SG11201408258TA - Method and structure providing optical isolation of a waveguide on a silicon-on-insulator substrate - Google Patents

Method and structure providing optical isolation of a waveguide on a silicon-on-insulator substrate

Info

Publication number
SG11201408258TA
SG11201408258TA SG11201408258TA SG11201408258TA SG11201408258TA SG 11201408258T A SG11201408258T A SG 11201408258TA SG 11201408258T A SG11201408258T A SG 11201408258TA SG 11201408258T A SG11201408258T A SG 11201408258TA SG 11201408258T A SG11201408258T A SG 11201408258TA
Authority
SG
Singapore
Prior art keywords
waveguide
silicon
insulator substrate
structure providing
optical isolation
Prior art date
Application number
SG11201408258TA
Inventor
Roy Meade
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Publication of SG11201408258TA publication Critical patent/SG11201408258TA/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/136—Integrated optical circuits characterised by the manufacturing method by etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
    • H01L21/76283—Lateral isolation by refilling of trenches with dielectric material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12035—Materials
    • G02B2006/12061—Silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optical Integrated Circuits (AREA)
  • Thin Film Transistor (AREA)
SG11201408258TA 2012-06-04 2013-05-30 Method and structure providing optical isolation of a waveguide on a silicon-on-insulator substrate SG11201408258TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/487,573 US9709740B2 (en) 2012-06-04 2012-06-04 Method and structure providing optical isolation of a waveguide on a silicon-on-insulator substrate
PCT/US2013/043347 WO2014042716A1 (en) 2012-06-04 2013-05-30 Method and structure providing optical isolation of a waveguide on a silicon-on-insulator substrate

Publications (1)

Publication Number Publication Date
SG11201408258TA true SG11201408258TA (en) 2015-02-27

Family

ID=49670354

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201408258TA SG11201408258TA (en) 2012-06-04 2013-05-30 Method and structure providing optical isolation of a waveguide on a silicon-on-insulator substrate

Country Status (8)

Country Link
US (4) US9709740B2 (en)
EP (1) EP2856499B1 (en)
JP (1) JP6353440B2 (en)
KR (1) KR101770886B1 (en)
CN (1) CN104412375B (en)
SG (1) SG11201408258TA (en)
TW (1) TWI503585B (en)
WO (1) WO2014042716A1 (en)

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US9768330B2 (en) * 2014-08-25 2017-09-19 Micron Technology, Inc. Method and optoelectronic structure providing polysilicon photonic devices with different optical properties in different regions
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US9618699B2 (en) 2015-03-15 2017-04-11 Cisco Technology, Inc. Multilayer photonic adapter
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US9933566B2 (en) 2015-11-13 2018-04-03 Cisco Technology, Inc. Photonic chip with an evanescent coupling interface
US10585241B2 (en) 2015-12-21 2020-03-10 University Of Central Florida Research Foundation, Inc. Optical waveguide, fabrication methods, and applications
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US10416381B1 (en) 2016-12-23 2019-09-17 Acacia Communications, Inc. Spot-size-converter design for facet optical coupling
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KR102590996B1 (en) * 2018-10-17 2023-10-17 삼성전자주식회사 Semiconductor device
RU2704199C1 (en) * 2019-01-10 2019-10-24 Акционерное общество "Научно-исследовательский институт физических измерений" Method of creating structure - silicon on insulator
JP2020144294A (en) * 2019-03-08 2020-09-10 ルネサスエレクトロニクス株式会社 Semiconductor device and manufacturing method for the same
JP7196736B2 (en) * 2019-03-29 2022-12-27 住友大阪セメント株式会社 Optical waveguide element and optical waveguide device
US11067751B2 (en) * 2019-10-09 2021-07-20 Globalfoundries U.S. Inc. Trench-based optical components for photonics chips
US11262500B2 (en) * 2019-12-02 2022-03-01 Renesas Electronics Corporation Semiconductor device and including an optical waveguide and method of manufacturing the same
US11251874B1 (en) * 2020-08-31 2022-02-15 Juniper Networks, Inc. Optical redistribution layers for high-channel-count photonics
US11409037B2 (en) * 2020-10-28 2022-08-09 Globalfoundries U.S. Inc. Enlarged waveguide for photonic integrated circuit without impacting interconnect layers
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US11803009B2 (en) * 2022-02-25 2023-10-31 Globalfoundries U.S. Inc. Photonics structures having a locally-thickened dielectric layer
US11977258B1 (en) 2022-12-29 2024-05-07 Globalfoundries U.S. Inc. Structure with substrate-embedded arrow waveguide and method

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Also Published As

Publication number Publication date
JP2015526883A (en) 2015-09-10
CN104412375A (en) 2015-03-11
JP6353440B2 (en) 2018-07-04
KR101770886B1 (en) 2017-08-23
CN104412375B (en) 2018-03-09
US20170315295A1 (en) 2017-11-02
US9709740B2 (en) 2017-07-18
EP2856499B1 (en) 2024-02-07
KR20150013900A (en) 2015-02-05
US10215921B2 (en) 2019-02-26
EP2856499A1 (en) 2015-04-08
TW201405184A (en) 2014-02-01
US20190377133A1 (en) 2019-12-12
TWI503585B (en) 2015-10-11
US20190162903A1 (en) 2019-05-30
US10502896B2 (en) 2019-12-10
US11237327B2 (en) 2022-02-01
US20130322811A1 (en) 2013-12-05
WO2014042716A1 (en) 2014-03-20

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