SG11201408258TA - Method and structure providing optical isolation of a waveguide on a silicon-on-insulator substrate - Google Patents
Method and structure providing optical isolation of a waveguide on a silicon-on-insulator substrateInfo
- Publication number
- SG11201408258TA SG11201408258TA SG11201408258TA SG11201408258TA SG11201408258TA SG 11201408258T A SG11201408258T A SG 11201408258TA SG 11201408258T A SG11201408258T A SG 11201408258TA SG 11201408258T A SG11201408258T A SG 11201408258TA SG 11201408258T A SG11201408258T A SG 11201408258TA
- Authority
- SG
- Singapore
- Prior art keywords
- waveguide
- silicon
- insulator substrate
- structure providing
- optical isolation
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/136—Integrated optical circuits characterised by the manufacturing method by etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
- H01L21/76283—Lateral isolation by refilling of trenches with dielectric material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12035—Materials
- G02B2006/12061—Silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Optical Integrated Circuits (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/487,573 US9709740B2 (en) | 2012-06-04 | 2012-06-04 | Method and structure providing optical isolation of a waveguide on a silicon-on-insulator substrate |
PCT/US2013/043347 WO2014042716A1 (en) | 2012-06-04 | 2013-05-30 | Method and structure providing optical isolation of a waveguide on a silicon-on-insulator substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201408258TA true SG11201408258TA (en) | 2015-02-27 |
Family
ID=49670354
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201408258TA SG11201408258TA (en) | 2012-06-04 | 2013-05-30 | Method and structure providing optical isolation of a waveguide on a silicon-on-insulator substrate |
Country Status (8)
Country | Link |
---|---|
US (4) | US9709740B2 (ja) |
EP (1) | EP2856499B1 (ja) |
JP (1) | JP6353440B2 (ja) |
KR (1) | KR101770886B1 (ja) |
CN (1) | CN104412375B (ja) |
SG (1) | SG11201408258TA (ja) |
TW (1) | TWI503585B (ja) |
WO (1) | WO2014042716A1 (ja) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2985371A1 (fr) * | 2011-12-29 | 2013-07-05 | Commissariat Energie Atomique | Procede de fabrication d'une structure multicouche sur un support |
US9709740B2 (en) | 2012-06-04 | 2017-07-18 | Micron Technology, Inc. | Method and structure providing optical isolation of a waveguide on a silicon-on-insulator substrate |
US10094988B2 (en) | 2012-08-31 | 2018-10-09 | Micron Technology, Inc. | Method of forming photonics structures |
KR101461525B1 (ko) * | 2013-11-25 | 2014-11-26 | 한국과학기술연구원 | 광도파 효율이 개선된 광도파 부재를 구비한 신경 탐침 구조체 및 그 제조방법 |
JP6021118B2 (ja) | 2014-03-27 | 2016-11-02 | インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation | 光デバイスおよびその製造方法 |
US9690045B2 (en) * | 2014-03-31 | 2017-06-27 | Huawei Technologies Co., Ltd. | Apparatus and method for a waveguide polarizer comprising a series of bends |
US9768330B2 (en) * | 2014-08-25 | 2017-09-19 | Micron Technology, Inc. | Method and optoelectronic structure providing polysilicon photonic devices with different optical properties in different regions |
US10031292B2 (en) * | 2015-01-08 | 2018-07-24 | Acacia Communications, Inc. | Horizontal coupling to silicon waveguides |
US9618699B2 (en) | 2015-03-15 | 2017-04-11 | Cisco Technology, Inc. | Multilayer photonic adapter |
US9606291B2 (en) | 2015-06-25 | 2017-03-28 | Globalfoundries Inc. | Multilevel waveguide structure |
US9933566B2 (en) | 2015-11-13 | 2018-04-03 | Cisco Technology, Inc. | Photonic chip with an evanescent coupling interface |
WO2017112663A1 (en) | 2015-12-21 | 2017-06-29 | University Of Central Florida Research Foundation, Inc. | Optical waveguide, fabrication methods, and applications |
JP2018077264A (ja) | 2016-11-07 | 2018-05-17 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
US10571633B1 (en) | 2016-12-23 | 2020-02-25 | Acacia Communications, Inc. | Suspended cantilever waveguide |
US10416381B1 (en) | 2016-12-23 | 2019-09-17 | Acacia Communications, Inc. | Spot-size-converter design for facet optical coupling |
KR102590996B1 (ko) * | 2018-10-17 | 2023-10-17 | 삼성전자주식회사 | 반도체 장치 |
RU2704199C1 (ru) * | 2019-01-10 | 2019-10-24 | Акционерное общество "Научно-исследовательский институт физических измерений" | Способ создания структуры - кремний на изоляторе |
JP2020144294A (ja) * | 2019-03-08 | 2020-09-10 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
JP7196736B2 (ja) * | 2019-03-29 | 2022-12-27 | 住友大阪セメント株式会社 | 光導波路素子、及び光導波路デバイス |
US11067751B2 (en) * | 2019-10-09 | 2021-07-20 | Globalfoundries U.S. Inc. | Trench-based optical components for photonics chips |
US11262500B2 (en) * | 2019-12-02 | 2022-03-01 | Renesas Electronics Corporation | Semiconductor device and including an optical waveguide and method of manufacturing the same |
US11251874B1 (en) * | 2020-08-31 | 2022-02-15 | Juniper Networks, Inc. | Optical redistribution layers for high-channel-count photonics |
US11409037B2 (en) * | 2020-10-28 | 2022-08-09 | Globalfoundries U.S. Inc. | Enlarged waveguide for photonic integrated circuit without impacting interconnect layers |
US11448822B2 (en) | 2020-12-23 | 2022-09-20 | Globalfoundries U.S. Inc. | Silicon-on-insulator chip structure with substrate-embedded optical waveguide and method |
US11803009B2 (en) * | 2022-02-25 | 2023-10-31 | Globalfoundries U.S. Inc. | Photonics structures having a locally-thickened dielectric layer |
US11977258B1 (en) | 2022-12-29 | 2024-05-07 | Globalfoundries U.S. Inc. | Structure with substrate-embedded arrow waveguide and method |
Family Cites Families (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5882987A (en) | 1997-08-26 | 1999-03-16 | International Business Machines Corporation | Smart-cut process for the production of thin semiconductor material films |
US6177333B1 (en) | 1999-01-14 | 2001-01-23 | Micron Technology, Inc. | Method for making a trench isolation for semiconductor devices |
JP2000275472A (ja) | 1999-03-26 | 2000-10-06 | Fujitsu Ltd | 光導波路付基板と該基板を用いる光モジュール装置 |
US6403447B1 (en) | 1999-07-07 | 2002-06-11 | Elantec Semiconductor, Inc. | Reduced substrate capacitance high performance SOI process |
US6387720B1 (en) | 1999-12-14 | 2002-05-14 | Phillips Electronics North America Corporation | Waveguide structures integrated with standard CMOS circuitry and methods for making the same |
US6602767B2 (en) * | 2000-01-27 | 2003-08-05 | Canon Kabushiki Kaisha | Method for transferring porous layer, method for making semiconductor devices, and method for making solar battery |
US20030015770A1 (en) | 2001-07-20 | 2003-01-23 | Motorola, Inc. | Optical waveguide trenches in composite integrated circuits |
US6789659B2 (en) | 2001-08-22 | 2004-09-14 | Odawara Automation, Inc. | Stator winding system and method with pallet on pallet arrangement |
US6603559B2 (en) | 2001-10-11 | 2003-08-05 | Yuan Ze University | Silicon-on-insulator optical waveguide Michelson interferometer sensor for temperature monitoring |
US6562127B1 (en) * | 2002-01-16 | 2003-05-13 | The United States Of America As Represented By The Secretary Of The Navy | Method of making mosaic array of thin semiconductor material of large substrates |
US6993236B1 (en) * | 2002-06-24 | 2006-01-31 | Luxtera, Inc. | Polysilicon and silicon dioxide light scatterers for silicon waveguides on five layer substrates |
JP4147577B2 (ja) | 2002-07-18 | 2008-09-10 | 信越半導体株式会社 | Soiウェーハの製造方法 |
US7110629B2 (en) | 2002-07-22 | 2006-09-19 | Applied Materials, Inc. | Optical ready substrates |
US7012314B2 (en) * | 2002-12-18 | 2006-03-14 | Agere Systems Inc. | Semiconductor devices with reduced active region defects and unique contacting schemes |
US6789959B1 (en) * | 2003-02-27 | 2004-09-14 | Xilinx, Inc. | Fiber optic integrated circuit package using micromirrors |
US6897498B2 (en) | 2003-03-31 | 2005-05-24 | Sioptical, Inc. | Polycrystalline germanium-based waveguide detector integrated on a thin silicon-on-insulator (SOI) platform |
US7285433B2 (en) | 2003-11-06 | 2007-10-23 | General Electric Company | Integrated devices with optical and electrical isolation and method for making |
US20050214989A1 (en) | 2004-03-29 | 2005-09-29 | Honeywell International Inc. | Silicon optoelectronic device |
US7683407B2 (en) * | 2005-08-01 | 2010-03-23 | Aptina Imaging Corporation | Structure and method for building a light tunnel for use with imaging devices |
US7454102B2 (en) | 2006-04-26 | 2008-11-18 | Honeywell International Inc. | Optical coupling structure |
JP4936313B2 (ja) * | 2006-08-25 | 2012-05-23 | 日本碍子株式会社 | 光変調素子 |
JP2008096484A (ja) | 2006-10-06 | 2008-04-24 | Sony Corp | 光半導体装置 |
US20090087137A1 (en) * | 2007-10-02 | 2009-04-02 | My The Doan | Planar lightwave circuits with air filled trenches |
US7920770B2 (en) * | 2008-05-01 | 2011-04-05 | Massachusetts Institute Of Technology | Reduction of substrate optical leakage in integrated photonic circuits through localized substrate removal |
US7955887B2 (en) | 2008-06-03 | 2011-06-07 | International Business Machines Corporation | Techniques for three-dimensional circuit integration |
US7972922B2 (en) | 2008-11-21 | 2011-07-05 | Freescale Semiconductor, Inc. | Method of forming a semiconductor layer |
US7847353B2 (en) | 2008-12-05 | 2010-12-07 | Bae Systems Information And Electronic Systems Integration Inc. | Multi-thickness semiconductor with fully depleted devices and photonic integration |
US20100144084A1 (en) | 2008-12-05 | 2010-06-10 | Doan Hung Q | Optical waveguide structures for an image sensor |
JP5369737B2 (ja) | 2009-02-10 | 2013-12-18 | 日本電気株式会社 | 光通信システムとその製造方法 |
US8450186B2 (en) | 2009-09-25 | 2013-05-28 | Intel Corporation | Optical modulator utilizing wafer bonding technology |
US8587063B2 (en) | 2009-11-06 | 2013-11-19 | International Business Machines Corporation | Hybrid double box back gate silicon-on-insulator wafers with enhanced mobility channels |
US8791405B2 (en) | 2009-12-03 | 2014-07-29 | Samsung Electronics Co., Ltd. | Optical waveguide and coupler apparatus and method of manufacturing the same |
US9608119B2 (en) | 2010-03-02 | 2017-03-28 | Micron Technology, Inc. | Semiconductor-metal-on-insulator structures, methods of forming such structures, and semiconductor devices including such structures |
US8633067B2 (en) | 2010-11-22 | 2014-01-21 | International Business Machines Corporation | Fabricating photonics devices fully integrated into a CMOS manufacturing process |
WO2012075350A2 (en) * | 2010-12-03 | 2012-06-07 | Bae Systems Information And Electronic Systems Integration Inc. | Method of integrating slotted waveguide into cmos process |
US9709740B2 (en) | 2012-06-04 | 2017-07-18 | Micron Technology, Inc. | Method and structure providing optical isolation of a waveguide on a silicon-on-insulator substrate |
-
2012
- 2012-06-04 US US13/487,573 patent/US9709740B2/en active Active
-
2013
- 2013-05-30 CN CN201380035848.1A patent/CN104412375B/zh active Active
- 2013-05-30 WO PCT/US2013/043347 patent/WO2014042716A1/en active Application Filing
- 2013-05-30 KR KR1020147036322A patent/KR101770886B1/ko active IP Right Grant
- 2013-05-30 JP JP2015516072A patent/JP6353440B2/ja active Active
- 2013-05-30 SG SG11201408258TA patent/SG11201408258TA/en unknown
- 2013-05-30 EP EP13814270.8A patent/EP2856499B1/en active Active
- 2013-06-04 TW TW102119826A patent/TWI503585B/zh active
-
2017
- 2017-07-12 US US15/648,326 patent/US10215921B2/en active Active
-
2019
- 2019-01-15 US US16/247,996 patent/US10502896B2/en active Active
- 2019-08-16 US US16/543,446 patent/US11237327B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP6353440B2 (ja) | 2018-07-04 |
KR20150013900A (ko) | 2015-02-05 |
JP2015526883A (ja) | 2015-09-10 |
US9709740B2 (en) | 2017-07-18 |
EP2856499B1 (en) | 2024-02-07 |
CN104412375B (zh) | 2018-03-09 |
KR101770886B1 (ko) | 2017-08-23 |
US20190377133A1 (en) | 2019-12-12 |
US20130322811A1 (en) | 2013-12-05 |
WO2014042716A1 (en) | 2014-03-20 |
US20170315295A1 (en) | 2017-11-02 |
US20190162903A1 (en) | 2019-05-30 |
US10502896B2 (en) | 2019-12-10 |
US11237327B2 (en) | 2022-02-01 |
EP2856499A1 (en) | 2015-04-08 |
CN104412375A (zh) | 2015-03-11 |
TW201405184A (zh) | 2014-02-01 |
US10215921B2 (en) | 2019-02-26 |
TWI503585B (zh) | 2015-10-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG11201408258TA (en) | Method and structure providing optical isolation of a waveguide on a silicon-on-insulator substrate | |
GB2495398B (en) | Optical waveguide and display device | |
GB2498252B (en) | An optical waveguide and a method for making an optical waveguide | |
GB2505812B (en) | Optical Waveguide and Method of Fabrication | |
SG11201401800PA (en) | Optical element and mach-zehnder optical waveguide element | |
TWI561872B (en) | Device for providing vertical optical coupler for planar photonic circuits and method of forming the same | |
EP2710695A4 (en) | THROUGH RESONATORS REINFORCED OPTOELECTRONIC DEVICES AND MANUFACTURING METHOD THEREFOR | |
EP2548062A4 (en) | Fiber optic interface devices for electronic devices | |
SG10201403629TA (en) | An optical modulator and a method of forming the same | |
EP2816382A4 (en) | FIBER OPTIC SYSTEM AND MANUFACTURING METHOD THEREFOR | |
EP3063577A4 (en) | Two-sided optical fiber management tray and method of use | |
EP2751611A4 (en) | ADJUSTABLE WAVE GUIDE FOR EYE DISPLAY APPLICATIONS | |
EP2687875A4 (en) | OPTICAL ELEMENT AND METHOD FOR ITS MANUFACTURE | |
SG11201501230TA (en) | Optical waveguide device | |
GB201009810D0 (en) | A method of forming an optical device | |
EP2734876A4 (en) | OPTICAL ELEMENT, DISPLAY DEVICE THEREFOR AND METHOD OF MANUFACTURING THEREOF | |
EP2674795A4 (en) | Optical fiber and optical transmission system | |
EP2672235A4 (en) | DEVICE AND METHOD FOR MEASURING THE CHARACTERISTICS OF GLASS FIBERS | |
GB2492996B (en) | Coupled waveguide apparatus and structures therefor | |
EP2997675A4 (en) | Alignment of optical devices | |
EP2771737A4 (en) | OPTICAL ELEMENT, DISPLAY DEVICE HAVING THE SAME, AND METHOD FOR MANUFACTURING THE SAME | |
EP2781941A4 (en) | OPTICAL FIBER AND OPTICAL TRANSMISSION SYSTEM | |
EP3008503A4 (en) | Optical fiber furcation assembly and method | |
EP3047549A4 (en) | Hybrid optical apparatuses including optical waveguides | |
EP2778706A4 (en) | POSITION COMPENSATION DEVICE USING TRANSMISSION WITH VISIBLE LIGHT AND METHOD THEREFOR |