PL3300126T3 - Sposób procesowy pakowania wiązanego LED przy użyciu oczyszczonego fotokonwertera i system sprzętu do oczyszczania - Google Patents
Sposób procesowy pakowania wiązanego LED przy użyciu oczyszczonego fotokonwertera i system sprzętu do oczyszczaniaInfo
- Publication number
- PL3300126T3 PL3300126T3 PL15901632T PL15901632T PL3300126T3 PL 3300126 T3 PL3300126 T3 PL 3300126T3 PL 15901632 T PL15901632 T PL 15901632T PL 15901632 T PL15901632 T PL 15901632T PL 3300126 T3 PL3300126 T3 PL 3300126T3
- Authority
- PL
- Poland
- Prior art keywords
- photoconverter
- refining
- bond
- process method
- equipment system
- Prior art date
Links
- 238000000034 method Methods 0.000 title 2
- 238000007670 refining Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Led Device Packages (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510508209 | 2015-08-18 | ||
CN201510507431.1A CN106469771B (zh) | 2015-08-18 | 2015-08-18 | 一种基于滚压式的有机硅树脂光转换体贴合封装led的装备系统 |
CN201510640249.3A CN106558642B (zh) | 2015-09-30 | 2015-09-30 | 一种精制光转换体贴合封装led的工艺方法及精制装备系统 |
PCT/CN2015/097918 WO2017028430A1 (zh) | 2015-08-18 | 2015-12-18 | 一种精制光转换体贴合封装led的工艺方法及精制装备系统 |
EP15901632.8A EP3300126B1 (en) | 2015-08-18 | 2015-12-18 | Process method for refining photoconverter to bond-package led and refinement equipment system |
Publications (1)
Publication Number | Publication Date |
---|---|
PL3300126T3 true PL3300126T3 (pl) | 2019-11-29 |
Family
ID=58050720
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL15901632T PL3300126T3 (pl) | 2015-08-18 | 2015-12-18 | Sposób procesowy pakowania wiązanego LED przy użyciu oczyszczonego fotokonwertera i system sprzętu do oczyszczania |
Country Status (6)
Country | Link |
---|---|
US (1) | US10158051B2 (pl) |
EP (1) | EP3300126B1 (pl) |
JP (1) | JP6678191B2 (pl) |
KR (1) | KR101957871B1 (pl) |
PL (1) | PL3300126T3 (pl) |
WO (1) | WO2017028430A1 (pl) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10446728B2 (en) * | 2014-10-31 | 2019-10-15 | eLux, Inc. | Pick-and remove system and method for emissive display repair |
US10418527B2 (en) * | 2014-10-31 | 2019-09-17 | eLux, Inc. | System and method for the fluidic assembly of emissive displays |
CN106469778B (zh) * | 2015-08-18 | 2017-12-22 | 江苏诚睿达光电有限公司 | 一种异形有机硅树脂光转换体贴合封装led的工艺方法 |
WO2017028430A1 (zh) | 2015-08-18 | 2017-02-23 | 江苏诚睿达光电有限公司 | 一种精制光转换体贴合封装led的工艺方法及精制装备系统 |
KR102536844B1 (ko) * | 2018-10-15 | 2023-05-30 | 삼성디스플레이 주식회사 | 표시 장치 및 그의 제조 방법 |
KR20240077490A (ko) | 2021-07-30 | 2024-05-31 | 이-서킷 모터스 인코퍼레이티드 | 자성 물질 충전된 인쇄 회로 기판 및 인쇄 회로 기판 고정자 |
TWI824688B (zh) | 2022-08-31 | 2023-12-01 | 晶呈科技股份有限公司 | 晶粒封裝體的接合與轉移方法 |
Family Cites Families (26)
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JPS56157310A (en) * | 1980-05-09 | 1981-12-04 | Dainippon Printing Co Ltd | Manufacture of lenticular screen sheet |
JPH0631744A (ja) * | 1992-07-16 | 1994-02-08 | Japan Gore Tex Inc | 通気性離型材 |
DE19755734A1 (de) * | 1997-12-15 | 1999-06-24 | Siemens Ag | Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelementes |
JP3676624B2 (ja) * | 1998-08-05 | 2005-07-27 | 松下電器産業株式会社 | 光ディスクの製造方法及び製造装置並びに基板の製造方法 |
TW543034B (en) | 1998-08-05 | 2003-07-21 | Matsushita Electric Ind Co Ltd | Production process and apparatus of optical disk and production process of substrate |
KR100880812B1 (ko) * | 2004-03-29 | 2009-01-30 | 아티큘레이티드 테크놀러지스 엘엘씨 | 롤-투-롤 제조된 광 시트 및 캡슐화된 반도체 회로디바이스들 |
US20060280912A1 (en) * | 2005-06-13 | 2006-12-14 | Rong-Chang Liang | Non-random array anisotropic conductive film (ACF) and manufacturing processes |
US7550319B2 (en) * | 2005-09-01 | 2009-06-23 | E. I. Du Pont De Nemours And Company | Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof |
JP2008041843A (ja) * | 2006-08-03 | 2008-02-21 | Sharp Corp | 半導体発光装置および半導体発光装置の製造方法 |
WO2011105185A1 (ja) * | 2010-02-26 | 2011-09-01 | コニカミノルタオプト株式会社 | 光学半導体素子モジュールの製造方法 |
KR101022015B1 (ko) * | 2010-04-09 | 2011-03-16 | 한국기계연구원 | 열형 롤 임프린팅과 블레이드 코팅을 이용하는 필름제품 제조방법, 이를 이용한 보안 필름 및 필름 일체형 전기 소자 |
CN101872828B (zh) | 2010-06-21 | 2012-07-25 | 深圳雷曼光电科技股份有限公司 | 一种倒装led芯片的封装方法 |
KR101769356B1 (ko) * | 2011-03-25 | 2017-08-18 | 삼성전자주식회사 | 발광소자에 형광체층을 형성하는 방법 및 장치 |
KR20120109737A (ko) * | 2011-03-25 | 2012-10-09 | 삼성전자주식회사 | 발광 소자 패키지 및 그 제조 방법 |
JP5745319B2 (ja) * | 2011-04-14 | 2015-07-08 | 日東電工株式会社 | 蛍光反射シート、および、発光ダイオード装置の製造方法 |
CN102881780B (zh) * | 2011-07-15 | 2015-04-01 | 展晶科技(深圳)有限公司 | 发光模组及其制造方法 |
KR20150001766A (ko) * | 2012-04-12 | 2015-01-06 | 생-고뱅 퍼포먼스 플라스틱스 코포레이션 | 발광장치 제조방법 |
DE102012207777A1 (de) | 2012-05-10 | 2013-11-14 | Voith Patent Gmbh | Verfahren zur Herstellung einer Verpackungsmaterialbahn auf Basis mehrerer Faserstoffbahnen |
CN104321888B (zh) | 2012-06-28 | 2017-06-30 | 东丽株式会社 | 树脂片材层合体及使用其的半导体发光元件的制造方法 |
US20140001949A1 (en) | 2012-06-29 | 2014-01-02 | Nitto Denko Corporation | Phosphor layer-covered led, producing method thereof, and led device |
JP5752741B2 (ja) * | 2012-09-26 | 2015-07-22 | 富士フイルム株式会社 | 多層基板および半導体パッケージ |
KR20140109624A (ko) * | 2013-03-06 | 2014-09-16 | 삼성전자주식회사 | 대면적 임프린트 장치 및 방법 |
JP2014192326A (ja) * | 2013-03-27 | 2014-10-06 | Nitto Denko Corp | 光半導体装置の製造方法 |
JP6398626B2 (ja) * | 2014-11-07 | 2018-10-03 | 日亜化学工業株式会社 | 発光装置の製造方法 |
CN204333019U (zh) * | 2014-12-13 | 2015-05-13 | 西安宝莱特光电科技有限公司 | 一种带有真空装置的简易封装设备 |
WO2017028430A1 (zh) | 2015-08-18 | 2017-02-23 | 江苏诚睿达光电有限公司 | 一种精制光转换体贴合封装led的工艺方法及精制装备系统 |
-
2015
- 2015-12-18 WO PCT/CN2015/097918 patent/WO2017028430A1/zh active Application Filing
- 2015-12-18 JP JP2017567796A patent/JP6678191B2/ja active Active
- 2015-12-18 US US15/737,919 patent/US10158051B2/en active Active
- 2015-12-18 PL PL15901632T patent/PL3300126T3/pl unknown
- 2015-12-18 KR KR1020177036273A patent/KR101957871B1/ko active IP Right Grant
- 2015-12-18 EP EP15901632.8A patent/EP3300126B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP3300126A4 (en) | 2018-04-25 |
US10158051B2 (en) | 2018-12-18 |
WO2017028430A1 (zh) | 2017-02-23 |
EP3300126B1 (en) | 2019-05-22 |
JP2018527744A (ja) | 2018-09-20 |
KR101957871B1 (ko) | 2019-03-13 |
US20180198032A1 (en) | 2018-07-12 |
EP3300126A1 (en) | 2018-03-28 |
JP6678191B2 (ja) | 2020-04-08 |
KR20180008712A (ko) | 2018-01-24 |
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