SG11201508809SA - Wafer container with latching mechanism for large diameter wafers - Google Patents

Wafer container with latching mechanism for large diameter wafers

Info

Publication number
SG11201508809SA
SG11201508809SA SG11201508809SA SG11201508809SA SG11201508809SA SG 11201508809S A SG11201508809S A SG 11201508809SA SG 11201508809S A SG11201508809S A SG 11201508809SA SG 11201508809S A SG11201508809S A SG 11201508809SA SG 11201508809S A SG11201508809S A SG 11201508809SA
Authority
SG
Singapore
Prior art keywords
large diameter
latching mechanism
wafer container
diameter wafers
wafers
Prior art date
Application number
SG11201508809SA
Other languages
English (en)
Inventor
Barry Gregerson
Matthew A Fuller
Original Assignee
Entegris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc filed Critical Entegris Inc
Publication of SG11201508809SA publication Critical patent/SG11201508809SA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D45/00—Clamping or other pressure-applying devices for securing or retaining closure members
    • B65D45/02—Clamping or other pressure-applying devices for securing or retaining closure members for applying axial pressure to engage closure with sealing surface
    • B65D45/16—Clips, hooks, or clamps which are removable, or which remain connected either with the closure or with the container when the container is open, e.g. C-shaped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67376—Closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Pivots And Pivotal Connections (AREA)
  • Packaging Frangible Articles (AREA)
SG11201508809SA 2013-04-26 2014-04-25 Wafer container with latching mechanism for large diameter wafers SG11201508809SA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361816576P 2013-04-26 2013-04-26
US201361818343P 2013-05-01 2013-05-01
PCT/US2014/035554 WO2014176558A1 (en) 2013-04-26 2014-04-25 Wafer container with latching mechanism for large diameter wafers

Publications (1)

Publication Number Publication Date
SG11201508809SA true SG11201508809SA (en) 2015-11-27

Family

ID=51788357

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201508809SA SG11201508809SA (en) 2013-04-26 2014-04-25 Wafer container with latching mechanism for large diameter wafers

Country Status (8)

Country Link
US (2) US10173812B2 (zh)
EP (1) EP2989657B1 (zh)
JP (1) JP6329252B2 (zh)
KR (1) KR102219534B1 (zh)
CN (1) CN105993067B (zh)
SG (1) SG11201508809SA (zh)
TW (1) TWI607935B (zh)
WO (1) WO2014176558A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014176558A1 (en) 2013-04-26 2014-10-30 Entegris, Inc. Wafer container with latching mechanism for large diameter wafers
WO2017205708A1 (en) 2016-05-26 2017-11-30 Entegris, Inc. Latching mechanism for a substrate container
CN109997217B (zh) * 2016-12-16 2023-10-31 恩特格里斯公司 配备具有两个凸轮轮廓的闩锁机构的衬底容器
DE102020119257A1 (de) * 2020-07-21 2022-01-27 Fritz Schäfer Gesellschaft Mit Beschränkter Haftung Deckel zum Verschließen eines Behälters sowie System aus einem Behälter und einem Deckel
TWI822366B (zh) * 2022-09-28 2023-11-11 家登精密工業股份有限公司 鎖附導正結構
TWI834526B (zh) * 2023-03-17 2024-03-01 中勤實業股份有限公司 容器門板及具有該容器門板之基板容器
CN116825689A (zh) * 2023-08-29 2023-09-29 芯岛新材料(浙江)有限公司 一种盒盖及具有其的晶圆盒

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US2660465A (en) * 1952-04-18 1953-11-24 Akron Hardware Mfg Corp Cabinet catch
GB912578A (en) * 1959-05-14 1962-12-12 Pye Ltd Machine for handling semiconductor material
US3191280A (en) * 1963-04-23 1965-06-29 Nat Transistor Mfg Company Apparatus for assembling semiconductor devices
US3695501A (en) * 1970-05-21 1972-10-03 Automated Equipment Corp Die bonder apparatus
US5740845A (en) 1995-07-07 1998-04-21 Asyst Technologies Sealable, transportable container having a breather assembly
USRE38221E1 (en) 1995-10-13 2003-08-19 Entegris, Inc. 300 mm microenvironment pod with door on side
US5915562A (en) 1996-07-12 1999-06-29 Fluoroware, Inc. Transport module with latching door
US5711427A (en) 1996-07-12 1998-01-27 Fluoroware, Inc. Wafer carrier with door
US5931512A (en) 1997-07-23 1999-08-03 Industrial Technology Research Institute Latch mechanism for wafer container
US5957292A (en) 1997-08-01 1999-09-28 Fluoroware, Inc. Wafer enclosure with door
US6160265A (en) 1998-07-13 2000-12-12 Kensington Laboratories, Inc. SMIF box cover hold down latch and box door latch actuating mechanism
JP3556480B2 (ja) 1998-08-17 2004-08-18 信越ポリマー株式会社 精密基板収納容器
US6082540A (en) 1999-01-06 2000-07-04 Fluoroware, Inc. Cushion system for wafer carriers
US6464081B2 (en) 1999-01-06 2002-10-15 Entegris, Inc. Door guide for a wafer container
TW433258U (en) * 2000-06-23 2001-05-01 Ind Tech Res Inst Improved door body structure for a pod
AU2002232612A1 (en) 2000-12-13 2002-06-24 Entegris Cayman Ltd. Latch hub assembly
US6457598B1 (en) * 2001-03-20 2002-10-01 Prosys Technology Integration, Inc. Module cover assembly with door latch transmission mechanism for wafer transport module
US7886910B2 (en) 2001-11-27 2011-02-15 Entegris, Inc. Front opening wafer carrier with path to ground effectuated by door
US6955382B2 (en) * 2002-01-15 2005-10-18 Entegris, Inc. Wafer carrier door and latching mechanism with c-shaped cam follower
TW534165U (en) * 2002-09-04 2003-05-21 Ind Tech Res Inst Latch locking mechanism used in doors of wafer boxes
WO2004102655A1 (ja) 2003-05-15 2004-11-25 Tdk Corporation クリーンボックス開閉装置を備えるクリーン装置
US7182203B2 (en) * 2003-11-07 2007-02-27 Entegris, Inc. Wafer container and door with vibration dampening latching mechanism
KR100561695B1 (ko) * 2003-12-01 2006-03-15 엘에스산전 주식회사 전원 개폐기의 커버 잠금 장치
JP4573566B2 (ja) 2004-04-20 2010-11-04 信越ポリマー株式会社 収納容器
JP4667769B2 (ja) 2004-06-11 2011-04-13 信越ポリマー株式会社 基板収納容器
JP4540529B2 (ja) 2005-04-18 2010-09-08 信越ポリマー株式会社 収納容器
JP4647417B2 (ja) * 2005-07-08 2011-03-09 信越ポリマー株式会社 基板収納容器の蓋体開閉方法
WO2007038504A2 (en) * 2005-09-27 2007-04-05 Entegris, Inc. Reticle pod
US7422107B2 (en) 2006-01-25 2008-09-09 Entegris, Inc. Kinematic coupling with textured contact surfaces
TWI358379B (en) * 2008-08-14 2012-02-21 Gudeng Prec Industral Co Ltd A wafer container with at least one latch
US7909166B2 (en) 2008-08-14 2011-03-22 Gudeng Precision Industrial Co, Ltd Front opening unified pod with latch structure
TWI365030B (en) * 2009-06-25 2012-05-21 Wistron Corp Covering mechanism for covering an opening of a housing
TWI394695B (zh) 2010-04-29 2013-05-01 Gudeng Prec Industral Co Ltd 一種具有橢圓門閂結構之前開式晶圓盒
KR101264285B1 (ko) * 2011-04-07 2013-05-22 주식회사 삼에스코리아 웨이퍼 캐리어 덮개 잠금 장치
JP5918936B2 (ja) * 2011-06-20 2016-05-18 ミライアル株式会社 基板収納容器
WO2014176558A1 (en) 2013-04-26 2014-10-30 Entegris, Inc. Wafer container with latching mechanism for large diameter wafers

Also Published As

Publication number Publication date
CN105993067A (zh) 2016-10-05
WO2014176558A1 (en) 2014-10-30
KR102219534B1 (ko) 2021-02-24
TWI607935B (zh) 2017-12-11
KR20160002883A (ko) 2016-01-08
US20140319020A1 (en) 2014-10-30
US10723525B2 (en) 2020-07-28
TW201446617A (zh) 2014-12-16
EP2989657A4 (en) 2016-11-30
EP2989657A1 (en) 2016-03-02
CN105993067B (zh) 2019-04-16
EP2989657B1 (en) 2018-05-23
US20190106249A1 (en) 2019-04-11
JP2016518719A (ja) 2016-06-23
US10173812B2 (en) 2019-01-08
JP6329252B2 (ja) 2018-05-23

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