SG11201407954VA - Adhesive composition for resin-bonded wire saw and method for producing resin-bonded wire saw - Google Patents

Adhesive composition for resin-bonded wire saw and method for producing resin-bonded wire saw

Info

Publication number
SG11201407954VA
SG11201407954VA SG11201407954VA SG11201407954VA SG11201407954VA SG 11201407954V A SG11201407954V A SG 11201407954VA SG 11201407954V A SG11201407954V A SG 11201407954VA SG 11201407954V A SG11201407954V A SG 11201407954VA SG 11201407954V A SG11201407954V A SG 11201407954VA
Authority
SG
Singapore
Prior art keywords
resin
adhesive composition
bonded wire
wire saw
producing
Prior art date
Application number
SG11201407954VA
Inventor
Masahiko Ikeuchi
Tadashi Endo
Original Assignee
Tkx Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tkx Corp filed Critical Tkx Corp
Publication of SG11201407954VA publication Critical patent/SG11201407954VA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185—Saw wires; Saw cables; Twisted saw strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D65/00—Making tools for sawing machines or sawing devices for use in cutting any kind of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/009—Tools not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
    • C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Abstract

(i2) mwu ft iz s-5 iv x m £ titz s issaj n d9) mm IHMMi (43) m&'&m a 2013^12^ 5 0(05.12.2013) WIPOIPCT (10) WO 2013/179498 A1 (51) C09J161/06 (2006.01) B24B 27/06 (2006.01) B24D 3/20 (2006.01) (21) (22) g&ttHQ: (25) B24D 11/00 (2006.01) B28D 5/04 (2006.01) C09J11/06 (2006.01) PCT/JP2012/066871 2012 ^7^ 2 0(02.07.2012) (26) @(g&M©Wl§: H*f§ (30) fiBfcftf '— 1 £: 4#Jg| 2012-126091 2012 ^6^ 1 0 (01.06.2012) JP (71) T K X (TKX Corporation) [JP/JP]; T 5430011 X TK^HT 5 # 1 6 -»§• Osaka (JP). (72) (75) fgBJ^/ttllA (^HICO^T®^): jftfi IEjt (IKEUCHI, Masahiko) [JP/JP]; T 5430011 K5m^I^E;f7K«BT5#1 6-^ tt5££ttT __ K X Osaka (JP). jH [JP/JP]; T 5430011 ^|Z;f7K# P3T 5 # 1 6 TKXrt Osaka (JP). (74) ftIIA: ^S(KUSUMOTO, Takayoshi); T 5200832 }& MRBj 4 # 7 jSb:^5 F fit^TFirFSfllFjT Shiga (JP). (81) (84) (ENDO, Tadashi) IS ft nJ f b ): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. 11^ nlfb): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW), 3- — V T (AM, AZ, BY, KG, KZ, RU, TJ, TM), 3 — • V / ^ (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, [mn%] (54) Title: ADHESIVE COMPOSITION FOR RESIN-BONDED WIRE SAW AND METHOD FOR PRODUCING RESIN-BON- DED WIRE SAW (54)#^a>«ffc : UV>7K> K9-T-V—V— [04] 4. 86 1000 500 20 25 30 00 o\ •t o\ l> i-H en i-H o CJ o & (57) Abstract: [Problem] To provide: a method for efficiently producing a resin-bonded wire saw that stabilizes the step of cutting an ingot and that obtains smooth a wafer in which the thickness of a damaged layer on the wafer surface caused by cutting is small; and an adhesive composition for resin-bonded wire saws that is suitable for said method. [Solution] This method for producing a resin-bonded wire saw comprises: a step of applying, to the surface of metal core wire, paste including a a an adhesive composition, abrasive grains, and a solvent for dissolving the adhesive composition, said adhesive composition being used for producing res­ in-bonded wire saws in which abrasive grains are firmly fixed to the surface of metal a core wire by means of a resin bond, said ad - hesive composition for resin-bonded wire saws including, as essential components, 100 parts by weight of novolac-type phenolic a resin, 10-30 parts by weight of resol-type a phenolic resin, and 0.1-5 parts by weight of an amine-based silane coupling agent; and a heating step of heating the applied paste with infrared rays including near-infrared rays, and causing said adhesive composition to undergo cross-linking reaction. a (57) mm-' fn WO 2013/179498 A1 GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI _ 21 ft(3)) (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG). V>TK> K9-<-v—7 —< Mmit t > UV>TK> K9-<-V— V— IcffifitfUv>#> K£ttLTHg$*iT £3 Uv>#> K9-<-V—7—©fiitlcm^bflStro^fcoT, 7 / #7 x / 10 OSiS 1 0~3 0iis o. 1 ~ 5 iisp uv>#> K7-re-v-ffla)g^ijffljsti'efey, r j m mt, h^jKEfsasi-^u t~ T|?> K9-r J e-v-o)Sii^}4'efe-So
SG11201407954VA 2012-06-01 2012-07-02 Adhesive composition for resin-bonded wire saw and method for producing resin-bonded wire saw SG11201407954VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012126091 2012-06-01
PCT/JP2012/066871 WO2013179498A1 (en) 2012-06-01 2012-07-02 Adhesive composition for resin-bonded wire saw and method for producing resin-bonded wire saw

Publications (1)

Publication Number Publication Date
SG11201407954VA true SG11201407954VA (en) 2015-01-29

Family

ID=49672746

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201407954VA SG11201407954VA (en) 2012-06-01 2012-07-02 Adhesive composition for resin-bonded wire saw and method for producing resin-bonded wire saw

Country Status (7)

Country Link
JP (1) JP5778864B2 (en)
KR (1) KR101563456B1 (en)
CN (1) CN104379695B (en)
MY (1) MY153895A (en)
SG (1) SG11201407954VA (en)
TW (1) TWI527666B (en)
WO (1) WO2013179498A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2017209242A1 (en) * 2016-06-01 2019-01-17 株式会社Tkx Resin bond wire saw and its manufacturing method
CN106826597A (en) * 2016-12-21 2017-06-13 河南易成新能源股份有限公司 The production method of continuous long range resin-diamond scroll saw
CN106826598A (en) * 2016-12-21 2017-06-13 河南易成新能源股份有限公司 Resinous coat diamond wire and preparation method thereof
JP7103305B2 (en) * 2019-05-29 2022-07-20 信越半導体株式会社 How to cut the ingot

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02232171A (en) * 1989-03-06 1990-09-14 Gun Ei Chem Ind Co Ltd Resinoid grindstone
JP2000271872A (en) 1999-03-23 2000-10-03 Osaka Diamond Ind Co Ltd Super abrasive grain resin bond wire saw
JP3604319B2 (en) * 2000-03-30 2004-12-22 株式会社ノリタケスーパーアブレーシブ Resin bond wire saw
JP2002254285A (en) * 2001-02-28 2002-09-10 Allied Material Corp Cutting method for porous metal by wire saw
US6949129B2 (en) * 2002-01-30 2005-09-27 Saint-Gobain Abrasives, Inc. Method for making resin bonded abrasive tools
CN1326965C (en) * 2003-08-27 2007-07-18 Nok株式会社 Vulcanizable adhesive composition
JP5011886B2 (en) * 2006-08-22 2012-08-29 Ｎｏｋ株式会社 Bonded piston seal
CN101088659B (en) * 2007-08-09 2010-11-17 山东圣泉化工股份有限公司 Coated low-nitrogen sand and its prepn
FR2921666B1 (en) * 2007-10-01 2012-11-09 Saint Gobain Abrasives Inc LIQUID RESIN COMPOSITION FOR ABRASIVE ARTICLES
SI2052798T1 (en) * 2008-11-25 2012-02-29 Huettenes Albertus Alkaline resol phenol-aldehyde resin binder compositions
JP5515646B2 (en) 2009-11-05 2014-06-11 株式会社中村超硬 Wire saw and method for manufacturing wire saw

Also Published As

Publication number Publication date
MY153895A (en) 2015-04-08
TW201350270A (en) 2013-12-16
KR101563456B1 (en) 2015-10-26
CN104379695A (en) 2015-02-25
JPWO2013179498A1 (en) 2016-01-18
JP5778864B2 (en) 2015-09-16
WO2013179498A1 (en) 2013-12-05
TWI527666B (en) 2016-04-01
KR20150005689A (en) 2015-01-14
CN104379695B (en) 2016-08-17

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