SG11201503617VA - Composition for metal electroplating comprising leveling agent - Google Patents
Composition for metal electroplating comprising leveling agentInfo
- Publication number
- SG11201503617VA SG11201503617VA SG11201503617VA SG11201503617VA SG11201503617VA SG 11201503617V A SG11201503617V A SG 11201503617VA SG 11201503617V A SG11201503617V A SG 11201503617VA SG 11201503617V A SG11201503617V A SG 11201503617VA SG 11201503617V A SG11201503617V A SG 11201503617VA
- Authority
- SG
- Singapore
- Prior art keywords
- composition
- leveling agent
- metal electroplating
- electroplating
- metal
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Electrodes Of Semiconductors (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261724350P | 2012-11-09 | 2012-11-09 | |
| PCT/IB2013/059777 WO2014072885A2 (en) | 2012-11-09 | 2013-10-30 | Composition for metal electroplating comprising leveling agent |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201503617VA true SG11201503617VA (en) | 2015-06-29 |
Family
ID=50685268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201503617VA SG11201503617VA (en) | 2012-11-09 | 2013-10-30 | Composition for metal electroplating comprising leveling agent |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US9758885B2 (en) |
| EP (1) | EP2917265B1 (en) |
| JP (1) | JP6411354B2 (en) |
| KR (1) | KR102140431B1 (en) |
| CN (1) | CN104797633B (en) |
| IL (1) | IL238129B (en) |
| MY (1) | MY172822A (en) |
| RU (1) | RU2015121797A (en) |
| SG (1) | SG11201503617VA (en) |
| TW (1) | TWI609922B (en) |
| WO (1) | WO2014072885A2 (en) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11579344B2 (en) | 2012-09-17 | 2023-02-14 | Government Of The United States Of America, As Represented By The Secretary Of Commerce | Metallic grating |
| US20150345039A1 (en) * | 2015-07-20 | 2015-12-03 | National Institute Of Standards And Technology | Composition having alkaline ph and process for forming superconformation therewith |
| EP3288990B1 (en) * | 2015-04-28 | 2022-09-28 | Rohm and Haas Electronic Materials LLC | Reaction products of bisanhydrids and diamines as additives for electroplating baths |
| JP6790075B2 (en) | 2015-08-31 | 2020-11-25 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ | Method of depositing copper or copper alloy on water-based copper plating bath and substrate |
| JP6797193B6 (en) * | 2015-10-08 | 2021-01-20 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ | Copper electroplating bath containing reaction products of amines, polyacrylamides, and bisepoxides |
| KR102125240B1 (en) | 2015-10-08 | 2020-06-22 | 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨 | Copper electroplating bath containing compound of reaction product of amine, polyacrylamide and sultone |
| CN108026655B (en) * | 2015-10-08 | 2020-04-14 | 罗门哈斯电子材料有限责任公司 | Copper electroplating baths containing compounds of the reaction products of amines and polyacrylamides |
| CN105543907A (en) * | 2015-12-09 | 2016-05-04 | 深圳市正天伟科技有限公司 | High-current-density-resistant copper electroplating additive and preparation method thereof |
| US10519557B2 (en) * | 2016-02-12 | 2019-12-31 | Macdermid Enthone Inc. | Leveler compositions for use in copper deposition in manufacture of microelectronics |
| KR102023363B1 (en) * | 2016-07-15 | 2019-09-24 | 한국생산기술연구원 | Leveling agent for nickel electrolytic plating and nickel electrolytic plating solution containing the leveling agent |
| WO2018073011A1 (en) | 2016-10-20 | 2018-04-26 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| EP3559317A1 (en) * | 2016-12-20 | 2019-10-30 | Basf Se | Composition for metal plating comprising suppressing agent for void free filling |
| EP3360988B1 (en) * | 2017-02-09 | 2019-06-26 | ATOTECH Deutschland GmbH | Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths |
| KR102641595B1 (en) | 2017-09-04 | 2024-02-27 | 바스프 에스이 | Composition for metal electroplating comprising planarizing agent |
| CN112135929B (en) * | 2018-04-20 | 2023-12-15 | 巴斯夫欧洲公司 | Composition for tin or tin alloy electroplating comprising inhibitors |
| CN110117801B (en) * | 2019-06-21 | 2021-04-20 | 通元科技(惠州)有限公司 | Copper plating additive for filling copper into blind holes of printed circuit board and preparation method thereof |
| CN110284162B (en) * | 2019-07-22 | 2020-06-30 | 广州三孚新材料科技股份有限公司 | Cyanide-free alkaline copper plating solution for photovoltaic confluence welding strip and preparation method thereof |
| WO2021058334A1 (en) | 2019-09-27 | 2021-04-01 | Basf Se | Composition for copper bump electrodeposition comprising a leveling agent |
| KR20220069012A (en) | 2019-09-27 | 2022-05-26 | 바스프 에스이 | Composition for electrodeposition of copper bumps comprising a leveling agent |
| KR20220164496A (en) | 2020-04-03 | 2022-12-13 | 바스프 에스이 | Composition for electrodeposition of copper bumps containing polyaminoamide type leveling agent |
| EP3922662A1 (en) | 2020-06-10 | 2021-12-15 | Basf Se | Polyalkanolamine |
| CN115720598A (en) | 2020-07-13 | 2023-02-28 | 巴斯夫欧洲公司 | Composition for electroplating copper on cobalt seed |
| CN118043502A (en) * | 2021-10-01 | 2024-05-14 | 巴斯夫欧洲公司 | Composition for copper electrodeposition comprising a polyaminoamide leveling agent |
| US20230203695A1 (en) * | 2021-12-29 | 2023-06-29 | Basf Se | Alkaline Composition For Copper Electroplating Comprising A Defect Reduction Agent |
| WO2024008562A1 (en) | 2022-07-07 | 2024-01-11 | Basf Se | Use of a composition comprising a polyaminoamide type compound for copper nanotwin electrodeposition |
| WO2024132828A1 (en) | 2022-12-19 | 2024-06-27 | Basf Se | A composition for copper nanotwin electrodeposition |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS494653B1 (en) * | 1970-10-27 | 1974-02-02 | ||
| GB8530460D0 (en) * | 1985-12-11 | 1986-01-22 | Ciba Geigy Ag | Holograms |
| DE19758121C2 (en) | 1997-12-17 | 2000-04-06 | Atotech Deutschland Gmbh | Aqueous bath and method for electrolytic deposition of copper layers |
| DE10139452A1 (en) | 2001-08-10 | 2003-02-20 | Basf Ag | Quaternary amideamines, useful in the cosmetic and pharmaceutical industries, in plant protection or textile dyeing |
| JP2007107074A (en) * | 2005-10-17 | 2007-04-26 | Okuno Chem Ind Co Ltd | Acidic copper electroplating solution and copper electroplating method |
| JP5558675B2 (en) | 2007-04-03 | 2014-07-23 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | Metal plating composition |
| WO2010115757A1 (en) | 2009-04-07 | 2010-10-14 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| CN102369315B (en) | 2009-04-07 | 2014-08-13 | 巴斯夫欧洲公司 | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| WO2010115796A1 (en) | 2009-04-07 | 2010-10-14 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| JP5702359B2 (en) | 2009-04-07 | 2015-04-15 | ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ | Inhibitor-containing metal plating composition for void-free filling of submicron depressions |
| RU2539897C2 (en) | 2009-07-30 | 2015-01-27 | Басф Се | Metal coating composition containing suppressing agent for void-free filling of submicron surface elements |
| CN102471910B (en) | 2009-07-30 | 2016-01-20 | 巴斯夫欧洲公司 | For the metal plating compositions comprising inhibitor that imporosity submicroscopic feature is filled |
| CN102639639B (en) * | 2009-11-27 | 2015-06-03 | 巴斯夫欧洲公司 | Composition for metal electroplating comprising leveling agent |
| EP2530102A1 (en) | 2011-06-01 | 2012-12-05 | Basf Se | Additive and composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias |
| SG10201604395TA (en) | 2011-06-01 | 2016-07-28 | Basf Se | Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect features |
-
2013
- 2013-10-30 CN CN201380058525.4A patent/CN104797633B/en active Active
- 2013-10-30 WO PCT/IB2013/059777 patent/WO2014072885A2/en active Application Filing
- 2013-10-30 JP JP2015541264A patent/JP6411354B2/en active Active
- 2013-10-30 KR KR1020157015001A patent/KR102140431B1/en active IP Right Grant
- 2013-10-30 MY MYPI2015001181A patent/MY172822A/en unknown
- 2013-10-30 RU RU2015121797A patent/RU2015121797A/en unknown
- 2013-10-30 EP EP13852692.6A patent/EP2917265B1/en active Active
- 2013-10-30 US US14/438,688 patent/US9758885B2/en active Active
- 2013-10-30 SG SG11201503617VA patent/SG11201503617VA/en unknown
- 2013-11-07 TW TW102140403A patent/TWI609922B/en active
-
2015
- 2015-04-02 IL IL238129A patent/IL238129B/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| IL238129B (en) | 2020-03-31 |
| KR102140431B1 (en) | 2020-08-03 |
| TW201434967A (en) | 2014-09-16 |
| CN104797633B (en) | 2018-04-24 |
| IL238129A0 (en) | 2015-05-31 |
| CN104797633A (en) | 2015-07-22 |
| JP6411354B2 (en) | 2018-10-24 |
| EP2917265A2 (en) | 2015-09-16 |
| RU2015121797A (en) | 2017-01-10 |
| US9758885B2 (en) | 2017-09-12 |
| WO2014072885A3 (en) | 2014-07-03 |
| EP2917265B1 (en) | 2019-01-02 |
| MY172822A (en) | 2019-12-12 |
| EP2917265A4 (en) | 2016-06-29 |
| JP2016504489A (en) | 2016-02-12 |
| WO2014072885A2 (en) | 2014-05-15 |
| KR20150082541A (en) | 2015-07-15 |
| TWI609922B (en) | 2018-01-01 |
| US20150284865A1 (en) | 2015-10-08 |
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