2) TWI622177B (en)
WO (1) WO2014104972A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9094593B2 (en) 2013-07-30 2015-07-28 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules
US9543354B2 (en) 2013-07-30 2017-01-10 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules
CN108076671B (en) 2015-08-27 2022-04-22 赫普塔冈微光有限公司 Optical assembly comprising a spacer directly adhered to a substrate
US10551596B2 (en) 2016-06-29 2020-02-04 Ams Sensors Singapore Pte. Ltd. Optical and optoelectronic assemblies including micro-spacers, and methods of manufacturing the same
TWI762532B (en) * 2016-12-01 2022-05-01 新加坡商海特根微光學公司 Optoelectronic modules and optoelectronic molding tools and processes for manufacturing the same
US11996505B2 (en) 2018-12-10 2024-05-28 Ams Sensors Singapore Pte. Ltd. Vacuum injection molding for optoelectronic modules

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US5655189A (en) * 1994-05-27 1997-08-05 Kyocera Corporation Image device having thermally stable light emitting/receiving arrays and opposing lenses
EP1443344A1 (en) 2003-01-29 2004-08-04 Heptagon Oy Manufacturing micro-structured elements
JPWO2005109042A1 (en) * 2004-05-12 2008-03-21 松下電器産業株式会社 Optical element and manufacturing method thereof
KR100636349B1 (en) * 2004-09-24 2006-10-19 엘지전자 주식회사 Microlens Array Sheet and Manufacturing Method thereof
DE102006010729A1 (en) * 2005-12-09 2007-06-14 Osram Opto Semiconductors Gmbh Optical component, e.g. for miniature opto-electronic semi-conductor chips, comprises a composite unit of lens and mounting part in different materials
JP5580207B2 (en) * 2007-11-27 2014-08-27 ヘプタゴン・マイクロ・オプティクス・プライベート・リミテッド Wafer scale package and manufacturing method thereof, and optical device and manufacturing method thereof
TW200937642A (en) * 2007-12-19 2009-09-01 Heptagon Oy Wafer stack, integrated optical device and method for fabricating the same
TWI505703B (en) * 2007-12-19 2015-10-21 Heptagon Micro Optics Pte Ltd Optical module, wafer scale package, and method for manufacturing those
TWI484237B (en) * 2007-12-19 2015-05-11 Heptagon Micro Optics Pte Ltd Optical module for a camera device, baffle substrate, wafer scale package, and manufacturing methods therefor
WO2009133756A1 (en) * 2008-04-28 2009-11-05 コニカミノルタオプト株式会社 Method for producing wafer lens assembly and method for producing wafer lens
WO2010050290A1 (en) * 2008-10-31 2010-05-06 コニカミノルタオプト株式会社 Wafer lens manufacturing method and wafer lens
JP5352392B2 (en) * 2009-09-14 2013-11-27 富士フイルム株式会社 Wafer level lens array manufacturing method, wafer level lens array, lens module, and imaging unit
JP5401227B2 (en) * 2009-09-16 2014-01-29 富士フイルム株式会社 Wafer level lens array manufacturing method, wafer level lens array, lens module, and imaging unit
JP2011062879A (en) * 2009-09-16 2011-03-31 Fujifilm Corp Method for molding wafer level lens array, wafer level lens array, lens module, and imaging unit
TWI495919B (en) * 2009-10-20 2015-08-11 Flir Systems Trading Belgium Bvba Optical apparatus and method of producing the same
JP2011128355A (en) * 2009-12-17 2011-06-30 Sony Corp Imaging lens, camera module using imaging lens, manufacturing method of imaging lens, and manufacturing method of camera module
KR101847658B1 (en) 2010-02-01 2018-05-24 디비엠 리플렉스 엔터프라이즈스 인크. Thick lens molded with embedded layers of the same resin using a two step injection molding process
SG191168A1 (en) 2011-01-25 2013-07-31 Heptagon Micro Optics Pte Ltd Manufacturing a plurality of optical elements
WO2012117986A1 (en) * 2011-03-01 2012-09-07 富士フイルム株式会社 Method for manufacturing lens module, and lens module
TW201241482A (en) * 2011-04-08 2012-10-16 E Pin Optical Industry Co Ltd Optical lens with insert soma and optical lens module thereof
TWI480615B (en) * 2011-06-30 2015-04-11 Lg Innotek Co Ltd Lens unit, manufacturing method of the same, and camera module including the same
US8848286B2 (en) * 2012-04-11 2014-09-30 Omni Version Technology, Inc. Lens plate for wafer-level camera and method of manufacturing same
US9634051B2 (en) * 2012-07-17 2017-04-25 Heptagon Micro Optics Pte. Ltd. Optical devices, in particular computational cameras, and methods for manufacturing the same

Also Published As

Publication number Publication date
TW201820643A (en) 2018-06-01
EP2939053A1 (en) 2015-11-04
US10126530B2 (en) 2018-11-13
WO2014104972A1 (en) 2014-07-03
TWI622177B (en) 2018-04-21
JP6253666B2 (en) 2017-12-27
US9478681B2 (en) 2016-10-25
CN104937445B (en) 2017-10-24
TWI655783B (en) 2019-04-01
KR20150103090A (en) 2015-09-09
TW201432918A (en) 2014-08-16
US20170010450A1 (en) 2017-01-12
US20140183585A1 (en) 2014-07-03
KR102135492B1 (en) 2020-07-20
JP2016506326A (en) 2016-03-03
EP2939053B1 (en) 2019-03-20
CN104937445A (en) 2015-09-23
EP2939053A4 (en) 2016-08-31

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