SG11201501263SA - Device and method for making dimensional measurements on multilayer objects such as wafers - Google Patents

Device and method for making dimensional measurements on multilayer objects such as wafers

Info

Publication number
SG11201501263SA
SG11201501263SA SG11201501263SA SG11201501263SA SG11201501263SA SG 11201501263S A SG11201501263S A SG 11201501263SA SG 11201501263S A SG11201501263S A SG 11201501263SA SG 11201501263S A SG11201501263S A SG 11201501263SA SG 11201501263S A SG11201501263S A SG 11201501263SA
Authority
SG
Singapore
Prior art keywords
wafers
dimensional measurements
multilayer objects
making dimensional
making
Prior art date
Application number
SG11201501263SA
Other languages
English (en)
Inventor
Gilles Fresquet
Sylvain Perrot
Original Assignee
Fogale Nanotech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fogale Nanotech filed Critical Fogale Nanotech
Publication of SG11201501263SA publication Critical patent/SG11201501263SA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0012—Biomedical image inspection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • G01B11/0633—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection using one or more discrete wavelengths
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0683—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating measurement during deposition or removal of the layer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/0209—Low-coherence interferometers
    • G01B9/02091—Tomographic interferometers, e.g. based on optical coherence
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0008—Industrial image inspection checking presence/absence
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10004—Still image; Photographic image
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10141—Special mode during image acquisition
    • G06T2207/10152—Varying illumination
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Quality & Reliability (AREA)
  • Manufacturing & Machinery (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Radiology & Medical Imaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Immunology (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Computer Hardware Design (AREA)
  • Pathology (AREA)
  • Power Engineering (AREA)
  • Medical Informatics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
SG11201501263SA 2012-08-21 2013-08-16 Device and method for making dimensional measurements on multilayer objects such as wafers SG11201501263SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1257906A FR2994734B1 (fr) 2012-08-21 2012-08-21 Dispositif et procede pour faire des mesures dimensionnelles sur des objets multi-couches tels que des wafers.
PCT/EP2013/067170 WO2014029703A1 (fr) 2012-08-21 2013-08-16 Dispositif et procede pour faire des mesures dimensionnelles sur des objets multi-couches tels que des wafers

Publications (1)

Publication Number Publication Date
SG11201501263SA true SG11201501263SA (en) 2015-05-28

Family

ID=47049296

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201501263SA SG11201501263SA (en) 2012-08-21 2013-08-16 Device and method for making dimensional measurements on multilayer objects such as wafers
SG11201501124RA SG11201501124RA (en) 2012-08-21 2013-08-20 Method and device for controllably revealing structures buried in objects such as wafers

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG11201501124RA SG11201501124RA (en) 2012-08-21 2013-08-20 Method and device for controllably revealing structures buried in objects such as wafers

Country Status (8)

Country Link
US (2) US10074172B2 (enrdf_load_stackoverflow)
EP (2) EP2888551B1 (enrdf_load_stackoverflow)
JP (2) JP2015532713A (enrdf_load_stackoverflow)
KR (2) KR102276035B1 (enrdf_load_stackoverflow)
CN (2) CN104620072A (enrdf_load_stackoverflow)
FR (2) FR2994734B1 (enrdf_load_stackoverflow)
SG (2) SG11201501263SA (enrdf_load_stackoverflow)
WO (2) WO2014029703A1 (enrdf_load_stackoverflow)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3026481B1 (fr) * 2014-09-25 2021-12-24 Fogale Nanotech Dispositif et procede de profilometrie de surface pour le controle de wafers en cours de process
WO2016092348A1 (fr) * 2014-12-09 2016-06-16 Asentys Sas Dispositif optique integre de mesure sans contact d'altitudes et d'epaisseurs.
CN107438494B (zh) 2015-02-12 2023-09-19 格罗弗治公司 用于激光加工的视觉预览
US10509390B2 (en) 2015-02-12 2019-12-17 Glowforge Inc. Safety and reliability guarantees for laser fabrication
FR3033643B1 (fr) * 2015-03-13 2020-07-17 Unity Semiconductor Dispositif et procede pour detecter des defauts dans des zones de liaison entre des echantillons tels que des wafers
JP6473050B2 (ja) * 2015-06-05 2019-02-20 株式会社荏原製作所 研磨装置
CN106403808A (zh) * 2015-07-29 2017-02-15 上海微电子装备有限公司 一种测量通孔硅形貌的装置与方法
JP2017075791A (ja) * 2015-10-13 2017-04-20 富士通株式会社 方法及び装置
CN108351310B (zh) * 2015-10-28 2021-05-18 日本碍子株式会社 蜂窝结构体的端面检查方法以及端面检查装置
FR3045813B1 (fr) * 2015-12-22 2020-05-01 Unity Semiconductor Dispositif et procede de mesure de hauteur en presence de couches minces
EP3222965B1 (en) * 2016-03-25 2020-01-15 Fogale Nanotech Chromatic confocal device and method for 2d/3d inspection of an object such as a wafer with variable spatial resolution
US11815347B2 (en) * 2016-09-28 2023-11-14 Kla-Tencor Corporation Optical near-field metrology
WO2018098393A1 (en) 2016-11-25 2018-05-31 Glowforge Inc. Housing for computer-numerically-controlled machine
WO2018098398A1 (en) 2016-11-25 2018-05-31 Glowforge Inc. Preset optical components in a computer numerically controlled machine
WO2018098399A1 (en) 2016-11-25 2018-05-31 Glowforge Inc. Controlled deceleration of moveable components in a computer numerically controlled machine
WO2018098394A1 (en) 2016-11-25 2018-05-31 Glowforge Inc. Fabrication with image tracing
WO2018098397A1 (en) 2016-11-25 2018-05-31 Glowforge Inc. Calibration of computer-numerically-controlled machine
JP6829653B2 (ja) 2017-05-17 2021-02-10 株式会社荏原製作所 研磨装置および研磨方法
EP3635771A4 (en) * 2017-06-08 2021-03-10 Rudolph Technologies, Inc. SLICE INSPECTION SYSTEM INCLUDING LASER TRIANGULATION SENSOR
CN107037059A (zh) * 2017-06-09 2017-08-11 浙江师范大学 一种光学材料亚表面裂纹深度的检测方法
JP7023062B2 (ja) * 2017-07-24 2022-02-21 株式会社荏原製作所 基板研磨装置及び方法
US20190355110A1 (en) * 2018-05-15 2019-11-21 Camtek Ltd. Cross talk reduction
CN113767315B (zh) * 2019-01-18 2024-05-24 上海宜晟生物科技有限公司 多模式照明系统
KR102807519B1 (ko) * 2019-03-29 2025-05-16 다이킨 고교 가부시키가이샤 성형품의 검사 방법 및 성형품의 제조 방법
EP3786574B1 (de) * 2019-08-26 2024-12-18 Sturm Maschinen- & Anlagenbau GmbH Sensorvorrichtung
CN111272773B (zh) * 2019-12-31 2021-10-29 浙江大学 一种半导体晶圆表面缺陷的快速超高分辨检测系统
EP3851834B1 (en) * 2020-01-16 2024-06-05 Roche Diagnostics GmbH Device for thermocycling biological samples, monitoring instrument comprising the same, and method for thermocycling biological samples using such device
CN113932728A (zh) * 2020-06-29 2022-01-14 深圳中科飞测科技股份有限公司 一种检测设备及检测方法
JP7134509B2 (ja) * 2021-01-27 2022-09-12 シンクランド株式会社 光干渉断層撮影システム
US11698622B2 (en) 2021-03-09 2023-07-11 Glowforge Inc. Previews for computer numerically controlled fabrication
CN115561255B (zh) * 2021-07-02 2025-07-15 深圳中科飞测科技股份有限公司 检测设备及检测方法、检测系统及存储介质
DE102021211046A1 (de) * 2021-09-30 2023-03-30 Micro-Epsilon Optronic Gmbh Spektrometer, Abstandsmesssystem sowie Verfahren zum Betreiben eines Spektrometers
US11852464B2 (en) * 2021-12-20 2023-12-26 Mloptic Corp. Chromatic confocal sensor with imaging capability for 6-axis spatial allocation calibration
CN116634254A (zh) * 2022-02-11 2023-08-22 深超光电（深圳）有限公司 成像系统及光学装置
EP4279861A1 (en) 2022-05-19 2023-11-22 Unity Semiconductor A method and a system for characterising structures etched in a substrate
EP4279862A1 (en) * 2022-05-19 2023-11-22 Unity Semiconductor A method and a system for combined characterisation of structures etched in a substrate
EP4279860A1 (en) * 2022-05-19 2023-11-22 Unity Semiconductor A method and a system for characterising structures through a substrate
CN115356350B (zh) * 2022-10-19 2023-03-14 苏州康代智能科技股份有限公司 多光谱led照明系统、光学检测设备及照明方法
CN117110290B (zh) * 2023-06-20 2025-08-12 华侨大学 一种明暗场和白光干涉的缺陷检测系统和检测方法

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5590538A (en) * 1995-11-16 1997-01-07 Lockheed Missiles And Space Company, Inc. Stacked multistage Joule-Thomson cryostat
JP3775861B2 (ja) * 1996-08-14 2006-05-17 株式会社ナノシステムソリューションズ 半導体ウェーハの検査方法および検査装置
US5821549A (en) * 1997-03-03 1998-10-13 Schlumberger Technologies, Inc. Through-the-substrate investigation of flip-chip IC's
JP3827999B2 (ja) * 2001-11-22 2006-09-27 株式会社モリテックス 赤外線撮像装置とその光源装置とバンドパスフィルタ
US6686270B1 (en) * 2002-08-05 2004-02-03 Advanced Micro Devices, Inc. Dual damascene trench depth monitoring
TW200519373A (en) * 2003-10-27 2005-06-16 Nikon Corp Surface inspection device and method
US8077305B2 (en) * 2004-04-19 2011-12-13 Owen Mark D Imaging semiconductor structures using solid state illumination
JP4531465B2 (ja) * 2004-07-06 2010-08-25 株式会社フジクラ ブラインドビアの深さ評価方法および深さ評価装置ならびに基板の研磨装置
US7477401B2 (en) * 2004-11-24 2009-01-13 Tamar Technology, Inc. Trench measurement system employing a chromatic confocal height sensor and a microscope
WO2006084279A2 (en) * 2005-02-04 2006-08-10 University Of Florida Research Foundation, Inc. Single fiber endoscopic full-field optical coherence tomography (oct) imaging probe
TWI391645B (zh) * 2005-07-06 2013-04-01 Nanometrics Inc 晶圓或其他工作表面下污染物及缺陷非接觸測量之差分波長光致發光
US20070148792A1 (en) 2005-12-27 2007-06-28 Marx David S Wafer measurement system and apparatus
US7554656B2 (en) * 2005-10-06 2009-06-30 Kla-Tencor Technologies Corp. Methods and systems for inspection of a wafer
US7485892B2 (en) * 2005-12-29 2009-02-03 Carl Zeiss Meditec Inc. Optical broadband emitters and methods of making the same
US7374621B2 (en) * 2006-02-09 2008-05-20 Hitachi Global Storage Technologies Netherlands Bv System and method for cleaning chemistry and processing during thin film magnetic head wafer fabrication
JP2008083059A (ja) * 2006-09-26 2008-04-10 David S Marx ウェーハの測定システム及び測定装置
JP2008170366A (ja) * 2007-01-15 2008-07-24 Disco Abrasive Syst Ltd チャックテーブルに保持された被加工物の計測装置およびレーザー加工機
JP2008218799A (ja) * 2007-03-06 2008-09-18 Topcon Corp 表面検査方法及び装置
EP2240568A4 (en) * 2007-12-10 2016-04-13 Samsung Electronics Co Ltd THIN FILM BIOVENTILING DEVICE AND CONTROL UNIT THEREFOR
JP5473265B2 (ja) * 2008-07-09 2014-04-16 キヤノン株式会社 多層構造計測方法および多層構造計測装置
US8223327B2 (en) * 2009-01-26 2012-07-17 Kla-Tencor Corp. Systems and methods for detecting defects on a wafer
US8461532B2 (en) * 2009-11-05 2013-06-11 The Aerospace Corporation Refraction assisted illumination for imaging
US8450688B2 (en) * 2009-11-05 2013-05-28 The Aerospace Corporation Refraction assisted illumination for imaging
US8330946B2 (en) * 2009-12-15 2012-12-11 Nanometrics Incorporated Silicon filter for photoluminescence metrology
DE102010015944B4 (de) * 2010-01-14 2016-07-28 Dusemund Pte. Ltd. Dünnungsvorrichtung mit einer Nassätzeinrichtung und einer Überwachungsvorrichtung sowie Verfahren für ein in-situ Messen von Waferdicken zum Überwachen eines Dünnens von Halbleiterwafern
GB2478590A (en) * 2010-03-12 2011-09-14 Precitec Optronik Gmbh Apparatus and method for monitoring a thickness of a silicon wafer
EP2378548A1 (en) * 2010-04-19 2011-10-19 Nanda Technologies GmbH Methods of processing and inspecting semiconductor substrates
FR2959305B1 (fr) 2010-04-26 2014-09-05 Nanotec Solution Dispositif optique et procede d'inspection d'objets structures.
CN101915547B (zh) * 2010-07-28 2012-05-02 深圳市斯尔顿科技有限公司 一种时域oct测量的方法和时域oct系统
US10460998B2 (en) * 2010-11-09 2019-10-29 Nikon Corporation Method for inspecting substrate, substrate inspection apparatus, exposure system, and method for producing semiconductor device
US9714825B2 (en) * 2011-04-08 2017-07-25 Rudolph Technologies, Inc. Wafer shape thickness and trench measurement

Also Published As

Publication number Publication date
JP2015532713A (ja) 2015-11-12
EP2888552B1 (fr) 2019-04-03
CN104620071B (zh) 2018-06-29
KR20150046065A (ko) 2015-04-29
SG11201501124RA (en) 2015-04-29
KR102276035B1 (ko) 2021-07-12
US10043266B2 (en) 2018-08-07
JP6277530B2 (ja) 2018-02-14
US20150228069A1 (en) 2015-08-13
EP2888552A1 (fr) 2015-07-01
CN104620071A (zh) 2015-05-13
CN104620072A (zh) 2015-05-13
FR2994741B1 (fr) 2023-01-20
US10074172B2 (en) 2018-09-11
FR2994734B1 (fr) 2017-08-25
KR102047578B1 (ko) 2019-11-21
FR2994741A1 (fr) 2014-02-28
WO2014029703A1 (fr) 2014-02-27
KR20150043352A (ko) 2015-04-22
US20150243024A1 (en) 2015-08-27
WO2014029784A1 (fr) 2014-02-27
JP2015536037A (ja) 2015-12-17
EP2888551A1 (fr) 2015-07-01
EP2888551B1 (fr) 2018-10-17
FR2994734A1 (fr) 2014-02-28

Similar Documents

Publication Publication Date Title
SG11201501263SA (en) Device and method for making dimensional measurements on multilayer objects such as wafers
EP2956821B8 (en) Method and apparatus for three-dimensional fabrication
SG11201405431TA (en) Method and apparatus for manufacturing semiconductor device
GB2519006B (en) Size measurement device and size measurement method
SG11201504825RA (en) Semiconductor device and method for manufacturing the same
EP2810054A4 (en) METHOD AND DEVICE FOR MEASURING THE THREE-DIMENSIONAL STRUCTURE OF A SURFACE
IL234055A0 (en) System and method for testing
GB201308662D0 (en) Apparatus for fabrication of three dimensional objects
IL230903A0 (en) Method and metrological device and method for manufacturing a device
EP2808642A4 (en) HOLE SHAPE MEASURING APPARATUS AND HOLE SHAPE MEASURING METHOD
SG11201400794QA (en) Apparatus and method for 3d surface measurement
EP2910917A4 (en) SENSOR AND METHOD FOR MANUFACTURING SAME
GB2504822B (en) Range measurement apparatus and range measurement method
PL2707705T3 (pl) Urządzenie do badania właściwości powierzchni i sposób badania właściwości powierzchni
GB201317904D0 (en) Size measurement apparatus and size measurement method
EP2835882A4 (en) SEMICONDUCTOR LASER DEVICE AND METHOD FOR MANUFACTURING THE SAME
EP2935615A4 (en) METHOD FOR IMPROVING MEASUREMENT ACCURACY AND RELATED DEVICES AND SYSTEMS
SG2013077656A (en) Magnetoresistive device and method for forming the same
SG11201404426YA (en) Semiconductor device and method for producing same
EP2860490A4 (en) THREE-DIMENSIONAL MEASURING APPARATUS AND THREE-DIMENSIONAL MEASURING METHOD
EP2816594A4 (en) SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREFOR
EP3021568A4 (en) Imaging apparatus and method for manufacturing imaging apparatus
EP2786238A4 (en) METHOD AND DEVICE FOR PROCESSING MITER PAGE
GB2499327B (en) Measurement apparatus and method
SG11201404460QA (en) Semiconductor device and method for producing same