SG11201406532YA - System for delivery of purified multiple phases of carbon dioxide to a process tool - Google Patents
System for delivery of purified multiple phases of carbon dioxide to a process toolInfo
- Publication number
- SG11201406532YA SG11201406532YA SG11201406532YA SG11201406532YA SG11201406532YA SG 11201406532Y A SG11201406532Y A SG 11201406532YA SG 11201406532Y A SG11201406532Y A SG 11201406532YA SG 11201406532Y A SG11201406532Y A SG 11201406532YA SG 11201406532Y A SG11201406532Y A SG 11201406532YA
- Authority
- SG
- Singapore
- Prior art keywords
- delivery
- carbon dioxide
- process tool
- multiple phases
- purified multiple
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0021—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02101—Cleaning only involving supercritical fluids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261625265P | 2012-04-17 | 2012-04-17 | |
PCT/US2013/036547 WO2013158526A1 (en) | 2012-04-17 | 2013-04-15 | System for delivery of purified multiple phases of carbon dioxide to a process tool |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201406532YA true SG11201406532YA (en) | 2014-11-27 |
Family
ID=49323970
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201406532YA SG11201406532YA (en) | 2012-04-17 | 2013-04-15 | System for delivery of purified multiple phases of carbon dioxide to a process tool |
SG10201608702RA SG10201608702RA (en) | 2012-04-17 | 2013-04-15 | System for delivery of purified multiple phases of carbon dioxide to a process tool |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201608702RA SG10201608702RA (en) | 2012-04-17 | 2013-04-15 | System for delivery of purified multiple phases of carbon dioxide to a process tool |
Country Status (8)
Country | Link |
---|---|
US (1) | US20130269732A1 (en) |
EP (2) | EP3667705A1 (en) |
JP (1) | JP6326041B2 (en) |
KR (1) | KR20150008404A (en) |
CN (2) | CN104380438B (en) |
SG (2) | SG11201406532YA (en) |
TW (1) | TWI576173B (en) |
WO (1) | WO2013158526A1 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105122425A (en) * | 2013-04-18 | 2015-12-02 | 国立大学法人东北大学 | Method for treating inner wall surface of micro-vacancy |
FR3021553B1 (en) * | 2014-05-28 | 2018-03-30 | Dfd - Dense Fluid Degreasing | METHOD AND DEVICE FOR SUPERCRITICAL FLUID TREATMENT WITH PASSIVE PUMPING |
KR102411946B1 (en) | 2015-07-08 | 2022-06-22 | 삼성전자주식회사 | Apparatus for treating substrates using supercritical fluid, substrate treatment system including the same and method of treating substrates using the same |
JP6498573B2 (en) * | 2015-09-15 | 2019-04-10 | 東京エレクトロン株式会社 | Substrate processing method, substrate processing apparatus, and storage medium |
KR20180006716A (en) | 2016-07-11 | 2018-01-19 | 세메스 주식회사 | Apparatus and method fdr treating substrates |
US10428306B2 (en) | 2016-08-12 | 2019-10-01 | Warsaw Orthopedic, Inc. | Method and system for tissue treatment with critical/supercritical carbon dioxide |
US10576493B2 (en) * | 2017-03-14 | 2020-03-03 | Tokyo Electron Limited | Substrate processing apparatus and substrate processing method |
CN109382403A (en) * | 2017-08-08 | 2019-02-26 | 寰宇生物科技股份有限公司 | Soil pollution processing system and its method |
JP7109328B2 (en) * | 2018-09-26 | 2022-07-29 | 東京エレクトロン株式会社 | Substrate processing system |
KR102075683B1 (en) * | 2018-12-17 | 2020-03-02 | 세메스 주식회사 | Apparatus and method fdr treating substrates |
US20210340469A1 (en) * | 2020-04-30 | 2021-11-04 | Ashley Zachariah | Method to remove explosive and toxic gases and clean metal surfaces in hydrocarbon equipment |
US11640115B2 (en) | 2020-09-04 | 2023-05-02 | Samsung Electronics Co., Ltd. | Substrate processing apparatus, semiconductor manufacturing equipment, and substrate processing method |
CN112974412A (en) * | 2021-02-23 | 2021-06-18 | 中国核动力研究设计院 | Chemical decontamination method and device for radioactive pollution by supercritical carbon dioxide |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6067728A (en) * | 1998-02-13 | 2000-05-30 | G.T. Equipment Technologies, Inc. | Supercritical phase wafer drying/cleaning system |
US7064070B2 (en) * | 1998-09-28 | 2006-06-20 | Tokyo Electron Limited | Removal of CMP and post-CMP residue from semiconductors using supercritical carbon dioxide process |
US6361696B1 (en) * | 2000-01-19 | 2002-03-26 | Aeronex, Inc. | Self-regenerative process for contaminant removal from liquid and supercritical CO2 fluid streams |
AU2000266442A1 (en) * | 2000-08-14 | 2002-02-25 | Tokyo Electron Limited | Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process |
US6562146B1 (en) | 2001-02-15 | 2003-05-13 | Micell Technologies, Inc. | Processes for cleaning and drying microelectronic structures using liquid or supercritical carbon dioxide |
EP1368136A4 (en) * | 2001-02-15 | 2005-10-12 | Micell Technologies Inc | Methods for cleaning microelectronic structures |
US6905555B2 (en) * | 2001-02-15 | 2005-06-14 | Micell Technologies, Inc. | Methods for transferring supercritical fluids in microelectronic and other industrial processes |
US6763840B2 (en) * | 2001-09-14 | 2004-07-20 | Micell Technologies, Inc. | Method and apparatus for cleaning substrates using liquid carbon dioxide |
JP3978023B2 (en) * | 2001-12-03 | 2007-09-19 | 株式会社神戸製鋼所 | High pressure processing method |
JP4128958B2 (en) | 2002-01-22 | 2008-07-30 | プラクスエア・テクノロジー・インコーポレイテッド | Method for analyzing impurities in carbon dioxide |
KR101284395B1 (en) | 2002-02-19 | 2013-07-09 | 프랙스에어 테크놀로지, 인코포레이티드 | Method for removing contaminants from gases |
US6790475B2 (en) * | 2002-04-09 | 2004-09-14 | Wafermasters Inc. | Source gas delivery |
US20080004194A1 (en) * | 2002-09-24 | 2008-01-03 | Air Products And Chemicals, Inc. | Processing of semiconductor components with dense processing fluids |
US6960242B2 (en) * | 2002-10-02 | 2005-11-01 | The Boc Group, Inc. | CO2 recovery process for supercritical extraction |
US20040112409A1 (en) * | 2002-12-16 | 2004-06-17 | Supercritical Sysems, Inc. | Fluoride in supercritical fluid for photoresist and residue removal |
JP2004249189A (en) * | 2003-02-19 | 2004-09-09 | Sony Corp | Washing method |
US7345000B2 (en) * | 2003-10-10 | 2008-03-18 | Tokyo Electron Limited | Method and system for treating a dielectric film |
US7553769B2 (en) * | 2003-10-10 | 2009-06-30 | Tokyo Electron Limited | Method for treating a dielectric film |
US8084367B2 (en) | 2006-05-24 | 2011-12-27 | Samsung Electronics Co., Ltd | Etching, cleaning and drying methods using supercritical fluid and chamber systems using these methods |
US20080060685A1 (en) * | 2006-09-08 | 2008-03-13 | Novak John S | Pulsed-gas agitation process for enhancing solid surface biological removal efficiency of dense phase fluids |
JP2009273483A (en) * | 2008-05-12 | 2009-11-26 | Sharp Corp | Washing device |
US20100184301A1 (en) * | 2009-01-20 | 2010-07-22 | Lam Research | Methods for Preventing Precipitation of Etch Byproducts During an Etch Process and/or Subsequent Rinse Process |
JP5426439B2 (en) * | 2010-03-15 | 2014-02-26 | 株式会社東芝 | Supercritical drying method and supercritical drying apparatus |
US8974603B2 (en) * | 2011-02-18 | 2015-03-10 | Organo Corporation | Method of purifying filter, and method of cleaning or drying object to be treated |
-
2013
- 2013-04-15 KR KR20147031725A patent/KR20150008404A/en not_active Application Discontinuation
- 2013-04-15 US US13/862,709 patent/US20130269732A1/en not_active Abandoned
- 2013-04-15 EP EP19215188.4A patent/EP3667705A1/en not_active Withdrawn
- 2013-04-15 SG SG11201406532YA patent/SG11201406532YA/en unknown
- 2013-04-15 CN CN201380031446.4A patent/CN104380438B/en not_active Expired - Fee Related
- 2013-04-15 EP EP13778890.7A patent/EP2839503A4/en not_active Withdrawn
- 2013-04-15 WO PCT/US2013/036547 patent/WO2013158526A1/en active Application Filing
- 2013-04-15 CN CN201810325555.1A patent/CN108435679A/en active Pending
- 2013-04-15 JP JP2015507081A patent/JP6326041B2/en active Active
- 2013-04-15 SG SG10201608702RA patent/SG10201608702RA/en unknown
- 2013-04-16 TW TW102113495A patent/TWI576173B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN104380438A (en) | 2015-02-25 |
TW201402234A (en) | 2014-01-16 |
JP2015515147A (en) | 2015-05-21 |
TWI576173B (en) | 2017-04-01 |
EP2839503A1 (en) | 2015-02-25 |
EP2839503A4 (en) | 2016-03-23 |
WO2013158526A1 (en) | 2013-10-24 |
CN108435679A (en) | 2018-08-24 |
SG10201608702RA (en) | 2016-12-29 |
KR20150008404A (en) | 2015-01-22 |
JP6326041B2 (en) | 2018-05-16 |
CN104380438B (en) | 2018-11-06 |
US20130269732A1 (en) | 2013-10-17 |
EP3667705A1 (en) | 2020-06-17 |
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