SG11201504021QA - Aluminium alloy wire for bonding applications - Google Patents
Aluminium alloy wire for bonding applicationsInfo
- Publication number
- SG11201504021QA SG11201504021QA SG11201504021QA SG11201504021QA SG11201504021QA SG 11201504021Q A SG11201504021Q A SG 11201504021QA SG 11201504021Q A SG11201504021Q A SG 11201504021QA SG 11201504021Q A SG11201504021Q A SG 11201504021QA SG 11201504021Q A SG11201504021Q A SG 11201504021QA
- Authority
- SG
- Singapore
- Prior art keywords
- aluminium alloy
- alloy wire
- bonding applications
- bonding
- applications
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C1/00—Manufacture of metal sheets, metal wire, metal rods, metal tubes by drawing
- B21C1/003—Drawing materials of special alloys so far as the composition of the alloy requires or permits special drawing methods or sequences
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C9/00—Cooling, heating or lubricating drawing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
- B23K35/0261—Rods, electrodes, wires
- B23K35/0266—Rods, electrodes, wires flux-cored
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
- B23K35/286—Al as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/02—Alloys based on aluminium with silicon as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/023—Alloys based on aluminium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/43—Manufacturing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/43—Manufacturing methods
- H01L2224/432—Mechanical processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/43—Manufacturing methods
- H01L2224/432—Mechanical processes
- H01L2224/4321—Pulling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/43—Manufacturing methods
- H01L2224/438—Post-treatment of the connector
- H01L2224/43848—Thermal treatments, e.g. annealing, controlled cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Conductive Materials (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP12007886 | 2012-11-22 | ||
EP12008371.2A EP2736047B1 (de) | 2012-11-22 | 2012-12-17 | Aluminiumlegierungsdraht für Bindungsanwendungen |
PCT/EP2013/073541 WO2014079726A1 (en) | 2012-11-22 | 2013-11-12 | Aluminium alloy wire for bonding applications |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201504021QA true SG11201504021QA (en) | 2015-07-30 |
Family
ID=47323815
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201504021QA SG11201504021QA (en) | 2012-11-22 | 2013-11-12 | Aluminium alloy wire for bonding applications |
Country Status (8)
Country | Link |
---|---|
US (1) | US9397064B2 (de) |
EP (1) | EP2736047B1 (de) |
JP (1) | JP6181767B2 (de) |
KR (1) | KR20150090132A (de) |
CN (1) | CN104937672B (de) |
SG (1) | SG11201504021QA (de) |
TW (1) | TWI542706B (de) |
WO (1) | WO2014079726A1 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9779849B2 (en) * | 2011-09-05 | 2017-10-03 | Dyden Corporation | Aluminum-based conductive material and electric wire and cable using the same |
CN105803268B (zh) * | 2016-02-01 | 2017-12-29 | 新疆众和股份有限公司 | 一种键合铝丝用母杆的生产方法 |
CN106624428A (zh) * | 2016-12-16 | 2017-05-10 | 吴中区穹窿山天仲高分子材料技术研究所 | 一种环保型焊接合金材料及其制备方法 |
CN107644716B (zh) * | 2017-09-15 | 2019-09-13 | 绍兴市高砚智生物科技有限公司 | 添加蜜胺甲醛树脂的复合铜丝生产方法 |
JP7126321B2 (ja) * | 2018-10-10 | 2022-08-26 | 日鉄マイクロメタル株式会社 | Alボンディングワイヤ |
EP4040448A4 (de) | 2019-10-01 | 2023-09-13 | Nippon Micrometal Corporation | Al-verdrahtungsmaterial |
CN115280475A (zh) | 2020-03-13 | 2022-11-01 | 日铁新材料股份有限公司 | Al接合线 |
KR20220153593A (ko) | 2020-03-25 | 2022-11-18 | 닛데쓰마이크로메탈가부시키가이샤 | 반도체 장치용 본딩 와이어 |
CN115989570A (zh) | 2020-08-31 | 2023-04-18 | 日铁新材料股份有限公司 | Al布线材料 |
KR20230058384A (ko) | 2020-08-31 | 2023-05-03 | 닛데쓰마이크로메탈가부시키가이샤 | Al 배선재 |
US20240105668A1 (en) | 2021-02-05 | 2024-03-28 | Nippon Micrometal Corporation | Ai wiring material |
TW202239982A (zh) | 2021-02-05 | 2022-10-16 | 日商日鐵新材料股份有限公司 | 半導體裝置用Al接合線 |
TW202239983A (zh) | 2021-02-05 | 2022-10-16 | 日商日鐵新材料股份有限公司 | 鋁配線材料 |
CN113584355A (zh) * | 2021-08-03 | 2021-11-02 | 上杭县紫金佳博电子新材料科技有限公司 | 一种键合用铝基合金母线及其制备方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3619181A (en) * | 1968-10-29 | 1971-11-09 | Aluminum Co Of America | Aluminum scandium alloy |
JPS61166939A (ja) * | 1985-01-16 | 1986-07-28 | Furukawa Electric Co Ltd:The | 半導体素子ボンデイング用アルミニウム線材 |
JPS61179840A (ja) * | 1985-02-04 | 1986-08-12 | Furukawa Electric Co Ltd:The | 半導体素子ボンデイング用アルミニウム線材 |
JPS61179839A (ja) * | 1985-02-04 | 1986-08-12 | Furukawa Electric Co Ltd:The | 半導体素子ボンデイング用アルミニウム線材 |
EP0521163B1 (de) * | 1991-01-17 | 1997-05-28 | Ryoka Matthey Corporation | Verdrahtungslage aus einer aluminiumlegierung, ihre herstellung, und aluminiumlegierungssputtertarget |
US5597529A (en) * | 1994-05-25 | 1997-01-28 | Ashurst Technology Corporation (Ireland Limited) | Aluminum-scandium alloys |
JPH07316705A (ja) * | 1994-05-31 | 1995-12-05 | Riyouka Massey Kk | 配線材料 |
JP3891699B2 (ja) * | 1998-07-17 | 2007-03-14 | 昭和電工株式会社 | 高強度アルミニウム合金 |
JP4098917B2 (ja) * | 1999-04-19 | 2008-06-11 | 昭和電工株式会社 | 高強度アルミニウム合金 |
JP2001348637A (ja) * | 2000-06-05 | 2001-12-18 | Hitachi Cable Ltd | アルミニウム合金材及びそれを用いた配線材の製造方法 |
JP4144184B2 (ja) * | 2001-03-12 | 2008-09-03 | 日立電線株式会社 | 導電用耐熱Al合金線材の製造方法 |
JP3811160B2 (ja) * | 2004-03-09 | 2006-08-16 | 株式会社東芝 | 半導体装置 |
US7875132B2 (en) * | 2005-05-31 | 2011-01-25 | United Technologies Corporation | High temperature aluminum alloys |
US9779849B2 (en) | 2011-09-05 | 2017-10-03 | Dyden Corporation | Aluminum-based conductive material and electric wire and cable using the same |
JP5159001B1 (ja) * | 2012-09-03 | 2013-03-06 | 田中電子工業株式会社 | アルミニウム合金ボンディングワイヤ |
-
2012
- 2012-12-17 EP EP12008371.2A patent/EP2736047B1/de active Active
-
2013
- 2013-11-12 WO PCT/EP2013/073541 patent/WO2014079726A1/en active Application Filing
- 2013-11-12 KR KR1020157016222A patent/KR20150090132A/ko not_active Application Discontinuation
- 2013-11-12 SG SG11201504021QA patent/SG11201504021QA/en unknown
- 2013-11-12 JP JP2015543386A patent/JP6181767B2/ja active Active
- 2013-11-12 CN CN201380060828.XA patent/CN104937672B/zh active Active
- 2013-11-12 US US14/443,848 patent/US9397064B2/en active Active
- 2013-11-22 TW TW102142719A patent/TWI542706B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2016511529A (ja) | 2016-04-14 |
KR20150090132A (ko) | 2015-08-05 |
CN104937672B (zh) | 2017-03-15 |
US9397064B2 (en) | 2016-07-19 |
TW201425596A (zh) | 2014-07-01 |
WO2014079726A1 (en) | 2014-05-30 |
EP2736047A1 (de) | 2014-05-28 |
US20150303165A1 (en) | 2015-10-22 |
EP2736047B1 (de) | 2017-11-08 |
TWI542706B (zh) | 2016-07-21 |
CN104937672A (zh) | 2015-09-23 |
JP6181767B2 (ja) | 2017-08-16 |
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