JP2010107879A - Method of manufacturing wafer lens, wafer lens, and device for manufacturing wafer lens - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent decrease in productivity, and also, to prevent deterioration in optical performance of a lens. <P>SOLUTION: The method of manufacturing the wafer lens consists of curing a resin 5A between a molding die 20 having recessed cavities 24 and a glass substrate 3, and then, manufacturing the wafer lens 1 having convex lenses 5 on the glass substrate 3. The manufacturing method includes: a filling step of moving the glass substrate 3 so as to press and spread the resin 5A lying between the molding die 20 and the glass substrate 3, and filling the resin 5A into the cavities 24; and a curing step of curing the resin 5A after the filling step. In the filling step, the resin 5A is pressed and spread while controlling the spreading speed of the resin 5A to be equal to or lower than an initial speed. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a wafer lens manufacturing method, a wafer lens, and a wafer lens manufacturing apparatus.

  Conventionally, in the field of manufacturing optical lenses, a technique for obtaining an optical lens having high heat resistance by providing a lens portion made of a curable resin on a glass substrate has been studied (for example, see Patent Document 1). As an example of a manufacturing method of an optical lens to which this technology is applied, a so-called “wafer lens (microlens array)” in which a plurality of optical members made of a curable resin is provided on the surface of a glass substrate is formed, and thereafter, for each lens portion A method of cutting a glass substrate has also been proposed.

  The wafer lens manufacturing method in the case of using a photo-curable resin as the curable resin will be briefly described. As shown in FIG. 12, the mold 20 sucked and fixed by the vacuum chuck device 70 and the resin 5A are dropped. After the glass substrate 3 is disposed so as to face the upper and lower sides, the glass substrate 3 is raised at a constant speed to press the resin 5A against the mold 20 (see arrow). The mold 20 is a light transmissive mold having a cavity 24 and is held and fixed by a stamp holder 80.

  Thereafter, while maintaining the height position of the glass substrate 3 as it is, as shown in FIG. 13, the resin 5A filled in the cavity 24 is irradiated with light from above the mold 20 to cure the resin 5A. Thereafter, the resin 5 </ b> A is released from the mold 20 while the glass substrate 3 is lowered. As a result, a wafer lens having a plurality of lens portions (5A) formed on the glass substrate 3 can be manufactured.

By the way, when manufacturing a wafer lens as described above, it is necessary to increase the rising speed of the glass substrate 3, that is, the mold clamping speed of the mold to some extent from the viewpoint of increasing productivity.
Japanese Patent No. 3926380

  However, when the glass substrate 3 is raised at a constant speed (for example, 0.1 mm / S) so that sufficient productivity can be obtained, as shown by the thin line graph in FIG. Since the resin 5A between the substrate 3 and the mold 20 is accelerated and expanded, the spreading speed becomes too high, resulting in entrainment of bubbles inside the cavity and unfilling of the resin 5A. As a result, the optical performance of the lens unit is deteriorated.

In addition, since the resin 5A is expanded at an accelerated speed, it is difficult to adjust the size of the expansion. Therefore, the expansion amount becomes insufficient, causing the resin 5A to be unfilled, or the expansion amount becomes excessive. Is cured and remains at the end of the mold, that is, the part not subjected to the mold release treatment, and the mold is damaged or defective.
The above problems are caused by insufficient control of the height of the glass substrate 3 (height measurement and drive control of the ascending mechanism), clogging of the dripping nozzle of the resin 5A, and lot variation. If you do, it will become even more prominent.

  An object of the present invention is to provide a wafer lens manufacturing method, a wafer lens, and a wafer lens manufacturing apparatus capable of preventing a decrease in productivity and a decrease in optical performance of a lens unit.

According to a first aspect of the invention,
A method for producing a wafer lens, comprising: curing a curable resin between a substrate and a mold in which a concave cavity is formed, and producing a wafer lens provided with a lens portion on the substrate,
A filling step of expanding the curable resin interposed between the mold and the substrate by moving at least one of the mold and the substrate, and filling the cavity.
A curing step of curing the curable resin after the filling step,
In the filling step,
The curable resin is pushed and expanded while controlling the spreading speed of the curable resin to be equal to or lower than the initial speed.

In the method for producing a wafer lens of the present invention,
In the filling step,
It is preferable to maintain the spreading speed at the initial speed.

In the method of manufacturing a wafer lens of the present invention,
In the filling step,
It is preferable that the curable resin is expanded until an edge of the curable resin is detected at a predetermined position in the gap between the mold and the substrate.

According to a second aspect of the present invention, in a wafer lens,
It is manufactured by the method for manufacturing a wafer lens of the present invention.

According to a third aspect of the present invention,
A wafer lens manufacturing apparatus that includes a mold having a concave cavity, cures a curable resin between the mold and the substrate, and manufactures a wafer lens having a lens portion provided on the substrate. And
A moving device for expanding the curable resin interposed between the mold and the substrate by moving at least one of the mold and the substrate, and filling the cavity.
A curing device for curing the curable resin,
The mobile device is
The curable resin is pushed and expanded while controlling the spreading speed of the curable resin to be equal to or lower than the initial speed.

In the wafer lens manufacturing apparatus of the present invention,
The mobile device is
It is preferable to maintain the spreading speed at the initial speed.

In the wafer lens manufacturing apparatus of the present invention,
An edge sensor that detects an edge of the curable resin at a predetermined position in a gap between the mold and the substrate;
The mobile device is
It is preferable that the curable resin is expanded until the edge sensor detects an edge of the curable resin.

According to the present invention, in the step of spreading the curable resin interposed between the mold and the substrate and filling the cavity, the curable resin is pushed while controlling the spreading speed of the curable resin to be lower than the initial speed. Since it spreads, unlike the conventional case where the spreading speed of the resin is accelerated, it is possible to prevent entrapment of bubbles inside the cavity and unfilling of the resin. Accordingly, it is possible to prevent a decrease in optical performance of the lens unit as compared with the conventional case.
In addition, since the spreading speed of the resin is controlled to be equal to or lower than the initial speed, the spreading amount (the magnitude of the spreading) can be easily adjusted, unlike the conventional case where the spreading speed is accelerated. Accordingly, since it is possible to prevent the spread amount from becoming insufficient and causing the resin to be unfilled, it is possible to more reliably prevent the optical performance from being deteriorated. In addition, it is possible to prevent the resin from hardening and remaining at the end of the mold, that is, the part that has not been subjected to the mold release process due to excessive spreading, thus preventing the mold from being damaged or defective. can do.
Further, since the optical performance can be prevented from being lowered without uniformly reducing the moving speed of the mold and / or the substrate, that is, the clamping speed, the productivity can be prevented from being lowered.
Moreover, since it is not necessary to perform calibration by once bringing the mold and the substrate into close contact with each other before the filling step, it is possible to facilitate the molding of a lens portion having high optical performance and to reliably prevent a decrease in productivity. .

Next, preferred embodiments of the present invention will be described with reference to the drawings.
[First Embodiment]

  As shown in FIG. 1, the wafer lens 1 has a circular glass substrate 3 and a plurality of convex lens portions 5. The glass substrate 3 is an example of a substrate. A plurality of convex lens portions 5 are arranged in an array on the surface of the glass substrate 3. The convex lens portion 5 may have a fine structure such as a diffraction groove or a step on the surface of the optical surface.

  The convex lens portion 5 is made of resin 5A. The resin 5A is a curable resin, and is a photocurable resin, preferably a UV curable resin, in the present embodiment. As the photocurable resin, for example, an acrylic resin or an allyl ester resin can be used, and these resins can be reaction-cured by radical polymerization. As another photocurable resin, for example, an epoxy-based resin can be used, and the resin can be reaction-cured by cationic polymerization.

  Next, the wafer lens manufacturing apparatus (30) used when manufacturing the wafer lens 1 is demonstrated.

  As shown in FIG. 2, the wafer lens manufacturing apparatus 30 has a base 32. A protruding portion 34 protruding inward is formed on the upper portion of the base 32. A guide 36 is erected between the bottom of the base 32 and the protrusion 34. A stage 40 is provided between the guides 36. A through hole 42 is formed in the stage 40, and the guide 36 passes through the through hole 42.

  A geared motor (moving device) 50 is provided on the base 32 and below the stage 40. The geared motor 50 has a built-in potentiometer 51 (see FIG. 6). A shaft 52 is connected to the geared motor 50, and the tip of the shaft 52 supports the stage 40. In the wafer lens manufacturing apparatus 30, the shaft 52 extends and contracts in the vertical direction by the operation of the geared motor 50, and accordingly, the stage 40 can move in the vertical direction while being guided by the guide 36.

  The stage 40 is formed with a concave portion 46 having a substantially hemispherical shape. A paralleling member 60 is embedded in the recess 46. The paralleling member 60 can swing with respect to the recess 46 like a bowl floating on the water surface. An XY stage 62 and a θ stage 64 are provided on the paralleling member 60. The XY stage 62 is movable on an XY plane (two-dimensional plane) on the stage 40, and the θ stage 64 is rotatable about its central portion as a rotation axis.

  A vacuum chuck device 70 is installed on the XY stage 62 and the θ stage 64. A concentric communication groove 72 is formed in the vacuum chuck device 70. A suction mechanism (not shown) is connected to the communication groove 72, and air can be sucked from the communication groove 72 by the operation of the suction mechanism, and members on the vacuum chuck device 70 can be sucked and fixed. ing. In the present embodiment, the glass substrate 3 is sucked and fixed by the vacuum chuck device 70.

  A stamp holder 80 is fixed to the upper part of the base 32. A light transmitting mold 20 is fixed to the stamp holder 80. Specifically, a concentric communication groove 82 is formed at the end of the stamp holder 80, and a suction mechanism (not shown) is connected to the communication groove 82. Similarly to the operation of the vacuum chuck device 70, when the suction mechanism is operated, air is sucked from the communication groove 82 and the mold 20 is sucked and fixed to the stamp holder 80.

  A light source (curing device) 90 and an edge sensor 91 are provided above the mold 20. The light source 90 can illuminate the mold 20 by turning on the light. As shown in FIG. 3, the edge sensor 91 is a resin at a predetermined position on the end side in the gap between the molding die 20 and the glass substrate 3 when the resin 5 </ b> A is spread on the molding die 20 and the glass substrate 3. In the present embodiment, the edge of the resin 5A is detected at the outer peripheral edge of the mold-released central region of the surface of the molding portion 22 described later in the molding die 20 in the present embodiment. It is like that. The edge sensor 91 is configured to retract from the irradiation area of the light source 90 when the light source 90 is turned on. In the present embodiment, the edge sensor 91 detects an edge by an optical method such as detecting an edge by a change in the state of reflected light. However, the edge sensor 91 may detect the edge by another method. good.

  As shown in FIGS. 2 and 4, the mold 20 is mainly composed of a molding part 22 and a base material 26. A plurality of concave cavities 24 for transferring and molding the optical functional surface of the convex lens portion 5 on the resin 5A are formed in the molding portion 22 in an array. The surface (molding surface) shape of the cavity 24 is a negative shape corresponding to the convex lens portion 5 in the wafer lens 1 and is recessed in a substantially hemispherical shape in this figure. Although an example in which the convex lens portion 5 is provided on the wafer lens 1 is shown here, a concave lens portion may be provided. However, in the present invention, the configuration in which the convex lens portion is provided, that is, the configuration in which the concave cavity 24 is provided in the mold 20 has a greater effect.

  The molding part 22 is formed of a resin 22A. As the resin 22A, a resin having good releasability, particularly a transparent resin is preferable. It is excellent in that it can be released without applying a release agent. However, in the present embodiment, a mold release process is performed on the central portion of the molding portion 22. As the resin 22A, any of a photocurable resin, a thermosetting resin, and a thermoplastic resin may be used.

  Even if the base material 26 is inferior in strength only by the molding part 22 of the molding die 20, the strength of the molding die 20 is increased by sticking the base material 26 to the molding part 22, and can be molded many times. It is a backing material.

  The base material 26 may be made of a material different from that of the molding part 22 or may be integrally made of the same material as that of the molding part 22. When the base material 26 is made of a material different from that of the molding part 22, any material having smoothness such as quartz, silicone wafer, metal, glass, resin, ceramics and the like may be used. Constructing the base material 26 integrally with the same material as the molding part 22 means that the molding die 20 is substantially constituted by only the molding part 22.

  In the manufacture of the wafer lens 1 (molding of the convex lens portion 5), the mold 20 shown in FIG. 4 is mainly used. In addition to this, the master 10 shown in FIG. 5 is also used. That is, the master 10 is a mother mold used when the mold 20 is manufactured, and the mold 20 is a mold used when the wafer lens 1 (convex lens portion 5) is molded. The mold 20 is used a plurality of times to mass-produce the wafer lens 1 and is different from the master 10 in its purpose of use and frequency of use.

  As shown in FIG. 5, the master 10 has a plurality of convex portions 14 formed in an array with respect to a rectangular parallelepiped base portion 12. The convex portion 14 is a portion corresponding to the convex lens portion 5 of the wafer lens 1 and protrudes in a substantially hemispherical shape. Note that the outer shape of the master 10 may be a quadrangle or a circle as described above.

  The surface (molded surface) shape of the convex portion 14 is a positive shape corresponding to the optical surface shape of the convex lens portion 5 that is molded and transferred onto the glass substrate 3.

  As a material of the master 10, when an optical surface shape is created by machining such as cutting or grinding, a metal or metal glass can be used. The classification includes ferrous materials and other alloys. Examples of the iron system include hot dies, cold dies, plastic dies, high-speed tool steel, general structural rolled steel, carbon steel for mechanical structure, chromium / molybdenum steel, and stainless steel. Among them, plastic molds include pre-hardened steel, quenched and tempered steel, and aging treated steel. Examples of pre-hardened steel include SC, SCM, and SUS. More specifically, the SC system is PXZ. SCM systems include HPM2, HPM7, PX5, and IMPAX. Examples of the SUS system include HPM38, HPM77, S-STAR, G-STAR, STAVAX, RAMAX-S, and PSL. Examples of iron-based alloys include JP-A-2005-113161 and JP-A-2005-206913. As the non-ferrous alloys, copper alloys, aluminum alloys and zinc alloys are well known. Examples include the alloys disclosed in JP-A-10-219373 and JP-A-2000-176970. PdCuSi, PdCuSiNi, etc. are suitable as metallic glass materials because they have high machinability in diamond cutting and less tool wear. Amorphous alloys such as electroless and electrolytic nickel phosphorous plating are also suitable because they have good machinability in diamond cutting. These highly machinable materials may constitute the entire master 10 or may cover only the surface of the optical transfer surface, in particular, by a method such as plating or sputtering.

  As shown in FIG. 6, the edge sensor 91, geared motor 50, potentiometer 51, paralleling member 60, XY stage 62, θ stage 64, vacuum chuck device 70 (suction mechanism), stamp holder (suction mechanism), and light source 90 are controlled. It is connected to the device 100. The control device 100 controls the operation of these members. Particularly in the present embodiment, the control device 100 controls the operation (rotation amount) of the geared motor 50 based on the output values of the edge sensor 91 and the potentiometer 51.

  Then, the manufacturing method of the wafer lens 1 using the wafer lens manufacturing apparatus 30 is demonstrated.

  As shown in FIG. 2, first, the mold 20 is sucked and fixed to the stamp holder 80, the glass substrate 3 is installed to the vacuum chuck device 70, and air is sucked from the connecting groove 72 to suck the glass substrate 3.・ Fix it. Thereafter, a predetermined amount of resin 5 </ b> A is dropped on the glass substrate 3. In the present embodiment, the dropping of the resin 5A is performed on the central portion of the glass substrate 3, but it may be performed separately on the opposing positions of the cavities 24.

  Next, the control device 100 controls the collimating member 60, the XY stage 62, and the θ stage 64 so that the lower surface of the mold 20 and the upper surface of the glass substrate 3 are parallel.

  In this state, as shown in FIG. 7, the control device 100 operates the geared motor 50 based on the output value of the potentiometer 51 to extend the shaft 52 upward, and moves the stage 40 upward to bring it close to the mold 20. . As a result, the resin 5A gradually expands upon receiving the pressure of the glass substrate 3, and is filled in the cavity 24 of the mold 20 as shown in FIG. 7 (filling step).

  At this time, in the present embodiment, the control device 100 is configured to push and spread the resin 5A while controlling the spreading speed of the resin 5A to be equal to or lower than the initial speed. More preferably, the thick line graph in FIG. As shown, the spreading speed is maintained at the initial speed. Thereby, in comparison with the conventional case where the ascending speed (clamping speed) of the glass substrate 3 is kept constant, that is, compared with the case where the spreading speed of the resin 5A is accelerated, In this way, unfilling of the resin can be prevented. The spreading speed of the resin 5A can be approximated by (spreading speed) ≈√ {(total volume of the dropped resin 5A) / (rising amount of the glass substrate 3)}. Further, as a method of controlling the spreading speed of the resin 5A to be equal to or lower than the initial speed, the relationship between the operating condition of the geared motor 50 and the spreading speed is measured in advance, and the control data of the geared motor 50 is set based on this measurement data. Or the method of observing the edge position of the resin 5A at every filling step and controlling the geared motor 50 so that the edge position moves below the initial speed. In this embodiment, the former method is used. Is used.

  Then, the control device 100 operates the geared motor 50 until the edge of the resin 5A is detected at a predetermined position on the end side in the gap between the mold 20 and the glass substrate 3 by the edge sensor 91, and then the glass substrate 3 is held in that position.

  Next, the control device 100 turns on the light source 90 while holding the stage 40 at a position corresponding to the reference position S, and irradiates the resin 5A with light through the light-transmitting mold 20 as shown in FIG. Then, the resin 5A is cured (curing step).

Next, the control device 100 turns off the light source 90 and stops the light irradiation on the resin 5A. Thereafter, the control device 100 operates the geared motor 50 to contract the shaft 52 downward and move the stage 40 downward.
Then, by releasing the cured resin 5 </ b> A from the mold 20 together with the glass substrate 3, the wafer lens 1 in which the plurality of convex lens portions 5 are formed on the glass substrate 3 can be manufactured.

  According to the above-described embodiment, in the filling step, the resin 5A is pushed and expanded while controlling the spreading speed of the resin 5A to be equal to or less than the initial speed, and thus the spreading speed of the resin 5A is accelerated. In contrast, it is possible to prevent entrainment of bubbles inside the cavity 24 and unfilling of the resin. Accordingly, it is possible to prevent the optical performance of the convex lens portion 5 from being lowered as compared with the conventional case.

  Further, since the spreading speed of the resin 5A is controlled to be equal to or lower than the initial speed, the spreading amount (the magnitude of the spreading) can be easily adjusted, unlike the conventional case where the spreading speed is accelerated. Therefore, since it is possible to prevent the spread amount from becoming insufficient and causing the resin 5A to be unfilled, it is possible to more reliably prevent the optical performance of the convex lens portion 5 from being deteriorated. Further, since the amount of spreading can be prevented and the resin 5A can be prevented from being cured and left at the end of the mold 20, that is, the part not subjected to the mold release treatment, the mold 20 is damaged or defective. Can be prevented.

  Further, since the glass substrate 3 is brought close to the mold 20 until the edge sensor 91 detects the edge of the resin 5 </ b> A that is expanded, the size of the expansion can be adjusted with certainty. Accordingly, it is possible to reliably prevent the optical performance of the convex lens portion 5 from being deteriorated and the molding die 20 from being damaged or defective.

  In addition, since it is possible to prevent a decrease in optical performance without uniformly reducing the mold clamping speed, it is possible to prevent a decrease in productivity. In particular, when the spreading speed is maintained at the initial speed in the filling process, the filling process can be performed in a shorter time than when the speed is reduced from the initial speed, so that the productivity is reliably reduced. Can be prevented.

  In addition, since it is not necessary to perform calibration by once bringing the mold 20 and the glass substrate 3 into close contact with each other before the filling step, it is easy to mold the convex lens portion 5 having high optical performance and more reliably reduce the productivity. Can be prevented.

[Second Embodiment]
The second embodiment is different from the first embodiment in the following points, and is otherwise the same as the first embodiment.

  In the present embodiment, the installation position of the glass substrate 3 and the installation position of the mold 20 are reversed. Specifically, as shown in FIG. 10, the mold 20 is sucked and fixed to the vacuum chuck device 70. A vacuum chuck device 110 is fixed to the protruding portion 34 of the base 32. The vacuum chuck device 110 is composed of a light transmissive member, and when the light source 90 is turned on, the light is transmitted through the vacuum chuck device 110. A concentric communication groove 112 is formed in the vacuum chuck device 110. A suction mechanism (not shown) is connected to the communication groove 112, and air can be sucked from the communication groove 112 by the operation of the suction mechanism, and members under the vacuum chuck device 110 can be sucked and fixed. ing. In the present embodiment, the glass substrate 3 is sucked and fixed by the vacuum chuck device 110. The vacuum chuck device 110 (suction mechanism) is connected to the control device 100 and its operation is controlled by the control device 100.

  When the wafer lens 1 is manufactured using the wafer lens manufacturing apparatus 30 according to the present embodiment, the glass substrate 3 is installed on the vacuum chuck apparatus 110 and the molding die 20 is installed on the vacuum chuck apparatus 70. Then, except that a predetermined amount of the resin 5A is dropped on the mold 20, and the resin 5A is irradiated with light through the light-transmitting vacuum chuck device 110 and the glass substrate 3 to cure the resin 5A. The wafer lens 1 is manufactured in the same manner as in the first embodiment.

  According to the present embodiment as described above, the same effect as in the first embodiment can be obtained.

  It should be noted that the present invention should not be construed as being limited to the above-described embodiment, and of course can be modified or improved as appropriate.

  For example, in the embodiment described above, the mold 20 or the glass substrate 3 is moved and the resin 5A is expanded, but the mold 20 and the glass substrate 3 may be moved.

Subsequently, an example suitable for the present embodiment will be described.
[Lens part molding]
As the mold 20, a plurality of cavities 24 having a sag amount of 0.2 mm and a diameter of 3 mm are arranged at a pitch of 5 mm, and 20 ml of an acrylic UV curable resin as a resin 5A is placed in the center of the mold 20. It was dripped. The viscosity of this resin was 3000 cP.

  Next, the space between the glass substrate 3 and the mold 20 was narrowed from 5 mm to 0.1 mm, the resin was filled in the cavities 24 while being expanded to a thickness of 0.1 mm and a diameter of 200 mm, and then cured.

  At this time, as shown in Table 1 below, when the resin is expanded, the movement speed of the mold 20 (clamping speed) is 0.1 mm / s, and the movement time (clamping time) is 19 seconds. The sample obtained from the sample having a speed of 1.3 mm / s at the initial speed to 65 mm / s at the final speed is the sample (1), the moving speed of the mold 20 is 0.02 mm / s, the moving time is 95 seconds, and the resin Sample (2) obtained from a spreading speed of 0.3 mm / s at the initial speed to 20 m / s at the final speed, and the moving speed of the mold 20 is reduced from 0.6 m / s to 0.01 m / s. The sample obtained by performing the variable control and setting the moving time to 9 seconds and the resin spreading speed to 20 m / s (constant) is set as the sample (3), and each of the samples (1) to (3) is set to 10 Individually formed. Of these samples (1) to (3), in sample (2), since the moving time (clamping time) of the mold 20 is too long, practically satisfactory productivity cannot be obtained.

[Evaluation of bubbles / unfilled]
Regarding the lens portions of the obtained samples (1) to (3), the presence or absence of bubbles and the presence or absence of shape defects due to unfilled resin were observed and evaluated according to the following criteria. As shown in Table 1 above, became.

○: No bubble or shape defect is observed in all samples.
X: The presence or absence of bubbles and shape defects were observed in all the samples.

  From the above, it can be seen that if the spreading speed of the resin is constant, the productivity can be prevented from being lowered and the optical performance of the lens portion can be prevented from being lowered.

It is a perspective view showing a schematic structure of a wafer lens concerning a 1st embodiment. It is drawing which shows schematic structure of the wafer lens manufacturing apparatus concerning 1st Embodiment, Comprising: It is drawing showing the state before filling a shaping | molding die with resin. (A), (b) is the side view for demonstrating a mode that resin is expanded by a shaping | molding die and a glass substrate, (c) is a figure for demonstrating operation | movement of an edge sensor. It is a perspective view which shows schematic structure of the shaping | molding die concerning 1st Embodiment. It is a perspective view which shows schematic structure of the master (matrix) of the shaping | molding die of FIG. It is a block diagram for demonstrating schematically the control structure of the wafer lens manufacturing apparatus concerning 1st Embodiment. It is drawing which shows schematic structure of the wafer lens manufacturing apparatus concerning 1st Embodiment, Comprising: It is drawing showing a state when resin is filled with the shaping | molding die. It is a figure which shows the raise speed | rate of the glass substrate at the time of making the spreading | diffusion speed | rate of resin constant at initial speed. It is drawing which expanded a part of FIG. It is drawing which shows schematic structure of the wafer lens manufacturing apparatus concerning 2nd Embodiment, Comprising: It is drawing showing the state before filling a shaping | molding die with resin. It is drawing which shows schematic structure of the wafer lens manufacturing apparatus concerning 2nd Embodiment, Comprising: It is drawing showing a state when resin is filled with the shaping | molding die. It is a schematic drawing for demonstrating a prior art, Comprising: It is drawing showing the state before filling resin in a shaping | molding die. It is schematic drawing for demonstrating a prior art, Comprising: It is drawing showing a state when resin is filled with the shaping | molding die.

Explanation of symbols

1 Wafer lens 3 Glass substrate (substrate)
5 Convex lens part 5A Resin (curable resin)
DESCRIPTION OF SYMBOLS 10 Master 12 Base part 14 Convex part 20 Molding die 22 Molding part 22A Resin 24 Cavity 26 Base material 30 Wafer lens manufacturing apparatus 32 Base 34 Protrusion part 36 Guide 40 Stage 42 Through-hole 46 Concave part 50 Geared motor (moving apparatus)
51 Potentiometer 52 Shaft 60 Paralleling member 62 XY stage 64 θ stage 70 Vacuum chuck device 72 Communication groove 80 Stamp holder 82 Communication groove 90 Light source (curing device)
100 Control Device 110 Vacuum Chuck Device 112 Communication Groove

Claims (7)

A method for producing a wafer lens, comprising: curing a curable resin between a substrate and a mold in which a concave cavity is formed, and producing a wafer lens provided with a lens portion on the substrate,
A filling step of expanding the curable resin interposed between the mold and the substrate by moving at least one of the mold and the substrate, and filling the cavity.
A curing step of curing the curable resin after the filling step,
In the filling step,
A method for producing a wafer lens, comprising: expanding the curable resin while controlling a spreading speed of the curable resin to be equal to or less than an initial speed. In the manufacturing method of the wafer lens according to claim 1,
In the filling step,
A method of manufacturing a wafer lens, wherein the spreading speed is maintained at an initial speed. In the manufacturing method of the wafer lens of Claim 1 or 2,
In the filling step,
A method for manufacturing a wafer lens, comprising: expanding a curable resin until an edge of the curable resin is detected at a predetermined position in a gap between the mold and the substrate.   A wafer lens manufactured by the method for manufacturing a wafer lens according to claim 1. A wafer lens manufacturing apparatus that includes a mold having a concave cavity, cures a curable resin between the mold and the substrate, and manufactures a wafer lens having a lens portion provided on the substrate. And
A moving device for expanding the curable resin interposed between the mold and the substrate by moving at least one of the mold and the substrate, and filling the cavity.
A curing device for curing the curable resin,
The mobile device is
An apparatus for manufacturing a wafer lens, wherein the curable resin is pushed and expanded while controlling a spreading speed of the curable resin to be equal to or less than an initial speed. The wafer lens manufacturing apparatus according to claim 5,
The mobile device is
An apparatus for manufacturing a wafer lens, wherein the spreading speed is maintained at an initial speed. In the wafer lens manufacturing apparatus according to claim 5 or 6,
An edge sensor that detects an edge of the curable resin at a predetermined position in a gap between the mold and the substrate;
The mobile device is
The wafer lens manufacturing apparatus, wherein the curable resin is expanded until the edge sensor detects an edge of the curable resin.

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