SG11201502394YA - Composite resin composition for electronic component and electronic component molded from composite resin composition - Google Patents

Composite resin composition for electronic component and electronic component molded from composite resin composition

Info

Publication number
SG11201502394YA
SG11201502394YA SG11201502394YA SG11201502394YA SG11201502394YA SG 11201502394Y A SG11201502394Y A SG 11201502394YA SG 11201502394Y A SG11201502394Y A SG 11201502394YA SG 11201502394Y A SG11201502394Y A SG 11201502394YA SG 11201502394Y A SG11201502394Y A SG 11201502394YA
Authority
SG
Singapore
Prior art keywords
resin composition
electronic component
composite resin
molded
component molded
Prior art date
Application number
SG11201502394YA
Other languages
English (en)
Inventor
Hiroki Fukatsu
Mineo Ohtake
Kazuhiro Ryu
Junichiro Sugiura
Yoshiaki Taguchi
Original Assignee
Polyplastics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co filed Critical Polyplastics Co
Publication of SG11201502394YA publication Critical patent/SG11201502394YA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
    • C09K19/38—Polymers
    • C09K19/3804—Polymers with mesogenic groups in the main chain
    • C09K19/3809—Polyesters; Polyester derivatives, e.g. polyamides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/52—Liquid crystal materials characterised by components which are not liquid crystals, e.g. additives with special physical aspect: solvents, solid particles
    • C09K2019/521—Inorganic solid particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
SG11201502394YA 2012-09-26 2013-08-20 Composite resin composition for electronic component and electronic component molded from composite resin composition SG11201502394YA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012212179 2012-09-26
JP2012212180 2012-09-26
PCT/JP2013/072226 WO2014050371A1 (ja) 2012-09-26 2013-08-20 電子部品用複合樹脂組成物、及び当該複合樹脂組成物から成形された電子部品

Publications (1)

Publication Number Publication Date
SG11201502394YA true SG11201502394YA (en) 2015-05-28

Family

ID=50387781

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201502394YA SG11201502394YA (en) 2012-09-26 2013-08-20 Composite resin composition for electronic component and electronic component molded from composite resin composition

Country Status (7)

Country Link
JP (1) JP5769888B2 (ko)
KR (1) KR20150060829A (ko)
CN (1) CN104704049B (ko)
MY (1) MY174277A (ko)
SG (1) SG11201502394YA (ko)
TW (1) TWI502019B (ko)
WO (1) WO2014050371A1 (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6157778B1 (ja) * 2015-10-21 2017-07-05 ポリプラスチックス株式会社 全芳香族ポリエステル及びその製造方法
WO2017110867A1 (ja) * 2015-12-25 2017-06-29 ポリプラスチックス株式会社 複合樹脂組成物、及び当該複合樹脂組成物から成形されたコネクター
WO2017110866A1 (ja) * 2015-12-25 2017-06-29 ポリプラスチックス株式会社 複合樹脂組成物、及び当該複合樹脂組成物から成形された電子部品
CN105837803B (zh) * 2016-02-01 2017-05-31 金发科技股份有限公司 一种液晶聚酯以及由其组成的模塑组合物和其应用
JP6356938B1 (ja) * 2016-10-07 2018-07-11 ポリプラスチックス株式会社 複合樹脂組成物、及び当該複合樹脂組成物から成形されたコネクター
KR102058121B1 (ko) * 2016-10-07 2019-12-20 포리프라스틱 가부시키가이샤 복합 수지 조성물, 및 당해 복합 수지 조성물로 성형된 전자 부품
WO2018074155A1 (ja) * 2016-10-21 2018-04-26 ポリプラスチックス株式会社 複合樹脂組成物、及び当該複合樹脂組成物から成形された電子部品
WO2018074156A1 (ja) * 2016-10-21 2018-04-26 ポリプラスチックス株式会社 複合樹脂組成物、及び当該複合樹脂組成物から成形されたコネクター
CN109844028B (zh) * 2016-12-21 2020-09-11 宝理塑料株式会社 表面安装继电器用液晶性树脂组合物及使用其的表面安装继电器
WO2022168706A1 (ja) * 2021-02-05 2022-08-11 ポリプラスチックス株式会社 ファンインペラ用液晶性樹脂組成物及びそれを用いたファンインペラ

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0216120A (ja) * 1988-07-05 1990-01-19 Polyplastics Co 溶融時に光学的異方性を示すポリエステル樹脂及び樹脂組成物
US5804634A (en) * 1995-12-15 1998-09-08 Toray Industries, Inc. Liquid crystalline resin compound and moldings thereof
JPH09221582A (ja) * 1995-12-15 1997-08-26 Toray Ind Inc 液晶性樹脂組成物および成形品
JP2000160030A (ja) * 1998-11-30 2000-06-13 Otsuka Chem Co Ltd 難燃性樹脂組成物
JP4488455B2 (ja) * 1999-03-30 2010-06-23 新日本石油株式会社 サーモトロピック液晶コポリエステルの製造方法、その組成物およびその成形体
JP4281377B2 (ja) * 2003-02-26 2009-06-17 東レ株式会社 液晶性ポリエステルおよびその組成物
TWI472574B (zh) * 2006-08-24 2015-02-11 Polyplastics Co 非對稱電子零件
JP2009221406A (ja) * 2008-03-18 2009-10-01 Ueno Fine Chem Ind Ltd 液晶ポリエステルの製造方法
JP2010037364A (ja) * 2008-07-31 2010-02-18 Polyplastics Co コネクター
EP2540778B1 (en) * 2011-02-28 2020-01-22 Toray Industries, Inc. Liquid crystal polyester resin composition and metal composite molded article using same
EP2695905B1 (en) * 2011-04-01 2021-01-27 Polyplastics Co., Ltd. Fully aromatic polyester and polyester resin composition
JP5485216B2 (ja) * 2011-04-01 2014-05-07 ポリプラスチックス株式会社 平面状コネクター

Also Published As

Publication number Publication date
TW201431949A (zh) 2014-08-16
MY174277A (en) 2020-04-01
CN104704049A (zh) 2015-06-10
JPWO2014050371A1 (ja) 2016-08-22
WO2014050371A1 (ja) 2014-04-03
KR20150060829A (ko) 2015-06-03
CN104704049B (zh) 2016-10-12
TWI502019B (zh) 2015-10-01
JP5769888B2 (ja) 2015-08-26

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