SG11201405097QA - Resin composition and semiconductor device - Google Patents
Resin composition and semiconductor deviceInfo
- Publication number
- SG11201405097QA SG11201405097QA SG11201405097QA SG11201405097QA SG11201405097QA SG 11201405097Q A SG11201405097Q A SG 11201405097QA SG 11201405097Q A SG11201405097Q A SG 11201405097QA SG 11201405097Q A SG11201405097Q A SG 11201405097QA SG 11201405097Q A SG11201405097Q A SG 11201405097QA
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor device
- resin composition
- resin
- composition
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012077658 | 2012-03-29 | ||
PCT/JP2013/001695 WO2013145608A1 (ja) | 2012-03-29 | 2013-03-14 | 樹脂組成物および半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201405097QA true SG11201405097QA (en) | 2014-10-30 |
Family
ID=49258923
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201405097QA SG11201405097QA (en) | 2012-03-29 | 2013-03-14 | Resin composition and semiconductor device |
Country Status (7)
Country | Link |
---|---|
US (1) | US20150014867A1 (zh) |
JP (1) | JP6187455B2 (zh) |
KR (1) | KR101852230B1 (zh) |
CN (1) | CN104221140B (zh) |
SG (1) | SG11201405097QA (zh) |
TW (1) | TWI572655B (zh) |
WO (1) | WO2013145608A1 (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6303373B2 (ja) * | 2013-10-02 | 2018-04-04 | 住友ベークライト株式会社 | 圧縮成形用モールドアンダーフィル材料、半導体パッケージ、構造体および半導体パッケージの製造方法 |
KR102367126B1 (ko) * | 2015-03-23 | 2022-02-25 | 스미토모 베이클리트 컴퍼니 리미티드 | 압축 성형용 몰드 언더필 재료, 반도체 패키지, 구조체 및 반도체 패키지의 제조 방법 |
CN107924888B (zh) * | 2015-08-24 | 2020-04-24 | 日本瑞翁株式会社 | 导热片及其制造方法 |
JP7155502B2 (ja) * | 2017-07-19 | 2022-10-19 | 住友ベークライト株式会社 | 半導体装置およびその製造方法ならびに封止用樹脂組成物 |
WO2019078044A1 (ja) * | 2017-10-18 | 2019-04-25 | 株式会社スリーボンド | 熱伝導性樹脂組成物、硬化物および放熱方法 |
WO2019131669A1 (ja) * | 2017-12-28 | 2019-07-04 | 日立化成株式会社 | 封止組成物及び半導体装置 |
CN113195631A (zh) * | 2018-12-18 | 2021-07-30 | 住友电木株式会社 | Lds用热固性树脂组合物和半导体装置的制造方法 |
JPWO2021153691A1 (zh) * | 2020-01-30 | 2021-08-05 | ||
JPWO2021241521A1 (zh) * | 2020-05-26 | 2021-12-02 | ||
WO2021241513A1 (ja) * | 2020-05-26 | 2021-12-02 | 昭和電工マテリアルズ株式会社 | コンパウンド、成型体、及び硬化物 |
KR20230015941A (ko) * | 2020-05-26 | 2023-01-31 | 쇼와덴코머티리얼즈가부시끼가이샤 | 콤파운드, 성형체 및 경화물 |
JP2022107395A (ja) | 2021-01-08 | 2022-07-21 | 昭和電工マテリアルズ株式会社 | 熱硬化性樹脂組成物及び電子部品装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10292094A (ja) * | 1997-02-20 | 1998-11-04 | Toshiba Corp | エポキシ樹脂組成物、これを用いた樹脂封止型半導体装置、エポキシ樹脂成形材料、およびエポキシ樹脂複合タブレット |
JP4155719B2 (ja) | 2001-02-27 | 2008-09-24 | 電気化学工業株式会社 | 球状無機質粉末及びその用途 |
JP3865641B2 (ja) * | 2002-01-29 | 2007-01-10 | 電気化学工業株式会社 | 球状無機質粉末およびその用途 |
JP4250988B2 (ja) * | 2003-03-25 | 2009-04-08 | 住友ベークライト株式会社 | 高熱伝導エポキシ樹脂組成物及び半導体装置 |
JP5031403B2 (ja) * | 2007-03-01 | 2012-09-19 | 京セラケミカル株式会社 | 封止用エポキシ樹脂組成物、樹脂封止型半導体装置及びその製造方法 |
-
2013
- 2013-03-14 SG SG11201405097QA patent/SG11201405097QA/en unknown
- 2013-03-14 CN CN201380018061.4A patent/CN104221140B/zh active Active
- 2013-03-14 KR KR1020147030284A patent/KR101852230B1/ko active IP Right Grant
- 2013-03-14 JP JP2014507386A patent/JP6187455B2/ja active Active
- 2013-03-14 WO PCT/JP2013/001695 patent/WO2013145608A1/ja active Application Filing
- 2013-03-14 US US14/384,328 patent/US20150014867A1/en not_active Abandoned
- 2013-03-15 TW TW102109347A patent/TWI572655B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN104221140B (zh) | 2017-08-25 |
CN104221140A (zh) | 2014-12-17 |
TWI572655B (zh) | 2017-03-01 |
KR101852230B1 (ko) | 2018-04-25 |
TW201348314A (zh) | 2013-12-01 |
JPWO2013145608A1 (ja) | 2015-12-10 |
US20150014867A1 (en) | 2015-01-15 |
JP6187455B2 (ja) | 2017-08-30 |
KR20140142338A (ko) | 2014-12-11 |
WO2013145608A1 (ja) | 2013-10-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI562361B (en) | Semiconductor device | |
EP2824703A4 (en) | SEMICONDUCTOR DEVICE | |
EP2908338A4 (en) | SEMICONDUCTOR COMPONENT | |
SG10201610711UA (en) | Semiconductor device | |
EP2814059A4 (en) | SEMICONDUCTOR DEVICE | |
SG10201605470SA (en) | Semiconductor device | |
EP2927281A4 (en) | RESIN COMPOSITION AND USES THEREOF | |
EP2804212A4 (en) | SEMICONDUCTOR DEVICE | |
EP2866250A4 (en) | SEMICONDUCTOR DEVICE | |
EP2814060A4 (en) | SEMICONDUCTOR COMPONENT | |
EP2704189A4 (en) | SEMICONDUCTOR DEVICE | |
SG11201405097QA (en) | Resin composition and semiconductor device | |
SG11201403633QA (en) | Resin composition for encapsulation and electronic device using thesame | |
EP2922092A4 (en) | SEMICONDUCTOR DEVICE | |
EP2827364A4 (en) | SEMICONDUCTOR COMPONENT | |
GB201506501D0 (en) | Semiconductor device | |
TWI560880B (en) | Semiconductor device | |
EP2822039A4 (en) | SEMICONDUCTOR DEVICE | |
EP2862910A4 (en) | ADHESIVE COMPOSITION AND SEMICONDUCTOR DEVICE THEREWITH | |
EP2887401A4 (en) | SEMICONDUCTOR DEVICE | |
HK1243823A1 (zh) | 半導體裝置 | |
EP2790323A4 (en) | SEMICONDUCTOR DEVICE | |
EP2940726A4 (en) | SEMICONDUCTOR DEVICE | |
EP2871676A4 (en) | SEMICONDUCTOR COMPONENT | |
EP2924739A4 (en) | SEMICONDUCTOR DEVICE |