EP1368136A4 - Methods for cleaning microelectronic structures - Google Patents
Methods for cleaning microelectronic structuresInfo
- Publication number
- EP1368136A4 EP1368136A4 EP02724947A EP02724947A EP1368136A4 EP 1368136 A4 EP1368136 A4 EP 1368136A4 EP 02724947 A EP02724947 A EP 02724947A EP 02724947 A EP02724947 A EP 02724947A EP 1368136 A4 EP1368136 A4 EP 1368136A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- methods
- microelectronic structures
- cleaning microelectronic
- cleaning
- structures
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0021—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
- H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
Applications Claiming Priority (13)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US951259 | 1992-09-25 | ||
| US26902601P | 2001-02-15 | 2001-02-15 | |
| US269026P | 2001-02-15 | ||
| US932063 | 2001-08-17 | ||
| US09/932,063 US6562146B1 (en) | 2001-02-15 | 2001-08-17 | Processes for cleaning and drying microelectronic structures using liquid or supercritical carbon dioxide |
| US951249 | 2001-09-13 | ||
| US09/951,092 US6613157B2 (en) | 2001-02-15 | 2001-09-13 | Methods for removing particles from microelectronic structures |
| US09/951,247 US6602351B2 (en) | 2001-02-15 | 2001-09-13 | Methods for the control of contaminants following carbon dioxide cleaning of microelectronic structures |
| US951247 | 2001-09-13 | ||
| US09/951,259 US6596093B2 (en) | 2001-02-15 | 2001-09-13 | Methods for cleaning microelectronic structures with cyclical phase modulation |
| US09/951,249 US6641678B2 (en) | 2001-02-15 | 2001-09-13 | Methods for cleaning microelectronic structures with aqueous carbon dioxide systems |
| US951092 | 2001-09-13 | ||
| PCT/US2002/004398 WO2002066176A1 (en) | 2001-02-15 | 2002-02-14 | Methods for cleaning microelectronic structures |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP1368136A1 EP1368136A1 (en) | 2003-12-10 |
| EP1368136A4 true EP1368136A4 (en) | 2005-10-12 |
Family
ID=27559475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP02724947A Withdrawn EP1368136A4 (en) | 2001-02-15 | 2002-02-14 | Methods for cleaning microelectronic structures |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1368136A4 (en) |
| JP (1) | JP2004527110A (en) |
| KR (1) | KR20030075185A (en) |
| CN (1) | CN1628000A (en) |
| WO (1) | WO2002066176A1 (en) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6905555B2 (en) * | 2001-02-15 | 2005-06-14 | Micell Technologies, Inc. | Methods for transferring supercritical fluids in microelectronic and other industrial processes |
| US7267727B2 (en) | 2002-09-24 | 2007-09-11 | Air Products And Chemicals, Inc. | Processing of semiconductor components with dense processing fluids and ultrasonic energy |
| US6989172B2 (en) | 2003-01-27 | 2006-01-24 | Micell Technologies, Inc. | Method of coating microelectronic substrates |
| US20050029492A1 (en) | 2003-08-05 | 2005-02-10 | Hoshang Subawalla | Processing of semiconductor substrates with dense fluids comprising acetylenic diols and/or alcohols |
| KR100597656B1 (en) * | 2003-10-02 | 2006-07-07 | 그린텍이십일 주식회사 | Cleaning method and apparatus for manufacturing semiconductor device |
| US7141496B2 (en) | 2004-01-22 | 2006-11-28 | Micell Technologies, Inc. | Method of treating microelectronic substrates |
| CN1960813A (en) * | 2004-05-07 | 2007-05-09 | 高级技术材料公司 | Compositions and methods for drying patterned wafers during manufacture of integrated circuitry products |
| US7195676B2 (en) | 2004-07-13 | 2007-03-27 | Air Products And Chemicals, Inc. | Method for removal of flux and other residue in dense fluid systems |
| KR100708773B1 (en) | 2006-01-21 | 2007-04-17 | 서강대학교산학협력단 | Cleaning process |
| US8084367B2 (en) | 2006-05-24 | 2011-12-27 | Samsung Electronics Co., Ltd | Etching, cleaning and drying methods using supercritical fluid and chamber systems using these methods |
| CN102371254B (en) * | 2010-08-11 | 2013-08-14 | 中国科学院微电子研究所 | Cleaning system and method |
| SG10201608702RA (en) * | 2012-04-17 | 2016-12-29 | Praxair Technology Inc | System for delivery of purified multiple phases of carbon dioxide to a process tool |
| CN103962345B (en) * | 2013-01-29 | 2017-02-08 | 无锡华润上华科技有限公司 | Method for removing debris of wafer |
| US20180323063A1 (en) * | 2017-05-03 | 2018-11-08 | Applied Materials, Inc. | Method and apparatus for using supercritical fluids in semiconductor applications |
| KR20190138743A (en) * | 2018-06-06 | 2019-12-16 | 도오꾜오까고오교 가부시끼가이샤 | Method for treating substrate and rinsing liquid |
| KR102378329B1 (en) | 2019-10-07 | 2022-03-25 | 세메스 주식회사 | Apparatus and method for treating substrate |
| US11239071B1 (en) * | 2020-12-03 | 2022-02-01 | Nanya Technology Corporation | Method of processing semiconductor device |
| CN113436998B (en) * | 2021-07-02 | 2022-02-18 | 江苏鑫华半导体材料科技有限公司 | Supercritical carbon dioxide silicon block cleaning device, silicon block processing system and method |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08330266A (en) * | 1995-05-31 | 1996-12-13 | Texas Instr Inc <Ti> | Method of cleansing and processing surface of semiconductor device or the like |
| US5783082A (en) * | 1995-11-03 | 1998-07-21 | University Of North Carolina | Cleaning process using carbon dioxide as a solvent and employing molecularly engineered surfactants |
| US6306564B1 (en) * | 1997-05-27 | 2001-10-23 | Tokyo Electron Limited | Removal of resist or residue from semiconductors using supercritical carbon dioxide |
| US6067728A (en) * | 1998-02-13 | 2000-05-30 | G.T. Equipment Technologies, Inc. | Supercritical phase wafer drying/cleaning system |
| US6242165B1 (en) * | 1998-08-28 | 2001-06-05 | Micron Technology, Inc. | Supercritical compositions for removal of organic material and methods of using same |
| US6277753B1 (en) * | 1998-09-28 | 2001-08-21 | Supercritical Systems Inc. | Removal of CMP residue from semiconductors using supercritical carbon dioxide process |
-
2002
- 2002-02-14 KR KR10-2003-7010495A patent/KR20030075185A/en not_active Application Discontinuation
- 2002-02-14 WO PCT/US2002/004398 patent/WO2002066176A1/en not_active Application Discontinuation
- 2002-02-14 CN CNA028049756A patent/CN1628000A/en active Pending
- 2002-02-14 EP EP02724947A patent/EP1368136A4/en not_active Withdrawn
- 2002-02-14 JP JP2002565725A patent/JP2004527110A/en active Pending
Non-Patent Citations (1)
| Title |
|---|
| No further relevant documents disclosed * |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20030075185A (en) | 2003-09-22 |
| CN1628000A (en) | 2005-06-15 |
| EP1368136A1 (en) | 2003-12-10 |
| JP2004527110A (en) | 2004-09-02 |
| WO2002066176A1 (en) | 2002-08-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| 17P | Request for examination filed |
Effective date: 20030916 |
|
| AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR |
|
| AX | Request for extension of the european patent |
Extension state: AL LT LV MK RO SI |
|
| A4 | Supplementary search report drawn up and despatched |
Effective date: 20050831 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
| 18D | Application deemed to be withdrawn |
Effective date: 20051118 |