SG11201501263SA - Device and method for making dimensional measurements on multilayer objects such as wafers - Google Patents
Device and method for making dimensional measurements on multilayer objects such as wafersInfo
- Publication number
- SG11201501263SA SG11201501263SA SG11201501263SA SG11201501263SA SG11201501263SA SG 11201501263S A SG11201501263S A SG 11201501263SA SG 11201501263S A SG11201501263S A SG 11201501263SA SG 11201501263S A SG11201501263S A SG 11201501263SA SG 11201501263S A SG11201501263S A SG 11201501263SA
- Authority
- SG
- Singapore
- Prior art keywords
- wafers
- dimensional measurements
- multilayer objects
- making dimensional
- making
- Prior art date
Links
- 238000005259 measurement Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 235000012431 wafers Nutrition 0.000 title 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0012—Biomedical image inspection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
- G01B11/0633—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection using one or more discrete wavelengths
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0683—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating measurement during deposition or removal of the layer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/0209—Low-coherence interferometers
- G01B9/02091—Tomographic interferometers, e.g. based on optical coherence
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/0008—Industrial image inspection checking presence/absence
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N7/00—Television systems
- H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10004—Still image; Photographic image
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10141—Special mode during image acquisition
- G06T2207/10152—Varying illumination
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Theoretical Computer Science (AREA)
- Quality & Reliability (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Manufacturing & Machinery (AREA)
- Radiology & Medical Imaging (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Analytical Chemistry (AREA)
- Power Engineering (AREA)
- Pathology (AREA)
- Biochemistry (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Immunology (AREA)
- Medical Informatics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1257906A FR2994734B1 (fr) | 2012-08-21 | 2012-08-21 | Dispositif et procede pour faire des mesures dimensionnelles sur des objets multi-couches tels que des wafers. |
PCT/EP2013/067170 WO2014029703A1 (fr) | 2012-08-21 | 2013-08-16 | Dispositif et procede pour faire des mesures dimensionnelles sur des objets multi-couches tels que des wafers |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201501263SA true SG11201501263SA (en) | 2015-05-28 |
Family
ID=47049296
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201501263SA SG11201501263SA (en) | 2012-08-21 | 2013-08-16 | Device and method for making dimensional measurements on multilayer objects such as wafers |
SG11201501124RA SG11201501124RA (en) | 2012-08-21 | 2013-08-20 | Method and device for controllably revealing structures buried in objects such as wafers |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201501124RA SG11201501124RA (en) | 2012-08-21 | 2013-08-20 | Method and device for controllably revealing structures buried in objects such as wafers |
Country Status (8)
Country | Link |
---|---|
US (2) | US10074172B2 (zh) |
EP (2) | EP2888551B1 (zh) |
JP (2) | JP2015532713A (zh) |
KR (2) | KR102276035B1 (zh) |
CN (2) | CN104620072A (zh) |
FR (2) | FR2994734B1 (zh) |
SG (2) | SG11201501263SA (zh) |
WO (2) | WO2014029703A1 (zh) |
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FR3026481B1 (fr) * | 2014-09-25 | 2021-12-24 | Fogale Nanotech | Dispositif et procede de profilometrie de surface pour le controle de wafers en cours de process |
CN107209356B (zh) * | 2014-12-09 | 2020-07-17 | 阿森提斯股份有限公司 | 用于高度和厚度的非接触式测量的集成光学器件 |
US10509390B2 (en) | 2015-02-12 | 2019-12-17 | Glowforge Inc. | Safety and reliability guarantees for laser fabrication |
CN107438800A (zh) | 2015-02-12 | 2017-12-05 | 格罗弗治公司 | 在激光加工过程中移动材料 |
FR3033643B1 (fr) * | 2015-03-13 | 2020-07-17 | Unity Semiconductor | Dispositif et procede pour detecter des defauts dans des zones de liaison entre des echantillons tels que des wafers |
JP6473050B2 (ja) * | 2015-06-05 | 2019-02-20 | 株式会社荏原製作所 | 研磨装置 |
CN106403808A (zh) * | 2015-07-29 | 2017-02-15 | 上海微电子装备有限公司 | 一种测量通孔硅形貌的装置与方法 |
JP2017075791A (ja) * | 2015-10-13 | 2017-04-20 | 富士通株式会社 | 方法及び装置 |
WO2017073628A1 (ja) * | 2015-10-28 | 2017-05-04 | 日本碍子株式会社 | ハニカム構造体の端面検査方法、及び端面検査装置 |
FR3045813B1 (fr) * | 2015-12-22 | 2020-05-01 | Unity Semiconductor | Dispositif et procede de mesure de hauteur en presence de couches minces |
EP3222965B1 (en) * | 2016-03-25 | 2020-01-15 | Fogale Nanotech | Chromatic confocal device and method for 2d/3d inspection of an object such as a wafer with variable spatial resolution |
US11815347B2 (en) * | 2016-09-28 | 2023-11-14 | Kla-Tencor Corporation | Optical near-field metrology |
WO2018098394A1 (en) | 2016-11-25 | 2018-05-31 | Glowforge Inc. | Fabrication with image tracing |
WO2018098397A1 (en) | 2016-11-25 | 2018-05-31 | Glowforge Inc. | Calibration of computer-numerically-controlled machine |
WO2018098398A1 (en) | 2016-11-25 | 2018-05-31 | Glowforge Inc. | Preset optical components in a computer numerically controlled machine |
WO2018098399A1 (en) | 2016-11-25 | 2018-05-31 | Glowforge Inc. | Controlled deceleration of moveable components in a computer numerically controlled machine |
WO2018098393A1 (en) | 2016-11-25 | 2018-05-31 | Glowforge Inc. | Housing for computer-numerically-controlled machine |
JP6829653B2 (ja) * | 2017-05-17 | 2021-02-10 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
EP3635771A4 (en) * | 2017-06-08 | 2021-03-10 | Rudolph Technologies, Inc. | SLICE INSPECTION SYSTEM INCLUDING LASER TRIANGULATION SENSOR |
CN107037059A (zh) * | 2017-06-09 | 2017-08-11 | 浙江师范大学 | 一种光学材料亚表面裂纹深度的检测方法 |
JP7023062B2 (ja) * | 2017-07-24 | 2022-02-21 | 株式会社荏原製作所 | 基板研磨装置及び方法 |
US20190355110A1 (en) * | 2018-05-15 | 2019-11-21 | Camtek Ltd. | Cross talk reduction |
US11543353B2 (en) * | 2019-01-18 | 2023-01-03 | Essenlix Corporation | Multi-mode illumination system |
CN113614519A (zh) * | 2019-03-29 | 2021-11-05 | 大金工业株式会社 | 成型品的检查方法以及成型品的制造方法 |
EP3786574A1 (de) * | 2019-08-26 | 2021-03-03 | Sturm Maschinen- & Anlagenbau GmbH | Sensorvorrichtung |
CN111272773B (zh) * | 2019-12-31 | 2021-10-29 | 浙江大学 | 一种半导体晶圆表面缺陷的快速超高分辨检测系统 |
EP3851834B1 (en) * | 2020-01-16 | 2024-06-05 | Roche Diagnostics GmbH | Device for thermocycling biological samples, monitoring instrument comprising the same, and method for thermocycling biological samples using such device |
JP7134509B2 (ja) * | 2021-01-27 | 2022-09-12 | シンクランド株式会社 | 光干渉断層撮影システム |
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CN116634254A (zh) * | 2022-02-11 | 2023-08-22 | 深超光电(深圳)有限公司 | 成像系统及光学装置 |
EP4279861A1 (en) * | 2022-05-19 | 2023-11-22 | Unity Semiconductor | A method and a system for characterising structures etched in a substrate |
EP4279862A1 (en) * | 2022-05-19 | 2023-11-22 | Unity Semiconductor | A method and a system for combined characterisation of structures etched in a substrate |
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-
2012
- 2012-08-21 FR FR1257906A patent/FR2994734B1/fr active Active
-
2013
- 2013-03-12 FR FR1352172A patent/FR2994741B1/fr active Active
- 2013-08-16 KR KR1020157004990A patent/KR102276035B1/ko active IP Right Grant
- 2013-08-16 US US14/422,443 patent/US10074172B2/en active Active
- 2013-08-16 EP EP13759989.0A patent/EP2888551B1/fr active Active
- 2013-08-16 WO PCT/EP2013/067170 patent/WO2014029703A1/fr active Application Filing
- 2013-08-16 CN CN201380044286.7A patent/CN104620072A/zh active Pending
- 2013-08-16 SG SG11201501263SA patent/SG11201501263SA/en unknown
- 2013-08-16 JP JP2015527872A patent/JP2015532713A/ja active Pending
- 2013-08-20 JP JP2015527896A patent/JP6277530B2/ja active Active
- 2013-08-20 US US14/422,300 patent/US10043266B2/en active Active
- 2013-08-20 WO PCT/EP2013/067339 patent/WO2014029784A1/fr active Application Filing
- 2013-08-20 CN CN201380043727.1A patent/CN104620071B/zh active Active
- 2013-08-20 EP EP13763196.6A patent/EP2888552B1/fr active Active
- 2013-08-20 SG SG11201501124RA patent/SG11201501124RA/en unknown
- 2013-08-20 KR KR1020157004986A patent/KR102047578B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR102276035B1 (ko) | 2021-07-12 |
EP2888551A1 (fr) | 2015-07-01 |
FR2994734B1 (fr) | 2017-08-25 |
US10043266B2 (en) | 2018-08-07 |
JP2015536037A (ja) | 2015-12-17 |
CN104620072A (zh) | 2015-05-13 |
KR20150046065A (ko) | 2015-04-29 |
EP2888551B1 (fr) | 2018-10-17 |
FR2994741A1 (fr) | 2014-02-28 |
CN104620071B (zh) | 2018-06-29 |
WO2014029784A1 (fr) | 2014-02-27 |
US20150243024A1 (en) | 2015-08-27 |
FR2994734A1 (fr) | 2014-02-28 |
US10074172B2 (en) | 2018-09-11 |
JP6277530B2 (ja) | 2018-02-14 |
SG11201501124RA (en) | 2015-04-29 |
EP2888552B1 (fr) | 2019-04-03 |
KR102047578B1 (ko) | 2019-11-21 |
CN104620071A (zh) | 2015-05-13 |
JP2015532713A (ja) | 2015-11-12 |
KR20150043352A (ko) | 2015-04-22 |
WO2014029703A1 (fr) | 2014-02-27 |
FR2994741B1 (fr) | 2023-01-20 |
EP2888552A1 (fr) | 2015-07-01 |
US20150228069A1 (en) | 2015-08-13 |
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