MY153895A - Adhesive composition for resin-bonded wire saw and method for producing resin-bonded wire saw - Google Patents

Adhesive composition for resin-bonded wire saw and method for producing resin-bonded wire saw

Info

Publication number
MY153895A
MY153895A MYPI2014003341A MYPI2014003341A MY153895A MY 153895 A MY153895 A MY 153895A MY PI2014003341 A MYPI2014003341 A MY PI2014003341A MY PI2014003341 A MYPI2014003341 A MY PI2014003341A MY 153895 A MY153895 A MY 153895A
Authority
MY
Malaysia
Prior art keywords
resin
adhesive composition
wire saw
bonded wire
producing
Prior art date
Application number
MYPI2014003341A
Inventor
Ikeuchi Masahiko
Endo Tadashi
Original Assignee
Tkx Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tkx Corp filed Critical Tkx Corp
Publication of MY153895A publication Critical patent/MY153895A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185—Saw wires; Saw cables; Twisted saw strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D65/00—Making tools for sawing machines or sawing devices for use in cutting any kind of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/009—Tools not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
    • C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

There are provided an adhesive composition to be used for producing a resin-bonded wire saw, in which abrasive grains are fixed to a surface of a metal core wire, which includes essential components: 100 parts by weight of a novolak-type phenol resin; 10 to 30 parts by weight of a resol-type phenol resin; and 0.1 to 5 parts by weight of an amine-based silane coupling agent and a method for producing the resin-bonded wire saw which includes the steps of: applying a paste including the adhesive composition, the abrasive grains, and a solvent for dissolving the adhesive composition to a surface of the metal core wire; and heating the applied paste by infrared rays including near-infrared rays to cause the adhesive composition to produce a cross-linking reaction.
MYPI2014003341A 2012-06-01 2012-07-02 Adhesive composition for resin-bonded wire saw and method for producing resin-bonded wire saw MY153895A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012126091 2012-06-01

Publications (1)

Publication Number Publication Date
MY153895A true MY153895A (en) 2015-04-08

Family

ID=49672746

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014003341A MY153895A (en) 2012-06-01 2012-07-02 Adhesive composition for resin-bonded wire saw and method for producing resin-bonded wire saw

Country Status (7)

Country Link
JP (1) JP5778864B2 (en)
KR (1) KR101563456B1 (en)
CN (1) CN104379695B (en)
MY (1) MY153895A (en)
SG (1) SG11201407954VA (en)
TW (1) TWI527666B (en)
WO (1) WO2013179498A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201819572A (en) * 2016-06-01 2018-06-01 Ｔｋｘ股份有限公司 Resin bond wire saw and method for producing the same
CN106826597A (en) * 2016-12-21 2017-06-13 河南易成新能源股份有限公司 The production method of continuous long range resin-diamond scroll saw
CN106826598A (en) * 2016-12-21 2017-06-13 河南易成新能源股份有限公司 Resinous coat diamond wire and preparation method thereof
JP7103305B2 (en) * 2019-05-29 2022-07-20 信越半導体株式会社 How to cut the ingot

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02232171A (en) * 1989-03-06 1990-09-14 Gun Ei Chem Ind Co Ltd Resinoid grindstone
JP2000271872A (en) * 1999-03-23 2000-10-03 Osaka Diamond Ind Co Ltd Super abrasive grain resin bond wire saw
JP3604319B2 (en) * 2000-03-30 2004-12-22 株式会社ノリタケスーパーアブレーシブ Resin bond wire saw
JP2002254285A (en) * 2001-02-28 2002-09-10 Allied Material Corp Cutting method for porous metal by wire saw
US6949129B2 (en) * 2002-01-30 2005-09-27 Saint-Gobain Abrasives, Inc. Method for making resin bonded abrasive tools
EP1659161B1 (en) * 2003-08-27 2011-11-23 Nok Corporation Vulcanizable adhesive composition
JP5011886B2 (en) * 2006-08-22 2012-08-29 Ｎｏｋ株式会社 Bonded piston seal
CN101088659B (en) * 2007-08-09 2010-11-17 山东圣泉化工股份有限公司 Coated low-nitrogen sand and its prepn
FR2921666B1 (en) * 2007-10-01 2012-11-09 Saint Gobain Abrasives Inc LIQUID RESIN COMPOSITION FOR ABRASIVE ARTICLES
PT2052798E (en) * 2008-11-25 2012-01-24 Huettenes Albertus Alkaline resol phenol-aldehyde resin binder compositions
JP5515646B2 (en) 2009-11-05 2014-06-11 株式会社中村超硬 Wire saw and method for manufacturing wire saw

Also Published As

Publication number Publication date
WO2013179498A1 (en) 2013-12-05
JPWO2013179498A1 (en) 2016-01-18
SG11201407954VA (en) 2015-01-29
TWI527666B (en) 2016-04-01
KR20150005689A (en) 2015-01-14
TW201350270A (en) 2013-12-16
CN104379695B (en) 2016-08-17
KR101563456B1 (en) 2015-10-26
CN104379695A (en) 2015-02-25
JP5778864B2 (en) 2015-09-16

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