WO2010050290A1

WO2010050290A1 - Wafer lens manufacturing method and wafer lens

Info

Publication number: WO2010050290A1
Application number: PCT/JP2009/065061
Authority: WO
Inventors: 正斎藤; 雄一藤井
Original assignee: コニカミノルタオプト株式会社
Priority date: 2008-10-31
Filing date: 2009-08-28
Publication date: 2010-05-06

Abstract

Provided is a wafer lens manufacturing method for manufacturing a wafer lens (1) provided with convex lens portions (5) on a glass substrate (3) by curing resin (5A) between the glass substrate (3) and a resin mold (20) in which concave cavities (24) are formed, in which after a tip side molding step is performed one or more times whereby the uncured resin (5A) is disposed on at least the cavities (24) in the resin mold (20) and cured, a base end side molding step is performed whereby the uncured resin (5A) is disposed between the resin mold (20) and the glass substrate (3) and the disposed resin (5A) is cured while being pressed from above by the glass substrate (3). Thus, the wafer lens with desired optical performance and a large amount of sag can be formed while a reduction in productivity is prevented.

Description

Wafer lens manufacturing method and wafer lens

The present invention relates to a wafer lens manufacturing method and a wafer lens.

Conventionally, in the field of manufacturing optical lenses, a technique for obtaining an optical lens having high heat resistance by providing a lens portion made of a curable resin on a glass substrate has been studied (for example, see Patent Document 1). As an example of a manufacturing method of an optical lens to which this technology is applied, a so-called “wafer lens (microlens array)” in which a plurality of optical members made of a curable resin is provided on the surface of a glass substrate is formed, and thereafter, for each lens portion A method of cutting a glass substrate has also been proposed.

The wafer lens manufacturing method in the case of using a photocurable resin as the curable resin will be briefly described. As shown in FIG. 9, the glass substrate 3 on which the resin 5A sucked and fixed by the vacuum chuck device 70 is dropped. Then, after arranging the mold 20 so as to face each other, the glass substrate 3 is raised and the resin 5A is pressed against the mold 20 (see arrow). The mold 20 is a light transmissive mold having a cavity 24 and is held and fixed by a stamp holder 80.

Then, while maintaining the height position of the glass substrate 3 as it is, as shown in FIG. 10, the resin 5A filled in the cavity 24 is irradiated with light from above the mold 20 to cure the resin 5A. Thereafter, the resin 5 A is released from the mold 20 while the glass substrate 3 is lowered. As a result, a wafer lens having a plurality of lens portions (5A) formed on the glass substrate 3 can be manufactured.

By the way, in the process of FIG. 10 in which the resin 5A is cured by light irradiation, the resin 5A that has been irradiated with light shrinks when it is cured, causing a sink or an uncured portion inside. In some cases, the optical performance of the lens deviates from the design value. Such a problem becomes more prominent as the sag amount of the wafer lens increases.

On the other hand, in recent years, as a method for solving such a problem, there is a method in which a plurality of types of molds are prepared and used in order of increasing depth to laminate and cure the resin in order from the surface side of the glass substrate. It has been proposed (see, for example, Patent Document 2).

Japanese Patent No. 3926380 European Patent Application No. 1474851

However, in the method described in Patent Document 2, since molding is performed by replacing a plurality of molding dies, dust may be mixed into the lens portion and the optical performance may change. In addition, if the position of the molding die is shifted between the molding steps, the shape accuracy of the lens part, and consequently the optical performance, will change. On the other hand, if the molding die is to be positioned with high accuracy, it will take time and productivity will be increased. It will decline. Note that such a problem is not limited to the case where the sag amount of the lens portion in the wafer lens is large, but a protruding portion that is separate from the lens portion (for example, a spacer when laminating wafer lenses or a positioning when arranging the wafer lens This also occurs when the member is provided protruding from the glass substrate.

An object of the present invention is to provide a wafer lens manufacturing method and a wafer lens capable of forming a wafer lens having a desired optical performance with a large sag amount while preventing a decrease in productivity.

According to a first aspect of the invention,
A method for producing a wafer lens, comprising: curing a curable resin between a substrate and a mold in which a concave cavity is formed, and producing a wafer lens provided with a lens portion on the substrate,
After performing at least one tip side molding step of disposing and curing an uncured curable resin on at least the cavity in the mold,
An uncured curable resin is disposed between the mold and the substrate, and a proximal-side molding process is performed in which the disposed curable resin is cured while being pressed from above with the substrate. .

According to a second aspect of the present invention,
A substrate,
Mold with a concave cavity having a predetermined depth corresponding to the negative shape of the lens part to be molded, and a recess formed deeper than the cavity so as to form a protrusion protruding from the lens part When,
Cure the curable resin between,
A wafer lens manufacturing method for manufacturing a wafer lens provided with the protruding portion together with the lens portion on the substrate,
After performing the front end side molding step of arranging and curing an uncured curable resin on at least the concave portion in the molding die one or more times,
An uncured curable resin is disposed between at least the cavity of the molding die and the substrate, and a proximal-side molding step is performed in which the disposed curable resin is cured while being pressed by the substrate. And

In the method for producing a wafer lens of the present invention,
In the tip side molding step,
The curable resin is preferably cured after being applied to a uniform thickness by spray coating.

In the method of manufacturing a wafer lens of the present invention,
When the distal end side molding step is performed a plurality of times, it is preferable to use different types of curable resins in at least the steps performed before and after each of the distal end side molding step and the proximal end side molding step.

In the method of manufacturing a wafer lens of the present invention,
In the tip side molding step,
The curable resin is preferably cured in air.

In the method of manufacturing a wafer lens of the present invention,
In the tip side molding step,
The curable resin may be cured in a gas not containing oxygen or in a vacuum.

According to the third aspect of the present invention, in the wafer lens,
It is manufactured by the method for manufacturing a wafer lens of the present invention.

According to the present invention, after performing at least one tip side molding step of disposing and curing an uncured curable resin on at least a cavity (or a recess), between the mold and the substrate (or at least the cavity) An uncured curable resin is disposed between the substrate and the substrate, and a base-end side molding step is performed in which the curable resin is cured while being pressed from above with the substrate. Molded in more than once. Therefore, even when a wafer lens with a large sag amount is molded, it is possible to prevent the occurrence of sink marks during curing and the occurrence of uncured portions. In addition, unlike the case of using a plurality of types of molds, the lens part (or protrusion) can be molded using a single type of mold, so that the optical performance changes due to contamination of the lens part, Thus, it is possible to prevent a change in the optical performance of the lens unit due to the displacement of the molds. Therefore, it is possible to form a wafer lens having a desired optical performance with a large sag amount.

Also, since the distal end side can be molded with resin with the base end side of the lens portion (or projection) open, it is possible to prevent transfer defects on the optical functional surface due to the resin being cured and shrunk. Therefore, a wafer lens having a desired optical performance can be formed more reliably.

In addition, unlike the case of using a plurality of types of molds, the lens part can be molded using one type of mold, which saves labor for positioning the mold with high accuracy and reduces productivity. It can be omitted.

It is a perspective view showing a schematic structure of a wafer lens concerning an embodiment. It is drawing which shows schematic structure of the wafer lens manufacturing apparatus concerning embodiment. It is a perspective view which shows schematic structure of the resin type | mold (molding die) concerning 1st Embodiment. It is a perspective view which shows schematic structure of the resin-type master (matrix) of FIG. It is a block diagram for demonstrating schematically the control structure of the wafer lens manufacturing apparatus concerning embodiment. (A) is a figure which shows the front end side shaping | molding process of the lens part concerning 1st Embodiment, (b) is a figure which shows a base end side shaping | molding process. It is drawing which shows schematic structure of the wafer lens manufacturing apparatus concerning 1st Embodiment, Comprising: It is drawing showing the state when resin is filled into the shaping | molding die (resin mold). (A) is a figure which shows the front end side shaping | molding process of the lens part concerning 2nd Embodiment, (b) is a figure which shows a base end side shaping | molding process. It is a schematic drawing for demonstrating a prior art, Comprising: It is drawing showing the state before filling resin in a shaping | molding die. It is schematic drawing for demonstrating a prior art, Comprising: It is drawing showing a state when resin is filled with the shaping | molding die.

Next, a preferred embodiment of the present invention will be described with reference to the drawings.

As shown in FIG. 1, the wafer lens 1 has a circular glass substrate 3 and a plurality of convex lens portions 5. The glass substrate 3 is an example of a substrate. On the surface of the glass substrate 3, a plurality of convex lens portions 5 having a sag amount of about 0.3 mm to 1 mm are arranged in an array. The convex lens portion 5 may have a fine structure such as a diffraction groove or a step on the surface of the optical surface.

The convex lens portion 5 is made of resin 5A. The resin 5A is a curable resin, and is a photocurable resin, preferably a UV curable resin, in the present embodiment. As the photocurable resin, for example, an acrylic resin or an allyl ester resin can be used, and these resins can be cured by radical polymerization. As another photocurable resin, for example, an epoxy-based resin can be used, and the resin can be reaction-cured by cationic polymerization.

Next, the wafer lens manufacturing apparatus 30 used when manufacturing the wafer lens 1 will be described.

As shown in FIG. 2, the wafer lens manufacturing apparatus 30 has a base 32. A protruding portion 34 protruding inward is formed on the upper portion of the base 32. A guide 36 is erected between the bottom of the base 32 and the protrusion 34. A stage 40 is provided between the guides 36. A through hole 42 is formed in the stage 40, and the guide 36 passes through the through hole 42.

A geared motor 50 is provided on the base 32 and below the stage 40. The geared motor 50 includes a potentiometer 51 (see FIG. 5). A shaft 52 is connected to the geared motor 50, and the tip of the shaft 52 supports the stage 40. In the wafer lens manufacturing apparatus 30, the shaft 52 extends and contracts in the vertical direction by the operation of the geared motor 50, and accordingly, the stage 40 can move in the vertical direction while being guided by the guide 36.

The recess 40 having a substantially hemispherical shape is formed on the stage 40. A paralleling member 60 is embedded in the recess 46. The paralleling member 60 can swing with respect to the recess 46 like a bowl floating on the water surface. An XY stage 62 and a θ stage 64 are provided on the paralleling member 60. The XY stage 62 is movable on an XY plane (two-dimensional plane) on the stage 40, and the θ stage 64 is rotatable about its central portion as a rotation axis.

A vacuum chuck device 70 is installed on the XY stage 62 and the θ stage 64. A concentric communication groove 72 is formed in the vacuum chuck device 70. A suction mechanism (not shown) is connected to the communication groove 72, and air can be sucked from the communication groove 72 by the operation of the suction mechanism, and members on the vacuum chuck device 70 can be sucked and fixed. ing. In the present embodiment, the resin mold 20 (molding mold) is sucked and fixed by the vacuum chuck device 70.

A stamp holder 80 is fixed to the upper part of the base 32, and a vacuum chuck device 110 made of a light transmissive member is fixed to the stamp holder 80. A concentric communication groove 112 is formed in the vacuum chuck device 110. A suction mechanism (not shown) is connected to the communication groove 112, and air can be sucked from the communication groove 112 by the operation of the suction mechanism, and members under the vacuum chuck device 110 can be sucked and fixed. ing. In the present embodiment, the glass substrate 3 is sucked and fixed by the vacuum chuck device 110. A light source 90 is provided above the vacuum chuck device 110, and when the light source 90 is turned on, the light passes through the vacuum chuck device 110 and the glass substrate 3.

2 and 3, the resin mold 20 is mainly composed of a molded part 22 and a base material 26. A plurality of concave cavities 24 are formed in the molding portion 22 in an array. The surface (molding surface) shape of the cavity 24 has a predetermined depth corresponding to the negative shape of the convex lens portion 5 in the wafer lens 1, and is recessed in a substantially hemispherical shape in FIGS. 2 and 3.

The molding part 22 is formed of a resin 22A. As the resin 22A, a resin having good releasability, particularly a transparent resin is preferable. It is excellent in that it can be released without applying a release agent. As the resin 22A, any of a photocurable resin, a thermosetting resin, and a thermoplastic resin may be used.

Even if the base material 26 is inferior in strength only by the molding part 22 of the resin mold 20, the strength of the resin mold 20 is increased by attaching the base material 26 to the molding part 22, and can be molded many times. It is a backing material.

The base material 26 may be made of a material different from that of the molding part 22 or may be integrally made of the same material as that of the molding part 22. When the base material 26 is made of a material different from that of the molding part 22, any material having smoothness such as quartz, silicone wafer, metal, glass, resin, ceramics and the like may be used. Constructing the base material 26 integrally with the same material as the molding part 22 means that the resin mold 20 is substantially constituted by only the molding part 22.

In the manufacture of the wafer lens 1 (molding of the convex lens portion 5), the resin mold 20 of FIG. 3 is mainly used, but in addition to this, the master 10 of FIG. 4 is also used. That is, the master 10 is a mother mold used when the resin mold 20 is manufactured, and the resin mold 20 is a molding mold used when the wafer lens 1 (convex lens portion 5) is molded. The resin mold 20 is used a plurality of times for mass production of the wafer lens 1, and is different from the master 10 in the purpose of use and the frequency of use.

As shown in FIG. 4, the master 10 has a plurality of convex portions 14 formed in an array with respect to a rectangular parallelepiped base portion 12. The convex portion 14 is a portion corresponding to the convex lens portion 5 of the wafer lens 1 and protrudes in a substantially hemispherical shape. Note that the outer shape of the master 10 may be a quadrangle or a circle as described above.

The surface (molding surface) shape of the convex portion 14 is a positive shape corresponding to the optical surface shape of the convex lens portion 5 that is molded and transferred onto the glass substrate 3.

As the material of the master 10, when an optical surface shape is created by machining such as cutting or grinding, metal or metal glass can be used. The classification includes ferrous materials and other alloys. Examples of the iron system include hot dies, cold dies, plastic dies, high-speed tool steel, general structural rolled steel, carbon steel for mechanical structure, chromium / molybdenum steel, and stainless steel. Among them, plastic molds include pre-hardened steel, quenched and tempered steel, and aging treated steel. Examples of pre-hardened steel include SC, SCM, and SUS. More specifically, the SC system is PXZ. SCM systems include HPM2, HPM7, PX5, and IMPAX. Examples of the SUS system include HPM38, HPM77, S-STAR, G-STAR, STAVAX, RAMAX-S, and PSL. Examples of iron-based alloys include JP-A-2005-113161 and JP-A-2005-206913. As the non-ferrous alloys, copper alloys, aluminum alloys and zinc alloys are well known. Examples include the alloys disclosed in JP-A-10-219373 and JP-A-2000-176970. PdCuSi, PdCuSiNi, etc. are suitable as metallic glass materials because they have high machinability in diamond cutting and less tool wear. Amorphous alloys such as electroless and electrolytic nickel phosphorous plating are also suitable because they have good machinability in diamond cutting. These highly machinable materials may constitute the entire master 10 or may cover only the surface of the optical transfer surface, in particular, by a method such as plating or sputtering.

As shown in FIG. 5, the geared motor 50, potentiometer 51, parallelizing member 60, XY stage 62, θ stage 64, vacuum chuck devices 70 and 110 (suction mechanism), stamp holder 80 (suction mechanism), and light source 90 are control devices. 100. The control device 100 controls the operation of these members. Particularly in the present embodiment, the control device 100 controls the operation (rotation amount) of the geared motor 50 based on the output value of the potentiometer 51.

Subsequently, a method for manufacturing the wafer lens 1 using the wafer lens manufacturing apparatus 30 will be described.

As shown in FIG. 2, first, the glass substrate 3 is sucked and fixed to the vacuum chuck device 110, and the resin mold 20 is set to the vacuum chuck device 70 and sucked and fixed.

Next, as shown in FIG. 2 and FIG. 6A, a predetermined amount of uncured resin 5A is disposed on at least each cavity 24 in the resin mold 20. Here, in the present embodiment, the resin 5A is disposed by applying the resin 5A to a uniform thickness by spray coating. However, the resin 5A may be disposed by dropping. Further, only a small amount of the resin 5A than the volume of the cavity 24 is disposed only on each cavity 24, but a larger amount of the resin 5A than the volume of the cavity 24 is disposed on the entire upper surface of the resin mold 20. It is also good.

Next, the light source 90 is turned on, and the resin 5A is irradiated with light through the light-transmitting vacuum chuck device 110 and the glass substrate 3 to cure the resin 5A. Thereby, the front end side part of the convex lens part 5 is shape | molded (front end side shaping | molding process).

In the present embodiment, the above-described tip side molding process is performed in a state where the resin 5A is exposed to the air. Thereby, hardening will be inhibited by oxygen on the surface of the resin 5A.

Next, after the light source 90 is turned off and the light irradiation to the resin 5A is stopped, an uncured resin 5A is dropped and disposed on at least the cavity 24 between the resin mold 20 and the glass substrate 3. . Here, in the present embodiment, the resin 5 A is dropped and disposed at the center of the upper surface of the resin mold 20, but the resin 5 A may be disposed on each cavity 24. Moreover, in this Embodiment, the kind of resin 5A arrange | positioned here is the same as the kind of resin used at the above-mentioned front end side shaping | molding process.

Next, the paralleling member 60, the XY stage 62, and the θ stage 64 are controlled by the control device 100 so that the upper surface of the resin mold 20 and the lower surface of the glass substrate 3 are parallel.

In this state, as shown in FIG. 7, the position of the resin mold 20 is controlled, the resin mold 20 is moved to a predetermined position with respect to the glass substrate 3, and the resin mold 20 is held at the predetermined position.

Specifically, the geared motor 50 is operated to extend the shaft 52 upward, and the stage 40 is moved upward. In this case, the control device 100 controls the operation of the geared motor 50 based on the output value of the potentiometer 51, and moves the stage 40 to a predetermined height position.

In the wafer lens manufacturing apparatus 30, the height position of the stage 40 to be moved is preset in the control apparatus 100. As shown in FIG. 7, the control apparatus 100 has the vacuum chuck apparatus 70 in the reference position S (FIG. 2). The geared motor 50 is operated to a position that reaches (see), and when the vacuum chuck device 70 reaches the reference position S, the operation of the geared motor 50 is stopped.

As a result, the uncured resin 5A receives pressure from the upper glass substrate 3 and gradually spreads, and fills the base end side (upper side in the drawing) of the cavity 24 in the resin mold 20. Thereafter, the light source 90 is turned on while the stage 40 is held at a position corresponding to the reference position S, and as shown in FIG. 6B, the light transmissive vacuum chuck device 110 (not shown) and the glass substrate 3 are mounted. The resin 5A is irradiated with light to cure the resin 5A. Thereby, the base end side part of the convex lens part 5 is shape | molded (base end side shaping | molding process).

Thereafter, the light source 90 is turned off and the light irradiation to the resin 5A is stopped. Thereafter, the geared motor 50 is operated, the shaft 52 is contracted downward, the stage 40 is moved downward, and the cured resin 5 A is released from the resin mold 20 together with the glass substrate 3. As a result, the wafer lens 1 in which the plurality of convex lens portions 5 are formed on the glass substrate 3 can be manufactured.

According to the present embodiment described above, at least one end-side molding step of disposing and curing the uncured resin 5A on at least the cavity 24 is performed one or more times, and then the uncured resin 5A is disposed on at least the cavity 24. Since the base end side molding step is performed in which the resin 5A is cured while being pressed by the glass substrate 3 from above, the convex lens portion 5 is molded in two or more steps. Therefore, even when the wafer lens 1 having a large sag amount is molded, it is possible to prevent the occurrence of sink marks during curing and the occurrence of uncured portions. Unlike the case of using a plurality of types of resin molds (molding molds) 20, the convex lens portion 5 can be molded using one type of resin mold 20, so that the optical performance due to dust mixed in the convex lens portion 5. And changes in the optical performance of the convex lens portion 5 due to the displacement of the positions of the resin molds 20 can be prevented. Therefore, it is possible to form the wafer lens 1 having a desired optical performance with a large sag amount.

Further, since the distal end side can be molded with the resin 5A in a state where the proximal end side of the convex lens portion 5 is opened, it is possible to prevent a transfer failure of the optical function surface due to the resin 5A being cured and contracted. Therefore, the wafer lens 1 having a desired optical performance can be formed more reliably.

Further, unlike the case of using a plurality of types of resin molds (molding molds) 20, the convex lens portion 5 can be molded using one type of resin mold 20, so that it is troublesome to position the resin mold 20 with high accuracy. Can be eliminated, and productivity can be reduced.

In the front end side molding step, the resin 5A is applied to a uniform thickness by spray coating and then cured, so that the interface of the resin layer cured in each molding step can be formed in a predetermined shape. Therefore, it is possible to reliably form the wafer lens 1 having a desired optical performance.

Further, in the front end side molding step, the resin 5A is cured in air, and the curing on the surface of the resin 5A is inhibited by oxygen. Therefore, the uncured portion of the surface of the resin 5A disposed in the front end side molding step is It can be cured together with the resin 5A disposed in the subsequent proximal end side molding step. Therefore, the formation of an interface between these resins 5A can be prevented, and the laminated resins 5A can be cured in a continuous state.

In the first embodiment, the resin 5A used in the front end side molding step and the resin 5A used in the base end side molding step have been described as being the same type, but may be different types. In this case, wafer lenses having more various optical performances can be formed.
[Second Embodiment]
The second embodiment according to the present invention is different from the first embodiment in the following points, and is otherwise the same as the first embodiment.

As shown in FIG. 2, a wafer lens manufacturing apparatus 30A according to the present embodiment includes a resin mold 20A instead of the resin mold 20, and the molding part 22B of the resin mold 20A has a convex lens part as shown in FIG. Between the plurality of cavities 24 for transfer-molding the optical function surface 5, a concave cavity (recess) 24 A for transfer-molding the protrusion is provided. In addition, at the transition portion between the

cavities

24 and 24A, the surface is roughened and the mold release process is performed. Here, the depth of the cavity 24 A is deeper than the cavity 24. The protrusion formed by the cavity 24A functions as a spacer when laminating the wafer lens, or functions as a positioning member when the wafer lens is disposed in the optical device. The thickness (height) is also increased.

When a wafer lens is manufactured using the wafer lens manufacturing apparatus 30A according to the present embodiment, as shown in FIG. 8A, the resin 5A is cured at least on the tip side of the cavity 24A in the tip side molding step. Thereafter, as shown in FIG. 8B, in the base end side molding step, resin is filled at least between the cavity 24 and the glass substrate 3, preferably the base end side of the cavity 24A and the inside of the cavity 24, and is cured. Except for this point, the wafer lens 1 is manufactured in the same manner as in the first embodiment. However, after the resin 5A is filled and cured in the cavity 24A in the distal end side molding process, the cavity 24 may be filled and cured in the proximal end molding process. In this case, if the resin 5A used in the front end side molding step and the resin 5A used in the base end side molding step are different types of resins, the wafer has various optical performances compared to the case where the same type of resin is used. A lens can be formed.

According to the present embodiment described above, the same effect as in the first embodiment can be obtained.

It should be noted that the present invention should not be construed as being limited to the above-described embodiment, and of course can be changed or improved as appropriate.

For example, in the first and second embodiments described above, the tip side molding step is described as being performed once, but may be performed a plurality of times. In this case, since it is possible to more reliably prevent the occurrence of sink marks or uncured portions during curing, a wafer lens having a desired optical performance with a large sag amount can be reliably formed. Can do.

Further, when the distal end side molding step is performed a plurality of times, different types of resin 5A may be used in at least the steps performed before and after each of the distal end side molding step and the proximal end side molding step. good. In this case, wafer lenses having more various optical performances can be formed. Here, when different types of resins are used in each molding step, the resin can be easily applied and the transferability of the optical functional surface can be improved by using a resin having a low viscosity in the previous molding step. it can. In addition, the throughput can be improved by using a resin having a high curing rate and a large shrinkage in the previous molding step. In addition, the resin used in the front end side molding step is excellent in releasability, and the resin used in the base end side molding step is preferably excellent in adhesiveness with glass.For example, a release agent is added to the former resin, It is conceivable to formulate the latter resin in order to improve the adhesion to glass. Further, by using a resin having the same refractive index in each molding step, an optical boundary surface can be eliminated, so that a decrease in optical performance due to the boundary surface can be prevented.

In the tip side molding step, the resin 5A is described as being cured in the air. However, the resin 5A may be cured in a gas not containing oxygen or in a vacuum. In this case, unlike the case where the resin 5A is cured in the presence of oxygen, the resin 5A is cured in the subsequent molding process (next distal-end molding process or proximal-end molding process) with the surface of the resin 5A cured. The provided resin 5A can be cured. Therefore, in particular, when dissimilar resins 5A are disposed in the molding process performed before and after each other, it is possible to form the convex lens portion 5 in which the interface is formed.

Moreover, although it demonstrated as resin 5A being pressed with the glass substrate 3 from the upper direction by raising the resin mold 20, it is good also as lowering | lowering the glass substrate 3, and making the resin mold 20 lowering | lowering the glass substrate 3. FIG. It may be raised.

In addition, although the resin 5A has been described as being cured by the transmitted light of the vacuum chuck device 110 and the glass substrate 3, the resin mold 20 may be made translucent and cured by the transmitted light of the resin mold 20.

1 Wafer lens 3 Glass substrate (substrate)
5 Convex lens part 5A Resin (curable resin)
10 Master 12 Base 14 Convex 20 Resin Mold (Molding Die)
22 Molding part 22A Resin 24 Cavity 24A Cavity (concave)
26 Base material 30 Wafer lens manufacturing apparatus 32 Base 34 Protruding part 36 Guide 40 Stage 42 Through hole 46 Recessed part 50 Geared motor 51 Potentiometer 52 Shaft 60 Paralleling member 62 XY stage 64 θ stage 70 Vacuum chuck device 72 Communication groove 80 Stamp holder 82 Communication groove 90 Light source 100 Control device 110 Vacuum chuck device 112 Communication groove

Claims

A method for producing a wafer lens, comprising: curing a curable resin between a substrate and a mold in which a concave cavity is formed, and producing a wafer lens provided with a lens portion on the substrate,
After performing at least one tip side molding step of disposing and curing an uncured curable resin on at least the cavity in the mold,
An uncured curable resin is disposed between the mold and the substrate, and a proximal lens forming step is performed in which the disposed curable resin is cured while being pressed by the substrate. Manufacturing method.
A substrate,
A mold having a concave cavity having a predetermined depth corresponding to the negative shape of the lens part to be molded, and a recess formed deeper than the cavity so as to form a protrusion protruding from the lens part. When,
Cure the curable resin between,
A wafer lens manufacturing method for manufacturing a wafer lens provided with the protruding portion together with the lens portion on the substrate,
After performing the front end side molding step of arranging and curing an uncured curable resin on at least the concave portion in the molding die one or more times,
An uncured curable resin is disposed between at least the cavity of the molding die and the substrate, and a proximal-side molding step is performed in which the disposed curable resin is cured while being pressed by the substrate. A method for manufacturing a wafer lens.
In the manufacturing method of the wafer lens according to claim 1 or 2,
In the tip side molding step,
A method for producing a wafer lens, wherein the curable resin is applied to a uniform thickness by spray coating and then cured.
In the method for manufacturing a wafer lens according to any one of claims 1 to 3,
When the front end side molding step is performed a plurality of times, a different type of curable resin is used in each of the front end side molding step and the base end side molding step performed at least before and after each other. A method for manufacturing a wafer lens.
In the method for manufacturing a wafer lens according to any one of claims 1 to 4,
In the tip side molding step,
A method for producing a wafer lens, wherein the curable resin is cured in air.
In the method for manufacturing a wafer lens according to any one of claims 1 to 4,
In the tip side molding step,
A method for producing a wafer lens, wherein the curable resin is cured in a gas containing no oxygen or in a vacuum.
A wafer lens manufactured by the method for manufacturing a wafer lens according to any one of claims 1 to 6.