SG11201408660QA - Microetching agent for copper, supplementary liquid for same, and manufacturing method for circuit board - Google Patents

Microetching agent for copper, supplementary liquid for same, and manufacturing method for circuit board

Info

Publication number
SG11201408660QA
SG11201408660QA SG11201408660QA SG11201408660QA SG11201408660QA SG 11201408660Q A SG11201408660Q A SG 11201408660QA SG 11201408660Q A SG11201408660Q A SG 11201408660QA SG 11201408660Q A SG11201408660Q A SG 11201408660QA SG 11201408660Q A SG11201408660Q A SG 11201408660QA
Authority
SG
Singapore
Prior art keywords
lllll
microetching agent
hyogo
copper
agent
Prior art date
Application number
SG11201408660QA
Other languages
English (en)
Inventor
Masayo Kurii
Kiyoto Tai
Mami Nakamura
Yuki Ogino
Original Assignee
Mec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mec Co Ltd filed Critical Mec Co Ltd
Publication of SG11201408660QA publication Critical patent/SG11201408660QA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
SG11201408660QA 2012-09-28 2013-06-25 Microetching agent for copper, supplementary liquid for same, and manufacturing method for circuit board SG11201408660QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012216235 2012-09-28
PCT/JP2013/067365 WO2013187537A1 (ja) 2012-09-28 2013-06-25 銅のマイクロエッチング剤及びその補給液、並びに配線基板の製造方法

Publications (1)

Publication Number Publication Date
SG11201408660QA true SG11201408660QA (en) 2015-01-29

Family

ID=49758346

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201408660QA SG11201408660QA (en) 2012-09-28 2013-06-25 Microetching agent for copper, supplementary liquid for same, and manufacturing method for circuit board

Country Status (9)

Country Link
US (1) US9011712B2 (ja)
EP (1) EP2878706B1 (ja)
JP (1) JP5404978B1 (ja)
KR (1) KR101485873B1 (ja)
CN (1) CN103890233B (ja)
HK (1) HK1196405A1 (ja)
SG (1) SG11201408660QA (ja)
TW (1) TWI467053B (ja)
WO (1) WO2013187537A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104599950B (zh) * 2014-12-31 2017-09-26 通富微电子股份有限公司 一种osp基板的蚀刻清洗设备及方法
JP6218000B2 (ja) * 2016-02-19 2017-10-25 メック株式会社 銅のマイクロエッチング剤および配線基板の製造方法
CN105887092B (zh) * 2016-04-28 2019-01-15 华南理工大学 一种适用于臭氧回收法的pcb酸性蚀刻液
JP6333455B1 (ja) * 2017-08-23 2018-05-30 メック株式会社 銅のマイクロエッチング剤および配線基板の製造方法
JP6338232B1 (ja) * 2017-09-22 2018-06-06 メック株式会社 銅表面の粗化方法および配線基板の製造方法
CN111020584B (zh) * 2019-12-23 2022-05-31 昆山市板明电子科技有限公司 铜表面微蚀粗化液及其制备方法
CN114672807A (zh) * 2022-05-26 2022-06-28 深圳市板明科技股份有限公司 一种高铜含量的有机酸超粗化微蚀液及其应用
CN115449794A (zh) * 2022-09-15 2022-12-09 昆山市板明电子科技有限公司 低微蚀量粗化微蚀液、其制备方法及铜面粗化方法
CN116288350B (zh) * 2023-02-23 2024-04-19 湖北兴福电子材料股份有限公司 一种长寿命的铜蚀刻液及其制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3645772A (en) 1970-06-30 1972-02-29 Du Pont Process for improving bonding of a photoresist to copper
JP3458023B2 (ja) 1995-08-01 2003-10-20 メック株式会社 銅および銅合金のマイクロエッチング剤
JP2923524B2 (ja) 1995-08-01 1999-07-26 メック株式会社 銅および銅合金のマイクロエッチング剤並びにマイクロエッチング方法
TW363090B (en) * 1995-08-01 1999-07-01 Mec Co Ltd Microetching composition for copper or copper alloy
CN1195895C (zh) * 1997-01-29 2005-04-06 美克株式会社 铜和铜合金的微浸蚀剂
JP4063475B2 (ja) 1999-11-10 2008-03-19 メック株式会社 銅または銅合金のエッチング剤
JP2001234367A (ja) 2000-02-23 2001-08-31 Mec Kk 銅または銅合金の表面処理剤および表面処理法
JP4090951B2 (ja) * 2003-06-26 2008-05-28 株式会社荏原電産 銅及び銅合金の鏡面仕上げエッチング液
JP2006111953A (ja) * 2004-10-18 2006-04-27 Mec Kk 銅又は銅合金のエッチング剤、その製造法、補給液及び配線基板の製造法
JP4967800B2 (ja) 2007-05-17 2012-07-04 凸版印刷株式会社 銅溶解液およびそれを用いた銅または銅合金のエッチング方法
DE102008045306A1 (de) * 2007-09-04 2009-03-05 MEC COMPANY LTD., Amagasaki Ätzlösung und Verfahren zur Bildung eines Leiterbildes
JP2009215592A (ja) * 2008-03-10 2009-09-24 Mitsubishi Paper Mills Ltd 銅および銅合金のスプレーエッチング用エッチング液
JP5443863B2 (ja) 2009-07-09 2014-03-19 株式会社Ａｄｅｋａ 銅含有材料用エッチング剤組成物及び銅含有材料のエッチング方法

Also Published As

Publication number Publication date
WO2013187537A1 (ja) 2013-12-19
HK1196405A1 (zh) 2014-12-12
EP2878706A4 (en) 2015-12-09
US9011712B2 (en) 2015-04-21
CN103890233A (zh) 2014-06-25
EP2878706B1 (en) 2016-11-09
KR20140068271A (ko) 2014-06-05
CN103890233B (zh) 2016-01-20
KR101485873B1 (ko) 2015-01-26
TWI467053B (zh) 2015-01-01
JPWO2013187537A1 (ja) 2016-02-08
US20140326696A1 (en) 2014-11-06
TW201413056A (zh) 2014-04-01
JP5404978B1 (ja) 2014-02-05
EP2878706A1 (en) 2015-06-03

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