SG11201503917UA - Laser annealing method and laser annealing apparatus - Google Patents

Laser annealing method and laser annealing apparatus

Info

Publication number
SG11201503917UA
SG11201503917UA SG11201503917UA SG11201503917UA SG11201503917UA SG 11201503917U A SG11201503917U A SG 11201503917UA SG 11201503917U A SG11201503917U A SG 11201503917UA SG 11201503917U A SG11201503917U A SG 11201503917UA SG 11201503917U A SG11201503917U A SG 11201503917UA
Authority
SG
Singapore
Prior art keywords
laser annealing
annealing method
annealing apparatus
laser
annealing
Prior art date
Application number
SG11201503917UA
Other languages
English (en)
Inventor
Junichi Shida
Masashi Machida
Suk-Hwan Chung
Original Assignee
Japan Steel Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Steel Works Ltd filed Critical Japan Steel Works Ltd
Publication of SG11201503917UA publication Critical patent/SG11201503917UA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02373Group 14 semiconducting materials
    • H01L21/02381Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02524Group 14 semiconducting materials
    • H01L21/02532Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02656Special treatments
    • H01L21/02664Aftertreatments
    • H01L21/02667Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H01L21/02675Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
    • H01L21/02686Pulsed laser beam
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/268Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Recrystallisation Techniques (AREA)
SG11201503917UA 2012-11-20 2013-10-29 Laser annealing method and laser annealing apparatus SG11201503917UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012254282A JP5907530B2 (ja) 2012-11-20 2012-11-20 レーザアニール方法およびレーザアニール装置
PCT/JP2013/079231 WO2014080727A1 (ja) 2012-11-20 2013-10-29 レーザアニール方法およびレーザアニール装置

Publications (1)

Publication Number Publication Date
SG11201503917UA true SG11201503917UA (en) 2015-06-29

Family

ID=50775914

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201503917UA SG11201503917UA (en) 2012-11-20 2013-10-29 Laser annealing method and laser annealing apparatus

Country Status (6)

Country Link
JP (1) JP5907530B2 (zh)
KR (1) KR102108028B1 (zh)
CN (1) CN104798180B (zh)
SG (1) SG11201503917UA (zh)
TW (1) TWI605493B (zh)
WO (1) WO2014080727A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6803189B2 (ja) 2016-10-06 2020-12-23 株式会社日本製鋼所 レーザ照射装置及び半導体装置の製造方法
CN112864040A (zh) * 2019-11-26 2021-05-28 上海微电子装备(集团)股份有限公司 激光退火装置
CN115903940A (zh) * 2023-01-06 2023-04-04 成都莱普科技股份有限公司 应用于激光退火系统的温度控制方法和激光退火系统

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2808220B2 (ja) 1992-10-31 1998-10-08 株式会社半導体エネルギー研究所 光照射装置
TW305063B (zh) * 1995-02-02 1997-05-11 Handotai Energy Kenkyusho Kk
JP3477888B2 (ja) * 1995-02-07 2003-12-10 ソニー株式会社 薄膜半導体装置の製造方法
JPH09321310A (ja) 1996-05-31 1997-12-12 Sanyo Electric Co Ltd 半導体装置の製造方法
JPH1074697A (ja) * 1996-08-29 1998-03-17 Toshiba Corp 多結晶シリコン膜、多結晶シリコンの製造方法、薄膜トランジスタの製造方法、液晶表示装置の製造方法、及びレーザアニール装置
JP2000058835A (ja) * 1998-07-31 2000-02-25 Semiconductor Energy Lab Co Ltd 薄膜トランジスタおよびその作製方法
JP4291539B2 (ja) * 2001-03-21 2009-07-08 シャープ株式会社 半導体装置およびその製造方法
JP4353352B2 (ja) * 2001-05-15 2009-10-28 シャープ株式会社 半導体装置及びその製造方法
JP4583004B2 (ja) * 2003-05-21 2010-11-17 株式会社 日立ディスプレイズ アクティブ・マトリクス基板の製造方法
JP2009018335A (ja) * 2007-07-13 2009-01-29 Sharp Corp ビーム照射装置、ビーム照射方法および機能素子の製造方法
JP5046778B2 (ja) * 2007-07-31 2012-10-10 住友重機械工業株式会社 多結晶膜の製造方法及びレーザ加工装置

Also Published As

Publication number Publication date
TW201423839A (zh) 2014-06-16
JP5907530B2 (ja) 2016-04-26
WO2014080727A1 (ja) 2014-05-30
TWI605493B (zh) 2017-11-11
JP2014103247A (ja) 2014-06-05
CN104798180A (zh) 2015-07-22
KR20150087195A (ko) 2015-07-29
CN104798180B (zh) 2017-09-29
KR102108028B1 (ko) 2020-05-07

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