SG11201408057UA - Double-disc grinding apparatus and workpiece double-disc grinding method - Google Patents

Double-disc grinding apparatus and workpiece double-disc grinding method

Info

Publication number
SG11201408057UA
SG11201408057UA SG11201408057UA SG11201408057UA SG11201408057UA SG 11201408057U A SG11201408057U A SG 11201408057UA SG 11201408057U A SG11201408057U A SG 11201408057UA SG 11201408057U A SG11201408057U A SG 11201408057UA SG 11201408057U A SG11201408057U A SG 11201408057UA
Authority
SG
Singapore
Prior art keywords
double
workpiece
rotation axis
llll
iii
Prior art date
Application number
SG11201408057UA
Inventor
Kenji Kobayashi
Original Assignee
Shinetsu Handotai Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk filed Critical Shinetsu Handotai Kk
Publication of SG11201408057UA publication Critical patent/SG11201408057UA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

(i2) mwu ft iz s-5 iv x m £ titz s issaj n d9) mm IHMMi (43) m&'&m a 2014^1 R 9 0(09.01.2014) WIPO IPCT (10) WO 2014/006818 A1 H01L 21/304 (2006.01) PCT/JP2013/003476 2013 ^6^ 3 0(03.06.2013) (51) B24B 7/77(2006.01) B24B 41/06 (2012.01) (21) (22) (25) g|@ttii0>Wi§: (26) @(8&M©Wl§: (30) fiBfcftf '— 1 £: 4#Jg| 2012-149203 2012 ^7^ 3 0 (03.07.2012) JP (71) ttiHA: tt(SHIN-ETSU HAN- DOT AI CO., LTD.) [JP/JP]; T 1000004 T g 6 # 2 Tokyo (JP). (72) % BJ # : /h # ® f] (KOBAYASHI, Kenji); T 9618061 liSRSS ¥150 e JHT Fukushima (JP). (74) ftSA: $7 E ^ ^ (YOSHIMIYA, \Iikio); T 1100005 Tl 6# 1 1 -^-fg — F Tokyo (JP). (8i) (^ro&i^PBy, IS ft nj f b): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) (asrofci^isy > ±T(Dmm(Dfcm% 11^ nlfb): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW), 3. — =j V T (AM, AZ, BY, KG, KZ, RU, TJ, TM), 3 — • V / ^ (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). - mmmi 21 ^(3)) = (54) Title: DOUBLE-HEADED GRINDING DEVICE AND METHOD FOR DOUBLE-HEADED GRINDING OF WORKPIECES ^ (54) f§EKDigffc : ffiSgSFS'JSH&tf 9 — <7 < 00 i-H 00 o o 1 3 (57) Abstract: The present invention is a double-headed grinding device having a ring-shaped holder which is rotat- able for supporting thin-plate workpiece a from the outer peri­ phery along the radial direction, and a pair of grindstones for grinding both surfaces of said workpiece simultaneously as said workpiece is supported by said ring-shaped holder. Said double-headed grinding device is characterized in that it is provided with a hydrostatic bearing for supporting said ring- shaped holder in non-contact a fashion by means of the static pressure of liquid delivered from both the rotation axis direc­ tion of said ring-shaped holder and the direction perpendicu­ lar to said rotation axis, and in that the pressure force for de­ livering the liquid from the rotation axis direction and the pressure force for delivering the liquid from the direction per­ pendicular to said rotation axis can be controlled independ­ ently. Accordingly, a double-headed grinding device and a method for double-headed grinding of workpieces are provided in which improvement is achieved in the dispersion of nanotopography that is generated depending on the grind­ ing wheel, workpiece lots, and so forth, such that stable and highly accurate nanotopography can be obtained every time grinding is performed. (57)^: mm-' fn o CJ o & wo 2014/006818 AI III llll IIII III III Hill III III III Hill Hill llll lllll lllll 111 lllllll llll 111 llll m sgiKPrtefcu m gfefcot, Mi~> HUSB u bflW&S *i33S{*0>»Elc«i; U HUIBU flufB § Iclfi Ji [R1 ft b {£$• $ ti & t HU IB § Iclfi lc H H ft Jj ft b {£^ $ ti & 0) f£ij&J± ti £ % ti -6 Mi tLLxmn^it^^cDxh^zt^mtt^mmnmw.xh^o 9—*©• >7 h-£5S 5lc<fe#LT#6±-f *>-*-/ hTK^^^-r-roiibo^sgfeSL, SF8iJ£lc££LTfcffiJtfc-*-/ ^ d «t^-e#SSSSSWSUSBifttf 9—*©ffiSSSF 8iJ££jb<S&£*i3o
SG11201408057UA 2012-07-03 2013-06-03 Double-disc grinding apparatus and workpiece double-disc grinding method SG11201408057UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012149203A JP5724958B2 (en) 2012-07-03 2012-07-03 Double-head grinding apparatus and double-head grinding method for workpiece
PCT/JP2013/003476 WO2014006818A1 (en) 2012-07-03 2013-06-03 Double-headed grinding device and method for double-headed grinding of workpieces

Publications (1)

Publication Number Publication Date
SG11201408057UA true SG11201408057UA (en) 2015-01-29

Family

ID=49881594

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201408057UA SG11201408057UA (en) 2012-07-03 2013-06-03 Double-disc grinding apparatus and workpiece double-disc grinding method

Country Status (8)

Country Link
US (1) US9669513B2 (en)
JP (1) JP5724958B2 (en)
KR (1) KR101908359B1 (en)
CN (1) CN104411455B (en)
DE (1) DE112013003038B4 (en)
SG (1) SG11201408057UA (en)
TW (1) TW201417947A (en)
WO (1) WO2014006818A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6040947B2 (en) * 2014-02-20 2016-12-07 信越半導体株式会社 Double-head grinding method for workpieces
JP6383700B2 (en) * 2015-04-07 2018-08-29 光洋機械工業株式会社 Thin plate workpiece manufacturing method and double-head surface grinding apparatus
JP7159861B2 (en) * 2018-12-27 2022-10-25 株式会社Sumco Double-headed grinding method
CN110216539B (en) * 2019-05-30 2021-10-01 南京东升冶金机械有限公司 Machine tool for precise double-face grinding of thin-wall structural part
CN114274041B (en) * 2021-12-24 2023-03-14 西安奕斯伟材料科技有限公司 Double-side polishing apparatus and double-side polishing method
CN114770366B (en) * 2022-05-17 2023-11-17 西安奕斯伟材料科技股份有限公司 Static pressure plate of silicon wafer double-sided grinding device and silicon wafer double-sided grinding device
CN115070604B (en) * 2022-06-09 2023-09-29 西安奕斯伟材料科技股份有限公司 Double-sided polishing apparatus and double-sided polishing method

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NL6807674A (en) * 1968-05-31 1969-12-02
US3560064A (en) * 1969-01-03 1971-02-02 Garrett Corp Servo controlled fluid bearing
US4643592A (en) * 1984-11-09 1987-02-17 Lewis David W Vibration limiting of rotating machinery through active control means
JP3332470B2 (en) * 1993-04-20 2002-10-07 光洋機械工業株式会社 Double-ended surface grinding method and apparatus
ES2169800T3 (en) * 1995-06-23 2002-07-16 Unova Uk Ltd IMPROVEMENTS IN A GRINDING PROCESS AND IN RELATION TO THE SAME.
JP3217731B2 (en) * 1997-04-18 2001-10-15 株式会社日平トヤマ Wafer processing method and double-sided surface grinder
US6296553B1 (en) 1997-04-02 2001-10-02 Nippei Toyama Corporation Grinding method, surface grinder, workpiece support, mechanism and work rest
US6062959A (en) * 1997-11-05 2000-05-16 Aplex Group Polishing system including a hydrostatic fluid bearing support
GB2335875B (en) * 1998-04-02 2000-08-30 Nsk Ltd Sphere grinding apparatus
DE102004005702A1 (en) * 2004-02-05 2005-09-01 Siltronic Ag Semiconductor wafer, apparatus and method for producing the semiconductor wafer
JP4143563B2 (en) 2004-03-16 2008-09-03 住友重機械工業株式会社 Work holding device and double-sided processing device
DE102007049810B4 (en) 2007-10-17 2012-03-22 Siltronic Ag Simultaneous double side grinding of semiconductor wafers
JP4985451B2 (en) * 2008-02-14 2012-07-25 信越半導体株式会社 Double-head grinding apparatus for workpiece and double-head grinding method for workpiece
JP5411739B2 (en) * 2010-02-15 2014-02-12 信越半導体株式会社 Carrier mounting method
JP5627114B2 (en) * 2011-07-08 2014-11-19 光洋機械工業株式会社 Thin plate workpiece grinding method and double-head surface grinding machine

Also Published As

Publication number Publication date
US9669513B2 (en) 2017-06-06
KR20150032844A (en) 2015-03-30
US20150147944A1 (en) 2015-05-28
JP5724958B2 (en) 2015-05-27
CN104411455B (en) 2016-08-17
WO2014006818A1 (en) 2014-01-09
TW201417947A (en) 2014-05-16
DE112013003038T5 (en) 2015-03-19
KR101908359B1 (en) 2018-10-16
TWI560025B (en) 2016-12-01
DE112013003038B4 (en) 2021-12-23
JP2014008594A (en) 2014-01-20
CN104411455A (en) 2015-03-11

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