CN103980669A - Preparation method for epoxy resin board - Google Patents
Preparation method for epoxy resin board Download PDFInfo
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- CN103980669A CN103980669A CN201410140838.0A CN201410140838A CN103980669A CN 103980669 A CN103980669 A CN 103980669A CN 201410140838 A CN201410140838 A CN 201410140838A CN 103980669 A CN103980669 A CN 103980669A
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Abstract
The invention discloses a preparation method for an epoxy resin board. The preparation method comprises the following steps: weighing a bisphenol F type epoxy resin, a bisphenol A type epoxy resin, an epoxy resin E-51, an isophthalic unsaturated polyester resin, N-(3,4-dichlorophenyl)N',N'-dimethyl urea, a microcapsule accelerant, a filling agent and a curing agent and subjecting the bisphenol F type epoxy resin, the bisphenol A type epoxy resin, the epoxy resin E-51, the isophthalic unsaturated polyester resin N-(3,4-dichlorophenyl)N',N'-dimethyl urea and the microcapsule accelerant to complex formulation and then to uniform mixing under stirring; adding the filling agent and the curing agent, carrying out uniform mixing under stirring, placing an obtained mixture on a flat mold, placing the flat mold on a vibration table for vibration, carrying out heating to 190 to 205 DEG C, then carrying out curing and heat insulation for 10 to 12 h and finally, carrying out room temperature curing for 5 to 8 d so as to obtain an epoxy resin board material; and cutting, polishing and sanding the epoxy resin board material so as to obtain the epoxy resin board. According to the invention, the epoxy resin board has the advantages of high temperature resistance, corrosion resistance, resistance to strong acid and alkali, high strength and hardness, uneasy deformation, simple preparation process and applicability to all kinds of laboratory platforms.
Description
Technical field
The present invention relates to epoxy resin board technical field, relate in particular to a kind of preparation method of epoxy resin board.
Background technology
Along with continuous progress economic and science and technology, various laboratories are also more and more; In the suite of equipment in laboratory, need to use various carrying platforms, namely table top; The making base material of some current table tops is poor, for high temperature resistant, anticorrosion effect is not good, can not adapt to the requirement of some special conditionss; Therefore, the table top synthetic to polymer composite, both high temperature resistant, acid and alkali-resistance, has fabulous erosion resistance again, and the market outlook of this material are wide.
Summary of the invention
The present invention proposes a kind of preparation method of epoxy resin board, high temperature resistant, corrosion-resistant, strong acid-base resistance, intensity and hardness are high, are not easy distortion, and preparation process is simple, is applicable to the application of various lab platforms.
The preparation method of a kind of epoxy resin board that the present invention proposes, take by weight following raw material: bisphenol f type epoxy resin 3-6 part, bisphenol A type epoxy resin 2-6 part, E-51 epoxy resin 4-7 part, metaphenylene unsaturated polyester resin 11-14 part, N-(3, 4-dichlorophenyl)-N ', N '-dimethyl urea 2-4 part, microcapsule promotor 0.5-1.4 part, weighting agent 60-75 part, solidifying agent 2-6 part, wherein, described weighting agent comprises 39-43 part high-purity ground quartz by weight, 13-18 part aluminium hydrate powder and 8-14 part marble flour, high-purity ground quartz purity is SiO2>=99.5%, Fe
2o
2≤ 0.005%, impurity < 1% in aluminium hydrate powder, described solidifying agent comprises trimellitic acid 1,2-anhydride 1-3 part by weight, toluene tetrahydrophthalic anhydride 1-3 part, microcapsule promotor is comprised of one or more of imidazoles microcapsule promotor, boron trifluoride amine complex microcapsule promotor, EMI microcapsule promotor and TMTD microcapsule promotor, by bisphenol f type epoxy resin, bisphenol A type epoxy resin, E-51 epoxy resin, metaphenylene unsaturated polyester resin, N-(3,4-dichlorophenyl)-N ', N '-dimethyl urea and microcapsule promotor is composite to complete final vacuum and is pumped in stirrer and stirs, in batch mixing, add weighting agent and solidifying agent and after mixing and stirring, be placed on flat plate mold in vacuum mixer, then flat plate mold is placed on high-speed microwave shaking table and is vibrated, after vibration Preset Time, shutting down standing 10-20h, flat plate mold is sent in high hot house and is heated to gradually 190-205 ℃, solidify insulation 10-12h, from high hot house, take out and ambient cure 5-8 days, obtain epoxy resin panel material, epoxy resin panel material is obtained to epoxy resin board after cutting, polishing, sanding.
In embodiment, bisphenol f type epoxy resin 3, 3.4, 4, 4.8, 5, 5.5, 6, bisphenol A type epoxy resin 2, 3, 4, 5, 6, E-51 epoxy resin 4, 4.6, 5, 5.8, 6, 6.7, 7, metaphenylene unsaturated polyester resin 11, 11.7, 12, 12.5, 13, 13.3, 14, N-(3, 4-dichlorophenyl)-N ', N '-dimethyl urea 2, 2.5, 2.8, 3, 3.4, 3.9, 4, microcapsule promotor 0.5, 0.8, 1, 1.2, 1.4, weighting agent 60, 62, 65, 68, 70, 73, 75, trimellitic acid 1,2-anhydride 1, 1.1, 1.5, 1.9, 2, 2.5, 2.8, 3, toluene tetrahydrophthalic anhydride 1, 1.5, 1.8, 2, 2.4, 2.8, 3.
Preferably, the weight ratio of described high-purity ground quartz, aluminium hydrate powder and marble flour is 8:3:2.
Preferably, the weight ratio of described trimellitic acid 1,2-anhydride and toluene tetrahydrophthalic anhydride is (3-4): 3.
Preferably, the weight ratio 2:(1-3 of described bisphenol f type epoxy resin and bisphenol A-type blend epoxy resin).
Preferably, described N-(3,4-dichlorophenyl)-N ', the weight ratio of N '-dimethyl urea and microcapsule promotor is (5-10): 3.
In the present invention, adopt bisphenol f type epoxy resin, bisphenol A type epoxy resin, E-51 epoxy resin and metaphenylene unsaturated polyester resin mixing effect, the viscosity of bisphenol f type epoxy resin little with raw material in the Combination of other component good, excellent anti-corrosion performance, curing performance and bisphenol A type epoxy resin are almost identical, but its corrosion resistance nature is slightly poor, bisphenol f type epoxy resin and bisphenol A type epoxy resin mating reaction thermotolerance, water tolerance and electric property are good, and add therein appropriate E-51 epoxy resin and metaphenylene unsaturated polyester resin, acid and alkali-resistance, corrosion resistance and good, process industrial art performance is good, Mechanical Properties of Products after solidifying is excellent, and can significantly strengthen goods toughness and resistance toheat, adding therein appropriate trimellitic acid 1,2-anhydride and toluene tetrahydrophthalic anhydride is used in conjunction with as the solidifying agent of above-mentioned base material, eutectic mixture viscosity is lower, with bisphenol f type epoxy resin, bisphenol A type epoxy resin, E-51 epoxy resin and metaphenylene unsaturated polyester resin base material mix, not only can greatly improve processing performance, and goods is high temperature resistant, corrosion-resistant and acid-proof alkaline also has obvious enhancing, N-(3, 4-dichlorophenyl)-N ', N '-dimethyl urea is obvious to above-mentioned resin base material system accelerative action in curing, itself and microcapsule promotor share effect and rationally control both proportionings, not only can reduce solidification value, accelerate curing reaction speed, improve condensate performance, and the storage at room temperature phase that can the above-mentioned resin base material system of significant prolongation, when described heating raw materials arrives certain temperature, cyst wall thawing is broken, discharge promotor, can further accelerate solidification rate, add high-purity ground quartz, aluminium hydrate powder and marble flour are as the weighting agent of these goods, and rationally control three's proportioning, product strength and hardness are higher, wear resisting property, Good Heat-resistance, and it is not yielding, in the present invention, above-mentioned epoxy resin board is high temperature resistant, corrosion-resistant, strong acid-base resistance, and intensity and hardness are high, is not easy distortion, and preparation process is simple, is applicable to the application of various lab platforms.
Embodiment
The present invention proposes a kind of preparation method of epoxy resin board, comprise the steps: to take by weight following raw material: bisphenol f type epoxy resin 3-6 part, bisphenol A type epoxy resin 2-6 part, E-51 epoxy resin 4-7 part, metaphenylene unsaturated polyester resin 11-14 part, N-(3, 4-dichlorophenyl)-N ', N '-dimethyl urea 2-4 part, microcapsule promotor 0.5-1.4 part, weighting agent 60-75 part, solidifying agent 2-6 part, wherein, described weighting agent comprises 39-43 part high-purity ground quartz by weight, 13-18 part aluminium hydrate powder and 8-14 part marble flour, high-purity ground quartz purity is SiO2>=99.5%, Fe
2o
2≤ 0.005%, impurity < 1% in aluminium hydrate powder, described solidifying agent comprises trimellitic acid 1,2-anhydride 1-3 part by weight, toluene tetrahydrophthalic anhydride 1-3 part, microcapsule promotor is comprised of one or more of imidazoles microcapsule promotor, boron trifluoride amine complex microcapsule promotor, EMI microcapsule promotor and TMTD microcapsule promotor, by bisphenol f type epoxy resin, bisphenol A type epoxy resin, E-51 epoxy resin, metaphenylene unsaturated polyester resin, N-(3,4-dichlorophenyl)-N ', N '-dimethyl urea and microcapsule promotor is composite to complete final vacuum and is pumped in stirrer and stirs, in batch mixing, add weighting agent and solidifying agent and after mixing and stirring, be placed on flat plate mold in vacuum mixer, then flat plate mold is placed on high-speed microwave shaking table and is vibrated, after vibration Preset Time, shutting down standing 10-20h, flat plate mold is sent in high hot house and is heated to gradually 190-205 ℃, solidify insulation 10-12h, from high hot house, take out and ambient cure 5-8 days, obtain epoxy resin panel material, epoxy resin panel material is obtained to epoxy resin board after cutting, polishing, sanding.
Embodiment 1
The preparation method of a kind of epoxy resin board that the present embodiment proposes, comprise the steps: to take by weight following raw material: 5.5 parts of bisphenol f type epoxy resins, 4 parts of bisphenol A type epoxy resins, 4.6 parts of E-51 epoxy resin, 13.3 parts of metaphenylene unsaturated polyester resins, N-(3,4-dichlorophenyl)-N ', 2.5 parts of N '-dimethyl ureas, 1.2 parts of imidazoles microcapsule promotor, 62 parts of weighting agents, 2.8 parts of trimellitic acid 1,2-anhydrides, 1.8 parts of toluene tetrahydrophthalic anhydride; Described weighting agent comprises by weight: 39 parts of high-purity ground quartzs, 16 parts of aluminium hydrate powders and 14 parts of marble flours, high-purity ground quartz purity is SiO
2be 99.5%, Fe
2o
2be 0.005%, the impurity of aluminium hydrate powder is 0.03%; By bisphenol f type epoxy resin, bisphenol A type epoxy resin, E-51 epoxy resin, metaphenylene unsaturated polyester resin, N-(3,4-dichlorophenyl)-N ', N '-dimethyl urea and microcapsule promotor is composite to complete final vacuum and is pumped in stirrer and stirs; In batch mixing, add weighting agent and solidifying agent and after mixing and stirring, be placed on flat plate mold in vacuum mixer, then flat plate mold is placed on high-speed microwave shaking table and is vibrated, after vibration Preset Time, shutting down standing 20h; Flat plate mold is sent in high hot house and is heated to gradually 203 ℃, solidify insulation 11h, from high hot house, take out also ambient cure 8 days, obtain epoxy resin panel material; Epoxy resin panel material is obtained to epoxy resin board after cutting, polishing, sanding.
Embodiment 2
The preparation method of a kind of epoxy resin board that the present embodiment proposes, comprise the steps: to take by weight following raw material: 3.4 parts of bisphenol f type epoxy resins, 5 parts of bisphenol A type epoxy resins, 5.8 parts of E-51 epoxy resin, 12.5 parts of metaphenylene unsaturated polyester resins, N-(3,4-dichlorophenyl)-N ', 3.9 parts of N '-dimethyl ureas, 1.4 parts of TMTD microcapsule promotor, 68 parts of weighting agents, 1.1 parts of trimellitic acid 1,2-anhydrides, 2.5 parts of toluene tetrahydrophthalic anhydride; Described weighting agent comprises by weight: 40 parts of high-purity ground quartzs, 13 parts of aluminium hydrate powders and 8 parts of marble flours, high-purity ground quartz purity is SiO
2be 99.7%, Fe
2o
2be 0.0024%, the impurity of aluminium hydrate powder is 0.45%; By bisphenol f type epoxy resin, bisphenol A type epoxy resin, E-51 epoxy resin, metaphenylene unsaturated polyester resin, N-(3,4-dichlorophenyl)-N ', N '-dimethyl urea and microcapsule promotor is composite to complete final vacuum and is pumped in stirrer and stirs; In batch mixing, add weighting agent and solidifying agent and after mixing and stirring, be placed on flat plate mold in vacuum mixer, then flat plate mold is placed on high-speed microwave shaking table and is vibrated, after vibration Preset Time, shutting down standing 13h; Flat plate mold is sent in high hot house and is heated to gradually 195 ℃, solidify insulation 10h, from high hot house, take out also ambient cure 5 days, obtain epoxy resin panel material; Epoxy resin panel material is obtained to epoxy resin board after cutting, polishing, sanding.
Embodiment 3
The preparation method of a kind of epoxy resin board that the present embodiment proposes, comprise the steps: to take by weight following raw material: 4.8 parts of bisphenol f type epoxy resins, 3 parts of bisphenol A type epoxy resins, 6.7 parts of E-51 epoxy resin, 11.7 parts of metaphenylene unsaturated polyester resins, N-(3,4-dichlorophenyl)-N ', 2.8 parts of N '-dimethyl ureas, 0.5 part of boron trifluoride amine complex microcapsule promotor, 75 parts of weighting agents, 1.5 parts of trimellitic acid 1,2-anhydrides, 2.8 parts of toluene tetrahydrophthalic anhydride; Described weighting agent comprises by weight: 43 parts of high-purity ground quartzs, 18 parts of aluminium hydrate powders and 12 parts of marble flours, high-purity ground quartz purity is SiO
2be 99.9%, Fe
2o
2be 0.0041%, the impurity of aluminium hydrate powder is 0.09%; By bisphenol f type epoxy resin, bisphenol A type epoxy resin, E-51 epoxy resin, metaphenylene unsaturated polyester resin, N-(3,4-dichlorophenyl)-N ', N '-dimethyl urea and microcapsule promotor is composite to complete final vacuum and is pumped in stirrer and stirs; In batch mixing, add weighting agent and solidifying agent and after mixing and stirring, be placed on flat plate mold in vacuum mixer, then flat plate mold is placed on high-speed microwave shaking table and is vibrated, after vibration Preset Time, shutting down standing 10h; Flat plate mold is sent in high hot house and is heated to gradually 205 ℃, solidify insulation 12h, from high hot house, take out also ambient cure 6 days, obtain epoxy resin panel material; Epoxy resin panel material is obtained to epoxy resin board after cutting, polishing, sanding.
Embodiment 4
The preparation method of a kind of epoxy resin board that the present embodiment proposes, comprise the steps: to take by weight following raw material: 4 parts of bisphenol f type epoxy resins, 4.5 parts of bisphenol A type epoxy resins, 6.3 parts of E-51 epoxy resin, 12.5 parts of metaphenylene unsaturated polyester resins, N-(3,4-dichlorophenyl)-N ', 3.5 parts of N '-dimethyl ureas, 1.2 parts of boron trifluoride amine complex microcapsule promotor, 40 parts of high-purity ground quartzs, 15 parts of aluminium hydrate powders, 10 parts of marble flours, 1.8 parts of trimellitic acid 1,2-anhydrides, 1.5 parts of toluene tetrahydrophthalic anhydride; Weighting agent comprises 41 parts of high-purity ground quartzs, 17 parts of aluminium hydrate powders and 13 parts of marble flours by weight, and high-purity ground quartz purity is SiO
2be 99.7%, Fe
2o
2be 0.0041%, the impurity of aluminium hydrate powder is 0.24%; By bisphenol f type epoxy resin, bisphenol A type epoxy resin, E-51 epoxy resin, metaphenylene unsaturated polyester resin, N-(3,4-dichlorophenyl)-N ', N '-dimethyl urea and microcapsule promotor is composite to complete final vacuum and is pumped in stirrer and stirs; In batch mixing, add weighting agent and solidifying agent and after mixing and stirring, be placed on flat plate mold in vacuum mixer, then flat plate mold is placed on high-speed microwave shaking table and is vibrated, after vibration Preset Time, shutting down standing 18h; Flat plate mold is sent in high hot house and is heated to gradually 200 ℃, solidify insulation 11h, from high hot house, take out also ambient cure 7 days, obtain epoxy resin panel material; Epoxy resin panel material is obtained to epoxy resin board after cutting, polishing, sanding.
Epoxy resin board described in embodiment 1-4 is high temperature resistant, corrosion-resistant, strong acid-base resistance, and intensity and hardness are high, is not easy distortion, and preparation process is simple, is applicable to the application of various lab platforms.
The above; it is only preferably embodiment of the present invention; but protection scope of the present invention is not limited to this; anyly be familiar with those skilled in the art in the technical scope that the present invention discloses; according to technical scheme of the present invention and inventive concept thereof, be equal to replacement or changed, within all should being encompassed in protection scope of the present invention.
Claims (5)
1. the preparation method of an epoxy resin board, it is characterized in that, take by weight following raw material: bisphenol f type epoxy resin 3-6 part, bisphenol A type epoxy resin 2-6 part, E-51 epoxy resin 4-7 part, metaphenylene unsaturated polyester resin 11-14 part, N-(3, 4-dichlorophenyl)-N ', N '-dimethyl urea 2-4 part, microcapsule promotor 0.5-1.4 part, weighting agent 60-75 part, solidifying agent 2-6 part, wherein, described weighting agent comprises 39-43 part high-purity ground quartz by weight, 13-18 part aluminium hydrate powder and 8-14 part marble flour, high-purity ground quartz purity is SiO2>=99.5%, Fe
2o
2≤ 0.005%, impurity < 1% in aluminium hydrate powder, described solidifying agent comprises trimellitic acid 1,2-anhydride 1-3 part by weight, toluene tetrahydrophthalic anhydride 1-3 part, microcapsule promotor is comprised of one or more of imidazoles microcapsule promotor, boron trifluoride amine complex microcapsule promotor, EMI microcapsule promotor and TMTD microcapsule promotor, by bisphenol f type epoxy resin, bisphenol A type epoxy resin, E-51 epoxy resin, metaphenylene unsaturated polyester resin, N-(3,4-dichlorophenyl)-N ', N '-dimethyl urea and microcapsule promotor is composite to complete final vacuum and is pumped in stirrer and stirs, in batch mixing, add weighting agent and solidifying agent and after mixing and stirring, be placed on flat plate mold in vacuum mixer, then flat plate mold is placed on high-speed microwave shaking table and is vibrated, after vibration Preset Time, shutting down standing 10-20h, flat plate mold is sent in high hot house and is heated to gradually 190-205 ℃, solidify insulation 10-12h, from high hot house, take out and ambient cure 5-8 days, obtain epoxy resin panel material, epoxy resin panel material is obtained to epoxy resin board after cutting, polishing, sanding.
2. the preparation method of epoxy resin board according to claim 1, is characterized in that, the weight ratio of described high-purity ground quartz, aluminium hydrate powder and marble flour is 8:3:2.
3. the preparation method of epoxy resin board according to claim 1, is characterized in that, the weight ratio of described trimellitic acid 1,2-anhydride and toluene tetrahydrophthalic anhydride is (3-4): 3.
4. the preparation method of epoxy resin board according to claim 1, is characterized in that, the weight ratio 2:(1-3 of described bisphenol f type epoxy resin and bisphenol A-type blend epoxy resin).
5. the preparation method of epoxy resin board according to claim 1, is characterized in that, described N-(3,4-dichlorophenyl)-N ', and the weight ratio of N '-dimethyl urea and microcapsule promotor is (5-10): 3.
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| CN103980669B CN103980669B (en) | 2016-08-17 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105672559A (en) * | 2016-02-26 | 2016-06-15 | 文登蓝岛建筑工程有限公司 | Lightweight thermal insulation wall board |
| CN105754299A (en) * | 2016-02-26 | 2016-07-13 | 文登蓝岛建筑工程有限公司 | Novel composite board |
| CN112111130A (en) * | 2020-08-29 | 2020-12-22 | 广西长城机械股份有限公司 | Stripping method of EPS foam-epoxy resin composite die applied to sand casting |
| CN112126195A (en) * | 2020-09-17 | 2020-12-25 | 广西长城机械股份有限公司 | Composite resin plate, preparation method and application thereof in preparation of EPS foam-resin composite die |
| CN112126088A (en) * | 2020-08-29 | 2020-12-25 | 广西长城机械股份有限公司 | EPS foam-epoxy resin composite die and preparation method thereof |
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| CN103483551A (en) * | 2013-09-28 | 2014-01-01 | 上海飞域实验室设备有限公司 | Preparation method and application of co-polymer of epoxy resin and unsaturated resin |
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| CN101337805A (en) * | 2008-08-25 | 2009-01-07 | 张璐 | Artificial quartz in lump and fabrication technology thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105672559A (en) * | 2016-02-26 | 2016-06-15 | 文登蓝岛建筑工程有限公司 | Lightweight thermal insulation wall board |
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| CN112111130A (en) * | 2020-08-29 | 2020-12-22 | 广西长城机械股份有限公司 | Stripping method of EPS foam-epoxy resin composite die applied to sand casting |
| CN112126088A (en) * | 2020-08-29 | 2020-12-25 | 广西长城机械股份有限公司 | EPS foam-epoxy resin composite die and preparation method thereof |
| CN112126195A (en) * | 2020-09-17 | 2020-12-25 | 广西长城机械股份有限公司 | Composite resin plate, preparation method and application thereof in preparation of EPS foam-resin composite die |
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| CN103980669B (en) | 2016-08-17 |
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