SG11201505685SA - Plasma device, carbon thin film manufacturing method and coating method using plasma device - Google Patents
Plasma device, carbon thin film manufacturing method and coating method using plasma deviceInfo
- Publication number
- SG11201505685SA SG11201505685SA SG11201505685SA SG11201505685SA SG11201505685SA SG 11201505685S A SG11201505685S A SG 11201505685SA SG 11201505685S A SG11201505685S A SG 11201505685SA SG 11201505685S A SG11201505685S A SG 11201505685SA SG 11201505685S A SG11201505685S A SG 11201505685SA
- Authority
- SG
- Singapore
- Prior art keywords
- plasma device
- thin film
- film manufacturing
- carbon thin
- coating method
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32541—Shape
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0605—Carbon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32055—Arc discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/3255—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32568—Relative arrangement or disposition of electrodes; moving means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
- H01J37/32669—Particular magnets or magnet arrangements for controlling the discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3321—CVD [Chemical Vapor Deposition]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Carbon And Carbon Compounds (AREA)
- Plasma Technology (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013009363 | 2013-01-22 | ||
| JP2013010820 | 2013-01-24 | ||
| PCT/JP2014/051141 WO2014115733A1 (ja) | 2013-01-22 | 2014-01-21 | プラズマ装置、それを用いたカーボン薄膜の製造方法およびコーティング方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201505685SA true SG11201505685SA (en) | 2015-09-29 |
Family
ID=51227524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201505685SA SG11201505685SA (en) | 2013-01-22 | 2014-01-21 | Plasma device, carbon thin film manufacturing method and coating method using plasma device |
Country Status (8)
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016017438A1 (ja) * | 2014-07-28 | 2016-02-04 | 日本アイ・ティ・エフ株式会社 | カーボン薄膜、それを製造するプラズマ装置および製造方法 |
| JP2016195035A (ja) * | 2015-03-31 | 2016-11-17 | ウシオ電機株式会社 | 極端紫外光光源装置 |
| JP7122316B2 (ja) | 2017-09-25 | 2022-08-19 | 住友電気工業株式会社 | 硬質炭素系被膜の製造方法、及び被膜付き部材 |
| JP7660321B2 (ja) | 2020-08-06 | 2025-04-11 | 日本アイ・ティ・エフ株式会社 | 真空アーク蒸着装置 |
| CN112133619B (zh) * | 2020-09-22 | 2023-06-23 | 重庆臻宝科技股份有限公司 | 下部电极塑封夹具及塑封工艺 |
| DE102021128160B3 (de) * | 2021-10-28 | 2023-01-05 | Joachim Richter Systeme und Maschinen GmbH & Co. KG | Vorrichtung und Verfahren zum Herstellen einer Graphenschicht |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3836451A (en) * | 1968-12-26 | 1974-09-17 | A Snaper | Arc deposition apparatus |
| US4673477A (en) * | 1984-03-02 | 1987-06-16 | Regents Of The University Of Minnesota | Controlled vacuum arc material deposition, method and apparatus |
| ATE146010T1 (de) * | 1990-03-01 | 1996-12-15 | Balzers Hochvakuum | Vorrichtung und verfahren zum verdampfen von material im vakuum sowie anwendung des verfahrens |
| US5269898A (en) * | 1991-03-20 | 1993-12-14 | Vapor Technologies, Inc. | Apparatus and method for coating a substrate using vacuum arc evaporation |
| US5401543A (en) * | 1993-11-09 | 1995-03-28 | Minnesota Mining And Manufacturing Company | Method for forming macroparticle-free DLC films by cathodic arc discharge |
| GB9722649D0 (en) * | 1997-10-24 | 1997-12-24 | Univ Nanyang | Cathode ARC source for metallic and dielectric coatings |
| JP2000212729A (ja) * | 1999-01-22 | 2000-08-02 | Kobe Steel Ltd | 真空ア―ク蒸着装置 |
| JP2002105628A (ja) | 2000-10-03 | 2002-04-10 | Nissin Electric Co Ltd | 真空アーク蒸着装置 |
| JP2003003251A (ja) * | 2001-06-20 | 2003-01-08 | Olympus Optical Co Ltd | 薄膜形成方法及び薄膜形成装置並びに蒸着源 |
| JP2003183816A (ja) * | 2001-12-13 | 2003-07-03 | Ulvac Japan Ltd | 同軸型真空アーク蒸着源 |
| JP4034563B2 (ja) * | 2001-12-27 | 2008-01-16 | 株式会社神戸製鋼所 | 真空アーク蒸発源 |
| JP4109503B2 (ja) * | 2002-07-22 | 2008-07-02 | 日新電機株式会社 | 真空アーク蒸着装置 |
| JP2006111930A (ja) * | 2004-10-15 | 2006-04-27 | Nissin Electric Co Ltd | 成膜装置 |
| JP4859523B2 (ja) * | 2006-05-09 | 2012-01-25 | スタンレー電気株式会社 | プラズマ源、成膜装置および膜の製造方法 |
| JP2007126754A (ja) * | 2006-12-21 | 2007-05-24 | Nissin Electric Co Ltd | 真空アーク蒸着装置 |
| JP5063143B2 (ja) * | 2007-03-02 | 2012-10-31 | 株式会社リケン | アーク式蒸発源 |
| GB2450933A (en) * | 2007-07-13 | 2009-01-14 | Hauzer Techno Coating Bv | Method of providing a hard coating |
| US8114256B2 (en) * | 2007-11-30 | 2012-02-14 | Applied Materials, Inc. | Control of arbitrary scan path of a rotating magnetron |
| JP4985490B2 (ja) * | 2008-03-12 | 2012-07-25 | 日新電機株式会社 | 成膜装置 |
| JP2009283107A (ja) * | 2008-05-26 | 2009-12-03 | Fuji Electric Device Technology Co Ltd | テトラヘドラル・アモルファス・カーボン膜を主体とする保護膜および該保護膜を有する磁気記録媒体 |
| JP5649308B2 (ja) * | 2009-04-28 | 2015-01-07 | 株式会社神戸製鋼所 | 成膜速度が速いアーク式蒸発源及びこのアーク式蒸発源を用いた皮膜の製造方法 |
| WO2013015280A1 (ja) * | 2011-07-26 | 2013-01-31 | 日新電機株式会社 | プラズマ装置およびそれを用いたカーボン薄膜の製造方法 |
-
2014
- 2014-01-21 US US14/762,468 patent/US20150371833A1/en not_active Abandoned
- 2014-01-21 EP EP14743534.1A patent/EP2949779A4/en not_active Withdrawn
- 2014-01-21 KR KR1020157022721A patent/KR20150133179A/ko not_active Ceased
- 2014-01-21 SG SG11201505685SA patent/SG11201505685SA/en unknown
- 2014-01-21 JP JP2014558578A patent/JP5954440B2/ja active Active
- 2014-01-21 CN CN201480005582.0A patent/CN104937132B/zh not_active Expired - Fee Related
- 2014-01-21 WO PCT/JP2014/051141 patent/WO2014115733A1/ja active Application Filing
- 2014-01-21 HK HK15111277.4A patent/HK1210629A1/xx unknown
-
2016
- 2016-04-14 JP JP2016081481A patent/JP6460034B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP2949779A1 (en) | 2015-12-02 |
| CN104937132B (zh) | 2017-10-24 |
| WO2014115733A1 (ja) | 2014-07-31 |
| JP2016172927A (ja) | 2016-09-29 |
| CN104937132A (zh) | 2015-09-23 |
| US20150371833A1 (en) | 2015-12-24 |
| JPWO2014115733A1 (ja) | 2017-01-26 |
| KR20150133179A (ko) | 2015-11-27 |
| HK1210629A1 (en) | 2016-04-29 |
| JP5954440B2 (ja) | 2016-07-20 |
| EP2949779A4 (en) | 2016-10-05 |
| JP6460034B2 (ja) | 2019-01-30 |
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