SG11201406532YA - System for delivery of purified multiple phases of carbon dioxide to a process tool - Google Patents

System for delivery of purified multiple phases of carbon dioxide to a process tool

Info

Publication number
SG11201406532YA
SG11201406532YA SG11201406532YA SG11201406532YA SG11201406532YA SG 11201406532Y A SG11201406532Y A SG 11201406532YA SG 11201406532Y A SG11201406532Y A SG 11201406532YA SG 11201406532Y A SG11201406532Y A SG 11201406532YA SG 11201406532Y A SG11201406532Y A SG 11201406532YA
Authority
SG
Singapore
Prior art keywords
delivery
carbon dioxide
process tool
multiple phases
purified multiple
Prior art date
Application number
SG11201406532YA
Other languages
English (en)
Inventor
Souvik Banerjee
William R Gerristead
Original Assignee
Praxair Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Praxair Technology Inc filed Critical Praxair Technology Inc
Publication of SG11201406532YA publication Critical patent/SG11201406532YA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0021—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02101—Cleaning only involving supercritical fluids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
SG11201406532YA 2012-04-17 2013-04-15 System for delivery of purified multiple phases of carbon dioxide to a process tool SG11201406532YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261625265P 2012-04-17 2012-04-17
PCT/US2013/036547 WO2013158526A1 (en) 2012-04-17 2013-04-15 System for delivery of purified multiple phases of carbon dioxide to a process tool

Publications (1)

Publication Number Publication Date
SG11201406532YA true SG11201406532YA (en) 2014-11-27

Family

ID=49323970

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201406532YA SG11201406532YA (en) 2012-04-17 2013-04-15 System for delivery of purified multiple phases of carbon dioxide to a process tool
SG10201608702RA SG10201608702RA (en) 2012-04-17 2013-04-15 System for delivery of purified multiple phases of carbon dioxide to a process tool

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201608702RA SG10201608702RA (en) 2012-04-17 2013-04-15 System for delivery of purified multiple phases of carbon dioxide to a process tool

Country Status (8)

Country Link
US (1) US20130269732A1 (zh)
EP (2) EP2839503A4 (zh)
JP (1) JP6326041B2 (zh)
KR (1) KR20150008404A (zh)
CN (2) CN108435679A (zh)
SG (2) SG11201406532YA (zh)
TW (1) TWI576173B (zh)
WO (1) WO2013158526A1 (zh)

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US20160064213A1 (en) * 2013-04-18 2016-03-03 Tohoku University Method for treating inner wall surface of micro-vacancy
FR3021553B1 (fr) * 2014-05-28 2018-03-30 Dfd - Dense Fluid Degreasing Procede et dispositif de traitement par fluide supercritique avec pompage passif
KR102411946B1 (ko) 2015-07-08 2022-06-22 삼성전자주식회사 초임계 유체를 이용한 기판 처리장치와 이를 포함하는 기판 처리 시스템 및 이를 이용한 기판처리 방법
JP6498573B2 (ja) * 2015-09-15 2019-04-10 東京エレクトロン株式会社 基板処理方法、基板処理装置および記憶媒体
KR20180006716A (ko) * 2016-07-11 2018-01-19 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
US10428306B2 (en) 2016-08-12 2019-10-01 Warsaw Orthopedic, Inc. Method and system for tissue treatment with critical/supercritical carbon dioxide
US10576493B2 (en) * 2017-03-14 2020-03-03 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
CN109382403A (zh) * 2017-08-08 2019-02-26 寰宇生物科技股份有限公司 土壤污染处理系统及其方法
JP7109328B2 (ja) * 2018-09-26 2022-07-29 東京エレクトロン株式会社 基板処理システム
KR102075683B1 (ko) * 2018-12-17 2020-03-02 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
KR102278629B1 (ko) * 2019-07-22 2021-07-19 세메스 주식회사 기판 처리 장치
US20210340469A1 (en) * 2020-04-30 2021-11-04 Ashley Zachariah Method to remove explosive and toxic gases and clean metal surfaces in hydrocarbon equipment
US11640115B2 (en) 2020-09-04 2023-05-02 Samsung Electronics Co., Ltd. Substrate processing apparatus, semiconductor manufacturing equipment, and substrate processing method
CN112974412A (zh) * 2021-02-23 2021-06-18 中国核动力研究设计院 放射性污染超临界二氧化碳化学去污方法及其去污装置

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US6067728A (en) * 1998-02-13 2000-05-30 G.T. Equipment Technologies, Inc. Supercritical phase wafer drying/cleaning system
US7064070B2 (en) * 1998-09-28 2006-06-20 Tokyo Electron Limited Removal of CMP and post-CMP residue from semiconductors using supercritical carbon dioxide process
US6361696B1 (en) * 2000-01-19 2002-03-26 Aeronex, Inc. Self-regenerative process for contaminant removal from liquid and supercritical CO2 fluid streams
JP2004507087A (ja) * 2000-08-14 2004-03-04 東京エレクトロン株式会社 超臨界二酸化炭素法を用いる半導体からのフォトレジストおよびフォトレジスト残留物の除去
US6562146B1 (en) * 2001-02-15 2003-05-13 Micell Technologies, Inc. Processes for cleaning and drying microelectronic structures using liquid or supercritical carbon dioxide
US6905555B2 (en) * 2001-02-15 2005-06-14 Micell Technologies, Inc. Methods for transferring supercritical fluids in microelectronic and other industrial processes
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US6763840B2 (en) * 2001-09-14 2004-07-20 Micell Technologies, Inc. Method and apparatus for cleaning substrates using liquid carbon dioxide
JP3978023B2 (ja) * 2001-12-03 2007-09-19 株式会社神戸製鋼所 高圧処理方法
TWI312067B (en) 2002-01-22 2009-07-11 Praxair Technology Inc Method for analyzing impurities in carbon dioxide
TWI263537B (en) 2002-02-19 2006-10-11 Praxair Technology Inc Method and system for removing contaminants from gases
US6790475B2 (en) * 2002-04-09 2004-09-14 Wafermasters Inc. Source gas delivery
US20080004194A1 (en) * 2002-09-24 2008-01-03 Air Products And Chemicals, Inc. Processing of semiconductor components with dense processing fluids
US6960242B2 (en) * 2002-10-02 2005-11-01 The Boc Group, Inc. CO2 recovery process for supercritical extraction
US20040112409A1 (en) * 2002-12-16 2004-06-17 Supercritical Sysems, Inc. Fluoride in supercritical fluid for photoresist and residue removal
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US20100184301A1 (en) * 2009-01-20 2010-07-22 Lam Research Methods for Preventing Precipitation of Etch Byproducts During an Etch Process and/or Subsequent Rinse Process
JP5426439B2 (ja) * 2010-03-15 2014-02-26 株式会社東芝 超臨界乾燥方法および超臨界乾燥装置
CN103167903B (zh) * 2011-02-18 2016-02-24 奥加诺株式会社 过滤器的清洁化方法、及被处理体的洗涤或干燥方法

Also Published As

Publication number Publication date
EP2839503A1 (en) 2015-02-25
EP3667705A1 (en) 2020-06-17
KR20150008404A (ko) 2015-01-22
EP2839503A4 (en) 2016-03-23
CN108435679A (zh) 2018-08-24
SG10201608702RA (en) 2016-12-29
TWI576173B (zh) 2017-04-01
WO2013158526A1 (en) 2013-10-24
JP2015515147A (ja) 2015-05-21
TW201402234A (zh) 2014-01-16
JP6326041B2 (ja) 2018-05-16
CN104380438A (zh) 2015-02-25
CN104380438B (zh) 2018-11-06
US20130269732A1 (en) 2013-10-17

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