SG11201406532YA - System for delivery of purified multiple phases of carbon dioxide to a process tool - Google Patents
System for delivery of purified multiple phases of carbon dioxide to a process toolInfo
- Publication number
- SG11201406532YA SG11201406532YA SG11201406532YA SG11201406532YA SG11201406532YA SG 11201406532Y A SG11201406532Y A SG 11201406532YA SG 11201406532Y A SG11201406532Y A SG 11201406532YA SG 11201406532Y A SG11201406532Y A SG 11201406532YA SG 11201406532Y A SG11201406532Y A SG 11201406532YA
- Authority
- SG
- Singapore
- Prior art keywords
- delivery
- carbon dioxide
- process tool
- multiple phases
- purified multiple
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0021—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02101—Cleaning only involving supercritical fluids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261625265P | 2012-04-17 | 2012-04-17 | |
PCT/US2013/036547 WO2013158526A1 (fr) | 2012-04-17 | 2013-04-15 | Système de distribution de multiples phases purifiées de dioxyde de carbone à un outil de traitement |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201406532YA true SG11201406532YA (en) | 2014-11-27 |
Family
ID=49323970
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201406532YA SG11201406532YA (en) | 2012-04-17 | 2013-04-15 | System for delivery of purified multiple phases of carbon dioxide to a process tool |
SG10201608702RA SG10201608702RA (en) | 2012-04-17 | 2013-04-15 | System for delivery of purified multiple phases of carbon dioxide to a process tool |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201608702RA SG10201608702RA (en) | 2012-04-17 | 2013-04-15 | System for delivery of purified multiple phases of carbon dioxide to a process tool |
Country Status (8)
Country | Link |
---|---|
US (1) | US20130269732A1 (fr) |
EP (2) | EP2839503A4 (fr) |
JP (1) | JP6326041B2 (fr) |
KR (1) | KR20150008404A (fr) |
CN (2) | CN108435679A (fr) |
SG (2) | SG11201406532YA (fr) |
TW (1) | TWI576173B (fr) |
WO (1) | WO2013158526A1 (fr) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160064213A1 (en) * | 2013-04-18 | 2016-03-03 | Tohoku University | Method for treating inner wall surface of micro-vacancy |
FR3021553B1 (fr) * | 2014-05-28 | 2018-03-30 | Dfd - Dense Fluid Degreasing | Procede et dispositif de traitement par fluide supercritique avec pompage passif |
KR102411946B1 (ko) | 2015-07-08 | 2022-06-22 | 삼성전자주식회사 | 초임계 유체를 이용한 기판 처리장치와 이를 포함하는 기판 처리 시스템 및 이를 이용한 기판처리 방법 |
JP6498573B2 (ja) * | 2015-09-15 | 2019-04-10 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置および記憶媒体 |
KR20180006716A (ko) * | 2016-07-11 | 2018-01-19 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
US10428306B2 (en) | 2016-08-12 | 2019-10-01 | Warsaw Orthopedic, Inc. | Method and system for tissue treatment with critical/supercritical carbon dioxide |
US10576493B2 (en) * | 2017-03-14 | 2020-03-03 | Tokyo Electron Limited | Substrate processing apparatus and substrate processing method |
CN109382403A (zh) * | 2017-08-08 | 2019-02-26 | 寰宇生物科技股份有限公司 | 土壤污染处理系统及其方法 |
JP7109328B2 (ja) * | 2018-09-26 | 2022-07-29 | 東京エレクトロン株式会社 | 基板処理システム |
KR102075683B1 (ko) * | 2018-12-17 | 2020-03-02 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
KR102278629B1 (ko) * | 2019-07-22 | 2021-07-19 | 세메스 주식회사 | 기판 처리 장치 |
US20210340469A1 (en) * | 2020-04-30 | 2021-11-04 | Ashley Zachariah | Method to remove explosive and toxic gases and clean metal surfaces in hydrocarbon equipment |
US11640115B2 (en) | 2020-09-04 | 2023-05-02 | Samsung Electronics Co., Ltd. | Substrate processing apparatus, semiconductor manufacturing equipment, and substrate processing method |
CN112974412A (zh) * | 2021-02-23 | 2021-06-18 | 中国核动力研究设计院 | 放射性污染超临界二氧化碳化学去污方法及其去污装置 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6067728A (en) * | 1998-02-13 | 2000-05-30 | G.T. Equipment Technologies, Inc. | Supercritical phase wafer drying/cleaning system |
US7064070B2 (en) * | 1998-09-28 | 2006-06-20 | Tokyo Electron Limited | Removal of CMP and post-CMP residue from semiconductors using supercritical carbon dioxide process |
US6361696B1 (en) * | 2000-01-19 | 2002-03-26 | Aeronex, Inc. | Self-regenerative process for contaminant removal from liquid and supercritical CO2 fluid streams |
JP2004507087A (ja) * | 2000-08-14 | 2004-03-04 | 東京エレクトロン株式会社 | 超臨界二酸化炭素法を用いる半導体からのフォトレジストおよびフォトレジスト残留物の除去 |
US6562146B1 (en) * | 2001-02-15 | 2003-05-13 | Micell Technologies, Inc. | Processes for cleaning and drying microelectronic structures using liquid or supercritical carbon dioxide |
US6905555B2 (en) * | 2001-02-15 | 2005-06-14 | Micell Technologies, Inc. | Methods for transferring supercritical fluids in microelectronic and other industrial processes |
CN1628000A (zh) * | 2001-02-15 | 2005-06-15 | 米歇尔技术公司 | 清洁微电子结构的方法 |
US6763840B2 (en) * | 2001-09-14 | 2004-07-20 | Micell Technologies, Inc. | Method and apparatus for cleaning substrates using liquid carbon dioxide |
JP3978023B2 (ja) * | 2001-12-03 | 2007-09-19 | 株式会社神戸製鋼所 | 高圧処理方法 |
TWI312067B (en) | 2002-01-22 | 2009-07-11 | Praxair Technology Inc | Method for analyzing impurities in carbon dioxide |
TWI263537B (en) | 2002-02-19 | 2006-10-11 | Praxair Technology Inc | Method and system for removing contaminants from gases |
US6790475B2 (en) * | 2002-04-09 | 2004-09-14 | Wafermasters Inc. | Source gas delivery |
US20080004194A1 (en) * | 2002-09-24 | 2008-01-03 | Air Products And Chemicals, Inc. | Processing of semiconductor components with dense processing fluids |
US6960242B2 (en) * | 2002-10-02 | 2005-11-01 | The Boc Group, Inc. | CO2 recovery process for supercritical extraction |
US20040112409A1 (en) * | 2002-12-16 | 2004-06-17 | Supercritical Sysems, Inc. | Fluoride in supercritical fluid for photoresist and residue removal |
JP2004249189A (ja) * | 2003-02-19 | 2004-09-09 | Sony Corp | 洗浄方法 |
US7345000B2 (en) * | 2003-10-10 | 2008-03-18 | Tokyo Electron Limited | Method and system for treating a dielectric film |
US7553769B2 (en) * | 2003-10-10 | 2009-06-30 | Tokyo Electron Limited | Method for treating a dielectric film |
US8084367B2 (en) | 2006-05-24 | 2011-12-27 | Samsung Electronics Co., Ltd | Etching, cleaning and drying methods using supercritical fluid and chamber systems using these methods |
US20080060685A1 (en) * | 2006-09-08 | 2008-03-13 | Novak John S | Pulsed-gas agitation process for enhancing solid surface biological removal efficiency of dense phase fluids |
JP2009273483A (ja) * | 2008-05-12 | 2009-11-26 | Sharp Corp | 洗浄装置 |
US20100184301A1 (en) * | 2009-01-20 | 2010-07-22 | Lam Research | Methods for Preventing Precipitation of Etch Byproducts During an Etch Process and/or Subsequent Rinse Process |
JP5426439B2 (ja) * | 2010-03-15 | 2014-02-26 | 株式会社東芝 | 超臨界乾燥方法および超臨界乾燥装置 |
CN103167903B (zh) * | 2011-02-18 | 2016-02-24 | 奥加诺株式会社 | 过滤器的清洁化方法、及被处理体的洗涤或干燥方法 |
-
2013
- 2013-04-15 WO PCT/US2013/036547 patent/WO2013158526A1/fr active Application Filing
- 2013-04-15 US US13/862,709 patent/US20130269732A1/en not_active Abandoned
- 2013-04-15 EP EP13778890.7A patent/EP2839503A4/fr not_active Withdrawn
- 2013-04-15 CN CN201810325555.1A patent/CN108435679A/zh active Pending
- 2013-04-15 SG SG11201406532YA patent/SG11201406532YA/en unknown
- 2013-04-15 SG SG10201608702RA patent/SG10201608702RA/en unknown
- 2013-04-15 KR KR20147031725A patent/KR20150008404A/ko not_active Application Discontinuation
- 2013-04-15 CN CN201380031446.4A patent/CN104380438B/zh not_active Expired - Fee Related
- 2013-04-15 EP EP19215188.4A patent/EP3667705A1/fr not_active Withdrawn
- 2013-04-15 JP JP2015507081A patent/JP6326041B2/ja active Active
- 2013-04-16 TW TW102113495A patent/TWI576173B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP2839503A1 (fr) | 2015-02-25 |
EP3667705A1 (fr) | 2020-06-17 |
KR20150008404A (ko) | 2015-01-22 |
EP2839503A4 (fr) | 2016-03-23 |
CN108435679A (zh) | 2018-08-24 |
SG10201608702RA (en) | 2016-12-29 |
TWI576173B (zh) | 2017-04-01 |
WO2013158526A1 (fr) | 2013-10-24 |
JP2015515147A (ja) | 2015-05-21 |
TW201402234A (zh) | 2014-01-16 |
JP6326041B2 (ja) | 2018-05-16 |
CN104380438A (zh) | 2015-02-25 |
CN104380438B (zh) | 2018-11-06 |
US20130269732A1 (en) | 2013-10-17 |
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