SG11201404960TA - Method for temporary bonding of a product substrate to a carrier substrate - Google Patents
Method for temporary bonding of a product substrate to a carrier substrateInfo
- Publication number
- SG11201404960TA SG11201404960TA SG11201404960TA SG11201404960TA SG11201404960TA SG 11201404960T A SG11201404960T A SG 11201404960TA SG 11201404960T A SG11201404960T A SG 11201404960TA SG 11201404960T A SG11201404960T A SG 11201404960TA SG 11201404960T A SG11201404960T A SG 11201404960TA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate
- temporary bonding
- product
- carrier substrate
- carrier
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68309—Auxiliary support including alignment aids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012101237A DE102012101237A1 (de) | 2012-02-16 | 2012-02-16 | Verfahren zum temporären Verbinden eines Produktsubstrats mit einem Trägersubstrat |
PCT/EP2013/050849 WO2013120648A1 (de) | 2012-02-16 | 2013-01-17 | Verfahren zum temporären verbinden eines produktsubstrats mit einem trägersubstrat |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201404960TA true SG11201404960TA (en) | 2014-11-27 |
Family
ID=47594741
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201404960TA SG11201404960TA (en) | 2012-02-16 | 2013-01-17 | Method for temporary bonding of a product substrate to a carrier substrate |
Country Status (8)
Country | Link |
---|---|
US (1) | US9390956B2 (ja) |
JP (1) | JP6140194B2 (ja) |
KR (1) | KR102061369B1 (ja) |
CN (1) | CN104115267B (ja) |
AT (1) | AT517748B1 (ja) |
DE (2) | DE102012101237A1 (ja) |
SG (1) | SG11201404960TA (ja) |
WO (1) | WO2013120648A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101502239B1 (ko) * | 2013-11-29 | 2015-03-19 | 엘지디스플레이 주식회사 | 기판분리장치 |
US10978334B2 (en) * | 2014-09-02 | 2021-04-13 | Applied Materials, Inc. | Sealing structure for workpiece to substrate bonding in a processing chamber |
CN104916574B (zh) * | 2015-04-22 | 2017-11-10 | 四川虹视显示技术有限公司 | 一种柔性oled脱膜装置 |
TWI557831B (zh) * | 2015-05-15 | 2016-11-11 | 友達光電股份有限公司 | 微組件的傳送方法 |
DE102015118742A1 (de) * | 2015-11-02 | 2017-05-04 | Ev Group E. Thallner Gmbh | Verfahren zum Bonden und Lösen von Substraten |
DE102016106351A1 (de) * | 2016-04-07 | 2017-10-12 | Ev Group E. Thallner Gmbh | Verfahren und Vorrichtung zum Bonden zweier Substrate |
CN111048461B (zh) * | 2018-10-12 | 2022-06-03 | 瀚宇彩晶股份有限公司 | 电子装置的离型前结构及电子装置的制造方法 |
WO2020178080A1 (en) * | 2019-03-05 | 2020-09-10 | Evatec Ag | Method for processing fragile substrates employing temporary bonding of the substrates to carriers |
FR3113771B1 (fr) * | 2020-08-27 | 2022-10-21 | Commissariat Energie Atomique | Procédé de fabrication d'un substrat-poignée destiné au collage temporaire d'un substrat. |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0828580B2 (ja) * | 1993-04-21 | 1996-03-21 | 日本電気株式会社 | 配線基板構造及びその製造方法 |
DE4339604C2 (de) | 1993-11-20 | 1996-06-05 | Beiersdorf Ag | Verwendung eines Klebfolien-Abschnitts für eine wiederablösbare Verklebung |
KR0165467B1 (ko) | 1995-10-31 | 1999-02-01 | 김광호 | 웨이퍼 디본더 및 이를 이용한 웨이퍼 디본딩법 |
JP2001196404A (ja) | 2000-01-11 | 2001-07-19 | Fujitsu Ltd | 半導体装置及びその製造方法 |
DE10140827B4 (de) | 2001-08-21 | 2004-07-29 | Infineon Technologies Ag | Vorrichtung zum Debonden von Dünnwafern |
AU2003299296A1 (en) * | 2002-11-29 | 2004-06-23 | Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. | Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer |
JP2004288725A (ja) | 2003-03-19 | 2004-10-14 | Citizen Watch Co Ltd | 半導体装置の製造方法,この製造方法に用いるシール部材及びこのシール部材の供給装置 |
JP4447280B2 (ja) | 2003-10-16 | 2010-04-07 | リンテック株式会社 | 表面保護用シートおよび半導体ウエハの研削方法 |
JP2006086479A (ja) * | 2004-09-17 | 2006-03-30 | Toshiba Corp | 薄膜基板の保持方法及び半導体装置の製造方法 |
DE102006000687B4 (de) * | 2006-01-03 | 2010-09-09 | Thallner, Erich, Dipl.-Ing. | Kombination aus einem Träger und einem Wafer, Vorrichtung zum Trennen der Kombination und Verfahren zur Handhabung eines Trägers und eines Wafers |
GB0602410D0 (en) | 2006-02-07 | 2006-03-15 | Filtronic Compound Semiconduct | A method of bonding a semiconductor wafer to a support substrate |
JP2007214271A (ja) | 2006-02-08 | 2007-08-23 | Zycube:Kk | 基板の接合方法および半導体装置 |
WO2007099146A1 (de) | 2006-03-01 | 2007-09-07 | Jakob + Richter Ip-Verwertungsgesellschaft Mbh | Verfahren zum bearbeiten insbesondere dünnen der rückseite eines wafers, wafer-träger-anordnung hierfür und verfahren zur herstellung einer solchen wafer-träger-anordnung |
JP2006332686A (ja) * | 2006-07-03 | 2006-12-07 | Matsushita Electric Ind Co Ltd | 固体撮像装置 |
US20090017248A1 (en) * | 2007-07-13 | 2009-01-15 | 3M Innovative Properties Company | Layered body and method for manufacturing thin substrate using the layered body |
JP5338250B2 (ja) * | 2008-08-21 | 2013-11-13 | 株式会社東京精密 | ワーク分離方法及び切削加工装置 |
JP2010283097A (ja) * | 2009-06-04 | 2010-12-16 | Lintec Corp | 両面接着シート |
US7975378B1 (en) * | 2010-01-06 | 2011-07-12 | Banpil Photonics, Inc. | Method of manufacturing high speed printed circuit board interconnects |
US7883991B1 (en) | 2010-02-18 | 2011-02-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Temporary carrier bonding and detaching processes |
US8852391B2 (en) * | 2010-06-21 | 2014-10-07 | Brewer Science Inc. | Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate |
-
2012
- 2012-02-16 DE DE102012101237A patent/DE102012101237A1/de not_active Withdrawn
-
2013
- 2013-01-17 KR KR1020147021338A patent/KR102061369B1/ko active IP Right Grant
- 2013-01-17 DE DE112013000980.3T patent/DE112013000980B4/de active Active
- 2013-01-17 CN CN201380009852.0A patent/CN104115267B/zh active Active
- 2013-01-17 AT ATA9032/2013A patent/AT517748B1/de active
- 2013-01-17 JP JP2014556963A patent/JP6140194B2/ja active Active
- 2013-01-17 SG SG11201404960TA patent/SG11201404960TA/en unknown
- 2013-01-17 US US14/376,460 patent/US9390956B2/en active Active
- 2013-01-17 WO PCT/EP2013/050849 patent/WO2013120648A1/de active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP2015507373A (ja) | 2015-03-05 |
DE112013000980A5 (de) | 2014-11-27 |
CN104115267B (zh) | 2017-08-25 |
AT517748B1 (de) | 2023-05-15 |
US20140374144A1 (en) | 2014-12-25 |
US9390956B2 (en) | 2016-07-12 |
DE112013000980B4 (de) | 2020-09-24 |
KR102061369B1 (ko) | 2020-02-11 |
JP6140194B2 (ja) | 2017-05-31 |
WO2013120648A1 (de) | 2013-08-22 |
KR20140128976A (ko) | 2014-11-06 |
AT517748A5 (de) | 2017-04-15 |
CN104115267A (zh) | 2014-10-22 |
DE102012101237A1 (de) | 2013-08-22 |
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