JP4671725B2 - Manufacturing method of mold for molding - Google Patents

Manufacturing method of mold for molding Download PDF

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JP4671725B2
JP4671725B2 JP2005080006A JP2005080006A JP4671725B2 JP 4671725 B2 JP4671725 B2 JP 4671725B2 JP 2005080006 A JP2005080006 A JP 2005080006A JP 2005080006 A JP2005080006 A JP 2005080006A JP 4671725 B2 JP4671725 B2 JP 4671725B2
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mold
mold base
base
main body
substrate
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JP2006256255A (en
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正人 中濱
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Olympus Corp
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本発明は、成形用型の製造方法に関し、特に型基材に型本体を埋没させて両者を一体的に固定した成形用型の製造方法に関する。 The present invention relates to a method for producing a mold, a method for manufacturing a mold in which it is fixed integrally to each other by particular bury mold body to the mold base material.

例えば、転写面として半球部を有するものを成形する成形用型は、半球部と該半球部から続く平面部とから構成されるが、従来は、この半球部と平面部との接続部分を、型製作時にグラインダ等を用いた研削加工により仕上げていた。しかし、このような複雑な曲面形状を有する部分の研削加工は困難であるため、完成した成形用型によって得られた成形品は、必ずしも十分な要求精度・機能を備えたものではなかった。この点に鑑み、複雑な部分の形状であっても、良好な曲面形状が得られるような成形用型として、例えば異なる複数の型部材を一体的に固定して成形用型を作成する技術が提案されている。   For example, a molding die that molds a transfer surface having a hemispherical part is composed of a hemispherical part and a flat part continuing from the hemispherical part. Finished by grinding using a grinder or the like during mold production. However, since it is difficult to grind the part having such a complicated curved surface shape, the molded product obtained by the completed molding die does not necessarily have sufficient required accuracy and function. In view of this point, there is a technique for creating a molding die by integrally fixing a plurality of different molding members, for example, as a molding die capable of obtaining a favorable curved surface shape even in the case of a complicated portion. Proposed.

すなわち、特許文献1には、研磨加工等により全球面を鏡面加工された炭化タングステン(WC)製等の球体を、この球体と同じ曲率半径にて凹形状に形成された受け型に載置し、この受け型の中心軸上に、例えば球体を吸引する吸入部を設け、更に、受け型に載置された球体を、吸入部を介して真空吸引することで受け型上に保持する旨が開示されている。この特許文献1によれば、球体の表面にはキズが入る余地はなくなり、球体のいずれの部分も転写面として使用できるというものである。
特開平11−199248号公報(第2−3頁、図1)
That is, in Patent Document 1, a sphere made of tungsten carbide (WC) whose mirror surface is mirror-finished by polishing or the like is placed on a receiving mold formed in a concave shape with the same radius of curvature as the sphere. For example, a suction part for sucking a sphere is provided on the central axis of the receiving mold, and the sphere placed on the receiving mold is held on the receiving mold by vacuum suction through the suction part. It is disclosed. According to Patent Document 1, there is no room for scratches on the surface of the sphere, and any part of the sphere can be used as a transfer surface.
JP-A-11-199248 (page 2-3, FIG. 1)

しかしながら、前述した特許文献1の技術によれば、受け型に球体を真空吸引して保持したり、その他、受け型に球体をホルダーにて機械的に固定する手段が記載されているが、いずれの手段においても、受け型と球体とがわずかでも形状が一致しない場合は、受け型と球体との間に隙間が生じ、これによって球体が受け型上で回転したり、又は球体が位置ずれを起こしてしまう等の課題があった。そして、このように、球体が受け型上で回転したり位置ずれを起こしたりすると、球体に傷が付いたり転写面の形状が変化したりして、均質な成形品を得ることができなかった。   However, according to the technique of Patent Document 1 described above, there is described means for holding the sphere by vacuum suction to the receiving mold or mechanically fixing the sphere to the receiving mold with a holder. Even if the shape of the receiving mold and the sphere does not coincide with each other even in the above means, a gap is formed between the receiving mold and the sphere, which causes the sphere to rotate on the receiving mold or the sphere to be displaced. There were issues such as waking up. As described above, when the sphere rotates on the receiving mold or is displaced, the sphere is scratched or the shape of the transfer surface is changed, so that a uniform molded product cannot be obtained. .

本発明は、斯かる課題を解決するためになされたもので、その目的とするところは、異なる複数の型部材を一体的に固定することで、複雑な形状を有する成形品を高精度で成形することのできる成形用型の製造方法を提供することにある。 The present invention has been made to solve such a problem, and an object of the present invention is to form a molded product having a complicated shape with high accuracy by integrally fixing a plurality of different mold members. It is to provide a method of manufacturing a mold which can be.

前記目的を達成するため、本発明の成形用型の製造方法は、成形品素材よりも可塑状態となる温度が高い型基材を配置する工程と、
前記型基材が可塑状態となる温度域では可塑状態とならない素材から成り、かつ加工されてその一部が転写面となる型本体を前記型基材上に載置する工程と、
前記型基材を加熱する工程と、
前記型基材の中心軸と前記型本体の中心軸とを一致させるようにして、前記型本体を前記型基材側に加圧する加圧工程と、
前記型本体を前記型基材内に埋没させ、その状態で冷却し、前記型本体と前記型基材とを一体的に固定する工程と、を備える。
In order to achieve the above object, the method for producing a molding die of the present invention includes a step of disposing a mold base having a higher temperature at which it becomes a plastic state than the molded article material,
Placing the mold body on the mold substrate, which is made of a material that does not become a plastic state in a temperature range in which the mold substrate is in a plastic state, and which is processed and a part thereof becomes a transfer surface;
Heating the mold substrate;
A pressurizing step of pressurizing the mold main body toward the mold base so that the central axis of the mold base coincides with the central axis of the mold main body;
Immersing the mold body in the mold substrate, cooling the mold body in that state, and fixing the mold body and the mold substrate integrally.

上記の成形用型の製造方法において、成形品素材よりも可塑状態となる温度が高い型基材を配置する工程と、
前記型基材が可塑状態となる温度域では可塑状態とならない素材から成り、かつ加工されてその一部が転写面となる型本体を前記型基材上に載置する工程と、
前記型基材を加熱する工程と、
前記型基材の中心軸と前記型本体の中心軸とを一致させるようにして、前記型本体を前記型基材側に加圧する加圧工程と、
前記型本体を前記型基材内に埋没させ、その状態で前記型基材に紫外線を照射して該型基材を硬化させ、前記型本体と前記型基材とを一体的に固定する工程と、を備える。
In the manufacturing method of the mold described above, a step of disposing a mold base having a higher temperature that becomes a plastic state than the molded article material, and
Placing the mold body on the mold substrate, which is made of a material that does not become a plastic state in a temperature range in which the mold substrate is in a plastic state, and which is processed and a part thereof becomes a transfer surface;
Heating the mold substrate;
A pressurizing step of pressurizing the mold main body toward the mold base so that the central axis of the mold base coincides with the central axis of the mold main body;
The step of burying the mold main body in the mold base material, irradiating the mold base material with ultraviolet rays to cure the mold base material, and fixing the mold main body and the mold base material integrally. And comprising.

上記の成形用型の製造方法において、成形品素材よりも可塑状態となる温度が高い型基材を配置する工程と、
前記型基材が可塑状態となる温度域では可塑状態とならない素材から成り、かつ加工されてその一部が転写面となる型本体を前記型基材上に載置する工程と、
前記型基材を加熱する工程と、
前記型基材の中心軸と前記型本体の中心軸とを一致させるようにして、前記型本体を前記型基材側に加圧する加圧工程と、
前記型本体を前記型基材内に埋没させ、その状態で冷却し、前記型本体と前記型基材とを一体的に固定する工程と、
前記型本体と前記型基材とを一体化した後に、前記型基材の上方から可塑性素材を前記型本体の周囲との間に隙間のないように密着させて一体的に固定する工程と、を備える。
In the manufacturing method of the mold described above, a step of disposing a mold base having a higher temperature that becomes a plastic state than the molded article material, and
Placing the mold body on the mold substrate, which is made of a material that does not become a plastic state in a temperature range in which the mold substrate is in a plastic state, and which is processed and a part thereof becomes a transfer surface;
Heating the mold substrate;
A pressurizing step of pressurizing the mold main body toward the mold base so that the central axis of the mold base coincides with the central axis of the mold main body;
Immersing the mold body in the mold substrate, cooling in that state, and integrally fixing the mold body and the mold substrate;
After the mold body and the mold base are integrated, a step of fixing the plastic material from above the mold base so that there is no gap between the mold base and the mold base; Is provided.

た、上記の成形用型の製造方法において、前記一体的に固定する工程は、前記型基材と前記型本体とを融着することにより行う。
Also, in the manufacturing method of the mold described above, the integrally affixing is carried out by fusing with the mold body and the mold base material.

上記の成形用型の製造方法において、前記一体的に固定する工程は、前記型基材と前記型本体とを接着剤又は固定具にて固定することにより行うThe method of manufacturing a mold of the said integrally affixing is carried out by fixing with an adhesive or fasteners and said mold body and the mold base material.

上記の成形用型の製造方法において、前記型本体と前記型基材とを一体固定した後に、前記型基材を加するThe method of manufacturing a mold of the above, after integrally fixing the said mold base and the mold body, which pressurized Engineering the mold base material.

上記の成形用型の製造方法において、前記型本体と前記型基材、及び前記可塑性素材を一体固定した後に、前記型基材を加工すThe method of manufacturing a mold of the said type substrate and the mold body, and after integrally fixing the plastic material, you pressurized Engineering the mold base material.

本発明によれば、型基材を配置する工程、型本体を前記型基材上に載置する工程、前記型基材を加熱する工程、前記型本体を前記型基材側に加圧する加圧工程、前記型本体と前記型基材とを一体的に固定する工程、等を備えるので、複雑な形状を有する成形用型を簡単に得ることができる。
According to the present invention, the step of placing the mold base, the step of placing the mold main body on the mold base, the step of heating the mold base, and the process of pressing the mold main body toward the mold base. pressure step, the mold body and a step of integrally fixing and the mold base material, since provided the like, can be obtained forming shape-type that have a complicated shape easily.

以下、図面に基づき本発明の実施の形態を説明する。
[第1の実施の形態]
図1乃至図5は、本実施の形態による成形用型の製造工程を示す図である。図1に示すように、成形品素材(例えば合成樹脂)よりも可塑状態となる温度が高い型基材(例えばガラス)1を、円筒状のスリーブ枠2内に配置し、更に、該スリーブ枠2の略中心軸上で型基材1の上面に、前記型基材1が可塑状態となる温度域では可塑状態とならない素材から成る型本体3を載置する。このとき、スリーブ枠2の中心軸C(型基材1の中心軸と略一致)と前記型本体3の中心軸Cとが略一致した状態となるようにする。そのためには、例えばスリーブ枠2内に型基材1を隙間のないように配置し、かつスリーブ枠2の略中心軸に一致するように型本体3を配置する。また、型本体3の素材としては、例えば炭化タングステン(WC)を主成分とする超硬合金やセラミックス等からなる鏡面加工例えば研磨加工された球体が用いられ、かつ、少なくとも光学面3a(図2参照)は研磨加工されている。
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[First Embodiment]
FIG. 1 to FIG. 5 are diagrams showing manufacturing steps of the molding die according to the present embodiment. As shown in FIG. 1, a mold base (for example, glass) 1 having a higher plasticity temperature than a molded article material (for example, synthetic resin) is disposed in a cylindrical sleeve frame 2, and the sleeve frame is further disposed. A mold main body 3 made of a material that does not become plastic in the temperature range where the mold base 1 becomes plastic is placed on the upper surface of the mold base 1 on a substantially central axis 2. At this time, the central axis C of the sleeve frame 2 (substantially coincident with the central axis of the mold base 1) and the central axis C of the mold body 3 are substantially coincident. For this purpose, for example, the mold base 1 is disposed in the sleeve frame 2 without any gaps, and the mold body 3 is disposed so as to coincide with the substantially central axis of the sleeve frame 2. Further, as the material of the mold body 3, for example, a mirror-finished sphere made of cemented carbide, ceramics, or the like mainly composed of tungsten carbide (WC) is used, and at least the optical surface 3a (FIG. 2). (See) is polished.

次いで、図2に示すように、型本体3の上方のスリーブ枠2内に、加圧部材4を上下に摺動自在に配置する。この加圧部材4には、型本体3との対面側に断面円形の逃げ穴5が形成されている。この逃げ穴5は、加圧部材4が型本体3の光学面(転写面)3aに接触しないようにして、傷を付けないようにするためのもので、逃げ穴5の中心線(図示せず)は、型本体3の中心線(図示せず)と略一致するように形成されている。この状態で、ヒータ6に通電して型基材1及び型本体3を加熱する。このときの加熱温度は、型基材1が可塑状態となるような温度まで加熱する。   Next, as shown in FIG. 2, a pressure member 4 is slidably arranged in the sleeve frame 2 above the mold body 3. The pressurizing member 4 is formed with a clearance hole 5 having a circular cross section on the side facing the mold body 3. The escape hole 5 is provided so that the pressure member 4 does not come into contact with the optical surface (transfer surface) 3a of the mold body 3 and is not scratched. Is formed so as to substantially coincide with a center line (not shown) of the mold body 3. In this state, the mold base 1 and the mold body 3 are heated by energizing the heater 6. The heating temperature at this time is heated to a temperature at which the mold substrate 1 is in a plastic state.

次に、加圧部材4を型基材1に対し接近する方向に若干摺動させ、加圧部材4の前記逃げ穴5を型本体3に当接させる。このとき、当初は型本体3の中心軸がスリーブ枠2の中心軸と若干変位した位置に載置されていたとしても、型本体3に当接する逃げ穴5の作用により、型本体3はスリーブ枠2の中心軸と略一致した位置に位置決めされる。この状態で、図3に示すように、加圧部材4が型本体3の光学面3aに接触しないように、該型本体3を型基材1側に所定圧で加圧し、加圧部材4の加圧面4a(図2参照)が型基材1の表面1a(図2参照)に密接した位置で停止させる。なお、加圧部材4の摺動量は図示しないモータ等により精密な精度で制御されている。   Next, the pressure member 4 is slightly slid in the direction approaching the mold base 1, and the relief hole 5 of the pressure member 4 is brought into contact with the mold body 3. At this time, even if the central axis of the mold main body 3 is initially placed at a position slightly displaced from the central axis of the sleeve frame 2, the mold main body 3 becomes the sleeve by the action of the escape hole 5 contacting the mold main body 3. It is positioned at a position substantially coincident with the central axis of the frame 2. In this state, as shown in FIG. 3, the mold body 3 is pressurized to the mold substrate 1 side with a predetermined pressure so that the pressure member 4 does not contact the optical surface 3 a of the mold body 3. The pressing surface 4a (see FIG. 2) is stopped at a position close to the surface 1a (see FIG. 2) of the mold base 1. Note that the sliding amount of the pressure member 4 is controlled with high precision by a motor or the like (not shown).

この図3の状態では、型本体3の型基材1に対面する側の一部(光学面3aを除く部分)が、可塑状態となっている型基材1内に埋没し、型基材1内に形成された保持部9に隙間のないように保持される。なお、型基材1が完全に溶融した状態では、型本体3が自重で型基材1内に落下してしまうので、ある程度粘性が残る状態まで型基材1の加熱を行う。この状態で、ヒータ6への通電を停止し、型本体3及び型基材1を冷却して、型本体3を型基材1に融着させて一体的に固定する。これにより、型本体3と型基材1との間に隙間が生じることはなく、両者が強固に結合される。よって、型本体3が、型基材1の前記保持部9内で回転したり位置ずれを起こしたりすることはない。なお、型本体3と型基材1とは融着により固定される他、接着剤やネジ等の固定具により固定することもできる。   In the state of FIG. 3, a part of the mold body 3 on the side facing the mold base 1 (a part excluding the optical surface 3 a) is buried in the mold base 1 in a plastic state, 1 is held in a holding portion 9 formed in 1 so that there is no gap. In the state where the mold base 1 is completely melted, the mold main body 3 falls into the mold base 1 by its own weight, so that the mold base 1 is heated until a certain degree of viscosity remains. In this state, energization to the heater 6 is stopped, the mold main body 3 and the mold base 1 are cooled, and the mold main body 3 is fused to the mold base 1 and fixed integrally. As a result, there is no gap between the mold body 3 and the mold substrate 1, and the two are firmly bonded. Therefore, the mold body 3 does not rotate or cause a position shift within the holding portion 9 of the mold base 1. The mold body 3 and the mold substrate 1 can be fixed by fusion, or can be fixed by a fixture such as an adhesive or a screw.

次いで、図4に示すように、一体化された型本体3及び型基材1から成る成形用型10をスリーブ枠2から取り出す。こうして得られた成形用型10は、球状の型本体3と型基材1との接続部分の複雑な形状を正確に表現しており、よってこの部分を研削等により仕上げ加工をする必要はない。なお、成形用型10の表面に形成される光学面(転写面)13は、離型又は酸化防止等を目的として、例えば、Ni,C,Cr,Pt,Ir,Ti,B,Nのいずれか1つを含む物質からなる膜によってコーティングされている。また、成形用型10は、スリーブ枠2から取り出された後、型本体3の中心Cを基準線として型基材1の端面1bが所定の精度に加工されて仕上げられる。   Next, as shown in FIG. 4, the molding die 10 composed of the integrated die body 3 and the die base material 1 is taken out from the sleeve frame 2. The molding die 10 thus obtained accurately represents the complicated shape of the connection portion between the spherical die body 3 and the die base material 1, and therefore it is not necessary to finish this portion by grinding or the like. . The optical surface (transfer surface) 13 formed on the surface of the molding die 10 is, for example, any of Ni, C, Cr, Pt, Ir, Ti, B, and N for the purpose of mold release or oxidation prevention. It is coated with a film made of a substance containing one of them. Further, after the mold 10 is taken out from the sleeve frame 2, the end surface 1b of the mold base 1 is processed with a predetermined accuracy and finished with the center C of the mold body 3 as a reference line.

図5は、前述により得られた成形用型10を用いて、成形品素材(例えば合成樹脂)14a(図5参照)を成形する方法を示す図である。同図に示すように、成形用型10を上型及び下型とし、これら上型及び下型をスリーブ型12内に摺動自在に配置し、上型と下型の間に成形品素材14aを配置する。次に、図6に示すように、図示しないヒータで成形品素材14aを可塑状態となる温度まで加熱し、続いて、例えば下型に対し上型を接近する方向に摺動させれば、成形品(例えば光学素子)14が成形される。
[第2の実施の形態]
この実施の形態では、前述と同様に、図7において、成形品素材(例えば合成樹脂)よりも可塑状態となる温度が高い型基材21をスリーブ枠22内に配置し、更に、型基材21の上面に、型基材21が可塑状態となる温度域では可塑状態とならない素材(WC等)から成る型本体23を載置する。なお、この実施の形態では、型基材21として紫外線硬化型の合成樹脂を用いている。また、スリーブ枠22は紫外線を透過する部材で構成されている。
FIG. 5 is a diagram showing a method of molding a molded product material (for example, synthetic resin) 14a (see FIG. 5) using the molding die 10 obtained as described above. As shown in the figure, the molding die 10 is an upper die and a lower die, the upper die and the lower die are slidably disposed in the sleeve die 12, and a molded product material 14a is interposed between the upper die and the lower die. Place. Next, as shown in FIG. 6, if the molded article material 14a is heated to a temperature at which it becomes a plastic state with a heater (not shown), and then, for example, the upper mold is slid in the direction approaching the lower mold, A product (for example, an optical element) 14 is formed.
[Second Embodiment]
In this embodiment, in the same manner as described above, in FIG. 7, the mold base 21 having a higher temperature in a plastic state than the molded product material (for example, synthetic resin) is disposed in the sleeve frame 22, and further, the mold base A mold body 23 made of a material (such as WC) that does not become plastic in the temperature range where the mold base 21 becomes plastic is placed on the upper surface of 21. In this embodiment, an ultraviolet curable synthetic resin is used as the mold base 21. The sleeve frame 22 is made of a member that transmits ultraviolet rays.

次いで、型本体23の上方のスリーブ枠22内に、加圧部材24を上下に摺動自在に配置する。この加圧部材24には、前述と同様に、型本体23との対面側に、加圧部材24が型本体23の光学面(転写面)23aに接触しないように断面円形の逃げ穴25が形成されている。また、この逃げ穴25の中心線(図示せず)は、スリーブ枠22の中心線(図示せず)と略一致するように形成されている。この状態で、ヒータ26に通電して型基材21及び型本体23を加熱する。このときの加熱温度は、型基材21が可塑状態となるような温度にまで加熱する。   Next, the pressurizing member 24 is slidably arranged in the sleeve frame 22 above the mold body 23. In the same manner as described above, the pressing member 24 has a clearance hole 25 having a circular cross section on the side facing the mold body 23 so that the pressing member 24 does not contact the optical surface (transfer surface) 23a of the mold body 23. Is formed. The center line (not shown) of the escape hole 25 is formed so as to substantially coincide with the center line (not shown) of the sleeve frame 22. In this state, the heater 26 is energized to heat the mold base 21 and the mold body 23. The heating temperature at this time is heated to a temperature at which the mold base 21 is in a plastic state.

次いで、図8に示すように、加圧部材24を型基材21に対し接近する方向に摺動させ、加圧部材24の逃げ穴25を型本体23に当接させて、型本体23をスリーブ枠22の中心軸と略一致した位置に位置決めする。この状態で、加圧部材24が型本体23の光学面23aに接触しないように、該型本体23を型基材21側に所定圧で加圧し、加圧部材24の加圧面24a(図7参照)が型基材21の表面に密接した位置で停止させるようにする。この状態では、型本体23の型基材21に対面する側の一部(光学面23aを除く部分)が、可塑状態となっている型基材21内に埋没し、型基材21内に形成された保持部29に隙間のないように保持される。但し、型基材21が完全に溶融した状態では、型本体23が自重で型基材21内に落下してしまうので、ある程度粘性が残る状態まで型基材21の加熱を行う。   Next, as shown in FIG. 8, the pressure member 24 is slid in the direction approaching the mold base 21, the relief hole 25 of the pressure member 24 is brought into contact with the mold body 23, and the mold body 23 is moved. Positioning is performed at a position substantially coincident with the central axis of the sleeve frame 22. In this state, the mold body 23 is pressurized with a predetermined pressure toward the mold base 21 so that the pressure member 24 does not contact the optical surface 23a of the mold body 23, and the pressure surface 24a of the pressure member 24 (FIG. 7). Reference) is stopped at a position close to the surface of the mold base 21. In this state, a part of the mold body 23 on the side facing the mold base 21 (a part excluding the optical surface 23a) is buried in the mold base 21 in a plastic state, and is embedded in the mold base 21. The formed holding portion 29 is held so that there is no gap. However, in a state where the mold base 21 is completely melted, the mold main body 23 falls into the mold base 21 due to its own weight. Therefore, the mold base 21 is heated until a certain degree of viscosity remains.

次に、紫外線ランプ27を点灯させて型基材21に向けて紫外線を照射する。この型基材21は、紫外線硬化型の合成樹脂であるので型基材21は硬化し、型基材21と型本体23とが一体的に固定される。この場合も、型本体23と型基材21とを融着により固定する他、接着剤やネジ等の固定具により固定することもできる。こうして、図4に示した成形用型10と同様の成形用型が得られる。
[第3の実施の形態]
この実施の形態では、図9において、前述した工程により、型基材31と型本体33とを一体的に固定して成形用型30を成形した後、更に、型基材31の上方から所定厚さの可塑性素材38を、型本体33の周囲との間に隙間のないように密着させて一体的に固定するものである。そのために、成形用型30における型基材31の上面に、可塑性素材38を配置し、図示しないヒータでこの可塑性素材38が可塑状態になる温度まで加熱する。このとき、可塑性素材38の素材として、該可塑性素材38が可塑状態となる温度域では型基材31が可塑状態とならないような素材を用いるのが好ましい。次に、加圧部材34を型基材31に対し接近する方向に摺動させ、加圧部材34の加圧面34aを可塑性素材38に密接させ、その後に冷却する。すると、図10に示すような成形用型130が得られる。最後に、成形用型130は、型本体33の中心Cを基準線として型基材31の端面36が所定の精度に加工されて仕上げられる。
Next, the ultraviolet lamp 27 is turned on to irradiate the mold substrate 21 with ultraviolet rays. Since the mold base 21 is an ultraviolet curable synthetic resin, the mold base 21 is cured, and the mold base 21 and the mold body 23 are integrally fixed. In this case as well, the mold body 23 and the mold base 21 can be fixed by fusion, or can be fixed by a fixture such as an adhesive or a screw. In this way, a molding die similar to the molding die 10 shown in FIG. 4 is obtained.
[Third Embodiment]
In this embodiment, in FIG. 9, the mold base 31 and the mold body 33 are integrally fixed and the molding die 30 is molded by the above-described process. A plastic material 38 having a thickness is brought into close contact with the periphery of the mold body 33 so as not to have a gap, and is integrally fixed. For this purpose, a plastic material 38 is disposed on the upper surface of the mold base 31 in the mold 30 and heated to a temperature at which the plastic material 38 is in a plastic state by a heater (not shown). At this time, as the material of the plastic material 38, it is preferable to use a material that does not cause the mold base 31 to be in a plastic state in a temperature range in which the plastic material 38 is in a plastic state. Next, the pressure member 34 is slid in the direction approaching the mold base 31, the pressure surface 34 a of the pressure member 34 is brought into close contact with the plastic material 38, and then cooled. Then, a molding die 130 as shown in FIG. 10 is obtained. Finally, the mold 130 is finished by processing the end surface 36 of the mold base 31 with a predetermined accuracy with the center C of the mold body 33 as a reference line.

本実施の形態によれば、図11に示すように、若しも、型基材31と型本体33との間に、冷却時のひけ等により空隙部39が生じることがあったとしても、表面の光学面(転写面)37には何ら影響がなく、型としての性能に影響は生じない。なお、可塑性素材38と成形用型30とは、融着により固定される他、接着剤やネジ等の固定具により固定することもできる。このような工程により、複雑な形状の成形用型をも簡単に得ることができる。
[第4の実施の形態]
この実施の形態では、図12に示すように、成形品素材(例えば合成樹脂)よりも可塑状態となる温度が高い型基材(例えばガラス)41を、スリーブ枠42内に配置し、更に、該スリーブ枠42の略中心軸上でかつ型基材41の上面に、前記型基材41が可塑状態となる温度域では可塑状態とならない素材から成る載頭円錐状の型本体43を載置する。この型本体3は、炭化タングステン(WC)を主成分とする超硬合金やセラミックスからなり、載頭円錐状の部分の表面は研磨加工されている。
According to the present embodiment, as shown in FIG. 11, even if a gap 39 may be generated between the mold base 31 and the mold body 33 due to sink marks or the like during cooling, The surface optical surface (transfer surface) 37 is not affected at all, and the performance as a mold is not affected. In addition, the plastic material 38 and the mold 30 can be fixed by fusion, or can be fixed by a fixing tool such as an adhesive or a screw. By such a process, a molding die having a complicated shape can be easily obtained.
[Fourth Embodiment]
In this embodiment, as shown in FIG. 12, a mold base material (for example, glass) 41 having a higher plastic state than a molded article material (for example, synthetic resin) is disposed in the sleeve frame 42, and A conical die main body 43 made of a material that does not become a plastic state in a temperature range where the die base material 41 is in a plastic state is placed on a substantially central axis of the sleeve frame 42 and on the upper surface of the die base material 41. To do. The mold body 3 is made of a cemented carbide or ceramics mainly composed of tungsten carbide (WC), and the surface of the top cone portion is polished.

次いで、型本体43の上方のスリーブ枠42内に、加圧部材44を上下方向に摺動自在に配置する。前述と同様に、この加圧部材44には、型本体43との対面側に、加圧部材44が型本体43の光学面(転写面)43aに接触しないように断面円形の逃げ穴45が形成されている。この逃げ穴45の中心線は、スリーブ枠42の中心線と略一致するように形成されている。この状態で、図示しないヒータに通電して型基材41及び型本体43を加熱する。このときの加熱温度は、型基材41が可塑状態となるような温度まで加熱する。   Next, the pressure member 44 is slidably arranged in the vertical direction in the sleeve frame 42 above the mold body 43. As described above, the pressure member 44 has a clearance hole 45 having a circular cross section on the side facing the mold body 43 so that the pressure member 44 does not contact the optical surface (transfer surface) 43 a of the mold body 43. Is formed. The center line of the escape hole 45 is formed so as to substantially coincide with the center line of the sleeve frame 42. In this state, the mold base 41 and the mold body 43 are heated by energizing a heater (not shown). The heating temperature at this time is heated to a temperature at which the mold base 41 is in a plastic state.

次に、加圧部材44を型基材41に対し接近する方向に摺動させ、加圧部材44の前記逃げ穴45を型本体43に当接させる。この状態で、加圧部材44が型本体43の光学面43aに接触しないように、該型本体43を型基材41側に所定圧で加圧し、型本体43の型基材41に対面する側を、可塑状態となっている型基材41内に埋没させる。更に、型本体43の底面がスリーブ枠42の底面に当接した位置で、加圧部材44による加圧を停止させる。   Next, the pressure member 44 is slid in the direction approaching the mold base 41, and the relief hole 45 of the pressure member 44 is brought into contact with the mold body 43. In this state, the mold body 43 is pressed to the mold base 41 side with a predetermined pressure so as not to contact the optical surface 43 a of the mold body 43, and faces the mold base 41 of the mold body 43. The side is buried in the mold base 41 in a plastic state. Further, the pressurization by the pressurizing member 44 is stopped at the position where the bottom surface of the mold main body 43 is in contact with the bottom surface of the sleeve frame 42.

なお、型基材41が完全に溶融した状態では、型本体43が自重で型基材41内に落下してしまうので、ある程度粘性が残る状態まで型基材41の加熱を行う。この状態で、ヒータ(不図示)への通電を停止し、型本体43と型基材41を冷却して、この型本体43を型基材41に融着させて一体的に固定する。この場合、型基材41と型本体43とは、融着により固定される他、接着剤やネジ等の固定具により固定することもできる。次いで、図13に示すように、一体化された型本体43と型基材41から成る成形用型40をスリーブ枠42から取り出す。更に、この成形用型40は、型本体43の中心Cを基準線として型基材41の端面46が所定の精度に加工されて仕上げられる。
[第5の実施の形態]
図14は、前述した実施の形態の変形例であり、この実施の形態では、スリーブ枠52の略中心軸上でかつ型基材51の上面に、底部側にアンカー55を有する載頭円錐状の型本体53を載置する。そして、前記と同様に、図示しないヒータに通電して型基材51及び型本体53を加熱し、次に、加圧部材54を型基材51に対し接近する方向に摺動させ、加圧部材54が型本体53の光学面(転写面)53aに接触しないように、該型本体53を型基材51側に所定圧で加圧する。そして、型本体53の底面がスリーブ枠52の底面に当接した位置で、加圧部材54による加圧を停止させる。この状態で、ヒータ(不図示)への通電を停止し、型本体53と型基材51を冷却して、この型本体53を型基材51に融着させて一体的に固定する。この場合も、型基材51と型本体53とは、融着により固定される他、接着剤やネジ等の固定具により固定することもできる。
In the state where the mold base 41 is completely melted, the mold main body 43 falls into the mold base 41 due to its own weight. Therefore, the mold base 41 is heated until a certain degree of viscosity remains. In this state, energization to the heater (not shown) is stopped, the mold main body 43 and the mold base 41 are cooled, and the mold main body 43 is fused to the mold base 41 and fixed integrally. In this case, the mold base 41 and the mold main body 43 can be fixed by fusion, or can be fixed by a fixture such as an adhesive or a screw. Next, as shown in FIG. 13, the molding die 40 composed of the integrated die body 43 and the die base material 41 is taken out from the sleeve frame 42. Further, the mold 40 is finished by processing the end surface 46 of the mold base 41 with a predetermined accuracy with the center C of the mold body 43 as a reference line.
[Fifth Embodiment]
FIG. 14 is a modified example of the above-described embodiment. In this embodiment, a conical cone shape having an anchor 55 on the bottom side and on the upper surface of the mold base 51 on the substantially central axis of the sleeve frame 52. The mold body 53 is placed. Then, in the same manner as described above, a heater (not shown) is energized to heat the mold base 51 and the mold main body 53, and then the pressure member 54 is slid in a direction approaching the mold base 51 to apply pressure. The mold body 53 is pressed to the mold base 51 side with a predetermined pressure so that the member 54 does not contact the optical surface (transfer surface) 53 a of the mold body 53. Then, the pressurization by the pressurizing member 54 is stopped at the position where the bottom surface of the mold body 53 is in contact with the bottom surface of the sleeve frame 52. In this state, energization to the heater (not shown) is stopped, the mold main body 53 and the mold base 51 are cooled, and the mold main body 53 is fused to the mold base 51 and fixed integrally. Also in this case, the mold base 51 and the mold main body 53 can be fixed by fusion, or can be fixed by a fixture such as an adhesive or a screw.

次いで、図15に示すように、一体化された型本体53と型基材51から成る成形用型50をスリーブ枠52から取り出す。更に、この成形用型50は、型本体53の中心Cを基準線として型基材51の端面56が加工されて仕上げられる。この実施の形態によれば、型本体53はアンカー55を有しているので、成形後に型基材51から型本体53が容易に離脱することはない。   Next, as shown in FIG. 15, the molding die 50 composed of the integrated die body 53 and the die base material 51 is taken out from the sleeve frame 52. Further, the mold 50 is finished by processing the end surface 56 of the mold base 51 with the center C of the mold body 53 as a reference line. According to this embodiment, since the mold body 53 has the anchor 55, the mold body 53 is not easily detached from the mold substrate 51 after molding.

スリーブ枠内に型基材を配置した工程を示す図である(第1の実施の形態)。It is a figure which shows the process which has arrange | positioned the mold base material in a sleeve frame (1st Embodiment). 型基材上に型本体を載置した工程を示す図である(第1の実施の形態)。It is a figure which shows the process which mounted the type | mold main body on the type | mold base material (1st Embodiment). 型本体を型基材側に加圧した工程を示す図である(第1の実施の形態)。It is a figure which shows the process which pressurized the type | mold main body to the type | mold base material side (1st Embodiment). 得られた成形用型を示す図である(第1の実施の形態)。It is a figure which shows the obtained shaping | molding die (1st Embodiment). 成形用型により成形品素材を成形する状態を示す図である(第1の実施の形態)。It is a figure which shows the state which shape | molds a molded article raw material with the shaping | molding die (1st Embodiment). 成形用型により成形品素材を成形する状態を示す図である(第1の実施の形態)。It is a figure which shows the state which shape | molds a molded article raw material with the shaping | molding die (1st Embodiment). 型基材上に型本体を載置した工程を示す図である(第2の実施の形態)。It is a figure which shows the process which mounted the type | mold main body on the type | mold base material (2nd Embodiment). 型本体を型基材側に加圧した工程を示す図である(第2の実施の形態)。It is a figure which shows the process which pressurized the type | mold main body to the type | mold base material side (2nd Embodiment). 型基材上に型本体を載置した工程を示す図である(第3の実施の形態)。It is a figure which shows the process which mounted the type | mold main body on the type | mold base material (3rd Embodiment). 得られた成形用型を示す図である(第3の実施の形態)。It is a figure which shows the obtained shaping | molding die (3rd Embodiment). 得られた成形用型を示す図である(第3の実施の形態)。It is a figure which shows the obtained shaping | molding die (3rd Embodiment). 型基材上に型本体を載置した工程を示す図である(第4の実施の形態)。It is a figure which shows the process which mounted the type | mold main body on the type | mold base material (4th Embodiment). 得られた成形用型を示す図である(第4の実施の形態)。It is a figure which shows the obtained shaping | molding die (4th Embodiment). 型基材上に型本体を載置した工程を示す図である(第5の実施の形態)。It is a figure which shows the process which mounted the type | mold main body on the type | mold base material (5th Embodiment). 得られた成形用型を示す図である(第5の実施の形態)。It is a figure which shows the obtained shaping | molding die (5th Embodiment).

符号の説明Explanation of symbols

1 型基材
1b 端面
2 スリーブ枠
3 型本体
3a 光学面
4 加圧部材
9 保持部
10 成形用型
14 成形品
14a 光学素子素材
21 型基材
22 スリーブ枠
23 型本体
23a 光学面
24 加圧部材
27 紫外線ランプ
29 保持部
30 成形用型
31 型基材
33 型本体
36 端面
39 保持部
40 成形用型
41 型基材
42 スリーブ枠
43 型本体
43a 光学面
46 端面
50 成形用型
51 型基材
52 スリーブ枠
53 型本体
53a 光学面
56 端面

DESCRIPTION OF SYMBOLS 1 Type | mold base material 1b End surface 2 Sleeve frame 3 Type | mold main body 3a Optical surface 4 Pressing member 9 Holding | maintenance part 10 Molding die 14 Molded product 14a Optical element material 21 Mold base material 22 Sleeve frame 23 Mold main body 23a Optical surface 24 Pressure member 27 Ultraviolet lamp 29 Holding part 30 Molding die 31 Mold base 33 Mold body 36 End face 39 Holding part 40 Molding mold 41 Mold base 42 Sleeve frame 43 Mold body 43a Optical surface 46 End face 50 Molding die 51 Mold base 52 Sleeve frame 53 Mold body 53a Optical surface 56 End surface

Claims (7)

成形品素材よりも可塑状態となる温度が高い型基材を配置する工程と、
前記型基材が可塑状態となる温度域では可塑状態とならない素材から成り、かつ加工されてその一部が転写面となる型本体を前記型基材上に載置する工程と、
前記型基材を加熱する工程と、
前記型基材の中心軸と前記型本体の中心軸とを一致させるようにして、前記型本体を前記型基材側に加圧する加圧工程と、
前記型本体を前記型基材内に埋没させ、その状態で冷却し、前記型本体と前記型基材とを一体的に固定する工程と、を備える、成形用型の製造方法。
A step of arranging a mold base having a higher temperature than the molded article material to be in a plastic state;
Placing the mold body on the mold substrate, which is made of a material that does not become a plastic state in a temperature range in which the mold substrate is in a plastic state, and which is processed and a part thereof becomes a transfer surface;
Heating the mold substrate;
A pressurizing step of pressurizing the mold main body toward the mold base so that the central axis of the mold base coincides with the central axis of the mold main body;
The mold body is embedded in the mold base material, cooled in that state, and integrally fixed to the mold body and the mold base material.
成形品素材よりも可塑状態となる温度が高い型基材を配置する工程と、
前記型基材が可塑状態となる温度域では可塑状態とならない素材から成り、かつ加工されてその一部が転写面となる型本体を前記型基材上に載置する工程と、
前記型基材を加熱する工程と、
前記型基材の中心軸と前記型本体の中心軸とを一致させるようにして、前記型本体を前記型基材側に加圧する加圧工程と、
前記型本体を前記型基材内に埋没させ、その状態で前記型基材に紫外線を照射して該型基材を硬化させ、前記型本体と前記型基材とを一体的に固定する工程と、を備える、成形用型の製造方法。
A step of arranging a mold base having a higher temperature than the molded article material to be in a plastic state;
Placing the mold body on the mold substrate, which is made of a material that does not become a plastic state in a temperature range in which the mold substrate is in a plastic state, and which is processed and a part thereof becomes a transfer surface;
Heating the mold substrate;
A pressurizing step of pressurizing the mold main body toward the mold base so that the central axis of the mold base coincides with the central axis of the mold main body;
The step of burying the mold main body in the mold base material, irradiating the mold base material with ultraviolet rays to cure the mold base material, and fixing the mold main body and the mold base material integrally. And a method for producing a molding die.
成形品素材よりも可塑状態となる温度が高い型基材を配置する工程と、
前記型基材が可塑状態となる温度域では可塑状態とならない素材から成り、かつ加工されてその一部が転写面となる型本体を前記型基材上に載置する工程と、
前記型基材を加熱する工程と、
前記型基材の中心軸と前記型本体の中心軸とを一致させるようにして、前記型本体を前記型基材側に加圧する加圧工程と、
前記型本体を前記型基材内に埋没させ、その状態で冷却し、前記型本体と前記型基材とを一体的に固定する工程と、
前記型本体と前記型基材とを一体化した後に、前記型基材の上方から可塑性素材を前記型本体の周囲との間に隙間のないように密着させて一体的に固定する工程と、を備える、成形用型の製造方法。
A step of arranging a mold base having a higher temperature than the molded article material to be in a plastic state;
Placing the mold body on the mold substrate, which is made of a material that does not become a plastic state in a temperature range in which the mold substrate is in a plastic state, and which is processed and a part thereof becomes a transfer surface;
Heating the mold substrate;
A pressurizing step of pressurizing the mold main body toward the mold base so that the central axis of the mold base coincides with the central axis of the mold main body;
Immersing the mold body in the mold substrate, cooling in that state, and integrally fixing the mold body and the mold substrate;
After the mold body and the mold base are integrated, a step of fixing the plastic material from above the mold base so that there is no gap between the mold base and the mold base; The manufacturing method of the shaping | molding die provided with.
請求項1乃至のいずれかに記載の成形用型の製造方法において、
前記一体的に固定する工程は、前記型基材と前記型本体とを融着することにより行う、成形用型の製造方法。
In the manufacturing method of the shaping die according to any one of claims 1 to 3 ,
The method of manufacturing a molding die, wherein the integrally fixing step is performed by fusing the mold base and the mold body.
請求項1乃至のいずれかに記載の成形用型の製造方法において、
前記一体的に固定する工程は、前記型基材と前記型本体とを接着剤又は固定具にて固定することにより行う、成形用型の製造方法。
In the manufacturing method of the shaping die according to any one of claims 1 to 3 ,
The step of integrally fixing is a method for manufacturing a mold for molding, wherein the mold base and the mold main body are fixed with an adhesive or a fixture.
請求項1,2,4,5のいずれかに記載の成形用型の製造方法において、
前記型本体と前記型基材とを一体固定した後に、前記型基材を加工する、成形用型の製造方法。
In the manufacturing method of the shaping | molding die in any one of Claims 1, 2 , 4 , and 5 ,
A method for producing a mold for molding, wherein the mold base is processed after integrally fixing the mold body and the mold base.
請求項3に記載の成形用型の製造方法において、
前記型本体と前記型基材、及び前記可塑性素材を一体固定した後に、前記型基材を加工する、成形用型の製造方法。
In the manufacturing method of the shaping die according to claim 3,
A method for producing a mold for molding, wherein the mold base is processed after integrally fixing the mold body, the mold base, and the plastic material.
JP2005080006A 2005-03-18 2005-03-18 Manufacturing method of mold for molding Expired - Fee Related JP4671725B2 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6060136U (en) * 1983-10-01 1985-04-26 積水化学工業株式会社 Mold product ejection plate quick return device
JPS6394929U (en) * 1986-12-10 1988-06-18
JPH07149527A (en) * 1993-11-30 1995-06-13 Matsushita Electric Ind Co Ltd Mold for forming optical element
JPH11199248A (en) * 1998-01-19 1999-07-27 Olympus Optical Co Ltd Fixation of spherical mold of forming mold, and forming mold
JPH11277543A (en) * 1998-03-27 1999-10-12 Sharp Corp Production of mold for molding micro-lens array

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6060136U (en) * 1983-10-01 1985-04-26 積水化学工業株式会社 Mold product ejection plate quick return device
JPS6394929U (en) * 1986-12-10 1988-06-18
JPH07149527A (en) * 1993-11-30 1995-06-13 Matsushita Electric Ind Co Ltd Mold for forming optical element
JPH11199248A (en) * 1998-01-19 1999-07-27 Olympus Optical Co Ltd Fixation of spherical mold of forming mold, and forming mold
JPH11277543A (en) * 1998-03-27 1999-10-12 Sharp Corp Production of mold for molding micro-lens array

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