CN106826598A - Resinous coat diamond wire and preparation method thereof - Google Patents
Resinous coat diamond wire and preparation method thereof Download PDFInfo
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- CN106826598A CN106826598A CN201611192764.0A CN201611192764A CN106826598A CN 106826598 A CN106826598 A CN 106826598A CN 201611192764 A CN201611192764 A CN 201611192764A CN 106826598 A CN106826598 A CN 106826598A
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- Prior art keywords
- resin
- phenolic resin
- solidification
- resinous coat
- diamond wire
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/009—Tools not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/285—Reaction products obtained from aldehydes or ketones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention discloses a kind of resinous coat diamond wire and preparation method thereof, aim to solve the problem that existing resin-diamond line production process resin bed is bonded loosely with bus, cause cutting process resin bed occur to come off, the low technical problem of cutting quantity, including phenolic resin type selecting and compounding, prepares resin mixture liquor, line processed and the step such as one-step solidification, secondary solidification.The present invention prepares high-performance diamond line using compound resin system, easily there are the defects such as bubble, exposed bus in avoid diamond wire presence prepared by single use thermosetting phenolic resin in the prior art or thermoplastic phenolic resin, resin to using is carried out preferably and compounded, reinforced resin liquid is to bus and the adhesive property of diamond, and then the cutting performance of raising resin-diamond line, extend the service life of resin-diamond line.
Description
Technical field
The present invention relates to solar energy crystal silicon chip cutting resin-diamond line production technical field, and in particular to a kind of resin
Coating diamond wire and preparation method thereof.
Background technology
Solar energy receives the attention of countries in the world as Novel clean regenerative resource.In solar energy power generating most
Main crystal silicon chip is produced by silicon ingot or silicon rod cutting, and its cutting mode has two kinds of free abrasive and concretion abrasive.It is free
Abrasive material mixes polyethylene glycol cutting fluid using silicon carbide blade material, and its environmental pollution is serious, production efficiency is relatively low, silicon chip damages layer
Thickness, therefore just gradually replaced by the concretion abrasive cutting of a new generation.Resin-diamond line is exactly most typical in concretion abrasive
Represent, fat diamond wire is the mixed liquor of resin, diamond abrasive grain and filler to be coated on into steel wire bus surface and is heating and curing
A kind of cutting tool being made, in cutting process, is directly cut using the diamond particles on steel wire to silicon ingot.Resin
Diamond wire has process is simple, and the manufacturing cycle is short, and low cost, pliability is good, the advantages of machined surface quality, as more next
The study hotspot of more crisp and hard material processing industries.The key technology of resin-diamond line production is the system of high performance resin liquid
It is standby, therefore, resin liquid there is strong heat resistance, stability and preferable adhesion strength it is critical that.
In resin-diamond line production process, resin liquid plays a part of to couple metallic bus bar and diamond abrasive, so
Its adhesive force with steel wire, the hold to diamond and the wearability of itself, intensity and heat resistance are by finally to product
Cutting performance produces material impact.In order to ensure the thermostability of resin liquid, resin liquid is set to be in uniform state, and it is solid to reduce crosslinking
The influence of change, it is to avoid bubble occurs in resinous coat caused by long-term line processed.Accordingly, it would be desirable to a kind of good resin system.
The content of the invention
The technical problem to be solved in the present invention is to provide one kind and can improve resin-diamond wire cutting performance, extension resin
Resinous coat diamond wire of diamond wire service life and preparation method thereof.
In order to solve the above technical problems, the present invention is adopted the following technical scheme that：
A kind of preparation method of resinous coat diamond wire is designed, is comprised the following steps：
（1）Phenolic resin type selecting and compounding：From solid thermoplastic phenolic resin and liquid thermoset phenolic resin；By the thermoplastic
Property phenolic resin and thermosetting phenolic resin with 1.5~4:1 weight forms compounding resin liquid than mixing；
The fluidity of the thermoplastic phenolic resin is 20~38mm, and it is 80~130 seconds, six first during solidification to gather speed at 150 DEG C
The consumption of urotropine is 10~12%, and molecular weight is 11000~13000；
The molecular weight of the thermosetting phenolic resin is 4000~7000, solidfied material content >=70%；
（2）Prepare resin mixture liquor：To step（1）Filler and organic solvent are added in the compounding resin liquid of gained and stirring is to molten
Solution, adds diadust, after being stirred through high-speed centrifugal, forms uniform resin mixture liquor；It is each in the resin mixture liquor
Part proportion is：Compounding 20~50wt% of resin liquid, 10~30wt% of organic solvent, 5~25wt% of filler, diadust
10~40wt%；
（3）Line processed and one-step solidification：By step（2）The resin mixture liquor of gained is coated uniformly on steel wire bus by line equipment processed
Surface, then the cured stove of bus after coating is carried out into curing process, obtain the resin-diamond line of one-step solidification；
（4）Secondary solidification：By step（3）The resin-diamond line of the one-step solidification of gained be placed in isothermal curing stove carry out it is secondary
Curing process, using staged temperature-rise period, programming rate is 1~20 DEG C/min, and soaking time is 0.5~3 h, maximum temperature
It it is 200~400 DEG C, using the draft type for continuing air blast in solidification process；Room temperature is finally down to naturally with stove, obtains finished product tree
Fat diamond wire.
Preferably, step（1）Described in thermoplastic phenolic resin be using the compound aralkyl ethers containing difunctional
The PF-2939-1 type thermoplastic phenolic resins produced by condensation reaction with phenol.
Thermoplastic phenolic resin used by the present invention, its synthesis material is different from traditional phenol and formaldehyde, is to use to contain
The compound aralkyl ethers and phenol for having difunctional are produced by condensation reaction, to reach heat-resisting, high-ductility, high-strength mesh
, compared with phenolic resin, identical mating material adhesion strength is higher by 30~50%, and heat resistance improves more than 100 DEG C,
The performance of macromolecular material has been given full play to, comprehensively modified effect has been reached.
Preferably, step（1）Described in thermosetting phenolic resin be PF-2508 type thermosetting phenolic resins, range of viscosities
Control is at 700~900mPa*s/25 DEG C；Or be PF-2518 type thermosetting phenolic resins, range of viscosities control 300~
500mPa*s/25℃；Or be PF-2551 type thermosetting phenolic resins, range of viscosities is controlled at 500~700mPa*s/25 DEG C.
Preferably, step（2）Described in filler be aluminum oxide, carborundum, titanium oxide, chromium oxide, nanofiber in extremely
Few one kind.
Preferably, step（2）Described in organic solvent be industrial alcohol, N, N- dimethylformamides, ethyl acetate, nothing
One kind in water-ethanol.
Preferably, step（2）Described in diadust be nickel plating diadust, its coating amount be 1~55wt%, chi
Very little is 10~20 μm.
Preferably, step（3）Described in solidification furnace length be 500mm~1500mm, solidification temperature be 500~900 DEG C, adopt
It is molded with infra-red electronic radiation curing.
Preferably, step（3）Described in a diameter of 80~110 μm of steel wire bus.
The invention further relates to a kind of resinous coat diamond wire, including steel wire bus and the tree for being solidificated in the bus surface
Fat coating, the resinous coat is obtained by the resin mixture liquor for being coated in the bus surface by solidification, the mixed with resin
Liquid includes：Compounding 20~50wt% of resin liquid, 10~30wt% of organic solvent, 5~25wt% of filler, diadust 10~
40wt%；The compounding resin liquid is 3 by weight ratio:2~4:1 thermoplastic phenolic resin and thermosetting phenolic resin mixing and
Into.
Preferably, the thermoplastic phenolic resin be PF-2939-1 type thermoplastic phenolic resins, its fluidity be 20~
38mm, gather speed 150 DEG C be 80~130 seconds, during solidification the consumption of hexamethylenetetramine be 10~12%, molecular weight be 11000~
13000；
The molecular weight of the thermosetting phenolic resin is 4000~7000, solidfied material content >=70%；
The thermosetting phenolic resin is PF-2508 type thermosetting phenolic resins, and range of viscosities is controlled in 700~900mPa*s/
25℃；Or be PF-2518 type thermosetting phenolic resins, range of viscosities is controlled at 300~500mPa*s/25 DEG C；Or be PF-2551
Type thermosetting phenolic resin, range of viscosities is controlled at 500~700mPa*s/25 DEG C.
The beneficial effects of the present invention are：
1. the present invention prepares high-performance diamond line using compound resin system, it is to avoid single use thermosetting in the prior art
Easily there are the defects such as bubble, exposed bus in what diamond wire prepared by phenolic resin or thermoplastic phenolic resin was present, solves
Existing resin-diamond line production process resin bed is bonded loosely with bus, is caused cutting process resin bed occur and is come off,
The low problem of cutting quantity.Resin to using carry out preferably and compounding, reinforced resin liquid to bus and the adhesive property of diamond,
And then the cutting performance of raising resin-diamond line, extend the service life of resin-diamond line.
2. the resinous coat diamond wire for being prepared using the method for the present invention, on the one hand can effectively improve resin bed itself
Intensity, on the other hand improve the binding ability of diamond abrasive and steel wire bus, and then improve resin-diamond line
Cutting power, while improve the service life of resin-diamond line, the line footpath of the resin-diamond line for being obtained is uniform, cutting
Surface quality is good, cutting efficiency is high.
Brief description of the drawings
Fig. 1 is 100 times of scanning electron microscope (SEM) photographs of the resinous coat diamond wire in embodiment 1；
Fig. 2 is 300 times of scanning electron microscope (SEM) photographs of the resinous coat diamond wire in embodiment 1.
Specific embodiment
Specific embodiment of the invention is illustrated with reference to the accompanying drawings and examples, but following examples are used only in detail
Describe the bright present invention in detail, the scope of the present invention is limited never in any form.Involved instrument and equipment is such as in the examples below
Without special instruction, routine instrument device is；The involved raw material of industry unless otherwise instructed, is commercially available regular industrial former
Material.
Embodiment 1：A kind of preparation method of resinous coat diamond wire, comprises the following steps：
（1）Phenolic resin type selecting and compounding：From the thermosetting through special modified novel thermoplastic phenolic resin and autonomous Design
Property phenolic resin, with 2.5:1 weight forms compounding resin liquid than mixing.
Wherein, thermoplastic phenolic resin is anti-by condensation using compound aralkyl ethers and phenol containing difunctional
The PF-2939-1 type thermoplastic phenolic resins answered and produce, its fluidity is 20~38mm, and it is 80~130 to gather speed at 150 DEG C
Second, the consumption of hexamethylenetetramine is 10~12% during solidification, and molecular weight is 11000~13000.
Thermosetting phenolic resin is PF2508 type thermosetting phenolic resins, and its molecular weight is 4000~7000, and solidfied material contains
Amount >=70%, range of viscosities is 500~700mPa*s/25 DEG C.
（2）Prepare resin mixture liquor：The silicon carbide micro-powder of 10wt%, the nanofiber of 2wt% are added to the N of 25wt%, N- bis-
It is well mixed in NMF solvent, is then added in the compounding resin liquid of 35wt%, the gold of 28wt% is fully added after dissolving
Hard rock micro mist, stirs through high speed centrifugation, obtains uniform resin mixture liquor.Wherein, diadust is nickel plating diadust,
Its coating amount is 1~55wt%, and average grain diameter is 10~20 μm.
（3）Line processed and one-step solidification：By step（2）The resin mixture liquor of middle gained is poured into batch can, is pumped by wriggling
Enter in drawing-die, 100 μm of steel wire bus is fitted into paying out reel, bus is with the speed of 1.2m/s by drawing-die, uniformly coating
One layer of resin mixture liquor；Again by the bus after coating by vertical curing oven, solidification temperature is 550 DEG C.Solidifying furnace length is
500mm~1500mm, solidification temperature is 500~900 DEG C, is molded using infra-red electronic radiation curing, is cemented in abrasive material
Around bus, the resin-diamond line of one-step solidification is obtained.
（4）Secondary solidification：By step（3）In the resin-diamond line line wheel input baking oven of the one-step solidification of gained, use
Staged heating mode, programming rate is 5 DEG C/min, and maximum temperature is 200 DEG C, and soaking time is 2.5 h, is adopted in solidification process
With the draft type of lasting air blast；Baking oven is finally closed, room temperature is cooled to the furnace, final finished resin-diamond line is obtained.
The test such as cutting quantity, line footpath, pulling force, electronic microscope photos is carried out to the product line obtained by embodiment 1.
Embodiment 2：A kind of preparation method of resinous coat diamond wire, the difference with embodiment 1 is,
Step（1）In, thermoplastic phenolic resin and thermosetting phenolic resin are with 7:3 weight forms compounding resin liquid than mixing；
Thermosetting phenolic resin PF-2518 type thermosetting phenolic resins, range of viscosities is controlled at 300~500mPa*s/25 DEG C.
Step（2）In, the nanofiber of the alumina powder of 8wt%, 2wt% is added in the absolute ethyl alcohol of 25wt% and is mixed
Uniformly, it is then added in the compounding resin liquid of 40wt%, the diadust of 25wt% is fully added after dissolving, is stirred through high speed centrifugation
Mix, obtain uniform resin mixture liquor.
Step（3）The speed of line process median generatrix processed is 2m/s.
Step（4）The maximum temperature used in secondary solidification is 220 DEG C, and soaking time is 2 h, finally with stove natural cooling
To room temperature.
Embodiment 3：A kind of preparation method of resinous coat diamond wire, the difference with embodiment 1 is,
Step（1）In, thermoplastic phenolic resin and thermosetting phenolic resin are with 5:2.4 weight forms compounding resin than mixing
Liquid.Thermosetting phenolic resin is PF-2551 type thermosetting phenolic resins, and range of viscosities is controlled at 500~700mPa*s/25 DEG C.
Step（2）In, mixing is equal during the titanium oxide of the silicon carbide micro-powder of 10wt%, 1wt% is added into the industrial alcohol of 24wt%
It is even, it is then added in the compounding resin liquid of 37wt%, the diadust of 28wt% is fully added after dissolving, stirred through high speed centrifugation
Mix, obtain uniform resin mixture liquor.
Step（3）The speed of line process median generatrix processed is 2m/s.
Step（4）The maximum temperature used in secondary solidification is 220 DEG C, and soaking time is 2 h, finally with stove natural cooling
To room temperature.
Electronic microscope photos is scanned to the resin-diamond line prepared by embodiment 1-3, to observe its overhang, diamond
Quantity and resin bed situation；Tensile test is carried out to resin thread using tensile testing machine；Using tester for friction between to resin
The cutting power test of line.Test result see the table below 1：
。
Test result analysis：The overhang of the resin-diamond line of gained meets with diamonds in above example
The relevant criterion of production requirement, resin bed is intact；Pulling force can reach more than 28N；Amount of friction reaches more than 3000 μm.
The present invention is described in detail above in conjunction with drawings and Examples, but, those of skill in the art
Member to the design parameter of each in above-described embodiment it is understood that on the premise of present inventive concept is not departed from, can also carry out
Change, forms multiple specific embodiments, is common excursion of the invention, no longer describes in detail one by one herein.
Claims (10)
1. a kind of preparation method of resinous coat diamond wire, it is characterised in that comprise the following steps：
（1）Phenolic resin type selecting and compounding：From solid thermoplastic phenolic resin and liquid thermoset phenolic resin；By the thermoplastic
Property phenolic resin and thermosetting phenolic resin with 3:2~4:1 weight forms compounding resin liquid than mixing；
The fluidity of the thermoplastic phenolic resin is 20~38mm, and it is 80~130 seconds, six first during solidification to gather speed at 150 DEG C
The consumption of urotropine is 10~12%, and molecular weight is 11000~13000；
The molecular weight of the thermosetting phenolic resin is 4000~7000, solidfied material content >=70%；
（2）Prepare resin mixture liquor：To step（1）Filler and organic solvent are added in the compounding resin liquid of gained and stirring is to molten
Solution, adds diadust, after being stirred through high-speed centrifugal, forms uniform resin mixture liquor；It is each in the resin mixture liquor
Part proportion is：Compounding 20~50wt% of resin liquid, 10~30wt% of organic solvent, 5~25wt% of filler, diadust
10~40wt%；
（3）Line processed and one-step solidification：By step（2）The resin mixture liquor of gained is coated uniformly on steel wire bus by line equipment processed
Surface, then the cured stove of bus after coating is carried out into curing process, obtain the resin-diamond line of one-step solidification；
（4）Secondary solidification：By step（3）The resin-diamond line of the one-step solidification of gained be placed in isothermal curing stove carry out it is secondary
Curing process, using staged temperature-rise period, programming rate is 1~20 DEG C/min, and soaking time is 0.5~3 h, maximum temperature
It it is 200~400 DEG C, using the draft type for continuing air blast in solidification process；Room temperature is finally down to naturally with stove, obtains finished product tree
Fat diamond wire.
2. the preparation method of resinous coat diamond wire according to claim 1, it is characterised in that step（1）Described in
Thermoplastic phenolic resin is the PF- produced by condensation reaction using compound aralkyl ethers and phenol containing difunctional
2939-1 type thermoplastic phenolic resins.
3. the preparation method of resinous coat diamond wire according to claim 1, it is characterised in that step（1）Described in
Thermosetting phenolic resin is PF-2508 type thermosetting phenolic resins, and range of viscosities is controlled at 700~900mPa*s/25 DEG C；Or be
PF-2518 type thermosetting phenolic resins, range of viscosities is controlled at 300~500mPa*s/25 DEG C；Or be PF-2551 type thermosettings
Phenolic resin, range of viscosities is controlled at 500~700mPa*s/25 DEG C.
4. the preparation method of resinous coat diamond wire according to claim 1, it is characterised in that step（2）Described in
Filler is at least one in aluminum oxide, carborundum, titanium oxide, chromium oxide, nanofiber.
5. the preparation method of resinous coat diamond wire according to claim 1, it is characterised in that step（2）Described in
Organic solvent is industrial alcohol, N, the one kind in N- dimethylformamides, ethyl acetate, absolute ethyl alcohol.
6. the preparation method of resinous coat diamond wire according to claim 1, it is characterised in that step（2）Described in
Diadust is nickel plating diadust, and its coating amount is 1~55wt%, and size is 10~20 μm.
7. the preparation method of resinous coat diamond wire according to claim 1, it is characterised in that step（3）Described in
Solidification furnace length is 500mm~1500mm, and solidification temperature is 500~900 DEG C, is molded using infra-red electronic radiation curing.
8. the preparation method of resinous coat diamond wire according to claim 1, it is characterised in that step（3）Described in
A diameter of 80~110 μm of steel wire bus.
9. a kind of resinous coat diamond wire, including steel wire bus and the resinous coat for being solidificated in the bus surface, its feature
It is that the resinous coat is obtained by the resin mixture liquor for being coated in the bus surface by solidification, the resin mixture liquor
Include：Compounding 20~50wt% of resin liquid, 10~30wt% of organic solvent, 5~25wt% of filler, diadust 10~
40wt%；The compounding resin liquid is 3 by weight ratio:2~4:1 thermoplastic phenolic resin and thermosetting phenolic resin mixing and
Into.
10. resinous coat diamond wire according to claim 9, it is characterised in that the thermoplastic phenolic resin is PF-
2939-1 type thermoplastic phenolic resins, its fluidity is 20~38mm, and it is 80~130 seconds, six first during solidification to gather speed at 150 DEG C
The consumption of urotropine is 10~12%, and molecular weight is 11000~13000；
The molecular weight of the thermosetting phenolic resin is 4000~7000, solidfied material content >=70%；
The thermosetting phenolic resin is PF-2508 type thermosetting phenolic resins, and range of viscosities is controlled in 700~900mPa*s/
25℃；Or be PF-2518 type thermosetting phenolic resins, range of viscosities is controlled at 300~500mPa*s/25 DEG C；Or be PF-2551
Type thermosetting phenolic resin, range of viscosities is controlled at 500~700mPa*s/25 DEG C.
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| CN201611192764.0A CN106826598A (en) | 2016-12-21 | 2016-12-21 | Resinous coat diamond wire and preparation method thereof |
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Cited By (7)
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| CN107443602A (en) * | 2017-09-11 | 2017-12-08 | 湖南七纬科技有限公司 | A kind of high-performance diamond line and preparation method thereof |
| CN108044818A (en) * | 2017-12-07 | 2018-05-18 | 浙江瑞翌新材料科技股份有限公司 | A kind of processing method of resin diamond wire busbar |
| CN110181698A (en) * | 2019-04-25 | 2019-08-30 | 南京大学连云港高新技术研究院 | A kind of stabilized structure formula diamond wire and preparation method thereof |
| CN110344769A (en) * | 2019-08-21 | 2019-10-18 | 郑州新亚复合超硬材料有限公司 | High-performance diamond composite sheet and preparation method thereof |
| CN111015984A (en) * | 2019-12-31 | 2020-04-17 | 南通曜世新材料科技有限公司 | Method for manufacturing resin diamond wire |
| CN111871561A (en) * | 2020-08-04 | 2020-11-03 | 苏州兴业材料科技南通有限公司 | Method for preventing low-softening-point phenolic resin from caking |
| CN114083449A (en) * | 2021-11-23 | 2022-02-25 | 廊坊盛森磨具有限公司 | Resin grinding wheel for cutting and disassembling reinforced concrete and preparation method and application thereof |
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| CN110344769B (en) * | 2019-08-21 | 2024-06-07 | 郑州新亚复合超硬材料有限公司 | High-performance diamond compact and preparation method thereof |
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