SG11201403634TA - Mixed mode pulsing etching in plasma processing systems - Google Patents

Mixed mode pulsing etching in plasma processing systems

Info

Publication number
SG11201403634TA
SG11201403634TA SG11201403634TA SG11201403634TA SG11201403634TA SG 11201403634T A SG11201403634T A SG 11201403634TA SG 11201403634T A SG11201403634T A SG 11201403634TA SG 11201403634T A SG11201403634T A SG 11201403634TA SG 11201403634T A SG11201403634T A SG 11201403634TA
Authority
SG
Singapore
Prior art keywords
etching
plasma processing
processing systems
mixed mode
mode pulsing
Prior art date
Application number
SG11201403634TA
Inventor
Kanarik Keren Jacobs
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG11201403634TA publication Critical patent/SG11201403634TA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
    • H01J37/32146—Amplitude modulation, includes pulsing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
    • H01J37/32155—Frequency modulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
SG11201403634TA 2011-12-28 2012-12-17 Mixed mode pulsing etching in plasma processing systems SG11201403634TA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161581054P 2011-12-28 2011-12-28
US13/550,548 US8883028B2 (en) 2011-12-28 2012-07-16 Mixed mode pulsing etching in plasma processing systems
PCT/IB2012/057385 WO2013098702A2 (en) 2011-12-28 2012-12-17 Mixed mode pulsing etching in plasma processing systems

Publications (1)

Publication Number Publication Date
SG11201403634TA true SG11201403634TA (en) 2014-07-30

Family

ID=48694019

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201608686TA SG10201608686TA (en) 2011-12-28 2012-12-17 Mixed mode pulsing etching in plasma processing systems
SG11201403634TA SG11201403634TA (en) 2011-12-28 2012-12-17 Mixed mode pulsing etching in plasma processing systems

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG10201608686TA SG10201608686TA (en) 2011-12-28 2012-12-17 Mixed mode pulsing etching in plasma processing systems

Country Status (7)

Country Link
US (3) US8883028B2 (en)
JP (1) JP6276704B2 (en)
KR (1) KR102062930B1 (en)
CN (2) CN105895490B (en)
SG (2) SG10201608686TA (en)
TW (2) TWI612576B (en)
WO (1) WO2013098702A2 (en)

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