CN103980669B - The preparation method of epoxy resin board - Google Patents
The preparation method of epoxy resin board Download PDFInfo
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- CN103980669B CN103980669B CN201410140838.0A CN201410140838A CN103980669B CN 103980669 B CN103980669 B CN 103980669B CN 201410140838 A CN201410140838 A CN 201410140838A CN 103980669 B CN103980669 B CN 103980669B
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- epoxy resin
- accelerator
- microcapsule
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- type epoxy
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Abstract
The invention discloses the preparation method of a kind of epoxy resin board, weigh bisphenol f type epoxy resin, bisphenol A type epoxy resin, E 51 epoxy resin, metaphenylene unsaturated polyester resin, N (3,4 Dichlorobenzene base) N ', N ' dimethyl urea, microcapsule accelerator, filler and firming agent, by bisphenol f type epoxy resin, bisphenol A type epoxy resin, E 51 epoxy resin, metaphenylene unsaturated polyester resin, N (3,4 Dichlorobenzene base) N ', N ' dimethyl urea and microcapsule accelerator stirs after having compounded；It is placed on flat plate mold after adding filler and firming agent mixing and stirring, is placed on vibration table and vibrates, be heated to 190 205 DEG C, solidification insulation 10 12h, normal temperature cure 58 days, obtains epoxy resin panel material, cuts, polishes, sanding obtains epoxy resin board.In the present invention, above-mentioned epoxy resin board is high temperature resistant, corrosion-resistant, strong acid-base resistance, and intensity and hardness are high, it is not easy to deformation, and preparation process is simple, is suitable for the application of various lab platforms.
Description
Technical field
The present invention relates to epoxy resin board technical field, particularly relate to the preparation method of a kind of epoxy resin board.
Background technology
Along with the economic and continuous progress of science and technology, various laboratorys also get more and more；The complete set of equipments of laboratory
In need to use various carrying platform, namely table top；The making base material of some current table tops is poor, right
In high temperature resistant, anticorrosion effect is the best, it is impossible to adapt to the requirement of some specific conditions；Therefore, to macromolecule
The table top of composite synthesis, the most high temperature resistant, acid and alkali-resistance again, there is fabulous corrosion resistance, this material
Wide market.
Summary of the invention
The present invention proposes the preparation method of a kind of epoxy resin board, high temperature resistant, corrosion-resistant, strong acid-base resistance,
Intensity and hardness are high, it is not easy to deformation, and preparation process is simple, is suitable for the application of various lab platforms.
The preparation method of a kind of epoxy resin board that the present invention proposes, weighs following raw material by weight: Bisphenol F
Type epoxy resin 3-6 part, bisphenol A type epoxy resin 2-6 part, E-51 epoxy resin 4-7 part, metaphenylene
Unsaturated polyester resin 11-14 part, N-(3,4-Dichlorobenzene base)-N ', N '-dimethyl urea 2-4 part is micro-
Capsule accelerator 0.5-1.4 part, filler 60-75 part, firming agent 2-6 part, wherein, described filler
Include 39-43 part high-purity ground quartz, 13-18 part aluminium hydrate powder and 8-14 part marble powder by weight,
High-purity ground quartz purity is SiO2>=99.5%, Fe2O2≤ 0.005%, in aluminium hydrate powder, impurity ＜ 1%, described
Firming agent includes trimellitic anhydride 1-3 part, methyl tetrahydro phthalic anhydride 1-3 part, microcapsule accelerator by weight
By imidazoles microcapsule accelerator, boron trifluoride amine complex microcapsule accelerator, EMI microcapsule accelerator and
One or more compositions of TMTD microcapsule accelerator；By bisphenol f type epoxy resin, bisphenol type epoxy tree
Fat, E-51 epoxy resin, metaphenylene unsaturated polyester resin, N-(3,4-Dichlorobenzene base)-N ', N '-two
MU and microcapsule accelerator have compounded final vacuum and have been pumped in blender and stir；Batch mixing adds
Enter filler and firming agent and be placed on flat plate mold after mixing and stirring in de-airing mixer, then will
Flat plate mold is placed on high-speed microwave vibration table and vibrates, and shuts down and stand after vibration Preset Time
10-20h；It is progressively heated at 190-205 DEG C in flat plate mold is sent into high hot house, solidification insulation 10-12h,
From high hot house, take out also normal temperature cure 5-8 days, obtain epoxy resin panel material；By epoxy resin panel material
Cleaved, polishing, obtain epoxy resin board after sanding.
In a specific embodiment, bisphenol f type epoxy resin 3,3.4,4,4.8,5,5.5,6, bis-phenol
A type epoxy resin 2,3,4,5,6, E-51 epoxy resin 4,4.6,5,5.8,6,6.7,7,
Benzene-type unsaturated polyester resin 11,11.7,12,12.5,13,13.3,14, N-(3,4-dichloro-benzenes
Base)-N ', N '-dimethyl urea 2,2.5,2.8,3,3.4,3.9,4, microcapsule accelerator 0.5,0.8,
1,1.2,1.4, filler 60,62,65,68,70,73,75, trimellitic anhydride 1,1.1,1.5,
1.9,2,2.5,2.8,3, methyl tetrahydro phthalic anhydride 1,1.5,1.8,2,2.4,2.8,3.
Preferably, the weight ratio of described high-purity ground quartz, aluminium hydrate powder and marble powder is 8:3:2.
Preferably, described trimellitic anhydride is (3-4) with the weight ratio of methyl tetrahydro phthalic anhydride: 3.
Preferably, described bisphenol f type epoxy resin and bisphenol A-type are blended weight ratio 2:(1-3 of epoxy resin).
Preferably, described N-(3,4-Dichlorobenzene base)-N ', N '-dimethyl urea and the weight of microcapsule accelerator
Amount ratio is (5-10): 3.
In the present invention, use bisphenol f type epoxy resin, bisphenol A type epoxy resin, E-51 epoxy resin and
Metaphenylene unsaturated polyester resin immixture, the viscosity of bisphenol f type epoxy resin is little with other group in raw material
The Combination divided is good, excellent anti-corrosion performance, and curing performance is almost identical with bisphenol A type epoxy resin, but
It is that its decay resistance is slightly worse, bisphenol f type epoxy resin and bisphenol A type epoxy resin mating reaction thermostability,
Resistance to water and electric property are excellent, and add appropriate E-51 epoxy resin and metaphenylene unsaturated polyester (UP) wherein
Resin, acid and alkali-resistance, corrosion resistance and good, process industrial art performance is excellent, and the Mechanical Properties of Products after solidification is excellent
Different, and goods toughness and heat resistance can be obviously enhanced, add appropriate trimellitic anhydride and methyl four wherein
Hydrogen phthalic anhydride as above-mentioned base material firming agent come with the use of, eutectic mixture viscosity is relatively low, with bisphenol-f type
Epoxy resin, bisphenol A type epoxy resin, E-51 epoxy resin and metaphenylene unsaturated polyester resin base material are mixed
Close uniformly, not only can substantially improve processing performance, and high temperature resistant, the corrosion-resistant and acid-proof alkaline of goods
Also having significantly enhancing, N-(3,4-Dichlorobenzene base)-N ', N '-dimethyl urea is to above-mentioned resin base material body
Being that accelerative action in curing is obvious, it shares the proportioning of effect conservative control with microcapsule accelerator, no
Only can reduce solidification temperature, accelerate curing reaction speed, improve condensate performance, and can significantly extend above-mentioned
The storage at room temperature phase of resin base material system, when described raw material is heated to uniform temperature, cyst wall thawing ruptures,
Discharge accelerator, solidification rate can be further speeded up, add high-purity ground quartz, aluminium hydrate powder and Dali
Stone powder is as the filler of these goods, and the proportioning of conservative control three, product strength and hardness are higher, resistance to
Mill performance, Good Heat-resistance, and be unlikely to deform；In the present invention, above-mentioned epoxy resin board is high temperature resistant, resistance to
Burn into strong acid-base resistance, intensity and hardness are high, it is not easy to deformation, and preparation process is simple, is suitable for various experiments
The application of room platform.
Detailed description of the invention
The present invention proposes the preparation method of a kind of epoxy resin board, comprises the steps: to weigh by weight
Following raw material: bisphenol f type epoxy resin 3-6 part, bisphenol A type epoxy resin 2-6 part, E-51 asphalt mixtures modified by epoxy resin
Fat 4-7 part, metaphenylene unsaturated polyester resin 11-14 part, N-(3,4-Dichlorobenzene base)-N ', N '-two
MU 2-4 part, microcapsule accelerator 0.5-1.4 part, filler 60-75 part, firming agent 2-6 part,
Wherein, described filler include by weight 39-43 part high-purity ground quartz, 13-18 part aluminium hydrate powder and
8-14 part marble powder, high-purity ground quartz purity is SiO2>=99.5%, Fe2O2≤ 0.005%, aluminium hydrate powder
Middle impurity ＜ 1%, described firming agent includes trimellitic anhydride 1-3 part, methyl tetrahydro phthalic anhydride 1-3 by weight
Part, microcapsule accelerator is by imidazoles microcapsule accelerator, boron trifluoride amine complex microcapsule accelerator, EMI
One or more compositions of microcapsule accelerator and TMTD microcapsule accelerator；By bisphenol f type epoxy resin,
Bisphenol A type epoxy resin, E-51 epoxy resin, metaphenylene unsaturated polyester resin, N-(3,4-dichloro-benzenes
Base)-N ', N '-dimethyl urea and microcapsule accelerator compounded final vacuum and has been pumped in blender stirring all
Even；In batch mixing, add filler and firming agent and be placed on flat in de-airing mixer after mixing and stirring
On board mold, then flat plate mold is placed on high-speed microwave vibration table and vibrates, vibration Preset Time it
Rear shutdown stands 10-20h；Being progressively heated at 190-205 DEG C in flat plate mold is sent into high hot house, solidification is protected
Temperature 10-12h, takes out also normal temperature cure 5-8 days from high hot house, obtains epoxy resin panel material；By epoxy
Resin plate material is cleaved, polishing, obtain epoxy resin board after sanding.
Embodiment 1
The preparation method of a kind of epoxy resin board that the present embodiment proposes, comprises the steps: to claim by weight
Take following raw material: bisphenol f type epoxy resin 5.5 parts, bisphenol A type epoxy resin 4 parts, E-51 asphalt mixtures modified by epoxy resin
4.6 parts of fat, metaphenylene unsaturated polyester resin 13.3 parts, N-(3,4-Dichlorobenzene base)-N ', N '-diformazan
Base urea 2.5 parts, imidazoles microcapsule accelerator 1.2 parts, filler 62 parts, trimellitic anhydride 2.8 parts, first
Base THPA 1.8 parts；Described filler includes by weight: 39 parts of high-purity ground quartzs, 16 parts of hydroxides
Aluminium powder and 14 parts of marble powders, high-purity ground quartz purity is SiO2Be 99.5%, Fe2O2It is 0.005%, hydrogen-oxygen
The impurity changing aluminium powder is 0.03%；By bisphenol f type epoxy resin, bisphenol A type epoxy resin, E-51 epoxy
Resin, metaphenylene unsaturated polyester resin, N-(3,4-Dichlorobenzene base)-N ', N '-dimethyl urea and micro-glue
Capsule accelerator has compounded final vacuum and has been pumped in blender and stirs；Filler is added with solid in batch mixing
Agent is also placed on flat plate mold after mixing and stirring in de-airing mixer, then is placed by flat plate mold
High-speed microwave vibration table vibrates, shuts down after vibration Preset Time and stand 20h；Flat plate mold is sent
203 DEG C it are progressively heated in entering high hot house, solidification insulation 11h, from high hot house, take out also normal temperature cure 8 days,
Obtain epoxy resin panel material；Asphalt mixtures modified by epoxy resin is obtained after cleaved for epoxy resin panel material, polishing, sanding
Fat plate.
Embodiment 2
The preparation method of a kind of epoxy resin board that the present embodiment proposes, comprises the steps: to claim by weight
Take following raw material: bisphenol f type epoxy resin 3.4 parts, bisphenol A type epoxy resin 5 parts, E-51 asphalt mixtures modified by epoxy resin
5.8 parts of fat, metaphenylene unsaturated polyester resin 12.5 parts, N-(3,4-Dichlorobenzene base)-N ', N '-diformazan
Base urea 3.9 parts, TMTD microcapsule accelerator 1.4 parts, filler 68 parts, trimellitic anhydride 1.1 parts, first
Base THPA 2.5 parts；Described filler includes by weight: 40 parts of high-purity ground quartzs, 13 parts of hydroxides
Aluminium powder and 8 parts of marble powders, high-purity ground quartz purity is SiO2Be 99.7%, Fe2O2It is 0.0024%, hydrogen-oxygen
The impurity changing aluminium powder is 0.45%；By bisphenol f type epoxy resin, bisphenol A type epoxy resin, E-51 epoxy
Resin, metaphenylene unsaturated polyester resin, N-(3,4-Dichlorobenzene base)-N ', N '-dimethyl urea and micro-glue
Capsule accelerator has compounded final vacuum and has been pumped in blender and stirs；Filler is added with solid in batch mixing
Agent is also placed on flat plate mold after mixing and stirring in de-airing mixer, then is placed by flat plate mold
High-speed microwave vibration table vibrates, shuts down after vibration Preset Time and stand 13h；Flat plate mold is sent
195 DEG C it are progressively heated in entering high hot house, solidification insulation 10h, from high hot house, take out also normal temperature cure 5 days,
Obtain epoxy resin panel material；Asphalt mixtures modified by epoxy resin is obtained after cleaved for epoxy resin panel material, polishing, sanding
Fat plate.
Embodiment 3
The preparation method of a kind of epoxy resin board that the present embodiment proposes, comprises the steps: to claim by weight
Take following raw material: bisphenol f type epoxy resin 4.8 parts, bisphenol A type epoxy resin 3 parts, E-51 asphalt mixtures modified by epoxy resin
6.7 parts of fat, metaphenylene unsaturated polyester resin 11.7 parts, N-(3,4-Dichlorobenzene base)-N ', N '-diformazan
Base urea 2.8 parts, boron trifluoride amine complex microcapsule accelerator 0.5 part, filler 75 parts, trimellitic acid
Acid anhydride 1.5 parts, methyl tetrahydro phthalic anhydride 2.8 parts；Described filler includes by weight: 43 parts of high-purity ground quartzs,
18 parts of aluminium hydrate powders and 12 parts of marble powders, high-purity ground quartz purity is SiO2Be 99.9%, Fe2O2For
0.0041%, the impurity of aluminium hydrate powder is 0.09%；By bisphenol f type epoxy resin, bisphenol type epoxy tree
Fat, E-51 epoxy resin, metaphenylene unsaturated polyester resin, N-(3,4-Dichlorobenzene base)-N ', N '-two
MU and microcapsule accelerator have compounded final vacuum and have been pumped in blender and stir；Batch mixing adds
Enter filler and firming agent and be placed on flat plate mold after mixing and stirring in de-airing mixer, then will
Flat plate mold is placed on high-speed microwave vibration table and vibrates, and shuts down and stand 10h after vibration Preset Time；
205 DEG C it are progressively heated in flat plate mold is sent into high hot house, solidification insulation 12h, takes out also from high hot house
Normal temperature cure 6 days, obtains epoxy resin panel material；By cleaved for epoxy resin panel material, polishing, sanding
Obtain epoxy resin board afterwards.
Embodiment 4
The preparation method of a kind of epoxy resin board that the present embodiment proposes, comprises the steps: to claim by weight
Take following raw material: bisphenol f type epoxy resin 4 parts, bisphenol A type epoxy resin 4.5 parts, E-51 asphalt mixtures modified by epoxy resin
6.3 parts of fat, metaphenylene unsaturated polyester resin 12.5 parts, N-(3,4-Dichlorobenzene base)-N ', N '-diformazan
Base urea 3.5 parts, boron trifluoride amine complex microcapsule accelerator 1.2 parts, high-purity ground quartz 40 parts, hydrogen-oxygen
Change aluminium powder 15 parts, marble powder 10 parts, trimellitic anhydride 1.8 parts, methyl tetrahydro phthalic anhydride 1.5 parts；Fill out
Fill agent and include 41 parts of high-purity ground quartzs, 17 parts of aluminium hydrate powders and 13 parts of marble powders by weight, high-purity
Silica flour purity is SiO2It is 99.7%, Fe2O2Being 0.0041%, the impurity of aluminium hydrate powder is 0.24%；Will
Bisphenol f type epoxy resin, bisphenol A type epoxy resin, E-51 epoxy resin, metaphenylene unsaturated polyester (UP) tree
Fat, N-(3,4-Dichlorobenzene base)-N ', N '-dimethyl urea and microcapsule accelerator have compounded final vacuum and have taken out
Enter and stir in blender；In batch mixing, add filler and firming agent and mix in de-airing mixer
It is placed on flat plate mold after stirring, then flat plate mold is placed on high-speed microwave vibration table and shakes
Dynamic, shut down after vibration Preset Time and stand 18h；It is progressively heated in flat plate mold is sent into high hot house
200 DEG C, solidification insulation 11h, takes out also normal temperature cure 7 days from high hot house, obtains epoxy resin panel material；
Epoxy resin board is obtained after cleaved for epoxy resin panel material, polishing, sanding.
Epoxy resin board described in embodiment 1-4 is high temperature resistant, corrosion-resistant, strong acid-base resistance, and intensity and hardness are high,
Being not easy deformation, preparation process is simple, is suitable for the application of various lab platforms.
The above, the only present invention preferably detailed description of the invention, but protection scope of the present invention not office
Being limited to this, any those familiar with the art is in the technical scope that the invention discloses, according to this
The technical scheme of invention and inventive concept thereof in addition equivalent or change, all should contain the protection in the present invention
Within the scope of.
Claims (3)
1. the preparation method of an epoxy resin board, it is characterized in that, weigh following raw material by weight: bisphenol f type epoxy resin 3-6 part, bisphenol A type epoxy resin 2-6 part, E-51 epoxy resin 4-7 part, metaphenylene unsaturated polyester resin 11-14 part, N-(3, 4-Dichlorobenzene base)-N ', N '-dimethyl urea 2-4 part, microcapsule accelerator 0.5-1.4 part, filler 60-75 part, firming agent 2-6 part, wherein, described filler includes 39-43 part high-purity ground quartz by weight, 13-18 part aluminium hydrate powder and 8-14 part marble powder, high-purity ground quartz purity is SiO2>=99.5%, Fe2O2≤ 0.005%, impurity ＜ 1% in aluminium hydrate powder, described firming agent includes trimellitic anhydride 1-3 part by weight, methyl tetrahydro phthalic anhydride 1-3 part, microcapsule accelerator is made up of one or more of imidazoles microcapsule accelerator, boron trifluoride amine complex microcapsule accelerator, EMI microcapsule accelerator and TMTD microcapsule accelerator；By bisphenol f type epoxy resin, bisphenol A type epoxy resin, E-51 epoxy resin, metaphenylene unsaturated polyester resin, N-(3,4-Dichlorobenzene base)-N ', N '-dimethyl urea and microcapsule accelerator compounded final vacuum and has been pumped in blender and stirs；In batch mixing, add filler and firming agent and be placed on flat plate mold after mixing and stirring in de-airing mixer, then flat plate mold being placed on high-speed microwave vibration table and vibrate, shutting down after vibration Preset Time and stand 10-20h；It is progressively heated at 190-205 DEG C in flat plate mold is sent into high hot house, solidification insulation 10-12h, takes out also normal temperature cure 5-8 days from high hot house, obtains epoxy resin panel material；Epoxy resin board is obtained after cleaved for epoxy resin panel material, polishing, sanding；Described N-(3,4-Dichlorobenzene base)-N ', N '-dimethyl urea is (5-10) with the weight ratio of microcapsule accelerator: 3.
The preparation method of epoxy resin board the most according to claim 1, it is characterised in that the weight ratio of described high-purity ground quartz, aluminium hydrate powder and marble powder is 8:3:2.
The preparation method of epoxy resin board the most according to claim 1, it is characterised in that described trimellitic anhydride is (3-4) with the weight ratio of methyl tetrahydro phthalic anhydride: 3.
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| CN201410140838.0A CN103980669B (en) | 2014-04-09 | 2014-04-09 | The preparation method of epoxy resin board |
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| CN103980669B true CN103980669B (en) | 2016-08-17 |
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| CN105754299A (en) * | 2016-02-26 | 2016-07-13 | 文登蓝岛建筑工程有限公司 | Novel composite board |
| CN105672559A (en) * | 2016-02-26 | 2016-06-15 | 文登蓝岛建筑工程有限公司 | Lightweight thermal insulation wall board |
| CN112111130A (en) * | 2020-08-29 | 2020-12-22 | 广西长城机械股份有限公司 | Stripping method of EPS foam-epoxy resin composite die applied to sand casting |
| CN112126088B (en) * | 2020-08-29 | 2022-11-11 | 广西长城机械股份有限公司 | EPS foam-epoxy resin composite die and preparation method thereof |
| CN112126195A (en) * | 2020-09-17 | 2020-12-25 | 广西长城机械股份有限公司 | Composite resin plate, preparation method and application thereof in preparation of EPS foam-resin composite die |
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| CN101337805B (en) * | 2008-08-25 | 2012-01-11 | 张璐 | Artificial quartz in lump and fabrication technology thereof |
| CN102337013B (en) * | 2010-07-22 | 2013-05-29 | 肖智雄 | Modified epoxy resin plate |
| CN102898799B (en) * | 2011-11-03 | 2015-07-22 | 苏州拓博琳新材料科技有限公司 | Biobased artificial stone and production process thereof |
| CN103483551B (en) * | 2013-09-28 | 2016-01-20 | 上海飞域实验室设备有限公司 | The preparation method of the interpolymer of a kind of epoxy resin and unsaturated polyester and application thereof |
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