SG11201503617VA - Composition for metal electroplating comprising leveling agent - Google Patents

Composition for metal electroplating comprising leveling agent

Info

Publication number
SG11201503617VA
SG11201503617VA SG11201503617VA SG11201503617VA SG11201503617VA SG 11201503617V A SG11201503617V A SG 11201503617VA SG 11201503617V A SG11201503617V A SG 11201503617VA SG 11201503617V A SG11201503617V A SG 11201503617VA SG 11201503617V A SG11201503617V A SG 11201503617VA
Authority
SG
Singapore
Prior art keywords
composition
leveling agent
metal electroplating
electroplating
metal
Prior art date
Application number
SG11201503617VA
Other languages
English (en)
Inventor
Marcel Patrik Kienle
Dieter Mayer
Cornelia Röger-Göpfert
Alexandra Haag
Charlotte Emnet
Alexander Flügel
Marco Arnold
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of SG11201503617VA publication Critical patent/SG11201503617VA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
SG11201503617VA 2012-11-09 2013-10-30 Composition for metal electroplating comprising leveling agent SG11201503617VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261724350P 2012-11-09 2012-11-09
PCT/IB2013/059777 WO2014072885A2 (en) 2012-11-09 2013-10-30 Composition for metal electroplating comprising leveling agent

Publications (1)

Publication Number Publication Date
SG11201503617VA true SG11201503617VA (en) 2015-06-29

Family

ID=50685268

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201503617VA SG11201503617VA (en) 2012-11-09 2013-10-30 Composition for metal electroplating comprising leveling agent

Country Status (11)

Country Link
US (1) US9758885B2 (ru)
EP (1) EP2917265B1 (ru)
JP (1) JP6411354B2 (ru)
KR (1) KR102140431B1 (ru)
CN (1) CN104797633B (ru)
IL (1) IL238129B (ru)
MY (1) MY172822A (ru)
RU (1) RU2015121797A (ru)
SG (1) SG11201503617VA (ru)
TW (1) TWI609922B (ru)
WO (1) WO2014072885A2 (ru)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11579344B2 (en) 2012-09-17 2023-02-14 Government Of The United States Of America, As Represented By The Secretary Of Commerce Metallic grating
US20150345039A1 (en) * 2015-07-20 2015-12-03 National Institute Of Standards And Technology Composition having alkaline ph and process for forming superconformation therewith
US10106512B2 (en) * 2015-04-28 2018-10-23 Dow Global Technologies Llc Metal plating compositions
CN107923060B (zh) * 2015-08-31 2020-03-10 埃托特克德国有限公司 含水铜镀浴和用于将铜或铜合金沉积到基底上的方法
CN108026655B (zh) * 2015-10-08 2020-04-14 罗门哈斯电子材料有限责任公司 含有胺和聚丙烯酰胺的反应产物的化合物的铜电镀覆浴
US10662541B2 (en) * 2015-10-08 2020-05-26 Rohm And Haas Electronic Materials Llc Copper electroplating baths containing reaction products of aminex, polyacrylamides and bisepoxides
WO2017059565A1 (en) 2015-10-08 2017-04-13 Rohm And Haas Electronic Materials Llc Copper electroplating baths containing compounds of reaction products of amines, polyacrylamides and sultones
CN105543907A (zh) * 2015-12-09 2016-05-04 深圳市正天伟科技有限公司 一种耐高电流密度电镀铜添加剂及其制备方法
US10519557B2 (en) * 2016-02-12 2019-12-31 Macdermid Enthone Inc. Leveler compositions for use in copper deposition in manufacture of microelectronics
KR102023363B1 (ko) * 2016-07-15 2019-09-24 한국생산기술연구원 니켈 도금용 평탄제 및 이를 포함하는 니켈 도금액
WO2018073011A1 (en) 2016-10-20 2018-04-26 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
CN110100048B (zh) * 2016-12-20 2022-06-21 巴斯夫欧洲公司 包含用于无空隙填充的抑制试剂的用于金属电镀的组合物
EP3360988B1 (en) * 2017-02-09 2019-06-26 ATOTECH Deutschland GmbH Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths
EP3679179B1 (en) 2017-09-04 2023-10-11 Basf Se Composition for metal electroplating comprising leveling agent
WO2019201753A1 (en) * 2018-04-20 2019-10-24 Basf Se Composition for tin or tin alloy electroplating comprising suppressing agent
CN110117801B (zh) * 2019-06-21 2021-04-20 通元科技(惠州)有限公司 一种印制电路板盲孔填铜用镀铜添加剂及其制备方法
CN110284162B (zh) * 2019-07-22 2020-06-30 广州三孚新材料科技股份有限公司 一种光伏汇流焊带无氰碱性镀铜液及其制备方法
CN114450438A (zh) 2019-09-27 2022-05-06 巴斯夫欧洲公司 用于铜凸块电沉积的包含流平剂的组合物
WO2021058334A1 (en) 2019-09-27 2021-04-01 Basf Se Composition for copper bump electrodeposition comprising a leveling agent
KR20220164496A (ko) 2020-04-03 2022-12-13 바스프 에스이 폴리아미노아미드 유형 레벨링제를 포함하는 구리 범프 전착용 조성물
EP3922662A1 (en) 2020-06-10 2021-12-15 Basf Se Polyalkanolamine
US20230265576A1 (en) 2020-07-13 2023-08-24 Basf Se Composition For Copper Electroplating On A Cobalt Seed
WO2023052254A1 (en) 2021-10-01 2023-04-06 Basf Se Composition for copper electrodeposition comprising a polyaminoamide type leveling agent
US20230203695A1 (en) * 2021-12-29 2023-06-29 Basf Se Alkaline Composition For Copper Electroplating Comprising A Defect Reduction Agent
WO2024008562A1 (en) 2022-07-07 2024-01-11 Basf Se Use of a composition comprising a polyaminoamide type compound for copper nanotwin electrodeposition
WO2024132828A1 (en) 2022-12-19 2024-06-27 Basf Se A composition for copper nanotwin electrodeposition

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS494653B1 (ru) 1970-10-27 1974-02-02
GB8530460D0 (en) * 1985-12-11 1986-01-22 Ciba Geigy Ag Holograms
DE19758121C2 (de) 1997-12-17 2000-04-06 Atotech Deutschland Gmbh Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten
DE10139452A1 (de) * 2001-08-10 2003-02-20 Basf Ag Quaternierte Polyamidamine, deren Herstellung, entsprechende Mittel und deren Verwendung
JP2007107074A (ja) 2005-10-17 2007-04-26 Okuno Chem Ind Co Ltd 酸性電気銅めっき液及び電気銅めっき方法
JP5558675B2 (ja) 2007-04-03 2014-07-23 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 金属メッキ組成物
JP5702360B2 (ja) 2009-04-07 2015-04-15 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ ボイドのないサブミクロンの機構を充填するための、抑制剤を含む金属メッキ用の組成物
JP5702359B2 (ja) 2009-04-07 2015-04-15 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ サブミクロンの窪みの無ボイド充填用の抑制剤含有金属めっき組成物
WO2010115757A1 (en) 2009-04-07 2010-10-14 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
CN102365395B (zh) 2009-04-07 2015-04-29 巴斯夫欧洲公司 包含抑制剂的无空隙亚微米结构填充用金属电镀组合物
CN102471910B (zh) 2009-07-30 2016-01-20 巴斯夫欧洲公司 用于无孔隙亚微观特征填充的包含抑制剂的金属电镀组合物
SG177685A1 (en) 2009-07-30 2012-02-28 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
EP2504396B1 (en) 2009-11-27 2021-02-24 Basf Se Composition for copper electroplating comprising leveling agent
SG194983A1 (en) 2011-06-01 2013-12-30 Basf Se Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect features
EP2530102A1 (en) * 2011-06-01 2012-12-05 Basf Se Additive and composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias

Also Published As

Publication number Publication date
EP2917265A4 (en) 2016-06-29
EP2917265A2 (en) 2015-09-16
TWI609922B (zh) 2018-01-01
WO2014072885A2 (en) 2014-05-15
WO2014072885A3 (en) 2014-07-03
EP2917265B1 (en) 2019-01-02
TW201434967A (zh) 2014-09-16
RU2015121797A (ru) 2017-01-10
JP2016504489A (ja) 2016-02-12
JP6411354B2 (ja) 2018-10-24
KR102140431B1 (ko) 2020-08-03
US20150284865A1 (en) 2015-10-08
CN104797633A (zh) 2015-07-22
IL238129B (en) 2020-03-31
US9758885B2 (en) 2017-09-12
IL238129A0 (en) 2015-05-31
MY172822A (en) 2019-12-12
KR20150082541A (ko) 2015-07-15
CN104797633B (zh) 2018-04-24

Similar Documents

Publication Publication Date Title
IL238129B (en) A preparation for electrical metallic coating containing an equalizing agent
IL223183A0 (en) Composition for metal electroplating comprising leveling agent
SG10201510522XA (en) Composition for metal electroplating comprising leveling agent
IL221655A (en) Preparation for metallic electrical coating containing comparator
EP2873699A4 (en) HART COATING COMPOSITION
EP2843007A4 (en) HART COATING COMPOSITION
IL219556A0 (en) Composition for metal electroplating comprising leveling agent
SG11201404577XA (en) Bactericidal agent composition
GB201215100D0 (en) Polymide composition
EP2891703A4 (en) LUBRICANT COMPOSITION
HK1204019A1 (en) Indicator coatings for metal surfaces
HUE047436T2 (hu) Fém katalizátorkészítmény
EP2826846A4 (en) LUBRICANT COMPOSITION
ZA201402914B (en) Hard metal composition
EP2823830A4 (en) MESH-HIGHNESS MEDIUM
SG11201404647QA (en) Lubricant composition
HK1210709A1 (en) Composition for external use
EP2878633A4 (en) curing composition
EP2922926A4 (en) COATING COMPOSITION
HK1206976A1 (en) Composition for agent for external use
EP2868740A4 (en) LUBRICANT COMPOSITION
EP2803741A4 (en) ALLOY STEEL
EP2902457A4 (en) COATING AGENT COMPOSITION
GB201314568D0 (en) Lubricant compositions
GB201314570D0 (en) Lubricant compositions