CN111015984A - Method for manufacturing resin diamond wire - Google Patents
Method for manufacturing resin diamond wire Download PDFInfo
- Publication number
- CN111015984A CN111015984A CN201911411983.7A CN201911411983A CN111015984A CN 111015984 A CN111015984 A CN 111015984A CN 201911411983 A CN201911411983 A CN 201911411983A CN 111015984 A CN111015984 A CN 111015984A
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- CN
- China
- Prior art keywords
- resin
- liquid
- diamond wire
- mould
- mixed liquid
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
Abstract
The invention discloses a method for manufacturing a resin diamond wire, which comprises the following steps: preparing a compound resin liquid: mixing solid thermoplastic phenolic resin and liquid thermosetting phenolic resin to form compound resin liquid; preparing a resin mixed solution, namely injecting the resin mixed solution into a mould, sequentially arranging 3-5 channels of the mould injected with the resin mixed solution, and arranging an immersion roller body above the mould; immersing the core wire into the resin mixed liquid coated in the mould through the immersing roller body, and controlling the frequency of coating the resin mixed liquid by controlling the height of the immersing roller body so as to control the thickness of the coating mixed liquid; pre-curing the coated core wire; and placing the pre-cured resin diamond wire in a constant-temperature curing furnace for secondary curing treatment. The invention improves the production efficiency.
Description
Technical Field
The invention relates to the technical field of resin diamond wires, in particular to a manufacturing method of a resin diamond wire.
Background
Solar energy has received attention from all countries in the world as a novel clean renewable energy source. The most important crystal silicon wafer in solar photovoltaic power generation is produced by cutting a silicon ingot or a silicon rod, and the cutting mode comprises two modes of free abrasive and fixed abrasive. The free abrasive adopts silicon carbide blade material mixed polyethylene glycol cutting fluid, which has serious environmental pollution, lower production efficiency and thick damaged layer of silicon wafers, thus being gradually replaced by the cutting of a new generation of fixed abrasive. The resin diamond wire is the most typical representative of the fixed abrasive, the resin diamond wire is a cutting tool which is prepared by coating a mixed solution of resin, diamond abrasive particles and a filler on the surface of a steel wire bus and heating and curing, and in the cutting process, the diamond particles on the steel wire are directly used for cutting a silicon ingot. The resin diamond wire has the advantages of simple process, short manufacturing period, low cost, good flexibility, good processing surface quality and the like, and becomes a more and more research hotspot in the brittle and hard material processing industry. The key technology of resin diamond wire production is the preparation of high-performance resin liquid, so that the resin liquid has high heat resistance, stability and good bonding strength.
Disclosure of Invention
The invention aims to provide a manufacturing method of a resin diamond wire and improve the production efficiency.
In order to solve the technical problems, the invention adopts the following technical scheme: a manufacturing method of a resin diamond wire comprises the following steps:
1) preparing a compound resin liquid: mixing solid thermoplastic phenolic resin and liquid thermosetting phenolic resin to form compound resin liquid;
2) preparing a resin mixed solution: adding carborundum, an organic solvent, SiC sand grains and aluminum oxide after the metal coating into the compound resin liquid obtained in the step 1), and stirring to obtain a resin mixed liquid;
3) injecting the resin mixed liquid into a mould, sequentially arranging 3-5 channels of moulds injected with the resin mixed liquid, and arranging an immersion roller body above the mould;
4) preparing a semi-hardened resin diamond wire: immersing the core wire into the resin mixed liquid coated in the mould through the immersing roller body, and controlling the frequency of coating the resin mixed liquid by controlling the height of the immersing roller body so as to control the thickness of the coating mixed liquid; pre-curing the coated core wire;
5) and (3) resin diamond wire finished product: and (3) placing the pre-cured resin diamond wire in a constant-temperature curing furnace for secondary curing treatment, adopting a step-type heating process, wherein the heating speed is 5-10 ℃/min, the heat preservation time is 1-3h, and the highest temperature is 220-.
Further, the thermoplastic phenolic resin and the thermosetting phenolic resin in the step 1) are mixed in a weight ratio of 3-5: 1-2.
Further, the proportion of each part in the resin mixed solution in the step 2) is as follows: 20-50wt% of compound resin liquid, 10-40wt% of carborundum, 10-30wt% of organic solvent, 5-25wt% of SiC sand grains and 5-25wt% of aluminum oxide.
Further, the core wire is conveyed at a speed of 1.5 to 1.8 m.
The invention has the beneficial effects that: according to the invention, the high-performance diamond wire is prepared by adopting a composite resin system, so that the defects of bubbles, bare buses and the like are avoided, and the resin layer is firmly bonded with the buses. The method has the advantages of short curing time and high production efficiency.
Detailed Description
The technical solution of the present invention will be clearly and completely described by the following detailed description.
Example 1
A manufacturing method of a resin diamond wire comprises the following steps:
1) preparing a compound resin liquid: mixing solid thermoplastic phenolic resin and liquid thermosetting phenolic resin to form compound resin liquid; the thermoplastic phenolic resin and the thermosetting phenolic resin are mixed in a weight ratio of 3-5: 1-2.
2) Preparing a resin mixed solution: adding carborundum, an organic solvent, SiC sand grains and aluminum oxide after the metal coating into the compound resin liquid obtained in the step 1), and stirring to obtain a resin mixed liquid; the proportion of each part in the resin mixed solution is as follows: 20-50wt% of compound resin liquid, 10-40wt% of carborundum, 10-30wt% of organic solvent, 5-25wt% of SiC sand grains and 5-25wt% of aluminum oxide.
3) Injecting the resin mixed liquid into a mould, sequentially arranging 3-5 channels of moulds injected with the resin mixed liquid, and arranging an immersion roller body above the mould;
4) preparing a semi-hardened resin diamond wire: dipping the core wire into the resin mixed liquid coated in the mould through the immersion roller body, wherein the conveying speed of the core wire is 1.5-1.8m, and the frequency of coating the resin mixed liquid is controlled by controlling the height of the immersion roller body, so that the thickness of the coating mixed liquid is controlled; the coated core wire is pre-cured.
5) And (3) resin diamond wire finished product: and (3) placing the pre-cured resin diamond wire in a constant-temperature curing furnace for secondary curing treatment, adopting a step-type heating process, wherein the heating speed is 5-10 ℃/min, the heat preservation time is 1-3h, and the highest temperature is 220-.
The above-mentioned embodiments are merely descriptions of the preferred embodiments of the present invention, and do not limit the concept and scope of the present invention, and various modifications and improvements made to the technical solutions of the present invention by those skilled in the art should fall into the protection scope of the present invention without departing from the design concept of the present invention, and the technical contents of the present invention as claimed are all described in the technical claims.
Claims (4)
1. A method for manufacturing a resin diamond wire is characterized by comprising the following steps: the method comprises the following steps:
1) preparing a compound resin liquid: mixing solid thermoplastic phenolic resin and liquid thermosetting phenolic resin to form compound resin liquid;
2) preparing a resin mixed solution: adding carborundum, an organic solvent, SiC sand grains and aluminum oxide after the metal coating into the compound resin liquid obtained in the step 1), and stirring to obtain a resin mixed liquid;
3) injecting the resin mixed liquid into a mould, sequentially arranging 3-5 channels of moulds injected with the resin mixed liquid, and arranging an immersion roller body above the mould;
4) preparing a semi-hardened resin diamond wire: immersing the core wire into the resin mixed liquid coated in the mould through the immersing roller body, and controlling the frequency of coating the resin mixed liquid by controlling the height of the immersing roller body so as to control the thickness of the coating mixed liquid; pre-curing the coated core wire;
5) and (3) resin diamond wire finished product: and (3) placing the pre-cured resin diamond wire in a constant-temperature curing furnace for secondary curing treatment, adopting a step-type heating process, wherein the heating speed is 5-10 ℃/min, the heat preservation time is 1-3h, and the highest temperature is 220-.
2. The method of manufacturing a resin diamond wire according to claim 1, wherein: mixing the thermoplastic phenolic resin and the thermosetting phenolic resin in the step 1) in a weight ratio of 3-5: 1-2.
3. The method of manufacturing a resin diamond wire according to claim 2, wherein: the proportion of each part in the resin mixed solution in the step 2) is as follows: 20-50wt% of compound resin liquid, 10-40wt% of carborundum, 10-30wt% of organic solvent, 5-25wt% of SiC sand grains and 5-25wt% of aluminum oxide.
4. The method of manufacturing a resin diamond wire according to claim 2, wherein: the core wire is transported at a speed of 1.5 to 1.8 m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911411983.7A CN111015984A (en) | 2019-12-31 | 2019-12-31 | Method for manufacturing resin diamond wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911411983.7A CN111015984A (en) | 2019-12-31 | 2019-12-31 | Method for manufacturing resin diamond wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111015984A true CN111015984A (en) | 2020-04-17 |
Family
ID=70197606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911411983.7A Withdrawn CN111015984A (en) | 2019-12-31 | 2019-12-31 | Method for manufacturing resin diamond wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111015984A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114043652A (en) * | 2021-11-15 | 2022-02-15 | 内蒙古工业大学 | Method for determining pre-curing temperature and time of thermosetting phenolic resin, pre-curing method of thermosetting phenolic resin and pouring method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202107771U (en) * | 2011-05-23 | 2012-01-11 | 宝山钢铁股份有限公司 | Novel final water cooling slot device for continuous annealing and hot galvanizing sharing production line |
| CN202490977U (en) * | 2011-12-28 | 2012-10-17 | 山东大学 | Resin bond consolidation abrasive wire saw production system |
| CN103911576A (en) * | 2014-04-11 | 2014-07-09 | 武汉钢铁(集团)公司 | Hot-dip galvanizing pan |
| CN106826598A (en) * | 2016-12-21 | 2017-06-13 | 河南易成新能源股份有限公司 | Resinous coat diamond wire and preparation method thereof |
| KR20190124583A (en) * | 2018-04-26 | 2019-11-05 | 일진다이아몬드(주) | Resin bonded diamond wire and method for manufacturing the same |
-
2019
- 2019-12-31 CN CN201911411983.7A patent/CN111015984A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202107771U (en) * | 2011-05-23 | 2012-01-11 | 宝山钢铁股份有限公司 | Novel final water cooling slot device for continuous annealing and hot galvanizing sharing production line |
| CN202490977U (en) * | 2011-12-28 | 2012-10-17 | 山东大学 | Resin bond consolidation abrasive wire saw production system |
| CN103911576A (en) * | 2014-04-11 | 2014-07-09 | 武汉钢铁(集团)公司 | Hot-dip galvanizing pan |
| CN106826598A (en) * | 2016-12-21 | 2017-06-13 | 河南易成新能源股份有限公司 | Resinous coat diamond wire and preparation method thereof |
| KR20190124583A (en) * | 2018-04-26 | 2019-11-05 | 일진다이아몬드(주) | Resin bonded diamond wire and method for manufacturing the same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114043652A (en) * | 2021-11-15 | 2022-02-15 | 内蒙古工业大学 | Method for determining pre-curing temperature and time of thermosetting phenolic resin, pre-curing method of thermosetting phenolic resin and pouring method |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20200417 |