SG11201408057UA - Double-disc grinding apparatus and workpiece double-disc grinding method - Google Patents

Double-disc grinding apparatus and workpiece double-disc grinding method

Info

Publication number
SG11201408057UA
SG11201408057UA SG11201408057UA SG11201408057UA SG11201408057UA SG 11201408057U A SG11201408057U A SG 11201408057UA SG 11201408057U A SG11201408057U A SG 11201408057UA SG 11201408057U A SG11201408057U A SG 11201408057UA SG 11201408057U A SG11201408057U A SG 11201408057UA
Authority
SG
Singapore
Prior art keywords
double
workpiece
rotation axis
llll
iii
Prior art date
Application number
SG11201408057UA
Other languages
English (en)
Inventor
Kenji Kobayashi
Original Assignee
Shinetsu Handotai Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk filed Critical Shinetsu Handotai Kk
Publication of SG11201408057UA publication Critical patent/SG11201408057UA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
SG11201408057UA 2012-07-03 2013-06-03 Double-disc grinding apparatus and workpiece double-disc grinding method SG11201408057UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012149203A JP5724958B2 (ja) 2012-07-03 2012-07-03 両頭研削装置及びワークの両頭研削方法
PCT/JP2013/003476 WO2014006818A1 (ja) 2012-07-03 2013-06-03 両頭研削装置及びワークの両頭研削方法

Publications (1)

Publication Number Publication Date
SG11201408057UA true SG11201408057UA (en) 2015-01-29

Family

ID=49881594

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201408057UA SG11201408057UA (en) 2012-07-03 2013-06-03 Double-disc grinding apparatus and workpiece double-disc grinding method

Country Status (8)

Country Link
US (1) US9669513B2 (de)
JP (1) JP5724958B2 (de)
KR (1) KR101908359B1 (de)
CN (1) CN104411455B (de)
DE (1) DE112013003038B4 (de)
SG (1) SG11201408057UA (de)
TW (1) TW201417947A (de)
WO (1) WO2014006818A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6040947B2 (ja) * 2014-02-20 2016-12-07 信越半導体株式会社 ワークの両頭研削方法
JP6383700B2 (ja) * 2015-04-07 2018-08-29 光洋機械工業株式会社 薄板状ワークの製造方法及び両頭平面研削装置
JP7159861B2 (ja) * 2018-12-27 2022-10-25 株式会社Sumco 両頭研削方法
CN110216539B (zh) * 2019-05-30 2021-10-01 南京东升冶金机械有限公司 一种薄壁结构件的精密双面磨削用机床
CN114274041B (zh) * 2021-12-24 2023-03-14 西安奕斯伟材料科技有限公司 双面研磨装置和双面研磨方法
CN114770366B (zh) * 2022-05-17 2023-11-17 西安奕斯伟材料科技股份有限公司 一种硅片双面研磨装置的静压板及硅片双面研磨装置
CN115070604B (zh) * 2022-06-09 2023-09-29 西安奕斯伟材料科技股份有限公司 双面研磨装置和双面研磨方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6807674A (de) * 1968-05-31 1969-12-02
US3560064A (en) * 1969-01-03 1971-02-02 Garrett Corp Servo controlled fluid bearing
US4643592A (en) * 1984-11-09 1987-02-17 Lewis David W Vibration limiting of rotating machinery through active control means
JP3332470B2 (ja) * 1993-04-20 2002-10-07 光洋機械工業株式会社 両頭平面研削方法および装置
US6149503A (en) * 1995-06-23 2000-11-21 Unova Uk Limited Method and apparatus for supporting a crankshaft in a grinding machine for grinding the crankpins of the crankshaft
US6296553B1 (en) 1997-04-02 2001-10-02 Nippei Toyama Corporation Grinding method, surface grinder, workpiece support, mechanism and work rest
JP3217731B2 (ja) * 1997-04-18 2001-10-15 株式会社日平トヤマ ウエハの加工方法及び両頭平面研削盤
US6062959A (en) * 1997-11-05 2000-05-16 Aplex Group Polishing system including a hydrostatic fluid bearing support
GB2335875B (en) * 1998-04-02 2000-08-30 Nsk Ltd Sphere grinding apparatus
DE102004005702A1 (de) * 2004-02-05 2005-09-01 Siltronic Ag Halbleiterscheibe, Vorrichtung und Verfahren zur Herstellung der Halbleiterscheibe
JP4143563B2 (ja) 2004-03-16 2008-09-03 住友重機械工業株式会社 ワーク保持装置及び両面加工装置
DE102007049810B4 (de) 2007-10-17 2012-03-22 Siltronic Ag Simultanes Doppelseitenschleifen von Halbleiterscheiben
JP4985451B2 (ja) * 2008-02-14 2012-07-25 信越半導体株式会社 ワークの両頭研削装置およびワークの両頭研削方法
JP5411739B2 (ja) * 2010-02-15 2014-02-12 信越半導体株式会社 キャリア取り付け方法
JP5627114B2 (ja) * 2011-07-08 2014-11-19 光洋機械工業株式会社 薄板状ワークの研削方法及び両頭平面研削盤

Also Published As

Publication number Publication date
TW201417947A (zh) 2014-05-16
JP5724958B2 (ja) 2015-05-27
CN104411455A (zh) 2015-03-11
WO2014006818A1 (ja) 2014-01-09
TWI560025B (de) 2016-12-01
CN104411455B (zh) 2016-08-17
US20150147944A1 (en) 2015-05-28
DE112013003038B4 (de) 2021-12-23
DE112013003038T5 (de) 2015-03-19
US9669513B2 (en) 2017-06-06
JP2014008594A (ja) 2014-01-20
KR20150032844A (ko) 2015-03-30
KR101908359B1 (ko) 2018-10-16

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