JP6383700B2 - Thin plate workpiece manufacturing method and double-head surface grinding apparatus - Google Patents

Thin plate workpiece manufacturing method and double-head surface grinding apparatus Download PDF

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JP6383700B2
JP6383700B2 JP2015078531A JP2015078531A JP6383700B2 JP 6383700 B2 JP6383700 B2 JP 6383700B2 JP 2015078531 A JP2015078531 A JP 2015078531A JP 2015078531 A JP2015078531 A JP 2015078531A JP 6383700 B2 JP6383700 B2 JP 6383700B2
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static pressure
workpiece
pair
adjustment
grinding
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JP2016198826A (en
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篤志 芝中
篤志 芝中
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Koyo Machine Industries Co Ltd
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Koyo Machine Industries Co Ltd
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Priority to KR1020160042115A priority patent/KR102499588B1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
    • H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Description

本発明は、薄板状ワークの製造方法及び両頭平面研削装置に関するものである。   The present invention relates to a method for manufacturing a thin plate workpiece and a double-head surface grinding apparatus.

例えば横型の両頭平面研削装置は、左右一対の静圧パッドと左右一対の研削砥石とを備えており、シリコンウェーハ等の薄板状ワークを、その両面側から静圧パッドにより静圧支持しつつ中心軸廻りに回転させ、回転する一対の研削砥石によりそのワークを両面側から挟み込んで研削するようになっている（例えば特許文献１参照）。   For example, a horizontal double-sided surface grinding apparatus includes a pair of left and right hydrostatic pads and a pair of left and right grinding wheels, and a thin plate-like workpiece such as a silicon wafer is supported by the hydrostatic pads from both sides. The workpiece is sandwiched from both sides by a pair of grinding wheels rotated around an axis and rotated (for example, see Patent Document 1).

この種の両頭平面研削装置では、研削中のワークは、２つの支持手段、即ち静圧パッドと研削砥石とにより、互いに異なる２箇所で支持されているため、例えばそれら２つの支持手段による支持位置が軸方向、即ちワークの板厚方向にずれていると、ワークに曲げ応力が発生し、高精度の研削を行うことができない。   In this type of double-sided surface grinding apparatus, the workpiece being ground is supported by two support means, that is, a hydrostatic pad and a grinding wheel, at two different positions. For example, a support position by these two support means Is shifted in the axial direction, that is, in the plate thickness direction of the workpiece, bending stress is generated in the workpiece, and high-precision grinding cannot be performed.

これに対し、特許文献１に記載の両頭平面研削装置は、左右の静圧パッドを軸方向に同調して移動させる移動機構を備え、ワークの装填基準位置を中心として、ワークの研削時に両静圧パッドを同調して同一速度で同一量移動させるように構成されており、これによって静圧パッドをワーク装填基準位置に対して正確に位置決めでき、高精度な研削が可能になるとしている。   On the other hand, the double-head surface grinding apparatus described in Patent Document 1 includes a moving mechanism that moves the left and right static pressure pads in synchronism with the axial direction. The pressure pad is configured to move in the same amount at the same speed in synchronism, whereby the static pressure pad can be accurately positioned with respect to the workpiece loading reference position, and high-precision grinding is possible.

特開２００３−２３６７４６号公報JP 2003-236746 A

特許文献１に記載の両頭平面研削装置では、上述のようにワークの装填基準位置を中心としてワークの研削時に両静圧パッドを同調して同一速度で同一量移動させているが、ワークが両静圧パッド間の中央で静圧支持されるとは限らず、また静圧支持位置と両研削砥石間の中央位置とが一致するとも限らないため、ワークに曲げ応力が発生しないという保証はない。   In the double-head surface grinding apparatus described in Patent Document 1, both the hydrostatic pads are synchronized and moved at the same speed at the same speed when grinding the workpiece around the workpiece loading reference position as described above. There is no guarantee that there will be no bending stress on the workpiece, because it is not necessarily supported in the center between the hydrostatic pads, and the center position between the hydrostatic support and the grinding wheel may not match. .

また、研削中のワークに曲げ応力を発生させないための他の方法としては、例えば予め試研削を行い、その試研削中の各種データ（砥石軸の電流値変化データ、ワーク挙動データ等）、研削後のワークの目視確認結果（表面粗さ、歪み等）、研削後のワークの測定データ等を総合的に分析して調整を行うという一連の作業を、所定精度が得られるまで繰り返し行う方法が考えられる。   As another method for preventing bending stress from being generated on the workpiece being ground, for example, trial grinding is performed in advance, and various data during the trial grinding (current value change data of the grinding wheel axis, workpiece behavior data, etc.), grinding A method of repeatedly performing a series of operations of comprehensively analyzing and adjusting the visual confirmation results (surface roughness, strain, etc.) of the subsequent workpiece and the measurement data of the workpiece after grinding until a predetermined accuracy is obtained. Conceivable.

しかしながら、このような試研削の繰り返しによる事前調整作業は、適切に行えば確実に高い精度を得られる一方、試研削の結果に基づいて適切な調整を行うためには作業者の十分な経験が必要であり、経験の浅い作業者には難しいという問題があった。   However, such pre-adjustment work by repeated trial grinding can ensure high accuracy if performed properly, while operators have sufficient experience to make appropriate adjustments based on the results of trial grinding. It was necessary and difficult for inexperienced workers.

本発明はこのような問題点に鑑み、薄板状ワークの研削を高精度で行うための事前調整を作業者の熟練度合いに拘わらず容易且つ確実に行うことが可能な薄板状ワークの製造方法及び両頭平面研削装置を提供することを目的とする。   In view of such problems, the present invention provides a method for manufacturing a thin plate workpiece capable of easily and reliably performing pre-adjustment for performing grinding of the thin plate workpiece with high accuracy regardless of the level of skill of the operator, and An object is to provide a double-head surface grinding apparatus.

本発明は、一対の静圧パッドと一対の研削砥石とを有する両頭平面研削装置を用いて、前記一対の静圧パッドの間で静圧支持された薄板状のワークを回転させながら、前記一対の研削砥石により前記ワークの両面を研削する研削工程と、前記研削工程の前に前記両頭平面研削装置を調整する事前調整工程とを備えた薄板状ワークの製造方法において、前記事前調整工程では、調整用ワークを前記一対の静圧パッドの間で静圧支持しつつ前記一対の研削砥石により挟持する第１状態と、前記調整用ワークを前記静圧パッドにより静圧支持することなく前記一対の研削砥石により挟持する第２状態とで前記調整用ワークの姿勢に関する所定値を取得し、それら両状態における前記所定値の変化に基づいて前記両頭平面研削装置を調整するものである。   The present invention uses a double-sided surface grinding apparatus having a pair of static pressure pads and a pair of grinding wheels, while rotating the thin plate-like workpiece supported statically between the pair of static pressure pads. In the manufacturing method of a thin plate-like workpiece comprising a grinding step of grinding both surfaces of the workpiece with a grinding wheel, and a pre-adjustment step of adjusting the double-sided surface grinding device before the grinding step, A first state in which the adjustment work is held between the pair of static pressure pads while being supported by the pair of grinding wheels, and the adjustment work is not supported by the static pressure pad. A predetermined value related to the posture of the adjustment work is acquired in the second state sandwiched between the two grinding wheels, and the double-sided surface grinding apparatus is adjusted based on changes in the predetermined value in both states. .

また、前記一対の静圧パッドと前記調整用ワークとの距離を検出する距離検出センサの出力値を前記所定値とすることが望ましい。この場合、前記第１状態と前記第２状態とにおける前記距離検出センサの出力値の変化量が所定判定値以下となることを条件に前記事前調整工程を終了することが望ましい。   In addition, it is preferable that an output value of a distance detection sensor that detects a distance between the pair of static pressure pads and the adjustment work is the predetermined value. In this case, it is desirable that the pre-adjustment step is terminated on condition that the amount of change in the output value of the distance detection sensor in the first state and the second state is equal to or less than a predetermined determination value.

また、前記事前調整工程は、前記調整用ワークを前記一対の静圧パッドの間で静圧支持する静圧支持工程と、前記静圧支持工程で静圧支持された前記調整用ワークを前記一対の研削砥石により挟持する砥石支持工程と、前記砥石支持工程の後に前記一対の静圧パッドによる静圧支持を停止する静圧支持停止工程と、前記静圧支持停止工程の前後における前記距離検出センサの出力値の変化量が前記所定判定値以下であるか否かを判定する姿勢変化判定工程とを備え、前記姿勢変化判定工程で前記変化量が前記所定判定値以下であると判定されるまで、前記変化量を小さくする方向に前記両頭平面研削装置を調整しつつ前記静圧支持工程以降の工程を繰り返すことが望ましい。   The pre-adjustment step includes a static pressure support step of statically supporting the adjustment workpiece between the pair of static pressure pads, and the adjustment workpiece supported statically in the static pressure support step. Grinding wheel support step sandwiched between a pair of grinding wheels, a static pressure support stop step for stopping static pressure support by the pair of static pressure pads after the grinding wheel support step, and the distance detection before and after the static pressure support stop step A posture change determination step for determining whether or not a change amount of the output value of the sensor is equal to or less than the predetermined determination value, and the change amount is determined to be equal to or less than the predetermined determination value in the posture change determination step. It is desirable to repeat the steps after the static pressure support step while adjusting the double-sided surface grinding device in the direction of decreasing the amount of change.

また、前記砥石支持工程では、前記距離検出センサの出力値が前記静圧支持工程のときと略同一となる位置で前記一対の研削砥石により前記調整用ワークを挟持することが望ましい。   In the grindstone support step, it is preferable that the adjustment work is sandwiched between the pair of grinding wheels at a position where the output value of the distance detection sensor is substantially the same as that in the static pressure support step.

また本発明は、一対の静圧パッドの間で静圧支持された薄板状のワークを回転させながら、一対の研削砥石により前記ワークの両面を研削する両頭平面研削装置において、調整用ワークを前記一対の静圧パッドの間で静圧支持しつつ前記一対の研削砥石により挟持する第１状態と、前記調整用ワークを前記静圧パッドにより静圧支持することなく前記一対の研削砥石により挟持する第２状態とで前記調整用ワークの姿勢に関する所定値を夫々取得し、それら両状態における前記所定値の変化に基づいて、前記ワークの研削前に所定の調整を行う事前調整手段を備えたものである。   Further, the present invention provides a dual-head surface grinding apparatus for grinding both surfaces of a workpiece with a pair of grinding wheels while rotating a thin plate-like workpiece supported statically between a pair of static pressure pads. A first state where the pair of static pressure pads are supported by the pair of grinding wheels while being supported by the pair of static pressure pads, and the adjustment work is sandwiched by the pair of grinding wheels without being supported by the static pressure pads. Preliminary adjustment means for obtaining predetermined values relating to the posture of the workpiece for adjustment in the second state and performing predetermined adjustment before grinding of the workpiece based on changes in the predetermined values in both states It is.

本発明によれば、薄板状ワークの研削を高精度で行うための事前調整を作業者の熟練度合いに拘わらず容易且つ確実に行うことが可能である。   ADVANTAGE OF THE INVENTION According to this invention, it is possible to perform easily and reliably prior adjustment for grind | pulverizing a thin-plate shaped workpiece | work with high precision irrespective of a worker's skill level.

本発明の第１の実施形態を示す横型両頭平面研削装置の平面断面図である。1 is a cross-sectional plan view of a horizontal double-sided surface grinding apparatus showing a first embodiment of the present invention. 同装置の側面図である。It is a side view of the same apparatus. 同装置の制御系のブロック図である。It is a block diagram of the control system of the apparatus. 同装置を用いた薄板状ワークの製造方法のフローチャートである。It is a flowchart of the manufacturing method of the thin plate-shaped workpiece | work using the apparatus. 同製造方法における静圧支持工程の説明図である。It is explanatory drawing of the static pressure support process in the manufacturing method. 同製造方法における砥石支持工程の説明図である。It is explanatory drawing of the grindstone support process in the manufacturing method. 同製造方法における静圧支持停止工程の説明図である。It is explanatory drawing of the static pressure support stop process in the manufacturing method. 同製造方法における第１状態と第２状態とにおけるセンサ出力値の変化の一例を示す説明図である。It is explanatory drawing which shows an example of the change of the sensor output value in the 1st state and 2nd state in the manufacturing method. 同製造方法における第１状態と第２状態とにおけるセンサ出力値の変化の一例を示す説明図である。It is explanatory drawing which shows an example of the change of the sensor output value in the 1st state and 2nd state in the manufacturing method. 本発明の第２の実施形態を示す横型両頭平面研削装置の制御系のブロック図である。It is a block diagram of the control system of the horizontal type double-head surface grinding apparatus which shows the 2nd Embodiment of this invention.

以下、本発明の実施形態を図面に基づいて詳述する。図１〜図９は本発明を横型両頭平面研削装置及びそれを用いた薄板状ワークの製造方法に採用した第１の実施形態を例示している。本実施形態の横型両頭平面研削装置は、図１，図２に示すように、シリコンウェーハ等の薄板状のワークＷを静圧支持する左右一対の静圧パッド１，２と、それら静圧パッド１，２により静圧支持されたワークＷを、キャリア３を介してその略中心廻りに回転駆動する駆動手段（図示省略）と、左右方向の軸心廻りに回転自在に配置され且つワークＷをその両面側から挟み込んで研削する左右一対の研削砥石４，５とを備えている。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. 1 to 9 illustrate a first embodiment in which the present invention is employed in a horizontal double-head surface grinding apparatus and a method for manufacturing a thin plate workpiece using the same. As shown in FIGS. 1 and 2, the horizontal double-head surface grinding apparatus of this embodiment includes a pair of left and right static pressure pads 1 and 2 that statically support a thin plate-like workpiece W such as a silicon wafer, and the static pressure pads. Drive means (not shown) for rotating the workpiece W supported by static pressures 1 and 2 around its substantially center via the carrier 3, and a workpiece W arranged so as to be rotatable about the left and right axis. A pair of left and right grinding wheels 4 and 5 for sandwiching and grinding from both sides are provided.

静圧パッド１，２は軸方向視略円形で、外周側から中心側に向けて凹入する凹部１ａ，２ａを例えば下部側に備え、その凹部１ａ，２ａに対応して研削砥石４，５が配置されている。静圧パッド１，２は、ワークＷの近傍の前進位置と、その前進位置よりもワークＷから離間した退避位置との間で左右方向に移動可能であり、前進位置において、ワークＷに対向するワーク支持面１ｂ，２ｂに供給される静圧流体（ここでは静圧水）を介してワークＷを静圧支持するようになっている。   The static pressure pads 1 and 2 are substantially circular in the axial direction, and have recesses 1a and 2a that are recessed from the outer peripheral side toward the center side, for example, on the lower side, and grinding wheels 4 and 5 corresponding to the recesses 1a and 2a. Is arranged. The static pressure pads 1 and 2 are movable in the left-right direction between an advance position in the vicinity of the work W and a retracted position farther from the work W than the advance position, and face the work W at the advance position. The workpiece W is statically supported via a static pressure fluid (here, static pressure water) supplied to the workpiece support surfaces 1b and 2b.

静圧パッド１，２のワーク支持面１ｂ，２ｂ側には、所定のノズルを介して静圧水が供給される複数個のポケット（図示省略）、各ポケットからの静圧水を外側へと排出する排出溝（図示省略）の他、凹部１ａ，２ａの近傍に所定間隔をおいて複数個（例えば周方向に３個）のエアセンサ６ａ〜６ｃ，７ａ〜７ｃが配置されている。   On the work support surfaces 1b and 2b side of the static pressure pads 1 and 2 are a plurality of pockets (not shown) to which static pressure water is supplied via a predetermined nozzle, and the static pressure water from each pocket is outward. In addition to the discharge grooves (not shown) for discharging, a plurality (for example, three in the circumferential direction) of air sensors 6a to 6c and 7a to 7c are arranged in the vicinity of the recesses 1a and 2a at a predetermined interval.

エアセンサ（距離検出センサ）６ａ〜６ｃ，７ａ〜７ｃは、エアノズルからワークＷ側にエアを噴出して、そのときの背圧の変化によりワークＷと静圧パッド１，２のワーク支持面１ｂ，２ｂとの隙間の大きさ（距離）に応じた出力を行うようになっており、凹部１ａ，２ａの前側（図１における下側）にエアセンサ６ａ，７ａが、後側（図１における上側）にエアセンサ６ｃ，７ｃが、上側にエアセンサ６ｂ，７ｂが、夫々左右方向に対応するように配置されている。なお、エアセンサ６ａ〜６ｃ，７ａ〜７ｃは距離検出センサの一例に過ぎず、ワークＷとの距離を検出し得るものであれば他のセンサ、例えばレーザ式センサ、接触式センサ等を用いてもよい。   The air sensors (distance detection sensors) 6a to 6c and 7a to 7c eject air from the air nozzle to the work W side, and the work support surfaces 1b of the work W and the static pressure pads 1 and 2 due to changes in back pressure at that time. 2b is output according to the size (distance) of the gap between the air sensors 6a and 7a on the front side (lower side in FIG. 1) of the recesses 1a and 2a, and the rear side (upper side in FIG. 1). The air sensors 6c and 7c are arranged on the upper side so that the air sensors 6b and 7b correspond to the left and right directions, respectively. Note that the air sensors 6a to 6c and 7a to 7c are merely examples of distance detection sensors, and other sensors such as a laser sensor, a contact sensor, and the like may be used as long as they can detect the distance from the workpiece W. Good.

研削砥石４，５はカップ型等であって、軸受ケース８，９により回転自在に支持される左右方向の砥石軸１０，１１の先端側に設けられており、砥石駆動モータ１２，１３の駆動により砥石軸１０，１１を介してその砥石軸１０，１１廻りに回転するようになっている。また研削砥石４，５は、例えば軸受ケース８，９等を介して切り込み駆動モータ（図示省略）の駆動により左右方向（軸方向）に移動可能であり、また例えば軸受ケース８，９等を介して軸方向に対する傾きを調整可能となっている。   The grinding wheels 4 and 5 are cup-shaped or the like, and are provided on the front end side of the left and right grinding wheel shafts 10 and 11 that are rotatably supported by the bearing cases 8 and 9, and are driven by the grinding wheel drive motors 12 and 13. Thus, the wheel rotates about the grinding wheel shafts 10 and 11 via the grinding wheel shafts 10 and 11. The grinding wheels 4 and 5 can be moved in the left and right direction (axial direction) by driving a cutting drive motor (not shown) through the bearing cases 8 and 9, for example. The inclination with respect to the axial direction can be adjusted.

キャリア３は、ワークＷを挿入可能なワーク装着孔１４を備えた略円環状で、その板厚はワークＷよりも薄く、外周に沿って配置された複数個の支持ローラ１５により略中心廻りに回転自在に支持され、駆動手段（図示省略）により回転駆動可能となっている。キャリア３には、ワーク装着孔１４内に突出してワークＷのノッチ部１６に係合する係合部１７が一体に設けられている。   The carrier 3 has a substantially annular shape having a workpiece mounting hole 14 into which the workpiece W can be inserted. The thickness of the carrier 3 is smaller than that of the workpiece W, and the carrier 3 is approximately centered by a plurality of support rollers 15 arranged along the outer periphery. It is rotatably supported and can be rotated by a driving means (not shown). The carrier 3 is integrally provided with an engaging portion 17 that protrudes into the workpiece mounting hole 14 and engages with the notch portion 16 of the workpiece W.

図３は本実施形態の横型両頭平面研削装置の制御係の概略構成を示している。この制御系は、静圧パッド１，２の移動（前進・後退）、静圧水の供給・停止等を制御する静圧パッド制御手段２１と、研削砥石４，５の移動（前進・後退）、回転・停止等を制御する砥石制御手段２２と、それら静圧パッド制御手段２１、砥石制御手段２２等に対する各種設定、その他の操作を行うための操作手段２３等を備えている。   FIG. 3 shows a schematic configuration of the controller in the horizontal double-sided surface grinding apparatus of the present embodiment. This control system includes a static pressure pad control means 21 for controlling the movement (advance / retreat) of the static pressure pads 1 and 2 and the supply / stop of the hydrostatic water, and the movement (advance / retreat) of the grinding wheels 4 and 5. Further, there are provided a grindstone control means 22 for controlling rotation, stop, etc., and various setting for the static pressure pad control means 21, the grindstone control means 22, etc., and an operation means 23 for performing other operations.

操作手段２３には、例えば静圧パッド制御手段２１に対して静圧水の流量を設定するための流量設定手段２４、砥石制御手段２２に対して研削砥石４，５の軸方向位置を設定するための位置設定手段２５、砥石制御手段２２に対して研削砥石４，５の傾きを設定するための傾き設定手段２６等の他、エアセンサ６ａ〜６ｃ，７ａ〜７ｃからの出力値を表示するセンサ出力値表示手段２７等を備えている。なお、例えば研削砥石４，５の傾きについては、砥石制御手段２２を介することなく、別途設けた傾き調整手段により調整するようにしてもよい。   In the operation means 23, for example, the flow rate setting means 24 for setting the flow rate of the static pressure water with respect to the static pressure pad control means 21, and the axial position of the grinding wheels 4 and 5 with respect to the grindstone control means 22 are set. Sensor for displaying output values from the air sensors 6a to 6c and 7a to 7c, in addition to the position setting means 25 and the inclination setting means 26 for setting the inclination of the grinding wheels 4 and 5 to the grinding wheel control means 22. Output value display means 27 and the like are provided. For example, the inclination of the grinding wheels 4 and 5 may be adjusted by a separately provided inclination adjusting means without using the grinding wheel control means 22.

続いて、図４に示すフローチャートを参照しつつ、本実施形態の横型両頭平面研削装置を用いた薄板状ワークの製造方法（調整方法及び研削方法）について説明する。横型両頭平面研削装置を用いて薄板状ワークを製造する際には、図４に示すように、まず横型両頭平面研削装置を調整する事前調整工程（Ｓ１〜Ｓ１０）を行い、その事前調整後の横型両頭平面研削装置を用いて、ワークＷの両面を研削する研削工程（Ｓ１１）を行うようになっている。   Next, a manufacturing method (adjustment method and grinding method) of a thin plate workpiece using the horizontal double-head surface grinding apparatus of the present embodiment will be described with reference to a flowchart shown in FIG. When a thin plate workpiece is manufactured using a horizontal double-sided surface grinding apparatus, as shown in FIG. 4, first, a pre-adjustment step (S1 to S10) for adjusting the horizontal double-sided surface grinding apparatus is performed, A grinding step (S11) for grinding both surfaces of the workpiece W is performed using a horizontal double-sided surface grinding apparatus.

事前調整工程では、まず事前準備として、作業者が砥石軸１０，１１の平行・同軸の調整、静圧パッド１，２の砥石軸１０，１１に対する角度（直角）の調整、エアセンサ６ａ〜６ｃ，７ａ〜７ｃのキャリブレーション、研削砥石４，５のドレッシング等を行う（Ｓ１）。エアセンサ６ａ〜６ｃ，７ａ〜７ｃのキャリブレーションでは、ワークＷと静圧パッド１，２のワーク支持面１ｂ，２ｂとの間の距離の変化量と、それに対応するセンサ出力値の変化量とが１：１となるように調整することが望ましいが、少なくとも両変化量の間に相関があればよい。また本実施形態のエアセンサ６ａ〜６ｃ，７ａ〜７ｃの出力値は、基準値を０としてワークＷとの距離が小さくなる方向が＋、大きくなる方向が−となるように設定されている。   In the pre-adjustment step, first as an advance preparation, the operator adjusts the parallel and coaxial of the grindstone shafts 10 and 11, adjusts the angle (right angle) of the static pressure pads 1 and 2 with respect to the grindstone shafts 10 and 11, air sensors 6a to 6c, Calibration of 7a-7c, dressing of the grinding wheels 4 and 5, etc. are performed (S1). In the calibration of the air sensors 6a to 6c and 7a to 7c, the change amount of the distance between the work W and the work support surfaces 1b and 2b of the static pressure pads 1 and 2 and the change amount of the sensor output value corresponding to the change amount. Although it is desirable to adjust so that it may become 1: 1, there should just be a correlation between at least both changes. The output values of the air sensors 6a to 6c and 7a to 7c of the present embodiment are set so that the reference value is 0 and the direction in which the distance from the workpiece W decreases is +, and the direction in which the distance increases is −.

事前準備（Ｓ１）に続いては、例えばキャリア３を一対の静圧パッド１，２の間に装着し、そのキャリア３に調整用ワークＷａを装着する（Ｓ２）。この調整用ワークＷａの装着は作業者が手作業で行ってもよいし、ワーク搬入出装置により自動的に行ってもよい。また、調整用ワークＷａには研削済みのワークＷを用いることが望ましいが、研削前のワークＷを用いてもよい。また、この事前調整工程ではワークの研削は行わないため、調整用ワークＷａには、実際の研削対象とは異なる金属板や樹脂板等を用いてもよい。   Subsequent to the preliminary preparation (S1), for example, the carrier 3 is mounted between the pair of static pressure pads 1 and 2, and the adjustment work Wa is mounted on the carrier 3 (S2). The adjustment work Wa may be mounted manually by an operator or automatically by a work carry-in / out device. Further, although it is desirable to use a ground workpiece W as the adjustment workpiece Wa, a workpiece W before grinding may be used. In addition, since the workpiece is not ground in this pre-adjustment step, a metal plate, a resin plate, or the like that is different from the actual grinding target may be used as the adjustment workpiece Wa.

調整用ワークＷａの装着（Ｓ２）が完了すると、続いて作業者が操作手段２３を操作することにより、静圧パッド制御手段２１の制御により左右の静圧パッド１，２に静圧水１ｃ，２ｃを供給し、図５に示すように調整用ワークＷａを静圧パッド１，２間で静圧支持する（Ｓ３：静圧支持工程）。なおこのとき、調整用ワークＷａは回転させない。続いて、作業者が操作手段２３を操作することにより、砥石制御手段２２の制御により左右の研削砥石４，５を回転停止状態のまま前進させて、図６に示すようにそれら研削砥石４，５により調整用ワークＷａを両面側から挟持する（Ｓ４：砥石支持工程）。そしてその状態で、作業者はエアセンサ６ａ〜６ｃ，７ａ〜７ｃによるセンサ出力値を例えばセンサ出力値表示手段２７から取得する（Ｓ５）。   When the mounting of the adjustment work Wa (S2) is completed, the operator subsequently operates the operation means 23, whereby the static pressure water 1c, 2c is supplied, and the adjustment work Wa is statically supported between the static pressure pads 1 and 2 as shown in FIG. 5 (S3: static pressure support step). At this time, the adjustment work Wa is not rotated. Subsequently, when the operator operates the operation means 23, the left and right grinding wheels 4, 5 are advanced in a rotation stopped state under the control of the grindstone control means 22, and as shown in FIG. 5, the adjustment work Wa is clamped from both sides (S4: whetstone support step). In this state, the operator acquires sensor output values from the air sensors 6a to 6c and 7a to 7c from, for example, the sensor output value display means 27 (S5).

ここで、Ｓ４の砥石支持工程では、エアセンサ６ａ〜６ｃ，７ａ〜７ｃによるセンサ出力値がその前後（研削砥石４，５による挟持前と挟持後）で略同じ値となるように研削砥石４，５の軸方向位置を調整することが望ましい。なお、このＳ４後の状態が、調整用ワークＷａを一対の静圧パッド１，２の間で静圧支持しつつ一対の研削砥石４，５により挟持する第１状態の一例である。この第１状態は、ワークＷの研削時（Ｓ１１）と同様に、調整用ワークＷａを静圧パッド１，２と研削砥石４，５との両方で支持している状態であるが、Ｓ５で取得した第１状態のセンサ出力値のみでは、調整用ワークＷａに曲げ応力が発生しているか否かは判別できない。   Here, in the grindstone support step of S4, the grinding wheel 4 is adjusted so that the sensor output values by the air sensors 6a to 6c and 7a to 7c are substantially the same before and after (before and after clamping by the grinding wheels 4 and 5). It is desirable to adjust the axial position of 5. The state after S4 is an example of a first state in which the adjustment work Wa is held between the pair of grinding stones 4 and 5 while being statically supported between the pair of static pressure pads 1 and 2. This first state is a state in which the adjustment work Wa is supported by both the static pressure pads 1 and 2 and the grinding stones 4 and 5 as in the grinding of the work W (S11). Only with the acquired sensor output value in the first state, it cannot be determined whether or not bending stress is generated in the adjustment work Wa.

続いて、研削砥石４，５により調整用ワークＷａを挟持した状態のまま、作業者が操作手段２３を操作することにより、静圧パッド制御手段２１の制御により図７に示すように静圧パッド１，２への静圧水１ｃ，２ｃの供給を停止し、静圧パッド１，２による静圧支持を停止する（Ｓ６：静圧支持停止工程）。そしてその状態で、作業者はエアセンサ６ａ〜６ｃ，７ａ〜７ｃによるセンサ出力値を例えばセンサ出力値表示手段２７から取得する（Ｓ７）。なお、このＳ６後の状態が、調整用ワークＷａを静圧パッド１，２により静圧支持することなく一対の研削砥石４，５により挟持する第２状態の一例である。この第２状態は、第１状態から静圧パッド１，２による静圧支持をやめて研削砥石４，５による支持のみとした状態であるから、調整用ワークＷａに曲げ応力が発生していないことは明らかである。   Subsequently, the operator operates the operating means 23 while holding the adjustment work Wa between the grinding wheels 4 and 5, and the static pressure pad control means 21 controls the static pressure pad as shown in FIG. The supply of the static pressure water 1c, 2c to 1 and 2 is stopped, and the static pressure support by the static pressure pads 1 and 2 is stopped (S6: static pressure support stop process). In this state, the operator acquires sensor output values from the air sensors 6a to 6c and 7a to 7c, for example, from the sensor output value display means 27 (S7). The state after S6 is an example of a second state in which the adjustment work Wa is held between the pair of grinding stones 4 and 5 without being supported by the static pressure pads 1 and 2 with static pressure. This second state is a state in which the static pressure pads 1 and 2 are no longer supported by the static pressure pads 1 and only supported by the grinding wheels 4 and 5 from the first state, and therefore no bending stress is generated in the adjustment work Wa. Is clear.

そして、Ｓ５で取得した第１状態（静圧支持停止前）におけるセンサ出力値と、Ｓ７で取得した第２状態（静圧支持停止後）におけるセンサ出力値との間の変化量を求め、その変化量が所定判定値（例えば５μｍ）以下であるか否かを判定する（Ｓ８：姿勢変化判定工程）。   Then, the amount of change between the sensor output value in the first state (before static pressure support stop) acquired in S5 and the sensor output value in the second state (after static pressure support stop) acquired in S7 is obtained, It is determined whether or not the change amount is a predetermined determination value (for example, 5 μm) or less (S8: posture change determination step).

そのセンサ出力値の変化量が十分に小さければ（所定判定値以下であれば）、Ｓ５時点（第１状態）とＳ７時点（第２状態）とで調整用ワークＷａの姿勢に殆ど変化がないということであるから、ワークＷの研削時と同じ条件の第１状態において調整用ワークＷａに発生する曲げ応力は許容範囲内であると判断できる。一方、センサ出力値の変化量が所定判定値よりも大であれば、Ｓ５時点（第１状態）とＳ７時点（第２状態）とで調整用ワークＷａの姿勢が大きく変化したということであるから、ワークＷの研削時と同じ条件の第１状態において調整用ワークＷａに無視できない曲げ応力が発生していると判断できる。   If the change amount of the sensor output value is sufficiently small (if it is equal to or less than the predetermined determination value), there is almost no change in the posture of the adjustment work Wa between time S5 (first state) and time S7 (second state). Therefore, it can be determined that the bending stress generated in the adjustment workpiece Wa in the first state under the same conditions as when grinding the workpiece W is within an allowable range. On the other hand, if the change amount of the sensor output value is larger than the predetermined determination value, it means that the posture of the adjustment work Wa has changed greatly between the time S5 (first state) and the time S7 (second state). From this, it can be determined that a bending stress that cannot be ignored is generated in the adjustment workpiece Wa in the first state under the same conditions as during grinding of the workpiece W.

そこで、センサ出力値の変化量が所定判定値以下でなければ（Ｓ８：Ｎｏ）、作業者はそのセンサ出力値の変化方向及び変化量に基づいて、変化量を小さくする方向に所定の調整を行う（Ｓ９）。この調整は、例えば研削砥石４，５の軸方向位置や傾きを対象として行うのが望ましいが、それ以外の例えば静圧水１ｃ，２ｃの流量、ノズル径等を調整の対象としてもよいし、それらのうちの複数を同時に調整してもよい。   Therefore, if the change amount of the sensor output value is not less than or equal to the predetermined determination value (S8: No), the operator makes a predetermined adjustment in the direction of decreasing the change amount based on the change direction and the change amount of the sensor output value. Perform (S9). For example, this adjustment is desirably performed on the position and inclination of the grinding wheels 4 and 5 in the axial direction, but the flow rate of the hydrostatic water 1c and 2c, the nozzle diameter, and the like may be other adjustment targets. A plurality of them may be adjusted simultaneously.

例えば図８に示すように、左側のエアセンサ６ａ〜６ｃの出力値の変化量が全て−１０であり、右側のエアセンサ７ａ〜７ｃの出力値の変化量が全て＋１０である場合、静圧パッド１，２による支持位置よりも研削砥石４，５による支持位置の方が右側にあると考えられる。従って作業者は、操作手段２３の位置設定手段２５を操作して、例えば研削砥石４，５の軸方向位置を左側にシフトするように調整すればよい。この場合、研削砥石４，５の軸方向位置を左側にシフトする代わりに、例えば右側の静圧パッド２側の静圧水２ｃの流量を左側の静圧パッド１側の静圧水１ｃの流量に対して相対的に小さくするように調整してもよいし、例えば右側の静圧パッド２側の静圧水２ｃのノズル径を左側の静圧パッド１側の静圧水１ｃのノズル径に対して相対的に小さくするように調整してもよい。   For example, as shown in FIG. 8, when the change amounts of the output values of the left air sensors 6 a to 6 c are all −10 and the change amounts of the output values of the right air sensors 7 a to 7 c are all +10, the static pressure pad 1 , 2 is considered to be on the right side of the support position by the grinding wheels 4 and 5 than the support position by the grinding wheel. Therefore, the operator may adjust the axial position of the grinding wheels 4 and 5 to shift to the left side by operating the position setting means 25 of the operation means 23, for example. In this case, instead of shifting the axial position of the grinding wheels 4 and 5 to the left side, for example, the flow rate of the static pressure water 2c on the right side static pressure pad 2 side is changed to the flow rate of the static pressure water 1c on the left side static pressure pad 1 side. For example, the nozzle diameter of the static pressure water 2c on the right side static pressure pad 2 side is set to the nozzle diameter of the static pressure water 1c on the left side static pressure pad 1 side. On the other hand, it may be adjusted to be relatively small.

Ｓ９の調整が終了すると、Ｓ３以降の処理を再び実行する。即ち、Ｓ８でセンサ出力値の変化量が所定判定値以下であると判定されるまで、Ｓ３〜Ｓ９の処理を繰り返し行う。そして、図９に示す例のように、Ｓ８でセンサ出力値の変化量が所定判定値以下であると判定された場合には（Ｓ８：Ｙｅｓ）、研削中のワークに曲げ応力が発生しないように調整されたものと判断できるため、ここで事前調整工程を完了し（Ｓ１０）、その調整後の横型両頭平面研削装置によりワークＷの研削を行う（Ｓ１１：研削工程）。   When the adjustment of S9 is completed, the processes after S3 are executed again. That is, the processes of S3 to S9 are repeated until it is determined in S8 that the change amount of the sensor output value is equal to or smaller than the predetermined determination value. Then, as in the example shown in FIG. 9, when it is determined in S8 that the change amount of the sensor output value is equal to or less than the predetermined determination value (S8: Yes), no bending stress is generated in the workpiece being ground. Therefore, the pre-adjustment process is completed here (S10), and the workpiece W is ground by the horizontal double-sided surface grinding apparatus after the adjustment (S11: grinding process).

以上説明したように、本実施形態に係る薄板状ワークの製造方法は、研削工程の前の事前調整工程において、調整用ワークＷａを一対の静圧パッド１，２の間で静圧支持しつつ一対の研削砥石４，５により挟持する第１状態と、調整用ワークＷａを静圧パッド１，２により静圧支持することなく一対の研削砥石４，５により挟持する第２状態とで、調整用ワークＷａと静圧パッド１，２との距離を検出するエアセンサ（距離検出センサ）６ａ〜６ｃ，７ａ〜７ｃの出力値を取得し、それら両状態におけるセンサ出力値の変化に基づいて、その変化を小さくする方向に調整を行うものであるため、薄板状ワークの研削を高精度で行うための事前調整を、作業者の熟練度合いに拘わらず容易且つ確実に行うことが可能である。   As described above, the thin plate workpiece manufacturing method according to the present embodiment supports the adjustment workpiece Wa statically between the pair of static pressure pads 1 and 2 in the pre-adjustment step before the grinding step. Adjustment between the first state of being sandwiched between the pair of grinding wheels 4 and 5 and the second state of being sandwiched between the pair of grinding wheels 4 and 5 without supporting the adjustment work Wa by the static pressure pads 1 and 2 Output values of air sensors (distance detection sensors) 6a to 6c and 7a to 7c that detect the distance between the workpiece Wa and the static pressure pads 1 and 2 are obtained, and based on changes in sensor output values in both states, Since the adjustment is performed in a direction to reduce the change, it is possible to easily and surely make a pre-adjustment for grinding the thin plate workpiece with high accuracy regardless of the skill level of the operator.

また、本実施形態に係る薄板状ワークの製造方法は、ワークの端面位置を監視するために従来から両頭平面研削装置に搭載されているエアセンサ６ａ〜６ｃ，７ａ〜７ｃをそのまま用いることができるため、低コストで実現可能である。   Moreover, since the manufacturing method of the thin plate-shaped workpiece | work which concerns on this embodiment can use the air sensors 6a-6c and 7a-7c conventionally mounted in the double-head surface grinding apparatus in order to monitor the end surface position of a workpiece | work. Can be realized at low cost.

図１０は本発明の第２の実施形態を例示し、第１の実施形態を一部変更して、横型両頭平面研削装置に、事前調整工程の少なくとも一部を自動的に行う事前調整手段３１を設けた例を示している。   FIG. 10 illustrates the second embodiment of the present invention. A part of the first embodiment is modified, and a pre-adjustment unit 31 that automatically performs at least a part of the pre-adjustment step in the horizontal double-sided surface grinding apparatus. The example which provided is shown.

本実施形態の横型両頭平面研削装置の制御系は、図１０に示すように、静圧パッド制御手段２１、砥石制御手段２２等の他、事前調整手段３１を備えている。この事前調整手段３１は、図４に示す事前調整工程の少なくとも一部、例えばＳ３〜Ｓ９の繰り返し処理を自動的に行うもので、第１状態制御手段３２、第１出力値取得手段３３、第２状態制御手段３４、第２出力値取得手段３５、判定手段３６、調整実行手段３７等を備えている。   As shown in FIG. 10, the control system of the horizontal double-sided surface grinding apparatus of this embodiment includes a pre-adjustment means 31 in addition to the static pressure pad control means 21, the grindstone control means 22, and the like. This pre-adjustment means 31 automatically performs at least a part of the pre-adjustment step shown in FIG. 4, for example, the repetitive processing of S3 to S9. The first state control means 32, the first output value acquisition means 33, the first A two-state control unit 34, a second output value acquisition unit 35, a determination unit 36, an adjustment execution unit 37, and the like are provided.

第１状態制御手段３２は、調整用ワークＷａを一対の静圧パッド１，２の間で静圧支持しつつ一対の研削砥石４，５により挟持する第１状態を実現すべく、静圧パッド制御手段２１及び砥石制御手段２２を介して図４のＳ３，Ｓ４の処理を自動的に実行させるように構成されている。また第１出力値取得手段３３は、その第１状態におけるエアセンサ６ａ〜６ｃ，７ａ〜７ｃの出力値を取得する（図４のＳ５）。   The first state control means 32 is a static pressure pad for realizing a first state in which the adjustment work Wa is held between the pair of grinding stones 4 and 5 while being statically supported between the pair of static pressure pads 1 and 2. 4 is automatically executed via the control means 21 and the grindstone control means 22. Further, the first output value acquisition means 33 acquires the output values of the air sensors 6a to 6c and 7a to 7c in the first state (S5 in FIG. 4).

第２状態制御手段３４は、調整用ワークＷａを静圧パッド１，２により静圧支持することなく一対の研削砥石４，５により挟持する第２状態を実現すべく、静圧パッド制御手段２１を介して図４のＳ６の処理を自動的に実行させるように構成されている。また第２出力値取得手段３５は、その第２状態におけるエアセンサ６ａ〜６ｃ，７ａ〜７ｃの出力値を取得する（図４のＳ７）。   The second state control means 34 is a static pressure pad control means 21 in order to realize a second state in which the adjustment work Wa is held between the pair of grinding wheels 4 and 5 without being statically supported by the static pressure pads 1 and 2. 4 is configured to automatically execute the process of S6 of FIG. Moreover, the 2nd output value acquisition means 35 acquires the output value of the air sensors 6a-6c and 7a-7c in the 2nd state (S7 of FIG. 4).

そして判定手段３６は、第１出力値取得手段３３により取得した第１状態（静圧支持停止前）におけるセンサ出力値と、第２出力値取得手段３５により取得した第２状態（静圧支持停止後）におけるセンサ出力値との間の変化量を求め、その変化量が所定判定値（例えば５μｍ）以下であるか否かを判定する（図４のＳ８）。   Then, the determination unit 36 detects the sensor output value in the first state (before static pressure support stop) acquired by the first output value acquisition unit 33 and the second state (static pressure support stop) acquired by the second output value acquisition unit 35. After that, the amount of change between the sensor output value and the sensor output value is obtained, and it is determined whether or not the amount of change is a predetermined determination value (for example, 5 μm) or less (S8 in FIG. 4).

また、調整実行手段３７は、静圧水１ｃ，２ｃの流量を調整する流量調整手段３７ａ、研削砥石４，５の軸方向位置を調整する位置調整手段３７ｂ、研削砥石４，５の傾きを調整する傾き調整手段３７ｃ等を備えており、判定手段３６によりセンサ出力値の変化量が所定判定値以下でないと判定された場合に（図４のＳ８：Ｎｏ）、そのセンサ出力値の変化方向及び変化量に基づいて、流量調整手段３７ａ、位置調整手段３７ｂ、調整手段３７ｃ等により、変化量を小さくする方向に自動的に調整を行う（図４のＳ９）。   Further, the adjustment executing means 37 adjusts the inclination of the grinding wheels 4 and 5, the flow rate adjusting means 37 a that adjusts the flow rates of the hydrostatic water 1 c and 2 c, the position adjusting means 37 b that adjusts the axial position of the grinding wheels 4 and 5, and the grinding wheels 4 and 5. When the determination means 36 determines that the change amount of the sensor output value is not less than or equal to the predetermined determination value (S8: No in FIG. 4), the change direction of the sensor output value and Based on the change amount, the flow rate adjusting means 37a, the position adjusting means 37b, the adjusting means 37c and the like are automatically adjusted to reduce the change amount (S9 in FIG. 4).

そして事前調整手段３１は、判定手段３６によりセンサ出力値の変化量が所定判定値以下であると判定されるまで、図４のＳ３〜Ｓ９を繰り返し実行する。   Then, the preliminary adjustment unit 31 repeatedly executes S3 to S9 in FIG. 4 until the determination unit 36 determines that the change amount of the sensor output value is equal to or less than the predetermined determination value.

以上説明したように、本発明では第１状態と第２状態とにおけるセンサ出力値の変化方向及び変化量が数値化できるため、本実施形態のように事前調整工程の少なくとも一部を自動化することも可能である。   As described above, in the present invention, since the change direction and the change amount of the sensor output value in the first state and the second state can be quantified, at least a part of the pre-adjustment step is automated as in this embodiment. Is also possible.

以上、本発明の実施形態について詳述したが、本発明はこの実施形態に限定されるものではなく、本発明の趣旨を逸脱しない範囲で種々の変更が可能である。例えば、実施形態の事前調整工程は、第１状態でセンサ出力値を取得した後に第２状態に移行してセンサ出力値を取得するように構成したが、先に第２状態でセンサ出力値を取得した後に第１状態に移行してセンサ出力値を取得するように構成してもよい。   As mentioned above, although embodiment of this invention was explained in full detail, this invention is not limited to this embodiment, A various change is possible in the range which does not deviate from the meaning of this invention. For example, the pre-adjustment step of the embodiment is configured to acquire the sensor output value in the second state after acquiring the sensor output value in the first state, but to acquire the sensor output value in the second state first. After the acquisition, the sensor output value may be acquired by moving to the first state.

また、実施形態の事前調整工程は、静圧支持工程（図４のＳ３）を実行した後に静圧支持停止工程（図４のＳ４）を実行することにより第１状態に移行するように構成したが、先に研削砥石４，５により調整用ワークＷａを挟持した後に静圧パッド１，２による静圧支持を行うことにより第１状態に移行するように構成してもよい。   In addition, the pre-adjustment step of the embodiment is configured to shift to the first state by executing the static pressure support stop step (S4 of FIG. 4) after executing the static pressure support step (S3 of FIG. 4). However, you may comprise so that it may transfer to a 1st state by performing the static pressure support by the static pressure pads 1 and 2, after previously clamping the workpiece | work Wa by the grinding stones 4 and 5. FIG.

実施形態では、砥石支持工程（図４のＳ４）において、エアセンサ６ａ〜６ｃ，７ａ〜７ｃの出力値が静圧支持工程（図４のＳ３）のときと略同一となる位置で研削砥石４，５により調整用ワークＷａを挟持するように構成したが、エアセンサ６ａ〜６ｃ，７ａ〜７ｃの出力値に拘わらず、予め設定された位置で研削砥石４，５により調整用ワークＷａを挟持するように構成してもよい。但しこの場合には、その後の調整に時間がかかる可能性がある。   In the embodiment, in the grinding wheel support step (S4 in FIG. 4), the grinding wheel 4 is positioned at a position where the output values of the air sensors 6a to 6c and 7a to 7c are substantially the same as those in the static pressure support step (S3 in FIG. 4). 5, the adjustment work Wa is sandwiched by the grinding wheels 4, 5 at a preset position regardless of the output values of the air sensors 6 a to 6 c and 7 a to 7 c. You may comprise. In this case, however, the subsequent adjustment may take time.

また、本発明の両頭平面研削装置は一対の静圧パッド１，２、一対の研削砥石４，５を上下に配置した縦型両頭平面研削装置においても同様に実施することが可能である。   The double-sided surface grinding apparatus of the present invention can be similarly implemented in a vertical double-sided surface grinding apparatus in which a pair of static pressure pads 1 and 2 and a pair of grinding wheels 4 and 5 are arranged vertically.

１，２ 静圧パッド
４，５ 研削砥石
６ａ〜６ｃ，
７ａ〜７ｃ エアセンサ（距離検出センサ）
Ｗ ワーク
Ｗａ 調整用ワーク 1, 2 Static pressure pads 4, 5 Grinding wheels 6a-6c,
7a-7c Air sensor (distance detection sensor)
W Work Wa Adjustment work

Claims (6)

一対の静圧パッドと一対の研削砥石とを有する両頭平面研削装置を用いて、前記一対の静圧パッドの間で静圧支持された薄板状のワークを回転させながら、前記一対の研削砥石により前記ワークの両面を研削する研削工程と、前記研削工程の前に前記両頭平面研削装置を調整する事前調整工程とを備えた薄板状ワークの製造方法において、
前記事前調整工程では、調整用ワークを前記一対の静圧パッドの間で静圧支持しつつ前記一対の研削砥石により挟持する第１状態と、前記調整用ワークを前記静圧パッドにより静圧支持することなく前記一対の研削砥石により挟持する第２状態とで前記調整用ワークの姿勢に関する所定値を取得し、それら両状態における前記所定値の変化に基づいて前記両頭平面研削装置を調整する
ことを特徴とする薄板状ワークの製造方法。 Using a double-sided surface grinding machine having a pair of static pressure pads and a pair of grinding wheels, while rotating a thin plate-like workpiece supported statically between the pair of static pressure pads, the pair of grinding wheels In a manufacturing method of a thin plate work comprising a grinding step of grinding both surfaces of the workpiece, and a pre-adjustment step of adjusting the double-sided surface grinding apparatus before the grinding step,
In the pre-adjustment step, a first state in which the adjustment work is held between the pair of static pressure pads while being statically supported by the pair of grinding wheels, and the adjustment work is statically applied by the static pressure pad. A predetermined value related to the posture of the adjustment workpiece is acquired in the second state sandwiched between the pair of grinding wheels without being supported, and the double-head surface grinding apparatus is adjusted based on the change in the predetermined value in both states. A method for manufacturing a thin plate-like workpiece. 前記一対の静圧パッドと前記調整用ワークとの距離を検出する距離検出センサの出力値を前記所定値とした
ことを特徴とする請求項１に記載の薄板状ワークの製造方法。 The method for manufacturing a thin plate workpiece according to claim 1, wherein an output value of a distance detection sensor that detects a distance between the pair of static pressure pads and the adjustment workpiece is the predetermined value. 前記第１状態と前記第２状態とにおける前記距離検出センサの出力値の変化量が所定判定値以下となることを条件に前記事前調整工程を終了する
ことを特徴とする請求項２に記載の薄板状ワークの製造方法。 The pre-adjustment step is terminated on condition that the amount of change in the output value of the distance detection sensor in the first state and the second state is equal to or less than a predetermined determination value. Method for manufacturing a thin plate workpiece. 前記事前調整工程は、
前記調整用ワークを前記一対の静圧パッドの間で静圧支持する静圧支持工程と、
前記静圧支持工程で静圧支持された前記調整用ワークを前記一対の研削砥石により挟持する砥石支持工程と、
前記砥石支持工程の後に前記一対の静圧パッドによる静圧支持を停止する静圧支持停止工程と、
前記静圧支持停止工程の前後における前記距離検出センサの出力値の変化量が前記所定判定値以下であるか否かを判定する姿勢変化判定工程とを備え、
前記姿勢変化判定工程で前記変化量が前記所定判定値以下であると判定されるまで、前記変化量を小さくする方向に前記両頭平面研削装置を調整しつつ前記静圧支持工程以降の工程を繰り返す
ことを特徴とする請求項３に記載の薄板状ワークの製造方法。 The preconditioning step includes
A static pressure support step of statically supporting the work for adjustment between the pair of static pressure pads;
A grindstone support step of sandwiching the adjustment work supported by the static pressure in the static pressure support step between the pair of grinding wheels;
A static pressure support stop step of stopping static pressure support by the pair of static pressure pads after the grindstone support step;
A posture change determination step of determining whether or not a change amount of the output value of the distance detection sensor before and after the static pressure support stop step is equal to or less than the predetermined determination value;
Until the change amount is determined to be less than or equal to the predetermined determination value in the posture change determination step, the steps after the static pressure support step are repeated while adjusting the double-sided surface grinding device in a direction to reduce the change amount. The method for manufacturing a thin plate workpiece according to claim 3. 前記砥石支持工程では、前記距離検出センサの出力値が前記静圧支持工程のときと略同一となる位置で前記一対の研削砥石により前記調整用ワークを挟持する
ことを特徴とする請求項４に記載の薄板状ワークの製造方法。 5. The adjustment workpiece is clamped by the pair of grinding wheels at a position where the output value of the distance detection sensor is substantially the same as that in the static pressure support step in the grinding wheel support step. The manufacturing method of the thin plate-shaped workpiece of description. 一対の静圧パッドの間で静圧支持された薄板状のワークを回転させながら、一対の研削砥石により前記ワークの両面を研削する両頭平面研削装置において、
調整用ワークを前記一対の静圧パッドの間で静圧支持しつつ前記一対の研削砥石により挟持する第１状態と、前記調整用ワークを前記静圧パッドにより静圧支持することなく前記一対の研削砥石により挟持する第２状態とで前記調整用ワークの姿勢に関する所定値を夫々取得し、それら両状態における前記所定値の変化に基づいて、前記ワークの研削前に所定の調整を行う事前調整手段を備えた
ことを特徴とする両頭平面研削装置。 In a double-head surface grinding apparatus that grinds both surfaces of a workpiece with a pair of grinding wheels while rotating a thin plate-like workpiece supported statically between a pair of static pressure pads,
A first state in which the adjustment work is held between the pair of static pressure pads while being statically supported by the pair of grinding stones, and the adjustment work is not statically supported by the static pressure pad. A pre-adjustment for obtaining a predetermined value related to the posture of the workpiece for adjustment in the second state sandwiched between the grinding wheels and performing a predetermined adjustment before grinding the workpiece based on a change in the predetermined value in both states A double-head surface grinding apparatus characterized by comprising means.
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