SG11201408708SA - Resin sheet laminate and process for producing semiconductor light-emitting element using same - Google Patents

Resin sheet laminate and process for producing semiconductor light-emitting element using same

Info

Publication number
SG11201408708SA
SG11201408708SA SG11201408708SA SG11201408708SA SG11201408708SA SG 11201408708S A SG11201408708S A SG 11201408708SA SG 11201408708S A SG11201408708S A SG 11201408708SA SG 11201408708S A SG11201408708S A SG 11201408708SA SG 11201408708S A SG11201408708S A SG 11201408708SA
Authority
SG
Singapore
Prior art keywords
emitting element
same
semiconductor light
resin sheet
sheet laminate
Prior art date
Application number
SG11201408708SA
Other languages
English (en)
Inventor
Nobuo Matsumura
Yutaka Ishida
Tetsuya Goto
Original Assignee
Toray Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries filed Critical Toray Industries
Publication of SG11201408708SA publication Critical patent/SG11201408708SA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y10T428/24331—Composite web or sheet including nonapertured component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Laminated Bodies (AREA)
  • Luminescent Compositions (AREA)
SG11201408708SA 2012-06-28 2013-06-13 Resin sheet laminate and process for producing semiconductor light-emitting element using same SG11201408708SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012145161 2012-06-28
PCT/JP2013/066357 WO2014002784A1 (ja) 2012-06-28 2013-06-13 樹脂シート積層体およびそれを用いた半導体発光素子の製造方法

Publications (1)

Publication Number Publication Date
SG11201408708SA true SG11201408708SA (en) 2015-02-27

Family

ID=49782946

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201408708SA SG11201408708SA (en) 2012-06-28 2013-06-13 Resin sheet laminate and process for producing semiconductor light-emitting element using same

Country Status (7)

Country Link
US (1) US20150171287A1 (ko)
JP (1) JP6354159B2 (ko)
KR (1) KR101922457B1 (ko)
CN (1) CN104321888B (ko)
SG (1) SG11201408708SA (ko)
TW (1) TW201407832A (ko)
WO (1) WO2014002784A1 (ko)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10655792B2 (en) 2014-09-28 2020-05-19 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
JP6267011B2 (ja) * 2014-03-05 2018-01-24 シチズン電子株式会社 半導体発光装置の製造方法及び半導体発光装置
JP2015182429A (ja) * 2014-03-26 2015-10-22 日東電工株式会社 成型用シートおよびその施工方法
KR101520743B1 (ko) * 2014-05-16 2015-05-18 코닝정밀소재 주식회사 발광 다이오드 패키지 제조방법
US11525547B2 (en) 2014-09-28 2022-12-13 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11997768B2 (en) 2014-09-28 2024-05-28 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11686436B2 (en) 2014-09-28 2023-06-27 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and light bulb using LED filament
US11543083B2 (en) 2014-09-28 2023-01-03 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US12007077B2 (en) 2014-09-28 2024-06-11 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US11085591B2 (en) 2014-09-28 2021-08-10 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11421827B2 (en) 2015-06-19 2022-08-23 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11073248B2 (en) * 2014-09-28 2021-07-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
WO2016052783A1 (ko) * 2014-10-02 2016-04-07 (주)라이타이저코리아 형광층 배치 방법
WO2016194947A1 (ja) * 2015-06-02 2016-12-08 日東電工株式会社 蛍光体樹脂シート、貼着光半導体素子およびその製造方法
WO2016194948A1 (ja) * 2015-06-02 2016-12-08 日東電工株式会社 蛍光体樹脂シートの製造方法
CN111736240A (zh) 2015-07-17 2020-10-02 大日本印刷株式会社 光学部件用层积体以及图像显示装置
CN106469780B (zh) 2015-08-18 2018-02-13 江苏诚睿达光电有限公司 一种基于串联滚压的有机硅树脂光转换体贴合封装led的工艺方法
PL3340319T3 (pl) 2015-08-18 2020-03-31 Jiangsu Cherrity Optronics Co., Ltd System urządzeń wykorzystujący fotokonwerter z żywicy termoplastycznej do pakowania wiązanego prowadzonego przez walcowanie
PL3300126T3 (pl) 2015-08-18 2019-11-29 Jiangsu Cherrity Optronics Co Ltd Sposób procesowy pakowania wiązanego LED przy użyciu oczyszczonego fotokonwertera i system sprzętu do oczyszczania
CN106469768B (zh) * 2015-08-18 2018-02-02 江苏诚睿达光电有限公司 一种异形有机硅树脂光转换体贴合封装led的装备系统
CN106469778B (zh) 2015-08-18 2017-12-22 江苏诚睿达光电有限公司 一种异形有机硅树脂光转换体贴合封装led的工艺方法
CN106469767B (zh) * 2015-08-18 2017-12-01 江苏诚睿达光电有限公司 一种基于串联滚压的有机硅树脂光转换体贴合封装led的装备系统
CN106469772B (zh) * 2015-08-18 2018-01-05 江苏诚睿达光电有限公司 一种基于滚压式的热塑性树脂光转换体贴合封装led的工艺方法
US10193031B2 (en) * 2016-03-11 2019-01-29 Rohinni, LLC Method for applying phosphor to light emitting diodes and apparatus thereof
WO2017164225A1 (ja) * 2016-03-22 2017-09-28 北海製罐株式会社 合成樹脂製多重ボトル
JP6447557B2 (ja) 2016-03-24 2019-01-09 日亜化学工業株式会社 発光装置の製造方法
JP2017194581A (ja) * 2016-04-21 2017-10-26 加藤　陽弘 粘着性蛍光シート及びこれを用いた発光装置
CN106098909B (zh) * 2016-06-15 2019-04-26 厦门大学 一种led照明用复合结构荧光玻璃片的制备方法
KR102186445B1 (ko) * 2016-09-02 2020-12-04 후지필름 가부시키가이샤 형광체 함유 필름 및 백라이트 유닛
US10276763B2 (en) * 2016-10-04 2019-04-30 Lumileds Llc Light emitting device with phase changing off state white material and methods of manufacture
CN106449951B (zh) * 2016-11-16 2019-01-04 厦门市三安光电科技有限公司 一种发光二极管封装结构的制作方法
JP6566016B2 (ja) * 2016-12-21 2019-08-28 日亜化学工業株式会社 発光装置の製造方法
CN108231974B (zh) * 2016-12-21 2022-09-02 日亚化学工业株式会社 发光装置的制造方法
WO2018219460A1 (en) * 2017-06-01 2018-12-06 Osram Opto Semiconductors Gmbh Method for producing an optoelectronic device
US11355548B2 (en) 2017-12-20 2022-06-07 Lumileds Llc Monolithic segmented LED array architecture
US11335835B2 (en) 2017-12-20 2022-05-17 Lumileds Llc Converter fill for LED array
US11527683B2 (en) * 2018-10-11 2022-12-13 Samsung Electronics Co., Ltd. Laser printing of color converter devices on micro LED display devices and methods
US10910433B2 (en) * 2018-12-31 2021-02-02 Lumileds Llc Pixelated LED array with optical elements
CN114787997A (zh) * 2019-10-15 2022-07-22 亮锐有限责任公司 形成多色磷光体转换led阵列
US11749786B2 (en) 2019-10-15 2023-09-05 Lumileds Llc Multicolor phosphor-converted LED array
US11063191B2 (en) 2019-10-15 2021-07-13 Lumileds Llc Forming a multicolor phosphor-converted LED array
CN112721209B (zh) * 2020-12-15 2022-09-20 业成科技（成都）有限公司 薄膜邦定的压板治具、压合结构及薄膜邦定装置
DE102021118749A1 (de) * 2021-07-20 2023-01-26 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung einer mehrzahl von optoelektronischen halbleiterbauelementen und optoelektronisches halbleiterbauelement

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6274890B1 (en) * 1997-01-15 2001-08-14 Kabushiki Kaisha Toshiba Semiconductor light emitting device and its manufacturing method
JP3378465B2 (ja) * 1997-05-16 2003-02-17 株式会社東芝 発光装置
JPH11242327A (ja) * 1998-02-26 1999-09-07 Hitachi Chem Co Ltd 感光性エレメント、その製造方法、感光性エレメントを用いる蛍光体パターンの製造法、蛍光体パターン及びプラズマディスプレイパネル用背面板
JP4213616B2 (ja) * 2004-03-31 2009-01-21 大日本印刷株式会社 液晶パネル用ベースフィルム、液晶パネル用機能フィルム、機能フィルムの製造方法、および機能フィルムの製造装置
JP4971672B2 (ja) 2005-09-09 2012-07-11 パナソニック株式会社 発光装置
KR20080082071A (ko) * 2007-03-07 2008-09-11 삼성테크윈 주식회사 테이프 피더
US7973327B2 (en) * 2008-09-02 2011-07-05 Bridgelux, Inc. Phosphor-converted LED
WO2010042995A1 (en) * 2008-10-16 2010-04-22 I.N.C. Corporation Pty Ltd Tape material and roll comprising pressure sensitive adhesive
JP5255421B2 (ja) * 2008-12-15 2013-08-07 株式会社小糸製作所 発光モジュール、発光モジュールの製造方法、および灯具ユニット
JP5630966B2 (ja) * 2009-04-27 2014-11-26 日亜化学工業株式会社 発光素子チップ組立体およびその製造方法
KR101171290B1 (ko) * 2010-05-12 2012-08-07 서울반도체 주식회사 형광체 시트를 갖는 발광장치
JP5427709B2 (ja) * 2010-06-29 2014-02-26 日東電工株式会社 蛍光体層転写シートおよび発光装置
KR101253586B1 (ko) * 2010-08-25 2013-04-11 삼성전자주식회사 형광체 필름, 이의 제조방법, 형광층 도포 방법, 발광소자 패키지의 제조방법 및 발광소자 패키지
US8795817B2 (en) * 2010-08-25 2014-08-05 Samsung Electronics Co., Ltd. Phosphor film, method of manufacturing the same, coating method of phosphor layer, method of manufacturing LED package, and LED package manufactured thereby
US8410679B2 (en) * 2010-09-21 2013-04-02 Cree, Inc. Semiconductor light emitting devices with densely packed phosphor layer at light emitting surface
WO2012081411A1 (ja) * 2010-12-13 2012-06-21 東レ株式会社 蛍光体シート、これを用いたｌｅｄおよび発光装置ならびにｌｅｄの製造方法
JP5110229B1 (ja) * 2011-06-07 2012-12-26 東レ株式会社 樹脂シート積層体、その製造方法およびそれを用いた蛍光体含有樹脂シート付きｌｅｄチップの製造方法

Also Published As

Publication number Publication date
JP6354159B2 (ja) 2018-07-11
JPWO2014002784A1 (ja) 2016-05-30
KR101922457B1 (ko) 2018-11-27
US20150171287A1 (en) 2015-06-18
CN104321888B (zh) 2017-06-30
WO2014002784A1 (ja) 2014-01-03
CN104321888A (zh) 2015-01-28
TW201407832A (zh) 2014-02-16
KR20150028765A (ko) 2015-03-16

Similar Documents

Publication Publication Date Title
SG11201408708SA (en) Resin sheet laminate and process for producing semiconductor light-emitting element using same
EP2692759A4 (en) RESIN COMPOSITION, RESIN FOIL, CURED RESIN FOIL, RESIN FOIL LAMINATE, CURED RESIN LAMINATE, AND METHOD OF MANUFACTURING THEM, SEMICONDUCTOR DEVICE, AND LED DEVICE
EP2871055A4 (en) GLASS-RESIN LAMINATE
EP2787638A4 (en) COMPOSITE SUBSTRATE
EP2800104A4 (en) PLASTIC SUBSTRATE
EP2610058A4 (en) RESIN SHEET LAMINATE BODY, METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING LED CHIP COMPRISING PHOSPHORUS-CONTAINING RESIN SHEET USING THE SAME
EP2863545A4 (en) COMPOSITE SUBSTRATE
EP2865521A4 (en) PROCESS FOR PRODUCING LAMINATE, LAMINATE AND ARTICLE
EP2881096A4 (en) METHOD AND DEVICE FOR PRODUCING COMPOSITE SHEET
HK1214568A1 (zh) 製造塑料複合製品
EP3015487A4 (en) Resin composition, resin sheet, cured resin sheet, resin sheet structure, cured resin sheet structure, method for producing cured resin sheet structure, semiconductor device, and led device
EP2832537A4 (en) GASPERRFOLIE AND MANUFACTURING METHOD AND GASSPERRLAMINAT
EP2842734A4 (en) COMPOSITE FILM AND METHOD FOR PRODUCING A COMPOSITE FILM
EP2913855A4 (en) FLUORESCENT-RESISTANT RESIN FOIL AND LIGHT-EMITTING DEVICE
EP2902460A4 (en) ADHESIVE AND PROCESS FOR MAKING THE ADHESIVE
EP2899025A4 (en) RESIN LAMINATE
HK1200774A1 (zh) 合成樹脂叠層體
EP2857469A4 (en) laminating
HK1202492A1 (en) Synthetic resin laminate
EP2711394A4 (en) ACRYLIC RESIN COMPOSITION, ACRYLIC RESIN PLATE, ACRYLIC RESIN LAMINATE AND MANUFACTURING METHOD THEREFOR
EP2934412A4 (en) LAMINATE AND METHOD FOR THE MANUFACTURE THEREOF
GB201419145D0 (en) Process for the manufacture of a polypropylene-paper laminate and polypropylene-paper lamianate
PL2729103T3 (pl) Urządzenie do wytwarzania wyrobu arkuszowego
EP2894032A4 (en) METHOD FOR PRODUCING A LAMINATE
EP2916630A4 (en) SUBSTRATE AND METHOD FOR THE PRODUCTION OF THE SUBSTRATE